JP5196552B2 - 圧電素子 - Google Patents
圧電素子 Download PDFInfo
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- JP5196552B2 JP5196552B2 JP2008154059A JP2008154059A JP5196552B2 JP 5196552 B2 JP5196552 B2 JP 5196552B2 JP 2008154059 A JP2008154059 A JP 2008154059A JP 2008154059 A JP2008154059 A JP 2008154059A JP 5196552 B2 JP5196552 B2 JP 5196552B2
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- dielectric
- piezoelectric element
- piezoelectric
- piezoelectric body
- thin film
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 239000010409 thin film Substances 0.000 description 58
- 239000000463 material Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 238000005259 measurement Methods 0.000 description 24
- 230000007423 decrease Effects 0.000 description 13
- 238000001514 detection method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 230000010363 phase shift Effects 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 238000005070 sampling Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 229910000542 Sc alloy Inorganic materials 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 238000002847 impedance measurement Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910000846 In alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- CAUFKFVKXSZCJW-UHFFFAOYSA-N [Sc].[In] Chemical compound [Sc].[In] CAUFKFVKXSZCJW-UHFFFAOYSA-N 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- LUKDNTKUBVKBMZ-UHFFFAOYSA-N aluminum scandium Chemical compound [Al].[Sc] LUKDNTKUBVKBMZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005621 ferroelectricity Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
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- Compositions Of Oxide Ceramics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
従来の圧電素子に係るAE計測の具体例として、スパッタリング法によって成膜した窒化アルミニウム薄膜を材料とした圧電体を備える圧電素子について、時定数の低下により高温での諸特性が低下する例を示す。
本実施例では本発明に係る圧電素子を作製し、これを用いて擬似AE検出実験を実施した。図1に示す圧電素子10の構成を採用し、圧電素子10の作製は、誘電体4の厚さが70μmになるように調整し、薄膜圧電体3としての窒化アルミニウム薄膜と電極2bとしての白金電極との間に、誘電体4を形成することにより行なった。
2a 電極(第1の電極)
2b 電極(第2の電極)
3 薄膜圧電体(圧電体)
4 誘電体
10 圧電素子
20 AE検出実験装置
21 環状電気炉
22 ウェーブガイド
23a AEセンサ
23b 圧電素子
24a・24b 断熱用蓋部材
25 ファンクションジェネレータ
26 プリアンプ
27 オシロスコープ
28 冷却機
Claims (4)
- 基板上に第1の電極、圧電体および第2の電極が、この順序で形成されている圧電素子であって、
上記第1の電極および圧電体の間、並びに、上記第2の電極および圧電体の間のうち少なくとも一方の間に誘電体が積層されており、
上記誘電体の静電容量は、圧電体の静電容量以下であり、
上記誘電体の時定数は、圧電体の時定数よりも大きく、
上記圧電体がウルツ鉱型の結晶構造を有することを特徴とする圧電素子。 - 上記圧電体の厚さが、0.5μm以上、150μm以下であることを特徴とする請求項1に記載の圧電素子。
- 上記圧電体が窒化アルミニウムであり、
上記誘電体が酸化アルミニウムまたは酸化シリコンの少なくとも何れかが主要成分であることを特徴とする請求項1または2に記載の圧電素子。 - 上記圧電体の厚さが、0.5μm以上、90μm以下であり、
上記誘電体が酸化アルミニウムであり、誘電体の厚さが10μm以上、100μm以下であることを特徴とする請求項3に記載の圧電素子。
Priority Applications (1)
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JP2008154059A JP5196552B2 (ja) | 2008-06-12 | 2008-06-12 | 圧電素子 |
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JP2008154059A JP5196552B2 (ja) | 2008-06-12 | 2008-06-12 | 圧電素子 |
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JP2009302233A JP2009302233A (ja) | 2009-12-24 |
JP5196552B2 true JP5196552B2 (ja) | 2013-05-15 |
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JP2008154059A Expired - Fee Related JP5196552B2 (ja) | 2008-06-12 | 2008-06-12 | 圧電素子 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7293909B2 (ja) | 2019-06-26 | 2023-06-20 | セイコーエプソン株式会社 | 振動片、電子機器、および移動体 |
CN111044181B (zh) * | 2019-12-19 | 2021-10-26 | 华南理工大学 | 梯度零泊松比结构电容式柔性触觉传感器及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3365832B2 (ja) * | 1993-09-08 | 2003-01-14 | 株式会社日立ユニシアオートモティブ | 圧電素子 |
JP3656434B2 (ja) * | 1998-10-02 | 2005-06-08 | 松下電器産業株式会社 | 圧力検出装置および圧力検出装置の製造方法およびケーブル状圧力センサの製造方法 |
JP4126370B2 (ja) * | 2002-12-04 | 2008-07-30 | 独立行政法人産業技術総合研究所 | 薄膜型圧電センサ |
JP5136986B2 (ja) * | 2008-04-30 | 2013-02-06 | 独立行政法人産業技術総合研究所 | 圧電体の製造方法および圧電素子 |
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- 2008-06-12 JP JP2008154059A patent/JP5196552B2/ja not_active Expired - Fee Related
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JP2009302233A (ja) | 2009-12-24 |
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