JP5215613B2 - 2面加工機械 - Google Patents
2面加工機械 Download PDFInfo
- Publication number
- JP5215613B2 JP5215613B2 JP2007208212A JP2007208212A JP5215613B2 JP 5215613 B2 JP5215613 B2 JP 5215613B2 JP 2007208212 A JP2007208212 A JP 2007208212A JP 2007208212 A JP2007208212 A JP 2007208212A JP 5215613 B2 JP5215613 B2 JP 5215613B2
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- Prior art keywords
- annular
- support ring
- processing machine
- disk
- machine according
- Prior art date
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- 238000003754 machining Methods 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005498 polishing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
円筒孔は、クロスボアによる環状流路と連通する。ピストンおよび環状流路の下で、円筒孔は水である液圧の媒体を適応することが好ましい。ピストンは、いかなる空気圧力源からも生じることのできる外部から生成された圧力によって駆動される。
Claims (8)
- 上下キャリア・ディスクに固定保持される上下加工ディスクと、これらキャリア・ディスクは軸心を同じにして相互に配置されるとともに、駆動シャフトを介して駆動モータにより互いに相対的に回転駆動されるよう構成され、かつ、前記上下加工ディスクはその間に平坦なワークの両面を加工処理する作用ギャップを形成し、半径方向の少なくとも2方向に作用ギャップの間隔をあけた位置で加工ディスク間の距離を測定する距離測定装置とを備えた2面加工機械であって、
上キャリア・ディスク(10a,50)は、回転のために固定されるよう上部駆動シャフトに連結された支持リング上に懸垂され、
キャリア・ディスクの環状部分(18,58)および支持リング(20,60)を利用して支持リング(20,60)の外周まわりからキャリア・ディスクの外周に力発生器により付与される支持リングの半径方向力を外部から制御可能な手段と、
距離測定装置により測定された距離または力計測装置により測定されたワークに作用している圧力のそれぞれに基づいて力発生器の力を調整する制御手段とを備えたことを特徴とする。 - 請求項1に記載の2面加工機械において、
環状部分(18,58)は、キャリア・ディスク(10a,50)の軸方向上側に延伸していることを特徴とする。 - 請求項1または2に記載の2面加工機械において、
半径方向力が円周方向に間欠的または連続的に環状部分(18,58)に付与されることを特徴とする。 - 請求項1ないし3のいずれかに記載の2面加工機械において、
外周が円周状の小幅環状流路(66)は、支持リング(20,60)と環状部分(18,58)との間に形成され、
力発生器は環状流路(66)と連通されるとともに、環状流路(66)の内部で予め決めた圧力を発生させる圧力発生装置であることを特徴とする。 - 請求項4に記載の2面加工機械において、
環状流路(66)は、環状スロットであることを特徴とする。 - 請求項4または5に記載の2面加工機械において、
環状流路(66)に面する環状部分(18,58)の環状面は、環状のキャリア・ディスク(10a,50)の半径方向有効幅の略中央に位置決めされることを特徴とする。 - 請求項4ないし6のいずれかに記載の2面加工機械において、
支持リング(60)上にピストン(74)を備えたシリンダ(72)を配置し、
ピストン(74)は、横断方向に延伸している流路(68)を介して環状流路(66)と連通する支持リング(60)の円筒孔(70)と協働し、
液圧媒体は、環状流路(66)およびシリンダ内径内部で満たされることを特徴とする。 - 請求項7に記載の2面加工機械において、
ピストン(74)は、液圧源の制御可能な圧力によって作動されることを特徴とする。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006037490A DE102006037490B4 (de) | 2006-08-10 | 2006-08-10 | Doppelseiten-Bearbeitungsmaschine |
DE102006037490.8 | 2006-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008044098A JP2008044098A (ja) | 2008-02-28 |
JP5215613B2 true JP5215613B2 (ja) | 2013-06-19 |
Family
ID=38922048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007208212A Active JP5215613B2 (ja) | 2006-08-10 | 2007-08-09 | 2面加工機械 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7367867B2 (ja) |
JP (1) | JP5215613B2 (ja) |
DE (1) | DE102006037490B4 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111230630A (zh) * | 2020-03-14 | 2020-06-05 | 李广超 | 一种扁钢双面打磨器 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102008056276A1 (de) | 2008-11-06 | 2010-05-12 | Peter Wolters Gmbh | Verfahren zur Regelung des Arbeitsspalts einer Doppelseitenbearbeitungsmaschine |
DE102008063227A1 (de) | 2008-12-22 | 2010-06-24 | Peter Wolters Gmbh | Verfahren zum Bearbeiten von Werkstücken in einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine |
DE102009024125B4 (de) | 2009-06-06 | 2023-07-27 | Lapmaster Wolters Gmbh | Verfahren zum Bearbeiten von flachen Werkstücken |
JP5056961B2 (ja) * | 2010-02-01 | 2012-10-24 | 旭硝子株式会社 | 磁気記録媒体用ガラス基板及びその製造方法 |
US8758088B2 (en) | 2011-10-06 | 2014-06-24 | Wayne O. Duescher | Floating abrading platen configuration |
US8602842B2 (en) * | 2010-03-12 | 2013-12-10 | Wayne O. Duescher | Three-point fixed-spindle floating-platen abrasive system |
US8647171B2 (en) * | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Fixed-spindle floating-platen workpiece loader apparatus |
US8647170B2 (en) | 2011-10-06 | 2014-02-11 | Wayne O. Duescher | Laser alignment apparatus for rotary spindles |
US8641476B2 (en) | 2011-10-06 | 2014-02-04 | Wayne O. Duescher | Coplanar alignment apparatus for rotary spindles |
US8740668B2 (en) | 2010-03-12 | 2014-06-03 | Wayne O. Duescher | Three-point spindle-supported floating abrasive platen |
US8647172B2 (en) | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Wafer pads for fixed-spindle floating-platen lapping |
US8500515B2 (en) * | 2010-03-12 | 2013-08-06 | Wayne O. Duescher | Fixed-spindle and floating-platen abrasive system using spherical mounts |
US8696405B2 (en) | 2010-03-12 | 2014-04-15 | Wayne O. Duescher | Pivot-balanced floating platen lapping machine |
DE102010024040A1 (de) * | 2010-06-16 | 2011-12-22 | Siltronic Ag | Verfahren zur Politur einer Halbleiterscheibe |
US8337280B2 (en) | 2010-09-14 | 2012-12-25 | Duescher Wayne O | High speed platen abrading wire-driven rotary workholder |
US8430717B2 (en) | 2010-10-12 | 2013-04-30 | Wayne O. Duescher | Dynamic action abrasive lapping workholder |
DE102011003006B4 (de) | 2011-01-21 | 2013-02-07 | Siltronic Ag | Verfahren zur Bereitstellung jeweils einer ebenen Arbeitsschicht auf jeder der zwei Arbeitsscheiben einer Doppelseiten-Bearbeitungsvorrichtung |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
DE102013201663B4 (de) * | 2012-12-04 | 2020-04-23 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
CN105881213A (zh) * | 2014-09-01 | 2016-08-24 | 曾庆明 | 一种精密双面研磨机的控制器 |
DE102014220888B4 (de) | 2014-10-15 | 2019-02-14 | Siltronic Ag | Vorrichtung und Verfahren zum doppelseitigen Polieren von scheibenförmigen Werkstücken |
DE102016102223A1 (de) * | 2016-02-09 | 2017-08-10 | Lapmaster Wolters Gmbh | Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
DE102018202059A1 (de) | 2018-02-09 | 2019-08-14 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
EP3597362B1 (de) * | 2018-07-16 | 2023-04-19 | Officina Meccanica Domaso SpA | Federendenschleifmaschine |
JP2020171996A (ja) | 2019-04-11 | 2020-10-22 | 信越半導体株式会社 | 両面研磨方法 |
JP6965305B2 (ja) | 2019-04-11 | 2021-11-10 | 信越半導体株式会社 | 両面研磨装置 |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
DE102020125246A1 (de) * | 2020-09-28 | 2022-03-31 | Lapmaster Wolters Gmbh | Doppel- oder Einseiten-Bearbeitungsmaschine |
DE102021103709A1 (de) | 2021-02-17 | 2022-08-18 | Lapmaster Wolters Gmbh | Doppel- oder Einseiten-Bearbeitungsmaschine |
DE102022111923A1 (de) | 2022-05-12 | 2023-11-16 | Lapmaster Wolters Gmbh | Doppel- oder Einseiten-Bearbeitungsmaschine sowie Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine |
DE102022111924A1 (de) | 2022-05-12 | 2023-11-16 | Lapmaster Wolters Gmbh | Verfahren zum Einrichten einer Doppel- oder Einseiten-Bearbeitungsmaschine sowie Doppel- oder Einseiten-Bearbeitungsmaschine |
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-
2006
- 2006-08-10 DE DE102006037490A patent/DE102006037490B4/de active Active
-
2007
- 2007-01-17 US US11/623,761 patent/US7367867B2/en active Active
- 2007-08-09 JP JP2007208212A patent/JP5215613B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111230630A (zh) * | 2020-03-14 | 2020-06-05 | 李广超 | 一种扁钢双面打磨器 |
CN111230630B (zh) * | 2020-03-14 | 2022-04-22 | 李广超 | 一种扁钢双面打磨器 |
Also Published As
Publication number | Publication date |
---|---|
US20080038989A1 (en) | 2008-02-14 |
US7367867B2 (en) | 2008-05-06 |
JP2008044098A (ja) | 2008-02-28 |
DE102006037490A1 (de) | 2008-02-14 |
DE102006037490B4 (de) | 2011-04-07 |
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