JP5196743B2 - 加工方法及び装置、並びに、デバイス製造方法 - Google Patents

加工方法及び装置、並びに、デバイス製造方法 Download PDF

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Publication number
JP5196743B2
JP5196743B2 JP2006179509A JP2006179509A JP5196743B2 JP 5196743 B2 JP5196743 B2 JP 5196743B2 JP 2006179509 A JP2006179509 A JP 2006179509A JP 2006179509 A JP2006179509 A JP 2006179509A JP 5196743 B2 JP5196743 B2 JP 5196743B2
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Prior art keywords
mold
wafer
pressing
processing method
resin
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Expired - Fee Related
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JP2006179509A
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Japanese (ja)
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JP2008006704A5 (https=
JP2008006704A (ja
Inventor
英悟 川上
和之 春見
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Canon Inc
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Canon Inc
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Priority to JP2006179509A priority Critical patent/JP5196743B2/ja
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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2006179509A 2006-06-29 2006-06-29 加工方法及び装置、並びに、デバイス製造方法 Expired - Fee Related JP5196743B2 (ja)

Priority Applications (1)

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JP2006179509A JP5196743B2 (ja) 2006-06-29 2006-06-29 加工方法及び装置、並びに、デバイス製造方法

Applications Claiming Priority (1)

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JP2006179509A JP5196743B2 (ja) 2006-06-29 2006-06-29 加工方法及び装置、並びに、デバイス製造方法

Publications (3)

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JP2008006704A JP2008006704A (ja) 2008-01-17
JP2008006704A5 JP2008006704A5 (https=) 2009-09-03
JP5196743B2 true JP5196743B2 (ja) 2013-05-15

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JP2006179509A Expired - Fee Related JP5196743B2 (ja) 2006-06-29 2006-06-29 加工方法及び装置、並びに、デバイス製造方法

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5371349B2 (ja) 2008-09-19 2013-12-18 キヤノン株式会社 インプリント装置、および物品の製造方法
JP5930622B2 (ja) * 2010-10-08 2016-06-08 キヤノン株式会社 インプリント装置、及び、物品の製造方法
JP6000712B2 (ja) 2012-07-24 2016-10-05 キヤノン株式会社 樹脂の製造方法及び樹脂の製造装置
JP6221461B2 (ja) * 2013-07-25 2017-11-01 大日本印刷株式会社 欠陥解析方法、凹凸パターン構造体の製造方法及びインプリントシステム
JP6315963B2 (ja) * 2013-12-09 2018-04-25 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000194142A (ja) * 1998-12-25 2000-07-14 Fujitsu Ltd パタ―ン形成方法及び半導体装置の製造方法
JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法

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JP2008006704A (ja) 2008-01-17

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