JP5169255B2 - Microwave processing equipment - Google Patents

Microwave processing equipment Download PDF

Info

Publication number
JP5169255B2
JP5169255B2 JP2008017753A JP2008017753A JP5169255B2 JP 5169255 B2 JP5169255 B2 JP 5169255B2 JP 2008017753 A JP2008017753 A JP 2008017753A JP 2008017753 A JP2008017753 A JP 2008017753A JP 5169255 B2 JP5169255 B2 JP 5169255B2
Authority
JP
Japan
Prior art keywords
power
unit
units
microwave
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008017753A
Other languages
Japanese (ja)
Other versions
JP2009181728A (en
Inventor
義治 大森
等隆 信江
健治 安井
誠 三原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008017753A priority Critical patent/JP5169255B2/en
Publication of JP2009181728A publication Critical patent/JP2009181728A/en
Application granted granted Critical
Publication of JP5169255B2 publication Critical patent/JP5169255B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/66Circuits
    • H05B6/68Circuits for monitoring or control
    • H05B6/686Circuits comprising a signal generator and power amplifier, e.g. using solid state oscillators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/70Feed lines
    • H05B6/705Feed lines using microwave tuning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/72Radiators or antennas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/80Apparatus for specific applications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/80Apparatus for specific applications
    • H05B6/806Apparatus for specific applications for laboratory use
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/04Heating using microwaves
    • H05B2206/044Microwave heating devices provided with two or more magnetrons or microwave sources of other kind
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B40/00Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Constitution Of High-Frequency Heating (AREA)

Description

本発明は、半導体素子を用いて構成したマイクロ波発生部を備えたマイクロ波処理装置に関するものである。   The present invention relates to a microwave processing apparatus including a microwave generation unit configured using a semiconductor element.

従来、この種のマイクロ波処理装置は、加熱室を6面以上の多面体で形成し、各面の一部あるいは全部の面から放射アンテナを加熱室内に突出して配置した従来技術がある(例えば、特許文献1参照)。互いの放射アンテナを異なる面に配したことで相互干渉を防止でき、放射アンテナがそれぞれ異なる方向を向いているので放射された電波は加熱室内のあらゆる方向に伝搬し、壁面にて反射して散乱するため、加熱室内で電波は均一に分布する。   Conventionally, this type of microwave processing apparatus has a conventional technique in which a heating chamber is formed of six or more polyhedrons, and a radiating antenna is disposed so as to protrude from a part or all of each surface into the heating chamber (for example, Patent Document 1). Mutual interference can be prevented by arranging the radiating antennas on different surfaces, and since the radiating antennas are directed in different directions, the radiated radio waves propagate in all directions in the heating chamber and are reflected and scattered by the wall surface. Therefore, the radio waves are uniformly distributed in the heating chamber.

半導体発振部と、発振部の出力を複数に分割する分配部と、分配された出力をそれぞれ増幅する複数の増幅部と、増幅部の出力を合成する合成部とを有し、分配部と増幅部との間に位相器を設けた従来技術がある(例えば、特許文献2参照)。位相器制御で2出力の電力比率を変化させたり、2出力間の位相を同相あるいは逆相にしたりすることができる。   A semiconductor oscillation unit; a distribution unit that divides the output of the oscillation unit into a plurality of units; a plurality of amplification units that amplify the distributed outputs; and a synthesis unit that synthesizes the outputs of the amplification units. There is a conventional technique in which a phase shifter is provided between the two (see, for example, Patent Document 2). The power ratio of the two outputs can be changed by the phase shifter control, or the phase between the two outputs can be in phase or in phase.

被加熱物を収納した加熱室からマイクロ波発生部側に戻ってくる反射電力を検出し、その反射電力信号に基づいて、たとえば反射電力が最小になる発振周波数を追尾させる従来技術がある(例えば、特許文献3参照)。
特開昭52−19342号公報 特開昭56−132793号公報 特開昭56−96486号公報
There is a conventional technique for detecting the reflected power returning from the heating chamber in which the object to be heated is returned to the microwave generation unit and tracking the oscillation frequency at which the reflected power is minimized based on the reflected power signal (for example, And Patent Document 3).
JP-A-52-19342 JP 56-132793 A JP-A-56-96486

しかしながら、前記従来の複数給電方式における構成では、下記説明のように、加熱室内に収納されたさまざまな形状・種類・量の異なる被加熱物を所望の状態に加熱処理することは難しいという課題を有していた。   However, in the configuration of the conventional multiple power feeding method, as described below, it is difficult to heat-treat objects to be heated in various shapes, types, and quantities stored in a heating chamber to a desired state. Had.

放射アンテナ配置については、機器体積に占める加熱室容量の拡大化要望により、使用できるスペースは限られ、6面に設置するのは実質上困難である。また、異なる面に配置するだけでは相互干渉を確実に防止できない。   With regard to the arrangement of the radiating antennas, the space that can be used is limited due to the demand for expansion of the heating chamber capacity occupying the equipment volume, and it is practically difficult to install them on six surfaces. In addition, mutual interference cannot be reliably prevented only by disposing them on different surfaces.

位相制御については、相互干渉するマイクロ波間に働くので、アンテナ多面配置や異周波数動作との併用ができず広範囲の条件での効果は期待できない。   Since phase control works between microwaves that interfere with each other, it cannot be used in combination with multi-sided antenna arrangement or different frequency operation, and an effect under a wide range of conditions cannot be expected.

本発明は、上記従来の課題を解決するもので、給電部から放射するマイクロ波の励振方向の制御と、励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量の制御をそれぞれ最適化することで、さまざまな形状・種類・量の異なる被加熱物を所望の状態に加熱処理するマイクロ波発処理装置を提供することを目的とする。   The present invention solves the above-described conventional problems, and optimally controls the control of the excitation frequency of the microwave radiated from the power supply unit, the operation frequency and phase, and the power amplification amount associated with the control of the excitation direction. It aims at providing the microwave generation processing apparatus which heat-processes the to-be-heated object from which various shapes, a kind, and quantity differ in desired state.

前記従来の課題を解決するために、本発明のマイクロ波処理装置は、被加熱物を収容する加熱室と、マイクロ波を発生させる発振部と、前記発振部の出力を複数に分配して出力する電力分配部と、前記電力分配部の各々の出力位相を可変する複数の位相可変部と、前記電力分配部または、前記位相可変部の出力をそれぞれ電力増幅する増幅部と、前記増幅部の出力を前記加熱室に供給する複数の給電部と、前記複数の給電部の少なくとも1つに前記給電部から放射されるマイクロ波の励振方向を任意の方向に設定する手段と、前記複数の給電部間の位相を可変制御する手段とを有するマイクロ波処理装置であって、前記給電部から放射されるマイクロ波の励振方向を任意の方向に設定した前記給電部の組合せに対して、動作周波数や位相及び電力増幅量の制御を伴うマイクロ波処理手段と、透過及び反射電力量を検知する検出手段を備え、前記マイクロ波処理手段及び前記検出手段の実行において、前記給電部の励振方向に対する複数ある組合せから最適なものを判断し、前記
給電部の励振方向を再設定して、選択する組合せを切り替えながら加熱処理を行う構成とする。本発明は、給電部から放射されるマイクロ波の励振方向の制御と、励振方向の制御と関連付けて行う動作周波数、位相及び電力増幅量の制御を組み合わせて行い、さまざまな形状・種類・量の異なる被加熱物を所望の状態に加熱処理することができる。
In order to solve the above-described conventional problems, a microwave processing apparatus according to the present invention includes a heating chamber that accommodates an object to be heated, an oscillation unit that generates microwaves, and an output of the oscillation unit that is divided into a plurality of outputs. A power distribution unit, a plurality of phase variable units that vary the output phase of each of the power distribution units, an amplification unit that amplifies the power of each of the outputs of the power distribution unit or the phase variable unit, and A plurality of power supply units for supplying an output to the heating chamber; a means for setting an excitation direction of microwaves radiated from the power supply unit to at least one of the plurality of power supply units; A microwave processing apparatus having a means for variably controlling the phase between the units, wherein an operating frequency for the combination of the power feeding units in which the excitation direction of the microwave radiated from the power feeding unit is set to an arbitrary direction And phase and Microwave processing means with control of the amount of force amplification and detection means for detecting transmitted and reflected power amounts, and in the execution of the microwave processing means and the detection means, from a plurality of combinations with respect to the excitation direction of the power feeding unit Determine the best one and
It is set as the structure which resets the excitation direction of an electric power feeding part and performs heat processing, changing the combination to select . The present invention combines the control of the excitation direction of the microwave radiated from the power supply unit with the control of the operating frequency, phase, and power amplification amount associated with the control of the excitation direction, and has various shapes, types, and quantities. Different objects to be heated can be heat-treated in a desired state.

本発明のマイクロ波処理装置は、給電部から放射するマイクロ波の励振方向の制御と、励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量の制御を組み合わせて行い、さまざまな形状・種類・量の異なる被加熱物を所望の状態に加熱処理するマイクロ波処理装置を提供することができる。   The microwave processing apparatus of the present invention performs various combinations of the control of the excitation direction of the microwave radiated from the power feeding unit and the control of the operating frequency and phase and the amount of power amplification performed in association with the control of the excitation direction. It is possible to provide a microwave processing apparatus that heat-treats different types and amounts of objects to be heated to a desired state.

第1の発明は、被加熱物を収容する加熱室と、マイクロ波を発生させる発振部と、前記発振部出力を複数に分配して出力する電力分配部と、前記電力分配部出力間の位相を可変する位相可変部と、前記電力分配部または、前記位相可変部の出力を電力増幅する増幅部と、前記増幅部出力を前記加熱室に供給する複数の給電部と、前記複数の給電部の少なくとも1つに前記給電部から放射されるマイクロ波の電界または磁界の向き(以下、励振方向という)を任意の方向に設定する手段と、前記複数の給電部間の位相を可変制御する手段とを有するマイクロ波処理装置であって、前記給電部から放射されるマイクロ波の励振方向を任意の方向に設定した前記給電部の組合せに対して、動作周波数や位相及び電力増幅量の制御を伴うマイクロ波処理手段と、透過及び反射電力量を検知する検出手段を備え、前記マイクロ波処理手段及び前記検出手段の実行において、前記給電部の励振方向に対する複数ある組合せから最適なものを判断し、前記給電部の励振方向を再設定して、選択する組合せを切り替えながら加熱処理を行う構成としたものである。これにより、加熱室に収納した被加熱物に適した励振方向、動作周波数、位相および、出力での加熱処理を選択することができ、さまざまな形状・種類・量の異なる被加熱物それぞれに合わせ、所望の状態に加熱することができる。また、放射するマイクロ波の励振方向を制御することにより、相互干渉させる給電部の組合せと、相互干渉させない給電部の組合せを意図的に選択できる。 The first invention includes a heating chamber that houses an object to be heated, an oscillator for generating a microwave, a power distribution unit for outputting the distributed output of the oscillation part to a plurality, between the output of the power distribution unit a phase variable unit for varying the phase of the power distribution unit or the amplifier for power-amplifying the output of the phase variable parts, and a plurality of feeding parts supplying outputs to said heating chamber of said amplifying unit, said plurality Means for setting the direction of the electric field or magnetic field of the microwave radiated from the power supply unit to at least one of the power supply units (hereinafter referred to as the excitation direction), and the phase between the plurality of power supply units is variable. A microwave processing apparatus having a control means, wherein an operating frequency, a phase, and a power amplification amount for a combination of the power feeding units in which an excitation direction of microwaves radiated from the power feeding unit is set to an arbitrary direction Microphone with control A wave processing means, and a detection means for detecting the amount of transmitted and reflected power, and in the execution of the microwave processing means and the detection means, determine an optimum one from a plurality of combinations with respect to the excitation direction of the power feeding unit, In this configuration, the heat treatment is performed while resetting the excitation direction of the power feeding unit and switching the combination to be selected. This makes it possible to select the heat treatment in the excitation direction, operating frequency, phase, and output suitable for the object to be heated stored in the heating chamber, and to suit each object to be heated in various shapes, types, and quantities. Can be heated to the desired state. In addition, by controlling the excitation direction of the radiating microwave, it is possible to intentionally select a combination of feeding units that cause mutual interference and a combination of feeding units that do not cause mutual interference.

さらに、マイクロ波処理手段及び、検出手段それぞれに最適な励振方向の給電部組合せを使用でき、さまざまな形状・種類・量の異なる被加熱物に対しても所望の状態に加熱処理することができる。 Furthermore, it is possible to use a combination of power supply units in the optimum excitation direction for each of the microwave processing means and the detection means, and it is possible to heat the object to be heated in various shapes, types, and quantities to a desired state. .

以下、本発明の実施の形態について、図面を参照しながら説明する。なお、この実施の形態によって本発明が限定されるものではない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(実施の形態1)
図1は、本発明の第1の実施の形態におけるマイクロ波処理装置の構成図である。
(Embodiment 1)
FIG. 1 is a configuration diagram of a microwave processing apparatus according to the first embodiment of the present invention.

図1において、マイクロ波発生部は、半導体素子を用いて構成した発振部1a、1c、発振部1a、1cの出力を2分配する電力分配部2a、2c、電力分配部2a、2cそれぞれの出力から任意の位相ずれを発生させる位相可変部3a〜3d、位相可変部3a〜3dの出力を増幅する増幅部4a〜4d、増幅部4a〜4dによって増幅されたマイクロ波出力を加熱室内に放射する給電部5a〜5dおよび、増幅部4a〜4dと給電部5a〜5dを接続するマイクロ波伝送路に挿入され給電部5a〜5dから反射する電力を検出する電力検出部6a〜6d、電力検出部6a〜6dによって検出される反射電力に応じて、発振部1a、1cの発振周波数と、位相可変部3a〜3dの位相調整量および、増幅部4a〜4dの増幅量を制御する制御部7とで構成している。   In FIG. 1, the microwave generation unit includes oscillation units 1 a and 1 c configured using semiconductor elements, power distribution units 2 a and 2 c that distribute the outputs of the oscillation units 1 a and 1 c, and outputs of the power distribution units 2 a and 2 c. The phase variable units 3a to 3d that generate an arbitrary phase shift from the amplifiers, the amplifiers 4a to 4d that amplify the outputs of the phase variable units 3a to 3d, and the microwave output amplified by the amplifiers 4a to 4d are radiated into the heating chamber. Power detectors 5a to 5d, power detectors 6a to 6d that detect power reflected from the power feeders 5a to 5d inserted in the microwave transmission path connecting the amplifiers 4a to 4d and the power feeders 5a to 5d, and a power detector Control for controlling the oscillation frequencies of the oscillation units 1a and 1c, the phase adjustment amounts of the phase variable units 3a to 3d, and the amplification amounts of the amplification units 4a to 4d in accordance with the reflected power detected by 6a to 6d It is composed of a 7.

電力分配部2a、2cは、例えばウィルキンソン型分配器であってもよいし、ブランチライン型やラットレース型のような出力間に位相差を生じる分配器であってもかまわない。この電力分配部2a、2cによって各々の出力には発振部1a、1cから入力されたマイクロ波電力の略1/2の電力が伝送される。位相可変部3a〜3dは、印加電圧に応じて容量が変化する容量可変素子を用いて構成し、各々出力されるマイクロ波電力の位相差は0度から±180度の範囲を制御することができる。   The power distribution units 2a and 2c may be, for example, Wilkinson distributors, or may be distributors that generate a phase difference between outputs, such as a branch line type or a rat race type. The power distribution units 2a and 2c transmit substantially half of the microwave power input from the oscillation units 1a and 1c to the respective outputs. The phase variable units 3a to 3d are configured using a variable capacitance element whose capacitance changes according to the applied voltage, and the phase difference of the output microwave power can be controlled in the range of 0 to ± 180 degrees. it can.

増幅部4a〜4dは、低誘電損失材料から構成した誘電体基板の片面に形成した導電体パターンにて回路を構成し、各増幅部の増幅素子である半導体素子を良好に動作させる整合回路を配している。各々の機能ブロックを接続するマイクロ波伝送路は、誘電体基板の片面に設けた導電体パターンの伝送回路や、同軸ケーブルなどで形成している。電力検知部6a〜6dは、加熱室8側からマイクロ波発生部側にそれぞれ伝送するいわゆる反射波の電力を抽出するものであり、電力結合度をたとえば約40dBとし、反射電力の約1/10000の電力量を抽出する。この電力信号はそれぞれ、検波ダイオード(図示していない)で整流化しコンデンサ(図示していない)で平滑処理し、その出力信号を制御部7に入力させている。   The amplifying units 4a to 4d are configured by a conductor pattern formed on one side of a dielectric substrate made of a low dielectric loss material, and a matching circuit that operates the semiconductor element that is an amplifying element of each amplifying unit satisfactorily. Arranged. The microwave transmission path connecting each functional block is formed by a conductor pattern transmission circuit provided on one surface of a dielectric substrate, a coaxial cable, or the like. The power detectors 6a to 6d extract the power of so-called reflected waves that are transmitted from the heating chamber 8 side to the microwave generator side, respectively. The power coupling degree is, for example, about 40 dB, and the reflected power is about 1/10000. The amount of power is extracted. The power signals are rectified by a detection diode (not shown), smoothed by a capacitor (not shown), and the output signal is input to the control unit 7.

制御部7は、使用者が直接入力する被加熱物の加熱処理条件と、電力検知部6a〜6dからの検知情報に基づいて、給電部5a、5dから放射するマイクロ波の励振電界11a、11dの制御および、発振部1a、1cと増幅部4a〜4dのそれぞれに供給する駆動電力や、位相可変部3a〜3dに供給する電圧を励振方向の制御と関連付けて制御し、加熱室8内に収納された被加熱物を最適に加熱処理する。   The control unit 7 generates microwave excitation electric fields 11a and 11d radiated from the power supply units 5a and 5d based on the heat treatment condition of the object to be heated that is directly input by the user and the detection information from the power detection units 6a to 6d. And the driving power supplied to each of the oscillating units 1a, 1c and the amplifying units 4a to 4d and the voltage supplied to the phase variable units 3a to 3d are controlled in association with the control of the excitation direction. The stored object to be heated is optimally heat-treated.

なお、上記の説明では、位相可変部を2つ挿入した例で説明したが、電力分配部3aのいずれかの出力にのみ挿入し、その位相変化幅を0度から360度となるように構成することもできる。   In the above description, the example in which two phase variable units are inserted has been described. However, the phase change width is set to 0 degree to 360 degrees by inserting only one of the outputs of the power distribution unit 3a. You can also

また、本発明のマイクロ波処理装置は、被加熱物を収納する略直方体構造からなる加熱室8を有し、加熱室8は金属材料からなる左壁面、右壁面、底壁面、上壁面、奥壁面および被加熱物を収納するために開閉する開閉扉(図示していない)と、被加熱物を載置する載置台から構成し、供給されるマイクロ波を内部に閉じ込めるように構成している。そして、マイクロ波を加熱室8内に放射する給電部5a〜5dが加熱室8を構成する左、右、上と底壁面に配置されている。この給電部の配置は本実施の形態に拘束されるものではなくいずれかの壁面に複数の給電部を設けてもよい。   In addition, the microwave processing apparatus of the present invention has a heating chamber 8 having a substantially rectangular parallelepiped structure that accommodates an object to be heated, and the heating chamber 8 has a left wall surface, a right wall surface, a bottom wall surface, an upper wall surface, and a back wall made of a metal material. An open / close door (not shown) that opens and closes to store the wall surface and the object to be heated, and a mounting table on which the object to be heated is placed, are configured to confine the supplied microwave inside. . And the electric power feeding parts 5a-5d which radiate | emit a microwave in the heating chamber 8 are arrange | positioned at the left, right, upper, and bottom wall surface which comprise the heating chamber 8. FIG. The arrangement of the power feeding units is not limited to the present embodiment, and a plurality of power feeding units may be provided on any wall surface.

給電部5a、5dは、回転位置を検出する手段(図示していない)と回転角度を制御する手段(図示していない)から構成される回転制御部9a、9dにより回転し、励振方向を調整することができる。   The power feeding units 5a and 5d are rotated by rotation control units 9a and 9d including means for detecting a rotation position (not shown) and means for controlling a rotation angle (not shown), and the excitation direction is adjusted. can do.

なお上述の説明においては、回転制御部9a、9d、回転位置を検出する手段、回転角度を制御する手段が、特許請求の範囲に記載された励振方向設定手段に相当する。   In the above description, the rotation control units 9a and 9d, the means for detecting the rotation position, and the means for controlling the rotation angle correspond to the excitation direction setting means described in the claims.

以上のように構成されたマイクロ波処理装置について、以下その動作を説明する。   The operation of the microwave processing apparatus configured as described above will be described below.

まず被加熱物10を加熱室8に収納し、その加熱処理条件を操作部(図示していない)から入力し、加熱開始キーを押す。加熱開始信号を受けた制御部7は、動作周波数が制御できる半導体素子などで構成した発振部1a、1cに制御出力信号を送り、選択された加熱処理条件に適応する周波数で発振開始する。発振部1a、1cを動作させると、その出力は電力分配部2a、2cにて各々略1/2分配され、4つのマイクロ波となる。そしてそれぞれのマイクロ波は、位相可変部3a〜3dにより、制御部7からの指定量だけ位相
がずれ、並列個別に動作する増幅部4a〜4dにて、制御部7から指定量の増幅をし、電力検知部6a〜6dを経て、給電部5a〜5dに供給され、給電部5a〜5dにて励振電界11a〜11dを発生させ加熱室8内にマイクロ波を放射する。
First, the object to be heated 10 is stored in the heating chamber 8, the heat treatment conditions are input from an operation unit (not shown), and the heating start key is pressed. Upon receiving the heating start signal, the control unit 7 sends a control output signal to the oscillating units 1a and 1c formed of a semiconductor element whose operating frequency can be controlled, and starts oscillating at a frequency suitable for the selected heat treatment condition. When the oscillating units 1a and 1c are operated, their outputs are distributed approximately ½ each by the power distributing units 2a and 2c to become four microwaves. The phase of each microwave is shifted by the specified amount from the control unit 7 by the phase variable units 3a to 3d, and the specified amount is amplified from the control unit 7 by the amplifying units 4a to 4d operating individually in parallel. Then, the electric power is supplied to the power feeding units 5 a to 5 d via the power detection units 6 a to 6 d, and the excitation electric fields 11 a to 11 d are generated by the power feeding units 5 a to 5 d to radiate microwaves into the heating chamber 8.

電力検出部6a〜6dは、マイクロ波発生部側に戻る反射電力を検出し、その反射電力量に比例した信号を検出するものであり、その検出信号を受けた制御部7は、選択されたメニューと組み込まれたプログラムに従い最適な動作条件の選択と実行をする。   The power detection units 6a to 6d detect the reflected power returning to the microwave generation unit and detect a signal proportional to the amount of reflected power. The control unit 7 that has received the detection signal is selected. Select and execute the optimal operating conditions according to the menu and the embedded program.

本発明は、放射するマイクロ波の励振方向の制御と、前記励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量を組み合わせて制御し、さまざまな形状・種類・量の異なる被加熱物を所望の状態に加熱処理する効果があるが、所望の状態に加熱処理するには、主に「高効率な加熱性能」、「むらの少ない加熱性能」が必要となる。以下にこの2性能について説明する。   The present invention controls the excitation direction of microwaves to be radiated, and controls the operating frequency and phase performed in association with the excitation direction control in combination with the amount of power amplification, and is heated in various shapes, types, and quantities. Although there is an effect of heat-treating an object to a desired state, in order to heat-treat the object to a desired state, mainly “highly efficient heating performance” and “heating performance with little unevenness” are required. The two performances will be described below.

発振部1a、1cで発生したマイクロ波電力が、効率よく加熱室8内に放射され、被加熱物に100%吸収されると加熱室8側からの反射電力は0Wになるが、実際は、被加熱物の種類・形状・量により決まる被加熱物を含む加熱室8のインピーダンスと、加熱室8と結合する給電部5a〜5dの出力インピーダンス間の不整合による反射や、被加熱物10に吸収されずに給電部5a〜5dで拾われたマイクロ波電力が、反射電力として発生部側に戻る。以下に反射電力を低く抑え、高効率な加熱性能を得る作用を説明する。   When the microwave power generated in the oscillators 1a and 1c is efficiently radiated into the heating chamber 8 and absorbed 100% by the object to be heated, the reflected power from the heating chamber 8 side becomes 0 W. Reflection due to mismatch between the impedance of the heating chamber 8 including the heated object determined by the type, shape, and quantity of the heated object and the output impedance of the power feeding units 5a to 5d coupled to the heating chamber 8, and absorption by the heated object 10 Instead, the microwave power picked up by the power feeding units 5a to 5d returns to the generation unit side as reflected power. In the following, the operation of suppressing the reflected power to obtain a highly efficient heating performance will be described.

加熱室8内では複数の給電部5a〜5dからマイクロ波が放射され、種々の励振方向、電力および、伝播方向のマイクロ波が入り乱れることになるが、加熱室8内の個々の場において、同じ電界方向が重なれば重畳し、逆であれば打ち消し合う相互干渉により、加熱室内の電磁界分布を形成する。各場の電界の強さは、動作周波数や、放射電力および、放射場所での位相ずれがかかわっている。また、各場の電界方向は、給電部5a〜5dでの励振方向が深くかかわっていて、干渉しあうマイクロ波の組合せやその度合いもこの電界方向で決まる。ただし、同じ動作周波数のマイクロ波の組合せでないと、励振方向が同じであっても相互干渉状態が変動し、位相制御も効果を発揮しなくなる。   In the heating chamber 8, microwaves are radiated from the plurality of power feeding units 5 a to 5 d, and microwaves in various excitation directions, electric powers, and propagation directions are disturbed, but in individual fields in the heating chamber 8, An electromagnetic field distribution in the heating chamber is formed by mutual interference that overlaps if the same electric field direction overlaps and cancels if the same electric field direction is opposite. The strength of the electric field in each field is related to the operating frequency, radiation power, and phase shift at the radiation location. In addition, the electric field direction of each field is deeply related to the excitation direction in the power feeding units 5a to 5d, and the combination and the degree of microwaves that interfere with each other are also determined by this electric field direction. However, if the combination of microwaves having the same operating frequency is not used, the mutual interference state fluctuates even if the excitation directions are the same, and the phase control is not effective.

回転制御部9aで給電部5aの励振電界11aの向きを調整し、励振電界をほぼ一致させた給電部5bとの組合せに対して、動作周波数や位相および、電力増幅量を調整することにより、電磁界分布を直接変えることができる。給電部5a、5bのマイクロ波発生源は同じ発振部1aで、動作周波数は制御部7の信号に従い一致させて調整できる。位相は制御部7の信号により位相可変部3a、3bを関連させて制御し、必要な位相差に設定できる。電力増幅量は、制御部7の信号により増幅部4a、4bを任意に制御できる。このように干渉させるマイクロ波の条件を調整し、電磁界分布を意図的に操作して、被加熱物10に電磁界分布を集中させて、マイクロ波の吸収効率を上げることが可能となる。   By adjusting the direction of the excitation electric field 11a of the power supply unit 5a with the rotation control unit 9a and adjusting the operating frequency, phase, and power amplification amount for the combination with the power supply unit 5b having substantially the same excitation electric field, The electromagnetic field distribution can be changed directly. The microwave generation sources of the power feeding units 5 a and 5 b are the same oscillation unit 1 a, and the operating frequency can be adjusted to match with the signal from the control unit 7. The phase can be controlled by associating the phase variable units 3a and 3b with a signal from the control unit 7 and set to a necessary phase difference. The amount of power amplification can arbitrarily control the amplifying units 4 a and 4 b by a signal from the control unit 7. In this way, it is possible to increase the microwave absorption efficiency by adjusting the conditions of the microwaves to be interfered and intentionally manipulating the electromagnetic field distribution to concentrate the electromagnetic field distribution on the object to be heated 10.

更に、回転制御部9dで給電部5dの励振電界11dの向きを調整して、給電部5cの励振電界11cとあわせることにより、別の相互干渉のある組合せを形成できる。この給電部5c、5dは給電部5a、5bの組合せと励振方向が異なるので、お互いの相互干渉関係を乱さないため、独立して制御しても重ね合わせた結果が得られる。この給電部5c、5dにより形成される電磁界分布にて、給電部5a、5bによる電磁界分布を補完する動作をさせれば、更に被加熱物10のマイクロ波の吸収効率を上げることも可能となる。   Furthermore, by adjusting the direction of the excitation electric field 11d of the power supply unit 5d by the rotation control unit 9d and combining it with the excitation electric field 11c of the power supply unit 5c, another combination with mutual interference can be formed. Since the feeding units 5c and 5d have different excitation directions from the combination of the feeding units 5a and 5b, the mutual interference relationship is not disturbed. If the electromagnetic field distribution formed by the power feeding units 5c and 5d is supplemented with the electromagnetic field distribution by the power feeding units 5a and 5b, the microwave absorption efficiency of the object to be heated 10 can be further increased. It becomes.

また、アンテナには電波を放射および受信しやすい方向(指向性)と電界・磁界の向き(励振方向)の特性があり、この特性が合えば、一旦加熱室8内に放射され、被加熱物10に吸収されないマイクロ波電力を拾い上げやすくなる。この現象は、他の給電部から放射されたマイクロ波に対しても同様に作用し、図1の場合、励振電界11a、11bの励
振方向が一致し、相互干渉のある組合せ間でお互いの放射電波を受け取りやすい構成となっている。相互干渉による電磁界分布の制御を行わない場合は、回転制御部9aで給電部5aの励振電界11aの向きを変えることで、励振方向一致によるお互いのマイクロ波電力受け取り量を少なくでき、高効率な加熱性能にも寄与する。
In addition, the antenna has characteristics of a direction in which radio waves are easily radiated and received (directivity) and an electric / magnetic field direction (excitation direction). Once these characteristics are met, the antenna is once radiated into the heating chamber 8 to be heated. It becomes easy to pick up the microwave electric power which is not absorbed by 10. This phenomenon works in the same way for microwaves radiated from other power supply units. In the case of FIG. 1, the excitation directions of the excitation electric fields 11a and 11b coincide with each other, and there is mutual radiation between combinations having mutual interference. It is easy to receive radio waves. When the electromagnetic field distribution is not controlled by mutual interference, the rotation control unit 9a changes the direction of the excitation electric field 11a of the power supply unit 5a, thereby reducing the amount of microwave power received by matching the excitation directions, and high efficiency. Contributes to the heating performance.

このように様々な形状・大きさ・量の異なる被加熱物に対しても、電力検出部6a〜6dで検出した反射電力に基づき、給電部5a〜5dの放射するマイクロ波の励振電界11a〜11dの励振方向と、励振方向の制御と関連付けて決める動作周波数や位相および、放射電力を制御することで、反射電力が最も小さくなる条件を見出し、加熱処理することができ、「高効率な加熱性能」が得られる。   As described above, the microwave excitation electric fields 11a to 11a to be radiated from the power feeding units 5a to 5d are also applied to the objects to be heated having various shapes, sizes, and quantities based on the reflected power detected by the power detection units 6a to 6d. By controlling the operating direction and phase determined in association with the excitation direction of 11d and the control of the excitation direction and the radiated power, it is possible to find a condition where the reflected power is minimized, and to perform the heat treatment. Performance ".

限られた閉空間の加熱室8に放射されたマイクロ波は、被加熱物10に吸収されたり、給電部5a〜5dに拾われたり、加熱室8の壁面で反射を繰り返し、相互干渉による電磁界分布を形成するが、この電磁界分布により各場の加熱の強弱が生じる。以下に加熱むらを抑える作用について説明する。   The microwaves radiated to the heating chamber 8 in the limited closed space are absorbed by the object to be heated 10, picked up by the power feeding units 5 a to 5 d, or repeatedly reflected on the wall surface of the heating chamber 8. Although the field distribution is formed, the electromagnetic field distribution causes the intensity of heating in each field. The effect | action which suppresses heating nonuniformity is demonstrated below.

給電部5a〜5dから放射するマイクロ波の励振電界11a〜11dと、前記励振電界11a〜11dの励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量制御により、加熱室8内の電磁界分布を操作でき、より均一に調整することも可能となる。更に、前述例の給電部5a、5bのグループおよび、励振方向が異なる給電部5c、5dのグループを同時に動作させ、給電部5c、5dにより形成される電磁界分布にて、給電部5a、5bによる電磁界分布を補完すれば、更に均一な加熱パターンを形成することも可能となる。   The inside of the heating chamber 8 is controlled by the excitation frequency 11a to 11d of the microwaves radiated from the power feeding units 5a to 5d, the operation frequency and phase performed in association with the control of the excitation direction of the excitation fields 11a to 11d, and the power amplification amount control. The electromagnetic field distribution can be manipulated and can be adjusted more uniformly. Further, the group of the power feeding units 5a and 5b and the group of the power feeding units 5c and 5d having different excitation directions are operated at the same time in the electromagnetic field distribution formed by the power feeding units 5c and 5d. If the electromagnetic field distribution due to is complemented, a more uniform heating pattern can be formed.

実際の調理では、均一な電磁界分布が必ずしも最適な結果を得るとは限らず、被加熱物が大きい場合は熱拡散が良い中央に比べ、周囲は熱が溜まりやすく温度むらとなる。解凍も同様に周囲の加熱が進みやすい傾向にある。このため、選択された被加熱物の調理条件に従い、励振方向と、前記励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量の制御をして、意図的に中央の電磁界分布を強めた条件で、調理することにより結果的に良い仕上がりが得られる。   In actual cooking, a uniform electromagnetic field distribution does not always give an optimal result, and when the object to be heated is large, the surroundings are more likely to accumulate heat than the center where heat diffusion is good, resulting in uneven temperature. Similarly, thawing tends to facilitate the surrounding heating. For this reason, according to the cooking conditions of the selected object to be heated, the centralized electromagnetic field distribution is intentionally controlled by controlling the excitation direction, the operation frequency and phase performed in association with the control of the excitation direction, and the amount of power amplification. As a result, a good finish can be obtained by cooking under the condition of strengthening.

また、電磁界分布むらが微小であっても、同一パターン加熱を継続すると同じ場所への蓄熱による加熱むらが発生する。更に、被加熱物自体も均質ではないため発熱量のずれも発生する。よって、調理途中に意図して、動作周波数、位相および、電力増幅量を変動させたり、回転制御部9a、9dで、給電部5a、5dの励振電界11a、11dの向きを変え、給電部の組合せを切り替えるなどで、電磁界分布を変え、加熱むらを緩和できる。   Even if the electromagnetic field distribution unevenness is small, if the same pattern heating is continued, uneven heating due to heat storage in the same place occurs. Furthermore, since the object to be heated itself is not homogeneous, a deviation in the amount of heat generation also occurs. Therefore, the operating frequency, phase, and power amplification amount are intentionally changed during cooking, or the rotation control units 9a and 9d change the directions of the excitation electric fields 11a and 11d of the power supply units 5a and 5d, By switching the combination, the electromagnetic field distribution can be changed and the uneven heating can be reduced.

このように給電部5a〜5dから放射するマイクロ波の励振電界11a〜11dの励振方向の制御と、前記励振方向の制御と関連付けて行う動作周波数や位相および、電力増幅量の制御をして、意図する最適な電磁界分布制御をすることで、様々な形状・大きさ・量の異なる被加熱物に対しても加熱むらが最も小さくなる条件で加熱処理することができ「むらの少ない加熱性能」を得られる。   In this way, the control of the excitation direction of the microwave excitation electric fields 11a to 11d radiated from the power supply units 5a to 5d, the operation frequency and phase performed in association with the control of the excitation direction, and the power amplification amount are controlled, By controlling the optimal electromagnetic field distribution as intended, it is possible to heat the object to be heated in various shapes, sizes, and quantities under conditions that minimize the uneven heating. Can be obtained.

様々な形状・大きさ・量の異なる被加熱物により、マイクロ波の励振方向による給電部の組合せと、動作周波数や位相および、放射電力の最適な加熱条件やマイクロ波の励振方向による給電部の組合せの最適な検知条件は変わる。例えば加熱処理に最適な組合せの給電部が5a、5dで、検知に最適な組合せの給電部が5a、5bのように最適な加熱条件と最適な検知条件が同時に両立できない場合、重なる場合給電部5aを回転制御部9aで再設置して、検知とマイクロ波処理を切り替え、最適条件を維持しながら進めることで、より最適な結果が得られる。   Depending on the object to be heated in various shapes, sizes, and quantities, the combination of the power feeding unit according to the microwave excitation direction, the operating frequency and phase, the optimum heating condition of the radiated power, and the power feeding unit according to the microwave excitation direction Optimal detection conditions for the combination vary. For example, when the optimum combination of power supply units for heat treatment is 5a and 5d and the optimum combination of detection power supply units for detection is 5a and 5b, the optimum heating condition and the optimum detection condition cannot be compatible at the same time. By re-installing 5a with the rotation control unit 9a, switching between detection and microwave processing and proceeding while maintaining optimum conditions, a more optimal result can be obtained.

また、温度上昇により被加熱物のマイクロ波の吸収特性などの物性が変わることもあり、前記最適な加熱条件や最適な検知条件も変動する。電力検出部6a〜6dで検出した反射電力の変動に基づき、マイクロ波の励振方向による給電部の組合せと、動作周波数や位相および、放射電力の最適な条件を追随して調整することで、「高効率な加熱性能」や「むらの少ない加熱性能」を満足する加熱処理が行える。   In addition, physical properties such as microwave absorption characteristics of an object to be heated may change due to a temperature rise, and the optimum heating conditions and optimum detection conditions also vary. Based on the fluctuations in the reflected power detected by the power detection units 6a to 6d, by adjusting the combination of the power feeding units according to the excitation direction of the microwave and the optimum conditions of the operating frequency and phase and the radiated power, Heat treatment that satisfies "highly efficient heating performance" and "uneven heating performance" can be performed.

電力検出部6a〜6dは全ての給電部5a〜5dに設けられていて、各設置部分でアンテナの指向性と励振方向の特性に従い拾った(受信した)マイクロ波電力を検出するが、個々の給電部での検知には限界がある。例えば、給電部5aでは加熱室8の幅方向と奥行き方向の電界は拾える(受信できる)が、縦方向は拾えない(受信できない)。また、加熱室8上壁面近傍の電磁界分布のみの検知となる。よって全ての給電部5a〜5dからの検知を連携して加熱室8内設置の被加熱物10条件を推定することにより検知の精度が向上する。   The power detection units 6a to 6d are provided in all the power supply units 5a to 5d, and detect microwave power picked up (received) in accordance with the characteristics of the antenna directivity and excitation direction in each installation part. There is a limit to detection at the power feeding unit. For example, in the power feeding unit 5a, the electric fields in the width direction and the depth direction of the heating chamber 8 can be picked up (can be received), but cannot be picked up (cannot be received) in the vertical direction. Further, only the electromagnetic field distribution near the upper wall surface of the heating chamber 8 is detected. Therefore, the detection accuracy is improved by estimating the condition of the heated object 10 installed in the heating chamber 8 in cooperation with the detection from all the power supply units 5a to 5d.

以上のように、本発明にかかるマイクロ波処理装置は複数の給電部を有し、給電部から放射されるマイクロ波の電界・磁界の向き(励振方向)、動作周波数、位相差および、電力を変化させる装置を提供できるので、電子レンジで代表されるような誘電加熱を利用した加熱処理装置や生ゴミ処理機、あるいは半導体製造装置であるプラズマ電源のマイクロ波電源などの用途にも適用できる。   As described above, the microwave processing apparatus according to the present invention has a plurality of power feeding units, and controls the direction (excitation direction), operating frequency, phase difference, and power of the microwave electric field / magnetic field radiated from the power feeding unit. Since the apparatus to be changed can be provided, it can be applied to applications such as a heat treatment apparatus using a dielectric heating as typified by a microwave oven, a garbage processing machine, or a microwave power source of a plasma power source as a semiconductor manufacturing apparatus.

本発明の実施の形態1におけるマイクロ波処理装置の構成図Configuration diagram of microwave processing apparatus according to Embodiment 1 of the present invention

1a、1c 発振部
2a、2c 電力分配部
3a〜3d 位相可変部
4a〜4d 増幅部
5a〜5d 給電部
6a〜6d 電力検出部
7 制御部
8 加熱室
9a、9d 回転制御部
10 被加熱物
11a〜11d 励振電界
DESCRIPTION OF SYMBOLS 1a, 1c Oscillator 2a, 2c Power distribution part 3a-3d Phase variable part 4a-4d Amplification part 5a-5d Power supply part 6a-6d Power detection part 7 Control part 8 Heating chamber 9a, 9d Rotation control part 10 Heated object 11a ~ 11d Excitation electric field

Claims (1)

被加熱物を収容する加熱室と、
マイクロ波を発生させる発振部と、
前記発振部の出力を複数に分配して出力する電力分配部と、
前記電力分配部の出力間の位相を可変する位相可変部と、
前記電力分配部または、前記位相可変部の出力を電力増幅する増幅部と、
前記増幅部の出力を前記加熱室に供給する複数の給電部と、
前記複数の給電部の少なくとも1つに前記給電部から放射されるマイクロ波の励振方向を任意の方向に設定する手段と、
前記複数の給電部間の位相を可変制御する手段とを有するマイクロ波処理装置であって、前記給電部から放射されるマイクロ波の励振方向を任意の方向に設定した前記給電部の組合せに対して、動作周波数や位相及び電力増幅量の制御を伴うマイクロ波処理手段と、
透過及び反射電力量を検知する検出手段を備え、
前記マイクロ波処理手段及び前記検出手段の実行において、前記給電部の励振方向に対する複数ある組合せから最適なものを判断し、前記給電部の励振方向を再設定して、選択する組合せを切り替えながら加熱処理を行う構成としたマイクロ波処理装置。
A heating chamber for storing an object to be heated;
An oscillation unit for generating microwaves;
A power distribution unit that distributes and outputs the output of the oscillation unit to a plurality of outputs;
A phase variable unit that varies a phase between outputs of the power distribution unit;
An amplifying unit for amplifying the output of the power distributing unit or the phase variable unit;
A plurality of power supply units that supply the output of the amplification unit to the heating chamber ;
Means for setting an excitation direction of microwaves radiated from the power feeding unit to at least one of the plurality of power feeding units in an arbitrary direction;
A microwave processing apparatus having a means for variably controlling the phase between the plurality of power feeding units , wherein the microwave excitation direction radiated from the power feeding unit is set to an arbitrary direction with respect to the combination of the power feeding units. Microwave processing means with control of operating frequency, phase and amount of power amplification,
A detecting means for detecting the amount of transmitted and reflected power;
In the execution of the microwave processing means and the detection means, the optimum one is determined from a plurality of combinations with respect to the excitation direction of the power feeding unit, the excitation direction of the power feeding unit is reset, and heating is performed while switching the combination to be selected. A microwave processing apparatus configured to perform processing.
JP2008017753A 2008-01-29 2008-01-29 Microwave processing equipment Expired - Fee Related JP5169255B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008017753A JP5169255B2 (en) 2008-01-29 2008-01-29 Microwave processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008017753A JP5169255B2 (en) 2008-01-29 2008-01-29 Microwave processing equipment

Publications (2)

Publication Number Publication Date
JP2009181728A JP2009181728A (en) 2009-08-13
JP5169255B2 true JP5169255B2 (en) 2013-03-27

Family

ID=41035546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008017753A Expired - Fee Related JP5169255B2 (en) 2008-01-29 2008-01-29 Microwave processing equipment

Country Status (1)

Country Link
JP (1) JP5169255B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471515B2 (en) * 2010-01-28 2014-04-16 パナソニック株式会社 Microwave processing equipment
EP2549832B1 (en) * 2010-03-19 2015-12-30 Panasonic Corporation Microwave heating apparatus
JP2015041561A (en) * 2013-08-23 2015-03-02 株式会社東芝 Microwave heating device
JP6748387B2 (en) * 2016-03-28 2020-09-02 学校法人上智学院 microwave
JP2019197609A (en) * 2018-05-07 2019-11-14 パナソニックIpマネジメント株式会社 Microwave heating device
JP7178557B2 (en) * 2019-03-28 2022-11-28 パナソニックIpマネジメント株式会社 High frequency heating device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4735741Y1 (en) * 1968-12-26 1972-10-28
JPS56132793A (en) * 1980-03-19 1981-10-17 Hitachi Netsu Kigu Kk High frequency heater
JPS6047711B2 (en) * 1980-04-24 1985-10-23 松下電器産業株式会社 High frequency heating device
JPH02250288A (en) * 1989-03-23 1990-10-08 Fuji Electric Co Ltd Microwave oven
JP2558877B2 (en) * 1989-06-09 1996-11-27 松下電器産業株式会社 High frequency heating equipment
JPH07161469A (en) * 1993-12-13 1995-06-23 Toshiba Corp High frequency heating device
JPH0949635A (en) * 1995-08-08 1997-02-18 Hitachi Home Tec Ltd High frequency heating device
JP2000357583A (en) * 1999-06-15 2000-12-26 Mitsubishi Electric Corp Microwave oven
JP2002246167A (en) * 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd High-frequency heating device
FR2854022A1 (en) * 2003-04-16 2004-10-22 Rimm Technologies Corp N V Microwave device for dehydrating zeolites, has applicator receiving substance e.g. fluid, and three propagation guides symmetrical with respect to ternary symmetry axis of trihedral so that generators are decoupled with each other
JP3960612B2 (en) * 2004-06-25 2007-08-15 島田理化工業株式会社 Microwave irradiation processing equipment
JP2006128075A (en) * 2004-10-01 2006-05-18 Seiko Epson Corp High-frequency heating device, semiconductor manufacturing device, and light source device
JP4935188B2 (en) * 2006-05-25 2012-05-23 パナソニック株式会社 Microwave equipment

Also Published As

Publication number Publication date
JP2009181728A (en) 2009-08-13

Similar Documents

Publication Publication Date Title
JP5167678B2 (en) Microwave processing equipment
JP5358580B2 (en) Microwave heating device
JP5142364B2 (en) Microwave processing equipment
KR101495378B1 (en) Microwave heating device
JP4935188B2 (en) Microwave equipment
JP5169255B2 (en) Microwave processing equipment
JP5104048B2 (en) Microwave processing equipment
JP5262250B2 (en) Microwave processing equipment
JP2009259511A (en) Microwave processor
JP4940922B2 (en) Microwave processing equipment
JP5217882B2 (en) Microwave processing equipment
JP5239229B2 (en) Microwave heating device
JP2009252346A5 (en)
JP5169371B2 (en) Microwave processing equipment
JP2014049276A (en) Microwave processing device
JP5217993B2 (en) Microwave processing equipment
JP2008021493A (en) Microwave utilization device
JP5444734B2 (en) Microwave processing equipment
KR101816214B1 (en) Multiple antennas for oven capable of uniform heating and oven using the same
JP7230802B2 (en) Microwave processor
JP5169254B2 (en) Microwave processing equipment
JP5195008B2 (en) Microwave heating device
JP5217881B2 (en) Microwave processing equipment
JP2011124049A (en) Microwave heating device
JP5142368B2 (en) High frequency processing equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110124

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20110215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120508

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120626

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121217

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160111

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees