JP5157315B2 - 圧電デバイスの製造方法、圧電デバイスおよび電子機器 - Google Patents

圧電デバイスの製造方法、圧電デバイスおよび電子機器 Download PDF

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Publication number
JP5157315B2
JP5157315B2 JP2007213358A JP2007213358A JP5157315B2 JP 5157315 B2 JP5157315 B2 JP 5157315B2 JP 2007213358 A JP2007213358 A JP 2007213358A JP 2007213358 A JP2007213358 A JP 2007213358A JP 5157315 B2 JP5157315 B2 JP 5157315B2
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Japan
Prior art keywords
piezoelectric
piezoelectric vibrator
vibrator
mold material
resin mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2007213358A
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English (en)
Japanese (ja)
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JP2008136169A5 (enrdf_load_stackoverflow
JP2008136169A (ja
Inventor
誠一 千葉
裕吾 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2007213358A priority Critical patent/JP5157315B2/ja
Publication of JP2008136169A publication Critical patent/JP2008136169A/ja
Publication of JP2008136169A5 publication Critical patent/JP2008136169A5/ja
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Publication of JP5157315B2 publication Critical patent/JP5157315B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2007213358A 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器 Expired - Fee Related JP5157315B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007213358A JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006288359 2006-10-24
JP2006288359 2006-10-24
JP2007213358A JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Publications (3)

Publication Number Publication Date
JP2008136169A JP2008136169A (ja) 2008-06-12
JP2008136169A5 JP2008136169A5 (enrdf_load_stackoverflow) 2010-09-02
JP5157315B2 true JP5157315B2 (ja) 2013-03-06

Family

ID=39560656

Family Applications (1)

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JP2007213358A Expired - Fee Related JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Country Status (1)

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JP (1) JP5157315B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5262530B2 (ja) 2008-09-30 2013-08-14 セイコーエプソン株式会社 電子デバイス及び電子デバイスの製造方法
JP6460124B2 (ja) * 2014-12-17 2019-01-30 株式会社村田製作所 積層セラミック電子部品およびその製造方法
JP6417970B2 (ja) * 2015-01-28 2018-11-07 ミツミ電機株式会社 モジュール及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297348A (ja) * 2003-03-26 2004-10-21 Seiko Epson Corp 圧電発振器の製造方法
JP2004363839A (ja) * 2003-06-04 2004-12-24 Toyo Commun Equip Co Ltd 圧電振動子とこれを用いた圧電発振器
JP2005347881A (ja) * 2004-05-31 2005-12-15 Kyocera Kinseki Corp 圧電発振器の製造方法
JP4512185B2 (ja) * 2004-06-30 2010-07-28 京セラキンセキ株式会社 圧電発振器の製造方法、及びそのシート型基板
JP2006042278A (ja) * 2004-07-30 2006-02-09 Kyocera Kinseki Corp 圧電発振器及びその製造方法
JP4376153B2 (ja) * 2004-08-31 2009-12-02 京セラキンセキ株式会社 圧電発振器の製造方法
JP2006129303A (ja) * 2004-10-29 2006-05-18 Kyocera Kinseki Corp 圧電発振器の製造方法
JP2006279872A (ja) * 2005-03-30 2006-10-12 Kyocera Kinseki Corp 圧電振動子及びその製造方法並びにその圧電振動子を用いた圧電発振器の製造方法

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Publication number Publication date
JP2008136169A (ja) 2008-06-12

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