JP5200276B2 - インラインリソグラフィ及びエッチングシステム - Google Patents

インラインリソグラフィ及びエッチングシステム Download PDF

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Publication number
JP5200276B2
JP5200276B2 JP2010501280A JP2010501280A JP5200276B2 JP 5200276 B2 JP5200276 B2 JP 5200276B2 JP 2010501280 A JP2010501280 A JP 2010501280A JP 2010501280 A JP2010501280 A JP 2010501280A JP 5200276 B2 JP5200276 B2 JP 5200276B2
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Japan
Prior art keywords
data
wafer
processing
wafers
measurement
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Application number
JP2010501280A
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English (en)
Japanese (ja)
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JP2010524209A (ja
Inventor
ジー ウィンクラー，マーク
イー ウィンター，トーマス
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/730,341 external-priority patent/US7650200B2/en
Priority claimed from US11/730,284 external-priority patent/US7596423B2/en
Priority claimed from US11/730,283 external-priority patent/US7373216B1/en
Priority claimed from US11/730,202 external-priority patent/US7531368B2/en
Priority claimed from US11/730,339 external-priority patent/US7935545B2/en
Priority claimed from US11/730,279 external-priority patent/US7783374B2/en
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JP2010524209A publication Critical patent/JP2010524209A/ja
Application granted granted Critical
Publication of JP5200276B2 publication Critical patent/JP5200276B2/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2010501280A 2007-03-30 2008-03-31 インラインリソグラフィ及びエッチングシステム Active JP5200276B2 (ja)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US11/730,341 US7650200B2 (en) 2007-03-30 2007-03-30 Method and apparatus for creating a site-dependent evaluation library
US11/730,284 2007-03-30
US11/730,279 2007-03-30
US11/730,341 2007-03-30
US11/730,284 US7596423B2 (en) 2007-03-30 2007-03-30 Method and apparatus for verifying a site-dependent procedure
US11/730,283 US7373216B1 (en) 2007-03-30 2007-03-30 Method and apparatus for verifying a site-dependent wafer
US11/730,202 US7531368B2 (en) 2007-03-30 2007-03-30 In-line lithography and etch system
US11/730,339 2007-03-30
US11/730,339 US7935545B2 (en) 2007-03-30 2007-03-30 Method and apparatus for performing a site-dependent dual patterning procedure
US11/730,279 US7783374B2 (en) 2007-03-30 2007-03-30 Method and apparatus for performing a site-dependent dual damascene procedure
US11/730,283 2007-03-30
US11/730,202 2007-03-30
PCT/US2008/058888 WO2008121955A2 (en) 2007-03-30 2008-03-31 In-line lithography and etch system

Publications (2)

Publication Number Publication Date
JP2010524209A JP2010524209A (ja) 2010-07-15
JP5200276B2 true JP5200276B2 (ja) 2013-06-05

Family

ID=39808885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010501280A Active JP5200276B2 (ja) 2007-03-30 2008-03-31 インラインリソグラフィ及びエッチングシステム

Country Status (4)

Country Link
JP (1) JP5200276B2 (ko)
KR (1) KR101475967B1 (ko)
TW (1) TWI381468B (ko)
WO (1) WO2008121955A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8739095B2 (en) * 2010-03-08 2014-05-27 Cadence Design Systems, Inc. Method, system, and program product for interactive checking for double pattern lithography violations
US9277186B2 (en) * 2012-01-18 2016-03-01 Kla-Tencor Corp. Generating a wafer inspection process using bit failures and virtual inspection
US10769320B2 (en) 2012-12-18 2020-09-08 Kla-Tencor Corporation Integrated use of model-based metrology and a process model
TWI631636B (zh) * 2013-12-16 2018-08-01 克萊譚克公司 以模型爲基礎之量測及一製程模型的整合使用
US11263737B2 (en) * 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
US20220351996A1 (en) * 2021-04-29 2022-11-03 Changxin Memory Technologies, Inc. Front opening unified pod, wafer transfer system and wafer transfer method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889355A (en) * 1973-02-05 1975-06-17 Ibm Continuous processing system
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
JPH0480939A (ja) * 1990-07-24 1992-03-13 Hitachi Ltd 半導体集積回路装置の製造方法
US6171174B1 (en) * 1998-06-26 2001-01-09 Advanced Micro Devices System and method for controlling a multi-arm polishing tool
JP4158384B2 (ja) * 2001-07-19 2008-10-01 株式会社日立製作所 半導体デバイスの製造工程監視方法及びそのシステム
US6909930B2 (en) * 2001-07-19 2005-06-21 Hitachi, Ltd. Method and system for monitoring a semiconductor device manufacturing process
US6908807B2 (en) * 2002-03-26 2005-06-21 Micron Technology, Inc. Methods of forming semiconductor constructions
JP4694843B2 (ja) * 2002-09-30 2011-06-08 東京エレクトロン株式会社 半導体製作プロセスの監視とコンロトールのための装置
US7065738B1 (en) * 2004-05-04 2006-06-20 Advanced Micro Devices, Inc. Method of verifying an optical proximity correction (OPC) model
US8084400B2 (en) * 2005-10-11 2011-12-27 Intermolecular, Inc. Methods for discretized processing and process sequence integration of regions of a substrate
US8882914B2 (en) * 2004-09-17 2014-11-11 Intermolecular, Inc. Processing substrates using site-isolated processing
TW200745771A (en) * 2006-02-17 2007-12-16 Nikon Corp Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium

Also Published As

Publication number Publication date
JP2010524209A (ja) 2010-07-15
KR20100016095A (ko) 2010-02-12
WO2008121955A2 (en) 2008-10-09
KR101475967B1 (ko) 2014-12-23
WO2008121955A3 (en) 2009-01-15
TWI381468B (zh) 2013-01-01
TW200903686A (en) 2009-01-16

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