JP5134679B2 - スナップ嵌合センサ構体 - Google Patents

スナップ嵌合センサ構体 Download PDF

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Publication number
JP5134679B2
JP5134679B2 JP2010291906A JP2010291906A JP5134679B2 JP 5134679 B2 JP5134679 B2 JP 5134679B2 JP 2010291906 A JP2010291906 A JP 2010291906A JP 2010291906 A JP2010291906 A JP 2010291906A JP 5134679 B2 JP5134679 B2 JP 5134679B2
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JP
Japan
Prior art keywords
sensor
sensor body
assembly
arcuate
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010291906A
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English (en)
Japanese (ja)
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JP2011137823A5 (https=
JP2011137823A (ja
Inventor
ジョン・トーマス・クラーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
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Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2011137823A publication Critical patent/JP2011137823A/ja
Publication of JP2011137823A5 publication Critical patent/JP2011137823A5/ja
Application granted granted Critical
Publication of JP5134679B2 publication Critical patent/JP5134679B2/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP2010291906A 2009-12-30 2010-12-28 スナップ嵌合センサ構体 Expired - Fee Related JP5134679B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/649,969 US8142073B2 (en) 2009-12-30 2009-12-30 Snap-fit sensor assembly
US12/649,969 2009-12-30

Publications (3)

Publication Number Publication Date
JP2011137823A JP2011137823A (ja) 2011-07-14
JP2011137823A5 JP2011137823A5 (https=) 2012-10-25
JP5134679B2 true JP5134679B2 (ja) 2013-01-30

Family

ID=43479450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010291906A Expired - Fee Related JP5134679B2 (ja) 2009-12-30 2010-12-28 スナップ嵌合センサ構体

Country Status (5)

Country Link
US (1) US8142073B2 (https=)
EP (1) EP2341321A3 (https=)
JP (1) JP5134679B2 (https=)
CN (1) CN102183271B (https=)
BR (1) BRPI1005763A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8057095B2 (en) * 2009-04-23 2011-11-15 Medtronic, Inc. Multiple use temperature monitor adapter, system and method of using same
CN103260924B (zh) 2010-12-07 2016-11-09 艾里逊变速箱公司 用于混合动力电动车的能量存储系统
US9829365B2 (en) * 2012-01-16 2017-11-28 R.W. Beckett Corporation Tactile feedback techniques to limit temperature runaway in boiler systems
US20140076026A1 (en) * 2012-09-20 2014-03-20 Therm-O-Disc, Incorporated Relative humidity sensor
US20140230545A1 (en) * 2013-02-21 2014-08-21 Amphenol Corporation Sensor and method of making a sensor
ES2755326T3 (es) * 2014-01-06 2020-04-22 Kobe Steel Ltd Detector de deterioro y dispositivo de inspección de termopar
DE112014000282B4 (de) * 2014-01-21 2017-10-12 Okazaki Manufacturing Company Temperatursensor für hohe Temperaturen
US9260071B2 (en) * 2014-03-11 2016-02-16 Trw Automotive U.S. Llc Apparatus for snap mounting a crash sensor
US10442365B2 (en) * 2014-06-13 2019-10-15 Ford Global Technologies, Llc Apparatus and methods for vehicle structural or semi-structural component assembly enabling tunable deceleration characteristics
US9470595B2 (en) 2014-08-29 2016-10-18 Trw Automotive U.S. Llc Apparatus for dry side mounting a crash pressure sensor
JP6303937B2 (ja) * 2014-09-10 2018-04-04 住友電装株式会社 車輪速センサ
JP6414689B2 (ja) * 2015-02-24 2018-10-31 三菱マテリアル株式会社 電子部品及びその製造方法
CN105180993A (zh) * 2015-10-30 2015-12-23 广西中才铝业有限公司 一种传感器外壳
ITUB20160129A1 (it) * 2016-01-21 2017-07-21 Skf Ab Procedimento e dispositivo di montaggio di un sensore di temperatura.
US20170343423A1 (en) * 2016-05-26 2017-11-30 Vertiv Energy Systems, Inc. Temperature sensor assemblies and methods for coupling a thermistor to a cable
CN108981950A (zh) * 2018-10-15 2018-12-11 上海文襄汽车传感器有限公司 一体式温度传感器
DE102019214417A1 (de) * 2019-09-23 2021-03-25 Aktiebolaget Skf Verfahren zum Beschichten einer Sensoreinheit und zugehörige Sensoreinheit
FR3108719B1 (fr) * 2020-03-24 2022-04-08 A Raymond Et Cie Procédé de fabrication d’un dispositif de mesure de température destiné à être connecté à un raccord de connexion fluidique, et ensemble intermédiaire associé
WO2024016311A1 (en) * 2022-07-22 2024-01-25 Ticona Llc Temperature sensor for battery module

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179309A (en) * 1978-10-18 1979-12-18 Leeds & Northrup Company Means for assembling expendable immersion thermocouples
JPS62103286U (https=) * 1985-12-18 1987-07-01
JPH0297636U (https=) * 1989-01-24 1990-08-03
US5038741A (en) * 1990-04-13 1991-08-13 Walbro Corporation In-tank fuel module
EP0612667A3 (en) 1993-02-23 1995-02-08 Gen Electric Bowl-like lower part for plastic bottles with a spherical base.
US5438877A (en) * 1994-06-13 1995-08-08 Motorola, Inc. Pressure sensor package for reducing stress-induced measurement error
DE19534887B4 (de) * 1995-09-20 2004-04-15 Robert Bosch Gmbh Temperaturfühler
US5823843A (en) * 1997-02-06 1998-10-20 Pohlman; Joe K. Spherical element combination for construction toy set
US5920193A (en) * 1997-05-19 1999-07-06 Itt Manufacturing Enterprises, Inc. Snap-fit integrated wheel speed sensor assembly
US5980330A (en) * 1998-03-23 1999-11-09 Micro Contacta Inc. Snap fit contact assembly
US6374685B1 (en) * 1999-10-14 2002-04-23 Siemens Automotive, Inc. Creep enhanced sensor attachment arrangement
US6395415B1 (en) * 1999-12-27 2002-05-28 Plug Power, Inc. Sensor mount assembly for a fuel cell system
US6435017B1 (en) * 2000-03-16 2002-08-20 Motorola, Inc. Snap-fit sensing apparatus
DE10116019B4 (de) * 2001-03-30 2007-12-27 Robert Bosch Gmbh Sensor sowie Verfahren zu dessen Herstellung
US6546824B2 (en) * 2001-08-16 2003-04-15 Deere & Company Sensor mounting assembly
US6851306B2 (en) * 2002-08-27 2005-02-08 Delphi Technologies, Inc. Method and apparatus for probe sensor assembly
US6774623B2 (en) * 2002-10-10 2004-08-10 Delphi Technologies, Inc. Mounting bracket for holding sensor assembly together
JP4569886B2 (ja) * 2003-12-25 2010-10-27 株式会社大泉製作所 温度センサーの製造方法
JP2009026685A (ja) * 2007-07-23 2009-02-05 Keyence Corp センサ取付部材及びこれを備えたセンサ並びに光電センサ用発光装置

Also Published As

Publication number Publication date
BRPI1005763A2 (pt) 2013-04-09
CN102183271B (zh) 2014-01-22
EP2341321A2 (en) 2011-07-06
JP2011137823A (ja) 2011-07-14
EP2341321A3 (en) 2012-01-18
US8142073B2 (en) 2012-03-27
US20110158287A1 (en) 2011-06-30
CN102183271A (zh) 2011-09-14

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