JP5196308B2 - Adhesive application method and adhesive application device - Google Patents

Description

  The present invention relates to an adhesive application method and an adhesive application device for applying an adhesive in advance on a base material laminated on an inlet sheet, for example, when producing a non-contact IC card.

  In recent years, contactless IC cards that communicate with external devices such as readers / writers in a contactless manner are becoming popular. The demand for non-contact IC cards is expected to expand rapidly in the future, and accordingly, it is strongly desired to manufacture high-quality non-contact IC cards at low cost. .

The non-contact IC card includes a first substrate, a surface-side substrate including a first adhesive layer provided on one surface of the first substrate, a second substrate, and one of the second substrates. And a back side substrate including a second adhesive layer provided on the surface. An inlet sheet including an inlet base material, an IC chip provided on the inlet base material, and an antenna provided corresponding to the IC chip is provided between the front surface side substrate and the rear surface side substrate. (See, for example, Patent Document 1). In the non-contact IC card having such a configuration, the first base material of the front surface side substrate and the second base material of the back surface side substrate are each cut in advance in a so-called sheet shape and each printed. In such a case, in order to match the printing applied to the first base material and the second base material, it is necessary to accurately align and laminate the front surface side substrate, the back surface side substrate, and the inlet sheet.
JP 2003-162697 A

  However, for example, when aligning the front side substrate and the inlet sheet, the first adhesive layer of the front side substrate has tackiness (adhesiveness), so it is easy to contact the front side substrate and the inlet sheet. May be joined. In this case, it is difficult to laminate the front side substrate and the inlet sheet while aligning them. Similarly, since the second adhesive layer of the back side substrate also has tackiness, it may be easily joined when the back side substrate and the inlet sheet come into contact with each other. It becomes difficult to laminate while aligning the inlet sheet and the inlet sheet.

  Therefore, by losing the tackiness of the first adhesive layer of the front surface side substrate and the second adhesive layer of the back surface side substrate, the front surface side substrate, the back surface side substrate, and the inlet sheet are more accurately aligned, Lamination is considered. In order to lose the tackiness of the adhesive layer of each substrate, the adhesive is cooled immediately after the adhesive is applied to the substrate to solidify the adhesive and form an adhesive layer on the substrate. It is effective to make it. However, it is difficult to cool the adhesive immediately after the adhesive is applied to the substrate in the method of applying the adhesive on the substrate while sequentially feeding the substrate wound around the roller. is there.

  The present invention has been made in consideration of the above points, and provides an adhesive application method and an adhesive application device capable of cooling an adhesive immediately after the adhesive is applied to a substrate. With the goal.

  The present invention applies a step of disposing a base material on a surface plate provided with a cooling mechanism, and a surface plate on which the base material is disposed on an application mechanism disposed so as to extend in the width direction of the base material. Relative movement in the direction perpendicular to the arrangement direction of the mechanism, the step of applying the adhesive on the substrate by the application mechanism, and the adhesive of the surface plate so that the adhesive applied on the substrate is solidified And a step of cooling by a cooling mechanism.

  In the present invention, the step of applying the adhesive onto the base material by the application mechanism is performed by moving the surface plate relative to the application mechanism in advance, and when the start of the application area of the base material reaches the application mechanism. The method for applying an adhesive comprises the step of starting the application of the adhesive.

  In the present invention, the step of applying the adhesive on the base material by the coating mechanism includes the step of stopping the coating by the coating mechanism when the coating region end of the base material reaches the coating mechanism, and thereafter the coating mechanism. And a step of continuing relative movement of the surface plate.

  The present invention is provided with a surface plate on which a base material is disposed, an upper portion of the surface plate, disposed so as to extend in the width direction of the base material, an application mechanism for applying an adhesive to the base material, and a surface plate. A cooling mechanism for solidifying the adhesive applied on the substrate, and the surface plate is movable relative to the application mechanism in a direction perpendicular to the direction of arrangement of the application mechanism. It is a coating device.

  The present invention is the adhesive applicator characterized in that the cooling mechanism is a cooling mechanism using a refrigerant.

  The present invention is the adhesive coating device, wherein the cooling mechanism is a cooling mechanism by air cooling.

  The present invention is the adhesive application device characterized in that the cooling mechanism can control the cooling rate at the time of cooling.

  The present invention is the adhesive application device, wherein the adhesive is made of a moisture curable urethane resin.

According to the present invention, after the base material is disposed on the surface plate, the surface plate is moved relative to the coating mechanism disposed so as to extend in the width direction of the base material in a direction orthogonal to the direction in which the coating mechanism is disposed. Then, an adhesive is applied onto the substrate by an application mechanism. For this reason, the thickness of the adhesive applied onto the substrate is controlled by controlling the speed at which the surface plate moves and the timing at which the application mechanism discharges the adhesive. Thereby, an adhesive layer having a uniform thickness can be formed on the substrate.
Moreover, according to this invention, the cooling mechanism is provided in the surface plate in which the base material is arrange | positioned. For this reason, after an adhesive agent is apply | coated on a base material by an application | coating mechanism, an adhesive agent is cooled by the cooling mechanism of a surface plate. Thus, the adhesive can be solidified immediately after the adhesive is applied on the substrate.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 4 are diagrams showing an adhesive application method and an adhesive application device according to the first embodiment of the present invention. Among these, FIG. 1 is a figure which shows the adhesive agent coating apparatus in the 1st Embodiment of this invention, FIG. 2 is the adhesive agent formed on the base material in the 1st Embodiment of this invention. It is a figure which shows a layer. FIG. 3 is a diagram showing an adhesive application method in the first embodiment of the present invention, and FIG. 4 is a diagram of an adhesive layer formed on a substrate in the first embodiment of the present invention. It is a figure which shows thickness. FIG. 5 is a diagram showing a non-contact IC card having a base material on which an adhesive layer is formed. In addition, FIG. 6 is a diagram showing an adhesive application method when the adhesive application method according to the first embodiment of the present invention is not used, and FIG. 7 is a diagram according to the first embodiment of the present invention. It is a figure which shows the thickness of the adhesive bond layer formed on the base material when not using an adhesive agent coating method.

Adhesive, Adhesive Layer First, a non-contact IC card will be described with reference to FIG. Here, the contactless IC card can communicate with an external device such as a reader / writer in a contactless manner.

  As shown in FIG. 5, the non-contact IC card 31 includes a pair of substrates 22 having a base material 13 and an adhesive layer 21 formed on the base material 13, and the pair of substrates 22 includes an adhesive layer. 21 are arranged so as to face each other. And the inlet sheet 35 is clamped between a pair of board | substrates 22, and each board | substrate 22 and an inlet sheet are bonded together. Among these, the inlet sheet 35 includes an inlet base 32, an antenna 33 provided on the inlet base 32, and an IC chip 34 provided corresponding to the antenna 33. In addition, when the pair of substrates 22 and the inlet sheet are bonded to each other, in order to accurately perform the alignment between the pair of substrates 22 and the inlet sheet, it is formed on each base material 13 as described above. It is preferable that the adhesive layer 21 is not tacky (adhesive).

  Next, the adhesive layer 21 will be described with reference to FIG. As will be described later, the adhesive layer 21 on the base material 13 is formed by applying the adhesive 30 on the base material 13 and solidifying the applied adhesive 30. In addition, as shown in FIG. 2, the start end 27 of the adhesive layer 21 is located inside the front end 25 of the base material 13. Similarly, the terminal end 28 of the adhesive layer 21 is located inside the rear end 26 of the base material 13. The application region start end 27 a of the substrate 13 corresponds to the start end 27 of the adhesive layer 21, and the application region end 28 a of the substrate 13 corresponds to the end 28 of the adhesive layer 21. The starting end 27 of the adhesive layer 21 is located on the inner side of the front end 25 of the base material 13 and the terminal end 28 of the adhesive layer 21 is located on the inner side of the rear end 26 of the base material 13. For example, the start end 27 of the adhesive layer 21 may be located on the substantially same vertical line as the front end 25 of the base material 13, and the end 28 of the adhesive layer 21 is substantially the same vertical as the rear end 26 of the base material 13. It may be located on the line. Note that “substantially the same” means that the scope of the present invention is not lost and includes a range close to the same.

The adhesive 30 forming the adhesive layer 21 is made of a moisture curable urethane resin. In addition, when the adhesive 30 which consists of a moisture hardening type urethane resin is rapidly cooled in the air environment at normal temperature, the tackiness is lost and solidifies in several seconds-several tens of seconds.
Further, the adhesive layer 21 is formed thicker than the thickness of the IC chip 34. Further, the adhesive layer 21 has a predetermined elasticity, and therefore, a portion of the non-contact IC card 31 where the IC chip 34 is arranged does not protrude in a convex shape as compared with other portions. The surface of the non-contact IC card 31 can be flattened.

Adhesive Application Device Next, the adhesive application device 10 will be described with reference to FIG. The adhesive application device 10 includes a surface plate 11 on which a base material 13 is disposed, and an application mechanism 15 that applies an adhesive 30 to the base material 13. In this case, the coating mechanism 15 is provided above the surface plate 11 and is disposed so as to extend in the width direction of the base material 13. The surface plate 11 is provided with a cooling mechanism 12 that solidifies the adhesive 30 applied on the base material 13.
As shown in FIGS. 1 (a) and 1 (b), the cooling mechanism 12 includes a surface plate that is formed inside the surface plate 11 and through which a refrigerant channel 12a through which a refrigerant (not shown) circulates and a hose 12b. 11 has a refrigerant circulation device 12c that circulates the refrigerant in the refrigerant flow path 12a. For example, water or oil is used as the refrigerant. In addition, the temperature and flow rate of the refrigerant sent from the refrigerant circulation device 12c are controlled by the control device 50, thereby controlling the speed of cooling the adhesive 30 applied on the base material 13. it can.

  Next, the coating mechanism 15 will be described. The coating mechanism 15 has a width corresponding to the width direction of the base material 13, is provided on the top surface of the coating die head 17 and the coating die head 17 for coating the adhesive on the base material 13, and extends in the width direction of the coating die head 17. A plurality of, for example, five adhesive supply mechanisms 16 are arranged. Each adhesive supply mechanism 16 is connected to an adhesive tank 18 via a hose 19, and a valve (not shown) provided inside each adhesive supply mechanism 16 is opened, whereby the adhesive tank An adhesive 30 is supplied from 18 to the coating die head 17. Opening and closing of the valves provided in each adhesive supply mechanism 16 is independently controlled by the control device 50.

In addition, an opening 17 a that has a width corresponding to the width direction of the substrate 13 and discharges the adhesive 30 supplied to the coating die head 17 onto the substrate 13 is formed at the lower end of the coating die head 17. .
When the valve provided inside each adhesive supply mechanism 16 is opened by the control device 50, the adhesive 30 is supplied to the coating die head 17 via each adhesive supply mechanism 16, and the supplied adhesive 30 is The ink is discharged from the opening 17a onto the substrate 13. At this time, the surface plate 11 on which the base material 13 is disposed is moved with respect to the coating mechanism 15 in a direction orthogonal to the direction in which the coating mechanism 15 is disposed, as will be described later. It is evenly applied on top.

  Next, the surface plate 11 on which the base material 13 is arranged will be described. The surface plate 11 can be moved by the drive mechanism 14 in a direction orthogonal to the arrangement direction of the coating mechanism 15. In this case, the drive mechanism 14 supports the surface plate 11 from below, a pair of rails 14b that supports the transport table 14a from below and extends in a direction orthogonal to the arrangement direction of the coating mechanism 15. And a piston rod 14 c that is fixed to the side surface of the transport table 14 a and that expands and contracts in the arrangement direction of the coating mechanism 15. Then, by expanding and contracting the piston rod 14c of the drive mechanism 14, the surface plate 11 supported by the transport table 14a can move in a direction perpendicular to the arrangement direction of the application mechanism 15 with respect to the application mechanism 15. It becomes. The expansion / contraction speed of the piston rod 14 c of the drive mechanism 14 is controlled by the control device 50.

Adhesive Application Method Next, an adhesive application method will be described with reference to FIGS.

  First, as shown in FIG. 1, the base material 13 is arrange | positioned on the surface plate 11 in which the cooling mechanism 12 is provided. Next, according to the adhesive application method shown in FIG. 3, the control device 50 controls the timing at which the application mechanism 15 discharges the adhesive 30 and the moving speed of the surface plate 11.

  In this case, the surface plate 11 is first arranged such that the application region start end 27 a corresponding to the start end 27 of the adhesive layer 21 in the base material 13 is located behind the application mechanism 15 (left side in FIG. 1). Next, the surface plate 11 is moved in the direction orthogonal to the arrangement direction of the coating mechanism 15 toward the front (right side in FIG. 1) so that the moving speed becomes V1 (time = T1). Thereafter, when the coating region start end 27a corresponding to the start end 27 of the adhesive layer 21 of the base material 13 reaches just below the coating mechanism 15, each of the coating mechanisms 15 is moved in a state where the surface plate 11 is moved at the speed V1. A valve (not shown) provided inside the adhesive supply mechanism 16 is opened, whereby the adhesive 30 is supplied to the coating die head 17 (time = T2). The supplied adhesive 30 is discharged from the opening 17a of the coating die head 17, and as a result, the adhesive 30 is uniformly coated on the substrate 13 while the surface plate 11 moves at the speed V1 with respect to the coating mechanism 15. Is done.

  Thereafter, when the application region end 28a corresponding to the end 28 of the adhesive layer 21 of the base material 13 reaches just below the application mechanism 15, a valve (inside each adhesive supply mechanism 16 of the application mechanism 15) ( (Not shown) is closed, and the supply of the adhesive 30 to the coating die head 17 is shut off. At the same time, the movement of the surface plate 11 is also stopped by the control device 50 (time = T3).

  Next, the adhesive 30 is cooled by the cooling mechanism 12 provided on the surface plate 11 so that the adhesive 30 applied on the substrate 13 is solidified. At this time, the temperature and flow rate of the refrigerant circulating in the refrigerant flow path 12 a inside the surface plate 11 are controlled by the control device 50 so that the cooling rate becomes an optimum value corresponding to the viscosity of the adhesive 30. As a result, the adhesive 30 applied on the substrate 13 is solidified, and the adhesive layer 21 is formed on the substrate 13.

  By the way, when applying the adhesive 30 on the base material 13, as described above, the surface plate 11 is moved in advance with respect to the application mechanism 15 at the moving speed V <b> 1, and then the adhesive layer 21 of the base material 13 is moved. When the coating region start end 27a corresponding to the start end 27 reaches just below the coating mechanism 15, the adhesive 30 is discharged from the opening 17a of the coating die head 17 with the surface plate 11 moved at the speed V1. For this reason, as shown in FIG. 4, the thickness of the adhesive layer 21 does not become thicker at the start end 27 of the adhesive layer 21 than the other portions. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13.

  Thus, according to this Embodiment, the cooling mechanism 12 is provided in the surface plate 11 in which the base material 13 is arrange | positioned. For this reason, after the adhesive 30 is applied on the base material 13, the adhesive 30 is immediately cooled by the cooling mechanism 12 of the surface plate 11, and the adhesive 30 is solidified. Thereby, the adhesive layer 21 having no tackiness can be formed on the substrate 13.

  Further, according to the present embodiment, when the adhesive 30 is applied onto the base material 13, the surface plate 11 is moved in advance with respect to the application mechanism 15, and then the adhesive layer 21 of the base material 13 is moved. When the application region start end 27a corresponding to the start end 27 reaches the application mechanism 15, application of the adhesive 30 is started by the application mechanism 15 while the surface plate 11 is moved at the speed V1. For this reason, the thickness of the adhesive layer 21 does not become thicker at the starting end 27 of the adhesive layer 21 than other portions. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13.

  Next, the effect of the present invention will be described in comparison with a comparative example. As a comparative example, in FIG. 6, when the adhesive application method according to the first embodiment of the present invention is not used, that is, when the adhesive 30 is applied on the base material 13, An adhesive application method when the surface plate 11 is not moved will be described. FIG. 7 shows the thickness of the adhesive layer 21 formed on the base material 13 in this case.

  In the comparative example, first, the surface plate 11 is arranged so that the application region start end 27 a corresponding to the start end 27 of the adhesive layer 21 in the base material 13 is positioned directly below the application mechanism 15. Next, the surface plate 11 is moved forward in the direction orthogonal to the arrangement direction of the coating mechanism 15 so that the moving speed becomes V1 (time = T2). At the same time, a valve provided in each adhesive supply mechanism 16 of the application mechanism 15 is opened, and as a result, the adhesive 30 is applied onto the base material 13 under the moving speed V1 of the surface plate 11. .

  Thereafter, when the application region end 28 a corresponding to the end 28 of the adhesive layer 21 in the base material 13 reaches just below the application mechanism 15, a valve provided inside each adhesive supply mechanism 16 of the application mechanism 15. It is closed and the supply of the adhesive 30 to the coating die head 17 is shut off. At the same time, the movement of the surface plate 11 is also stopped by the control device 50 (time = T3).

In this case, when the surface plate 11 is moved so that the moving speed becomes V1 (time = T2), a required time is required until the moving speed of the surface plate 11 reaches V1. On the other hand, the adhesive 30 is applied on the base material 13 even before the moving speed of the surface plate 11 reaches V1. For this reason, the thickness of the adhesive layer 21 formed on the base material 13 in the vicinity of the start end 27 is thicker than other portions.
On the other hand, according to the present embodiment, as described above, when the adhesive 30 is applied on the substrate 13, the surface plate 11 is moved in advance with respect to the application mechanism 15, and then the substrate 13, when the application region start end 27 a corresponding to the start end 27 of the adhesive layer 21 reaches the application mechanism 15, the application of the adhesive 30 is started by the application mechanism 15. For this reason, the thickness of the adhesive layer 21 does not become thicker at the starting end 27 of the adhesive layer 21 than other portions. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13.

  In the present embodiment, the cooling mechanism 12 includes a refrigerant flow path 12a formed inside the surface plate 11 through which a refrigerant (not shown) circulates, and a refrigerant flow in the surface plate 11 via the hose 12b. The example which has the refrigerant | coolant circulation apparatus 12c which circulates a refrigerant | coolant to the path 12a was shown. However, the present invention is not limited to this, and the cooling mechanism 12 may be a cooling mechanism by air cooling. In this case, a blower mechanism (not shown) for blowing air to the adhesive 30 applied to the base material 13 is provided on the surface plate 11, and the adhesive 30 is applied onto the base material 13 by the application mechanism 15. Then, the adhesive layer 21 having no tackiness is formed on the base material 13 by spraying air on the applied adhesive 30.

  Moreover, in this Embodiment, the surface plate 11 showed the example which can be moved to the direction orthogonal to the arrangement direction of the application | coating mechanism 15 with the drive mechanism 14. FIG. However, the present invention is not limited to this, and the drive mechanism 15 moves in a direction orthogonal to the arrangement direction of the coating mechanism 15 in a state where the surface plate 11 is fixed. It may be applied.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 8 is a diagram showing an adhesive application method according to the second embodiment of the present invention, and FIG. 9 is an adhesion formed on a substrate in the second embodiment of the present invention. It is a figure which shows the thickness of an agent layer.

  The second embodiment shown in FIGS. 8 and 9 is different only in the moving speed of the surface plate 11, and the other configurations are substantially the same as those of the first embodiment shown in FIGS. . In the second embodiment shown in FIG. 8 and FIG. 9, the same parts as those in the first embodiment shown in FIG. 1 to FIG.

  The timing at which the coating mechanism 15 discharges the adhesive 30 and the moving speed of the surface plate 11 are controlled according to the adhesive coating method shown in FIG. In this case, the surface plate 11 is first arranged such that the application region start end 27 a corresponding to the start end 27 of the adhesive layer 21 of the base material 13 is positioned directly below the application mechanism 15. Next, the surface plate 11 is moved forward in the direction orthogonal to the arrangement direction of the coating mechanism 15 so that the moving speed becomes V1 (time = T2). At the same time, a valve provided in each adhesive supply mechanism 16 of the coating mechanism 15 is opened, and as a result, the surface plate 11 adheres to the substrate 13 while moving to the coating mechanism 15 at a speed V1. The agent 30 is uniformly applied.

  Thereafter, when the application region end 28 a corresponding to the end 28 of the adhesive layer 21 in the base material 13 reaches just below the application mechanism 15, a valve provided inside each adhesive supply mechanism 16 of the application mechanism 15. It is closed and the supply of the adhesive 30 to the coating die head 17 is shut off. At the same time, the moving speed of the surface plate 11 is reduced from V1 to V2 by the control device 50 (time = T3).

  After the moving speed of the surface plate 11 is decelerated from V1 to V2, the movement of the surface plate 11 is stopped by the control device 50 after a certain time has elapsed (time = T4). Next, the adhesive 30 is cooled by the cooling mechanism 12 provided on the surface plate 11 so that the adhesive 30 applied on the base 13 is solidified, whereby the adhesive layer is formed on the base 13. 21 is formed.

  By the way, after the valve provided in each adhesive supply mechanism 16 of the application mechanism 15 is closed and the supply of the adhesive 30 to the application die head 17 is shut off, the surface plate 11 is kept for a certain period of time. The coating mechanism 15 is moved at a moving speed V2. For this reason, as shown in FIG. 9, the thickness of the adhesive layer 21 does not become thicker at the end 28 of the adhesive layer 21 than the other portions. When the surface plate 11 is stopped (time = T4), the terminal end 28 of the adhesive layer 21 is at a position sufficiently away from the coating mechanism 15. Therefore, when the surface plate 11 is stopped, the adhesive applied on the substrate 13 does not adhere to the coating die head 17 of the coating mechanism 15 and the surface of the coating die head 17 is not contaminated. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13 and the surface of the coating die head 17 can be kept clean.

  As described above, according to the present embodiment, when the adhesive 30 is applied on the base material 13, the application region end 28 a corresponding to the end 28 of the adhesive layer 21 of the base material 13 reaches the application mechanism 15. Even after the application of the adhesive 30 by the application mechanism 15 is stopped, the movement of the surface plate 11 with respect to the application mechanism 15 is continued. For this reason, at the end 28 of the adhesive layer 21, the thickness of the adhesive layer 21 does not become thicker than other portions, and when the surface plate 11 is stopped (time = T4), the adhesive agent The end 28 of the layer 21 is at a position sufficiently away from the coating mechanism 15. Therefore, when the surface plate 11 is stopped, the adhesive applied on the substrate 13 does not adhere to the coating die head 17 of the coating mechanism 15 and the surface of the coating die head 17 is not contaminated. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13 and the surface of the coating die head 17 can be kept clean.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. Here, FIG. 10 is a diagram showing an adhesive application method according to the third embodiment of the present invention, and FIG. 11 is a diagram showing an adhesion formed on a substrate in the third embodiment of the present invention. It is a figure which shows the thickness of an agent layer.

  The third embodiment shown in FIGS. 10 and 11 differs only in the moving speed of the surface plate 11, and the other configurations are substantially the same as those of the first embodiment shown in FIGS. . In the third embodiment shown in FIG. 10 and FIG. 11, the same parts as those in the first embodiment shown in FIG. 1 to FIG.

  The timing at which the coating mechanism 15 discharges the adhesive 30 and the moving speed of the surface plate 11 are controlled according to the adhesive coating method shown in FIG. In this case, the surface plate 11 is first arranged such that the application region start end 27 a corresponding to the start end 27 of the adhesive layer 21 of the base material 13 is located behind the application mechanism 15. Next, the surface plate 11 is moved forward in the direction orthogonal to the arrangement direction of the coating mechanism 15 so that the moving speed becomes V1 (time = T1). Thereafter, when the coating region start end 27a corresponding to the start end 27 of the adhesive layer 21 of the base material 13 reaches just below the coating mechanism 15, each of the coating mechanisms 15 is moved in a state where the surface plate 11 is moved at the speed V1. The valve provided in the adhesive supply mechanism 16 is opened, and thereby the adhesive 30 is supplied to the coating die head 17 (time = T2). The supplied adhesive 30 is discharged from the opening 17a of the coating die head 17, and as a result, the adhesive 30 is uniformly coated on the substrate 13 while the surface plate 11 moves at the speed V1 with respect to the coating mechanism 15. Is done.

  Thereafter, when the application region end 28 a corresponding to the end 28 of the adhesive layer 21 in the base material 13 reaches just below the application mechanism 15, a valve provided inside each adhesive supply mechanism 16 of the application mechanism 15. It is closed and the supply of the adhesive 30 to the coating die head 17 is shut off. At the same time, the moving speed of the surface plate 11 is reduced from V1 to V2 by the control device 50 (time = T3).

  After the movement speed of the surface plate 11 is decelerated from V1 to V2, the movement of the surface plate 11 is stopped by the control device 50 after a certain period of time (time = T4). Next, the adhesive 30 is cooled by the cooling mechanism 12 provided on the surface plate 11 so that the adhesive 30 applied on the base 13 is solidified, whereby the adhesive layer is formed on the base 13. 21 is formed.

  By the way, when applying the adhesive 30 on the base material 13, as described above, the surface plate 11 is moved in advance with respect to the application mechanism 15 at the moving speed V <b> 1, and then the adhesive layer 21 of the base material 13 is moved. When the coating region start end 27a corresponding to the start end 27 reaches just below the coating mechanism 15, the adhesive 30 is discharged from the opening 17a of the coating die head 17 with the surface plate 11 moved at the speed V1. For this reason, as shown in FIG. 11, the thickness of the adhesive layer 21 does not become thicker at the start end 27 of the adhesive layer 21 than the other portions. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13.

  Further, after the valves provided in the adhesive supply mechanisms 16 of the coating mechanism 15 are closed and the supply of the adhesive 30 to the coating die head 17 is shut off, the surface plate 11 is kept for a certain period. The coating mechanism 15 is moved at a moving speed V2. For this reason, as shown in FIG. 11, the thickness of the adhesive layer 21 does not become thicker at the end 28 of the adhesive layer 21 than the other portions. When the surface plate 11 is stopped (time = T4), the terminal end 28 of the adhesive layer 21 is at a position sufficiently away from the coating mechanism 15. Therefore, when the surface plate 11 is stopped, the adhesive applied on the substrate 13 does not adhere to the coating die head 17 of the coating mechanism 15 and the surface of the coating die head 17 is not contaminated. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13 and the surface of the coating die head 17 can be kept clean.

  As described above, according to the present embodiment, when the adhesive 30 is applied on the base material 13, the surface plate 11 is moved in advance with respect to the application mechanism 15, and then the adhesive layer of the base material 13. When the application region start end 27a corresponding to the start end 27 of 21 reaches the application mechanism 15, application of the adhesive 30 is started by the application mechanism 15 with the surface plate 11 moved at the speed V1. For this reason, the thickness of the adhesive layer 21 does not become thicker at the starting end 27 of the adhesive layer 21 than other portions. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13.

  Further, according to the present embodiment, when the adhesive 30 is applied on the base material 13, when the application region end 28 a corresponding to the end 28 of the adhesive layer 21 of the base material 13 reaches the application mechanism 15. Even after the application of the adhesive 30 by the application mechanism 15 is stopped, the movement of the surface plate 11 with respect to the application mechanism 15 is continued. For this reason, at the end 28 of the adhesive layer 21, the thickness of the adhesive layer 21 does not become thicker than other portions, and when the surface plate 11 is stopped (time = T4), the adhesive agent The end 28 of the layer 21 is at a position sufficiently away from the coating mechanism 15. Therefore, when the surface plate 11 is stopped, the adhesive applied on the substrate 13 does not adhere to the coating die head 17 of the coating mechanism 15 and the surface of the coating die head 17 is not contaminated. As a result, the adhesive layer 21 having a uniform thickness can be formed on the substrate 13 and the surface of the coating die head 17 can be kept clean.

FIG. 1 is a diagram showing an adhesive application device according to a first embodiment of the present invention. FIG. 2 is a diagram showing an adhesive layer formed on a substrate in the first embodiment of the present invention. FIG. 3 is a diagram showing an adhesive application method according to the first embodiment of the present invention. FIG. 4 is a diagram showing the thickness of an adhesive layer formed on a substrate in the first embodiment of the present invention. FIG. 5 is a view showing a non-contact IC card having a base material on which an adhesive layer is formed. The figure which shows the adhesive agent coating method when not using the adhesive agent coating method in the 1st Embodiment of this invention. The figure which shows the thickness of the adhesive bond layer formed on the base material when not using the adhesive agent coating method in the 1st Embodiment of this invention. FIG. 8 is a diagram showing an adhesive application method according to the second embodiment of the present invention. FIG. 9 is a diagram showing the thickness of an adhesive layer formed on a substrate in the second embodiment of the present invention. FIG. 10 is a diagram showing an adhesive application method according to the third embodiment of the present invention. FIG. 11 is a diagram showing the thickness of an adhesive layer formed on a substrate in the third embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Adhesive coating device 11 Surface plate 12 Cooling mechanism 12a Refrigerant circulation device 12b Hose 12c Refrigerant flow path 13 Base material 14a Carriage 14b Rail 14c Piston rod 15 Application mechanism 16 Adhesive supply mechanism 17 Application die head 17a Application die head opening 18 Adhesive tank 19 Hose 21 Adhesive layer 22 Substrate 25 Front end 26 of base material Rear end 27 of base material 27 Start end 27a Start of application area 28 End 28b Application area end 30 Adhesive 31 Non-contact IC card 32 Inlet base material 33 Antenna 34 IC chip 35 inlet sheet 50 control device

Claims (6)

Arranging the base material on a surface plate provided with a cooling mechanism;
The surface plate on which the base material is arranged is moved relative to the coating mechanism arranged so as to extend in the width direction of the base material in a direction perpendicular to the direction in which the coating mechanism is arranged, and the adhesive is applied onto the base material by the coating mechanism. A step of applying
A step of cooling the adhesive by a cooling mechanism of the surface plate so that the adhesive applied on the substrate is solidified , and
The process of applying the adhesive on the substrate by the application mechanism is as follows:
A step of moving the surface plate relative to the coating mechanism in advance at the first moving speed V1, and starting the application of the adhesive by the coating mechanism when the coating region start end of the substrate reaches the coating mechanism;
A step of stopping coating by the coating mechanism when the coating region end of the substrate disposed on the surface plate that is moving relative to the coating mechanism at the first moving speed V1 reaches the coating mechanism;
And continuing the relative movement of the platen with respect to the coating mechanism at the second movement speed V2 decelerated from the first movement speed V1 after stopping the application by the coating mechanism. . A surface plate on which the base material is disposed;
An application mechanism that is provided above the surface plate and arranged to extend in the width direction of the base material, and applies an adhesive to the base material;
A cooling mechanism provided on the surface plate and solidifying the adhesive applied on the substrate,
The surface plate is movable relative to the coating mechanism in a direction perpendicular to the direction of arrangement of the coating mechanism ,
A control device for controlling the coating mechanism and the surface plate;
The control device
The surface plate is moved relative to the coating mechanism in advance at the first moving speed V1, and when the start of the coating area of the substrate reaches the coating mechanism, the coating mechanism starts coating the adhesive.
When the coating region end of the substrate disposed on the surface plate that is moving relative to the coating mechanism at the first moving speed V1 reaches the coating mechanism, the coating mechanism stops coating.
After stopping the application by the application mechanism, the relative movement of the surface plate with respect to the application mechanism is continued at the second movement speed V2 decelerated from the first movement speed V1.
The adhesive coating apparatus characterized by controlling the coating mechanism and the surface plate . The adhesive application device according to claim 2 , wherein the cooling mechanism is a cooling mechanism using a refrigerant. The adhesive application device according to claim 2 , wherein the cooling mechanism is a cooling mechanism by air cooling. The adhesive application device according to any one of claims 2 to 4 , wherein the cooling mechanism is capable of controlling a cooling rate at the time of cooling. The adhesive application device according to any one of claims 2 to 5 , wherein the adhesive is made of a moisture curable urethane resin.

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