JP5207387B2 - 電極を作製する方法および電極 - Google Patents
電極を作製する方法および電極 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract 1
- 239000013077 target material Substances 0.000 description 17
- 239000013076 target substance Substances 0.000 description 10
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- 229920000647 polyepoxide Polymers 0.000 description 4
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 239000008103 glucose Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- 108010015776 Glucose oxidase Proteins 0.000 description 1
- 239000004366 Glucose oxidase Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 229940116332 glucose oxidase Drugs 0.000 description 1
- 235000019420 glucose oxidase Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/1486—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using enzyme electrodes, e.g. with immobilised oxidase
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0574—Stacked resist layers used for different processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
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- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
Description
本特許出願は、2006年2月27日に出願された米国仮特許出願第60/777,135号の優先権を主張し、この仮特許出願はその譲受人に譲渡され、これにより本明細書において明白に参考として援用される。
本発明は、概して、フレックス回路技術に関する。より具体的には、本発明は、電極を作製するためのフレックス回路技術の使用に関する。
Claims (20)
- 電極を作製する方法であって、
該方法は、
第1の物質からなる電極を有するフレックス回路を提供することと、
該フレックス回路の上に第1のマスクを提供することであって、該第1のマスクは、オフセット領域と、該電極を露出する開口部とを有する、ことと、
該オフセット領域および該開口部の上に第2の物質を蒸着することであって、該第2の物質は、該第1の物質とは異なる、ことと、
該第2の物質の上に第2のマスクを提供することであって、該第2のマスクは、該オフセット領域の上の該第2の物質の一部の上に開口部を有し、該電極は、医療患者における生理学的な指標を測定するために構成される、ことと
を含む、方法。 - 前記第2のマスクの前記開口部の中に薄膜を提供することをさらに含む、請求項1に記載の方法。
- 前記オフセット領域は、前記第1のマスクの前記開口部に隣接している、請求項1に記載の方法。
- 前記第1の物質は銅物質であり、前記第2の物質は、炭素、金、黒鉛、白金、銀−塩化銀、ロジウム、パラジウム物質からなる群から選択される、請求項1に記載の方法。
- 複数の電極のうちの1つは、第1の軸に沿って配置され、前記オフセット領域は、該第1の軸と一致しない第2の軸に沿って配置される、請求項1に記載の方法。
- 複数の電極のうちの1つは、第1の平面に沿って配置され、前記オフセット領域は、該第1の平面と一致しない第2の平面に沿って配置される、請求項1に記載の方法。
- 前記第1の物質は銅であり、前記第2の物質は銅ではない、請求項1に記載の方法。
- 電極を作製する方法であって、
該方法は、
第1の物質からなる導電性トレースを上に有する基板を提供することと、
該導電性トレースの上に第1のマスクを適用することであって、該第1のマスクは、該導電性トレースの一部の上に第1の開口部を有する、ことと、
該第1の開口部の上および該第1のマスクの一部の上に第2の物質を適用することと、
該第2の物質の上に第2のマスクを適用することであって、該第2のマスクは、該第2の物質の一部の上に第2の開口部を有し、該第2の開口部は、該第1の開口部からオフセットされており、該電極は、医療患者における生理学的な指標を測定するために構成される、ことと
を含む、方法。 - 前記導電性トレースは銅物質からなり、前記第2の物質は、銅ではない、請求項8に記載の方法。
- 前記第1の開口部は、第1の軸に沿って配置され、前記第2の開口部は、該第1の軸と一致しない第2の軸に沿って配置される、請求項8に記載の方法。
- 前記第1の開口部は、第1の平面に沿って配置され、前記第2の開口部は、該第1の平面と一致しない第2の平面に沿って配置される、請求項8に記載の方法。
- 前記オフセットは、前記基板の長さと平行する方向にある、請求項8に記載の方法。
- 前記オフセットは、前記基板の幅と平行する方向にある、請求項8に記載の方法。
- 前記導電性トレースは銅物質からなり、前記第2の物質は、炭素、金、黒鉛、白金、銀−塩化銀、ロジウム、パラジウム物質からなる群から選択される、請求項8に記載の方法。
- 電極であって、
該電極は、
第1の物質からなる導電性トレースを有する基板と、
該導電性トレースの上に配置された第1のマスクであって、該第1のマスクは、該導電性トレースの一部の上に第1の開口部を有する、第1のマスクと、
該第1の開口部の上および該第1のマスクの一部の上に配置された第2の物質と、
該第2の物質の上の第2のマスクであって、該第2のマスクは、該第2の物質の一部の上に第2の開口部を有し、該第2の開口部は、該第1の開口部からオフセットされており、該電極は、医療患者における生理学的な指標を測定するために構成される、第2のマスクと
を含む、電極。 - 前記第1の開口部は、第1の軸に沿って配置され、前記第2の開口部は、該第1の軸と一致しない第2の軸に沿って配置される、請求項15に記載の電極。
- 前記第1の開口部は、第1の平面に沿って配置され、前記第2の開口部は、該第1の平面と一致しない第2の平面に沿って配置される、請求項15に記載の電極。
- 前記オフセットは、前記基板の長さと平行する方向にある、請求項15に記載の電極。
- 前記オフセットは、前記基板の幅と平行する方向にある、請求項15に記載の電極。
- 前記導電性トレースは、銅物質からなり、前記第2の物質は、銅ではない、請求項15に記載の電極。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77713506P | 2006-02-27 | 2006-02-27 | |
US60/777,135 | 2006-02-27 | ||
PCT/US2007/004472 WO2007098187A2 (en) | 2006-02-27 | 2007-02-22 | Active electrode and method for manufacturing it using flex circuit technology |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009528677A JP2009528677A (ja) | 2009-08-06 |
JP5207387B2 true JP5207387B2 (ja) | 2013-06-12 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008556402A Expired - Fee Related JP5207387B2 (ja) | 2006-02-27 | 2007-02-22 | 電極を作製する方法および電極 |
Country Status (9)
Country | Link |
---|---|
US (2) | US8065796B2 (ja) |
EP (2) | EP1989930B1 (ja) |
JP (1) | JP5207387B2 (ja) |
CN (1) | CN101356865B (ja) |
AT (1) | ATE468006T1 (ja) |
AU (1) | AU2007217768A1 (ja) |
CA (1) | CA2630535C (ja) |
DE (1) | DE602007006433D1 (ja) |
WO (1) | WO2007098187A2 (ja) |
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JP2009528677A (ja) | 2009-08-06 |
WO2007098187A3 (en) | 2008-04-10 |
US8065796B2 (en) | 2011-11-29 |
CA2630535C (en) | 2014-12-23 |
US20070200254A1 (en) | 2007-08-30 |
EP2131635A1 (en) | 2009-12-09 |
CN101356865A (zh) | 2009-01-28 |
CN101356865B (zh) | 2012-06-06 |
EP1989930A2 (en) | 2008-11-12 |
US8546701B2 (en) | 2013-10-01 |
WO2007098187A2 (en) | 2007-08-30 |
ATE468006T1 (de) | 2010-05-15 |
CA2630535A1 (en) | 2007-08-30 |
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