JP5176144B2 - 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 Download PDF

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Publication number
JP5176144B2
JP5176144B2 JP2008212690A JP2008212690A JP5176144B2 JP 5176144 B2 JP5176144 B2 JP 5176144B2 JP 2008212690 A JP2008212690 A JP 2008212690A JP 2008212690 A JP2008212690 A JP 2008212690A JP 5176144 B2 JP5176144 B2 JP 5176144B2
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Prior art keywords
resin composition
group
optical semiconductor
thermosetting light
light reflecting
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JP2008212690A
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Japanese (ja)
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JP2009068007A (ja
JP2009068007A5 (enExample
Inventor
勇人 小谷
直之 浦崎
良一 池澤
高士 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008212690A priority Critical patent/JP5176144B2/ja
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Publication of JP2009068007A5 publication Critical patent/JP2009068007A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008212690A 2007-08-22 2008-08-21 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 Active JP5176144B2 (ja)

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JP2008212690A JP5176144B2 (ja) 2007-08-22 2008-08-21 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007215903 2007-08-22
JP2007215903 2007-08-22
JP2008212690A JP5176144B2 (ja) 2007-08-22 2008-08-21 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置

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JP2009068007A JP2009068007A (ja) 2009-04-02
JP2009068007A5 JP2009068007A5 (enExample) 2011-12-08
JP5176144B2 true JP5176144B2 (ja) 2013-04-03

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5108825B2 (ja) 2009-04-24 2012-12-26 信越化学工業株式会社 光半導体装置用シリコーン樹脂組成物及び光半導体装置
JP5621236B2 (ja) * 2009-10-05 2014-11-12 日立化成株式会社 ウレタン樹脂組成物、硬化体及び硬化体を用いた光半導体装置
JP5581643B2 (ja) * 2009-10-05 2014-09-03 日立化成株式会社 ウレタン樹脂組成物、硬化体及び硬化体を用いた光半導体装置
KR101103674B1 (ko) 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
JP2014517110A (ja) * 2011-05-18 2014-07-17 株式會社ネペスエーエムシー 熱硬化型光反射用樹脂組成物及びその製造方法、熱硬化型光反射用樹脂組成物によって製造された光半導体素子搭載用反射板及びそれを含む光半導体装置
JP5834560B2 (ja) * 2011-07-12 2015-12-24 日立化成株式会社 エポキシ樹脂硬化剤、エポキシ樹脂組成物及び光半導体装置
JP5861356B2 (ja) * 2011-09-26 2016-02-16 大日本印刷株式会社 光半導体装置用反射部材付リードフレーム、光半導体装置用リードフレーム、光半導体装置用リードフレーム基板、光半導体装置、および、光半導体装置用反射部材付リードフレームの製造方法、並びに、光半導体装置の製造方法
JP5917137B2 (ja) * 2011-12-27 2016-05-11 株式会社カネカ 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
JP5938912B2 (ja) 2012-01-13 2016-06-22 日亜化学工業株式会社 発光装置及び照明装置
JP2012162729A (ja) * 2012-04-11 2012-08-30 Hitachi Chemical Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2014195081A (ja) * 2014-04-07 2014-10-09 Hitachi Chemical Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2016028426A (ja) * 2015-08-12 2016-02-25 日立化成株式会社 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
CN108212094B (zh) * 2016-12-09 2020-11-06 上海海关工业品与原材料检测技术中心 双吡唑功能化sba-15介孔材料及其制备方法和应用
JP2017147454A (ja) * 2017-04-04 2017-08-24 日立化成株式会社 光反射用熱硬化性樹脂組成物の製造方法及び光半導体素子搭載用基板の製造方法
JP6981794B2 (ja) * 2017-06-30 2021-12-17 スリーエム イノベイティブ プロパティズ カンパニー エポキシ接着剤
CN111868170B (zh) * 2018-03-16 2024-08-06 亨斯迈先进材料许可(瑞士)有限公司 存储稳定且固化性的树脂组合物

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。

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