JP5193994B2 - 光電池用の支持体を金属化する装置及び方法 - Google Patents
光電池用の支持体を金属化する装置及び方法 Download PDFInfo
- Publication number
- JP5193994B2 JP5193994B2 JP2009502341A JP2009502341A JP5193994B2 JP 5193994 B2 JP5193994 B2 JP 5193994B2 JP 2009502341 A JP2009502341 A JP 2009502341A JP 2009502341 A JP2009502341 A JP 2009502341A JP 5193994 B2 JP5193994 B2 JP 5193994B2
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- Prior art keywords
- support
- screen
- support base
- metallization
- conductor track
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000004020 conductor Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000001465 metallisation Methods 0.000 claims description 17
- 238000003892 spreading Methods 0.000 claims description 13
- 230000007480 spreading Effects 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000008569 process Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photovoltaic Devices (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims (10)
- 導体トラック(13)を作成することができる第1の面である前面(11a)と、前記第1の面(11a)と反対側の第2の面(11b)とを有する光電池用の支持体(11)を金属化する装置であって、
前記装置は、前記導体トラックを得るために前記第1の面(11a)に金属組成物を移すことができる金属化手段(16,19,20)と、前記支持体(11)を前記第2の面(11b)を介して置くことができる支持台(28)とを有し、
前記金属化手段は、前記第1の面(11a)と接触できる少なくとも1枚のスクリーン(16)と、前記第1の面(11a)に前記金属組成物を塗り、付着させるために、摺動可能で前記スクリーン(16)に圧力を加えることが可能である、少なくとも1個の広げ部材(20)とを有し、
前記支持台(28)は、最小圧力を受けたときでも一時的に変形できるような高い弾性率を有する弾性的に変形する材料で作成され、前記金属化手段(16,19、20)が金属化工程において前記支持体(11)を押圧すると、前記金属化手段(16,19、20)の動作に従って前記支持台自体が前記第2の面(11b)の凹凸(29)に入り込んで、前記支持体(11)の前記第2の面(11b)に適合し、さらに、
前記第1の面(11a)の起伏の形状に適合するように、前記スクリーン(16)が弾性変形可能である、装置。 - 前記支持台(28)は、高分子化合物で作成された、請求項1に記載の装置。
- 前記支持台(28)は、シリコンで作成された、請求項1又は2に記載の装置。
- 前記支持台(28)は、ゴムで作成された、請求項1又は2に記載の装置。
- 前記支持台(28)は、ポリ塩化ビニル(PVC)で作成された、請求項1又は2に記載の装置。
- 前記支持台(28)は、前記支持台(28)を前記スクリーン(16)に対して側方に配置する第1の位置から前記支持台(28)を前記スクリーン(16)の下に配置する第2の位置まで少なくとも選択的に移動させることができる移動体(27)と連結された、請求項1に記載の装置。
- 前記広げ部材(20)は、その摺動方向又は前記支持体(11)の長手軸と実質的に平行な回転軸(X)に対して揺動する、請求項1に記載の装置。
- 前記広げ部材(20)は、前記スクリーン(16)に向かって選択的に移動可能であり、その移動と前記スクリーン(16)に印加される圧力を制限するために移動終端手段(25)と協力することができる当接手段(24)と連結された、請求項1〜7のいずれか1項に記載の装置。
- 前記広げ部材は、少なくとも1枚のへら又はブレード(20)を有し、ブレード(20)は下部には、前記スクリーン(16)に作用することができる弾性的に変形する材料で作成されたエッジ(26)を備える、請求項1〜8のいずれか1項に記載の装置。
- 金属組成物によって導体トラック(13)を上に作成することができる第1の面である前面(11a)と、前記第1の面(11a)と反対側の第2の面とを有する光電池用の支持体(11)を金属化する方法であって、
前記方法は、少なくとも、少なくとも1枚のスクリーン(16)を有し、その上で広げ部材(20)が圧力下で働くことができる、前記導体トラック(13)を再現する第1の金属化手段(16)に前記金属組成物を塗布する第1の段階と、
圧力下で前記金属組成物を前記第1の面(11a)に移して前記導体トラック(13)を得るために前記第1の金属化手段(16)を前記第1の面(11a)と接触させる第2の段階とを含み、
前記第2の段階で支持台(28)上に前記支持体(11)が前記第2の面(11b)を介して置かれ、前記支持台(28)は高い弾性率を有する材料で作成され、最小圧力を受けたときでも一時的に変形でき、金属化工程において前記支持体(11)が前記第1の金属化手段(16)に押圧されると、前記第1の金属化手段(16)によって印加される圧力に従って前記支持台自体が前記支持体(11)の凹凸に入り込むために前記支持体(11)の前記第2の面(11b)に適合することができ、さらに、
前記第2の段階で、前記スクリーン(16)は、前記第1の面(11a)の断面形状に少なくとも部分的に適合するように弾性変形される、方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IT2006/000228 WO2007113877A1 (en) | 2006-03-31 | 2006-03-31 | Apparatus and method to metalize supports for photovoltaic cells |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009532854A JP2009532854A (ja) | 2009-09-10 |
JP5193994B2 true JP5193994B2 (ja) | 2013-05-08 |
Family
ID=37668092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009502341A Expired - Fee Related JP5193994B2 (ja) | 2006-03-31 | 2006-03-31 | 光電池用の支持体を金属化する装置及び方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2008302A1 (ja) |
JP (1) | JP5193994B2 (ja) |
CN (1) | CN101496155B (ja) |
TW (1) | TW200802912A (ja) |
WO (1) | WO2007113877A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8901010B2 (en) * | 2013-03-15 | 2014-12-02 | Sunpower Corporation | Methods for improving solar cell lifetime and efficiency |
CN106211588A (zh) * | 2016-08-16 | 2016-12-07 | 成都俱进科技有限公司 | 一种pcb板加工定位组件 |
CN106102343A (zh) * | 2016-08-16 | 2016-11-09 | 成都俱进科技有限公司 | 一种印刷电路板定位装置 |
CN106102344A (zh) * | 2016-08-16 | 2016-11-09 | 成都俱进科技有限公司 | 可对pcb制板进行稳定夹持的定位工装 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59152766U (ja) * | 1983-03-30 | 1984-10-13 | 富士通株式会社 | 基板ホルダ− |
JPH01312820A (ja) * | 1988-06-10 | 1989-12-18 | Murata Mfg Co Ltd | スクリーン印刷用パレット |
JP2544962Y2 (ja) * | 1990-01-30 | 1997-08-20 | 日本電気株式会社 | 謄写式ペースト印刷機用バキュームパット |
JPH04199895A (ja) * | 1990-11-29 | 1992-07-21 | Ibiden Co Ltd | ハンダ印刷装置におけるプリント基板支持装置 |
JP3250574B2 (ja) * | 1992-12-28 | 2002-01-28 | キヤノン株式会社 | 光起電力素子及びその製造方法、並びに発電システム |
JP3337764B2 (ja) * | 1993-07-16 | 2002-10-21 | 松下電器産業株式会社 | スクリーン印刷方法およびスクリーン印刷機 |
JPH07178887A (ja) * | 1993-12-24 | 1995-07-18 | Toshiba Corp | 印刷装置 |
US5996487A (en) | 1997-04-11 | 1999-12-07 | Matsushita Electric Industrial Co., Ltd. | Solder paste screen printing apparatus and solder paste screen printing method |
JP4393735B2 (ja) * | 2001-12-11 | 2010-01-06 | ヤマハ発動機株式会社 | スクリーン印刷機 |
DE10222119B4 (de) * | 2002-05-17 | 2004-11-11 | Asys Automatisierungssysteme Gmbh | Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster |
-
2006
- 2006-03-31 EP EP06745260A patent/EP2008302A1/en not_active Withdrawn
- 2006-03-31 CN CN2006800541171A patent/CN101496155B/zh not_active Expired - Fee Related
- 2006-03-31 JP JP2009502341A patent/JP5193994B2/ja not_active Expired - Fee Related
- 2006-03-31 WO PCT/IT2006/000228 patent/WO2007113877A1/en active Application Filing
-
2007
- 2007-03-26 TW TW096110337A patent/TW200802912A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP2008302A1 (en) | 2008-12-31 |
JP2009532854A (ja) | 2009-09-10 |
CN101496155A (zh) | 2009-07-29 |
WO2007113877A1 (en) | 2007-10-11 |
CN101496155B (zh) | 2010-07-28 |
TW200802912A (en) | 2008-01-01 |
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