JP5197368B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5197368B2 JP5197368B2 JP2008532122A JP2008532122A JP5197368B2 JP 5197368 B2 JP5197368 B2 JP 5197368B2 JP 2008532122 A JP2008532122 A JP 2008532122A JP 2008532122 A JP2008532122 A JP 2008532122A JP 5197368 B2 JP5197368 B2 JP 5197368B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- emitting device
- optical member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 description 22
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
B 発光素子12を準備すること
C 光学部材14を発光素子12に形成すること
D 光学部材14が形成された発光素子12を基体11に実装すること
工程Aにおいて、発光素子12は、第1の電極パッド(n側電極パッド)12npおよび第2の電極パッド(p側電極パッド)12ppを備えた実装面Mを有している。
Claims (4)
- 基体と、
半導体材料からなり、前記基体上に実装されており、第1の光を発生する発光素子と、
前記第1の光によって励起されて第2の光を放射する蛍光材料を含んでいるとともに、シート形状を有しており、前記発光素子の上方に設けられた発光部材と、
前記発光素子が設けられた開口と、前記発光部材に対向している平坦な形状の上面および前記基体の上面と間を空けて対向している平坦な形状の下面とを有しており、前記発光素子の側面に接している透光性材料からなる光学部材と、
を備えた発光装置。 - 前記光学部材は、前記発光素子の活性層を覆っていることを特徴とする請求項1記載の発光装置。
- 前記光学部材は、記発光素子の側面を囲んでいることを特徴とする請求項2記載の発光装置。
- 前記光学部材は、前記発光素子の上端を囲んでいることを特徴とする請求項3記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008532122A JP5197368B2 (ja) | 2006-08-30 | 2007-08-30 | 発光装置 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006233308 | 2006-08-30 | ||
JP2006233308 | 2006-08-30 | ||
JP2006263858 | 2006-09-28 | ||
JP2006263858 | 2006-09-28 | ||
JP2008532122A JP5197368B2 (ja) | 2006-08-30 | 2007-08-30 | 発光装置 |
PCT/JP2007/066911 WO2008026699A1 (en) | 2006-08-30 | 2007-08-30 | Light-emitting device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012231594A Division JP5484544B2 (ja) | 2006-08-30 | 2012-10-19 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008026699A1 JPWO2008026699A1 (ja) | 2010-01-21 |
JP5197368B2 true JP5197368B2 (ja) | 2013-05-15 |
Family
ID=39135981
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008532122A Expired - Fee Related JP5197368B2 (ja) | 2006-08-30 | 2007-08-30 | 発光装置 |
JP2012231594A Expired - Fee Related JP5484544B2 (ja) | 2006-08-30 | 2012-10-19 | 発光装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012231594A Expired - Fee Related JP5484544B2 (ja) | 2006-08-30 | 2012-10-19 | 発光装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2061095A4 (ja) |
JP (2) | JP5197368B2 (ja) |
CN (1) | CN101507006B (ja) |
WO (1) | WO2008026699A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9753214B2 (en) | 2014-04-02 | 2017-09-05 | Samsung Display Co., Ltd. | Light source unit, method of fabricating the light source unit and backlight assembly including the light source unit |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101305569B1 (ko) * | 2011-05-11 | 2013-09-09 | 엘지이노텍 주식회사 | 광학 부재, 표시장치 및 광학 부재의 제조방법 |
JP5543518B2 (ja) | 2011-04-05 | 2014-07-09 | エルジー イノテック カンパニー リミテッド | 表示装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004039938A (ja) * | 2002-07-05 | 2004-02-05 | Sony Corp | チップ状電子部品、その実装構造、その中間基板、及びこれらの製造方法、並びにチップ状電子部品の検査方法 |
JP2005332963A (ja) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | 発光装置 |
JP2006086191A (ja) * | 2004-09-14 | 2006-03-30 | Nichia Chem Ind Ltd | 発光装置 |
JP2006332381A (ja) * | 2005-05-26 | 2006-12-07 | Matsushita Electric Works Ltd | 発光装置 |
JP2007080859A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
WO2007088909A1 (ja) * | 2006-01-31 | 2007-08-09 | Kyocera Corporation | 発光装置および発光モジュール |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6196780A (ja) * | 1984-10-17 | 1986-05-15 | Stanley Electric Co Ltd | Ledチツプのコ−テイング方法 |
DE29820384U1 (de) * | 1998-11-06 | 1999-01-14 | Opto-System GmbH, 12555 Berlin | Leucht- oder Anzeigeelement mit mischfarbigen, insbesondere weißem Licht |
WO2001009963A1 (fr) * | 1999-07-29 | 2001-02-08 | Citizen Electronics Co., Ltd. | Diode electroluminescente |
US6642652B2 (en) * | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP2004128057A (ja) * | 2002-09-30 | 2004-04-22 | Fuji Photo Film Co Ltd | 発光装置およびその製造方法 |
JP4303550B2 (ja) * | 2003-09-30 | 2009-07-29 | 豊田合成株式会社 | 発光装置 |
DE602004028648D1 (de) * | 2003-11-25 | 2010-09-23 | Panasonic Elec Works Co Ltd | Lichtemittierendes bauelement mit einem leuchtdiodenchip |
US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
JP2006019409A (ja) * | 2004-06-30 | 2006-01-19 | Mitsubishi Chemicals Corp | 発光装置並びにそれを用いた照明、ディスプレイ用バックライト及びディスプレイ |
JP2006093399A (ja) * | 2004-09-24 | 2006-04-06 | Kyocera Corp | 発光装置およびその製造方法ならびに照明装置 |
JP2006128322A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光装置および照明装置 |
EP1840977A4 (en) * | 2004-12-24 | 2009-07-29 | Kyocera Corp | LIGHT SOURCE AND LIGHTING DEVICE |
EP1976030A1 (en) * | 2006-01-04 | 2008-10-01 | Rohm Co., Ltd. | Thin-type light emitting diode lamp, and its manufacturing |
KR101523482B1 (ko) * | 2006-08-22 | 2015-05-28 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 부재, 그리고 반도체 디바이스용 부재 형성액 및 반도체 디바이스용 부재의 제조 방법, 그리고 그것을 이용한 반도체 디바이스용 부재 형성액, 형광체 조성물, 반도체 발광 디바이스, 조명 장치, 및 화상 표시 장치 |
-
2007
- 2007-08-30 WO PCT/JP2007/066911 patent/WO2008026699A1/ja active Application Filing
- 2007-08-30 CN CN2007800318046A patent/CN101507006B/zh not_active Expired - Fee Related
- 2007-08-30 JP JP2008532122A patent/JP5197368B2/ja not_active Expired - Fee Related
- 2007-08-30 EP EP07806388A patent/EP2061095A4/en not_active Withdrawn
-
2012
- 2012-10-19 JP JP2012231594A patent/JP5484544B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004039938A (ja) * | 2002-07-05 | 2004-02-05 | Sony Corp | チップ状電子部品、その実装構造、その中間基板、及びこれらの製造方法、並びにチップ状電子部品の検査方法 |
JP2005332963A (ja) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | 発光装置 |
JP2006086191A (ja) * | 2004-09-14 | 2006-03-30 | Nichia Chem Ind Ltd | 発光装置 |
JP2006332381A (ja) * | 2005-05-26 | 2006-12-07 | Matsushita Electric Works Ltd | 発光装置 |
JP2007080859A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
WO2007088909A1 (ja) * | 2006-01-31 | 2007-08-09 | Kyocera Corporation | 発光装置および発光モジュール |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9753214B2 (en) | 2014-04-02 | 2017-09-05 | Samsung Display Co., Ltd. | Light source unit, method of fabricating the light source unit and backlight assembly including the light source unit |
Also Published As
Publication number | Publication date |
---|---|
EP2061095A4 (en) | 2012-03-07 |
CN101507006B (zh) | 2011-08-24 |
CN101507006A (zh) | 2009-08-12 |
JP2013012789A (ja) | 2013-01-17 |
JP5484544B2 (ja) | 2014-05-07 |
JPWO2008026699A1 (ja) | 2010-01-21 |
WO2008026699A1 (en) | 2008-03-06 |
EP2061095A1 (en) | 2009-05-20 |
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