JP5128050B2 - フレキシブルフラットケーブルの製造方法 - Google Patents
フレキシブルフラットケーブルの製造方法 Download PDFInfo
- Publication number
- JP5128050B2 JP5128050B2 JP2005000421A JP2005000421A JP5128050B2 JP 5128050 B2 JP5128050 B2 JP 5128050B2 JP 2005000421 A JP2005000421 A JP 2005000421A JP 2005000421 A JP2005000421 A JP 2005000421A JP 5128050 B2 JP5128050 B2 JP 5128050B2
- Authority
- JP
- Japan
- Prior art keywords
- flat cable
- flexible flat
- ferrite film
- substrate
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 45
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 26
- 230000001590 oxidative effect Effects 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000012295 chemical reaction liquid Substances 0.000 claims description 6
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001448 ferrous ion Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 47
- 230000001629 suppression Effects 0.000 description 34
- 238000011156 evaluation Methods 0.000 description 26
- 238000007747 plating Methods 0.000 description 20
- 230000005540 biological transmission Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 239000011261 inert gas Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- -1 metal hydroxide ions Chemical class 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 229910000175 cerite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
4 基体
5,6 タンク
7 ガス導入口
8 フェライト膜
9 電気絶縁性被覆材
10 粘着層(両面テープ)
11 導体
12 マイクロストリップライン
13 金属箔
14 高誘電率シート
Claims (1)
- 同一平面内で配列した所定数の導体を電気絶縁性被覆材により平板状に被覆する工程と、
金属箔で構成されたフレキシブルな基体上に少なくとも第一鉄イオンを含む反応液を接触させる反応液接触工程と、
少なくとも酸化剤を含んだ酸化液を前記基体上に接触させる酸化液接触工程と、前記反応液及び前記酸化液のうちの膜生成に寄与しない残分を前記基体上から除去することにより前記フェライト膜を成膜する残分除去工程と、
前記基体の表面に成膜された前記フェライト膜を、前記電気絶縁性被覆材の片方の面又は両方の面の何れかに粘着層を介して貼り付ける工程と、
を有することを特徴とするフレキシブルフラットケーブルの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005000421A JP5128050B2 (ja) | 2005-01-05 | 2005-01-05 | フレキシブルフラットケーブルの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005000421A JP5128050B2 (ja) | 2005-01-05 | 2005-01-05 | フレキシブルフラットケーブルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006190524A JP2006190524A (ja) | 2006-07-20 |
JP5128050B2 true JP5128050B2 (ja) | 2013-01-23 |
Family
ID=36797528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005000421A Expired - Fee Related JP5128050B2 (ja) | 2005-01-05 | 2005-01-05 | フレキシブルフラットケーブルの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5128050B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008021977A (ja) * | 2006-06-16 | 2008-01-31 | Toyo Kohan Co Ltd | 複合電磁波シールド材及びその製造方法 |
JP5872801B2 (ja) * | 2011-06-22 | 2016-03-01 | Necトーキン株式会社 | インターポーザ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56148882A (en) * | 1980-04-21 | 1981-11-18 | Murata Manufacturing Co | Flexible wiring sheet |
JPH08273445A (ja) * | 1995-03-31 | 1996-10-18 | Fujikura Ltd | シールド付フラットケーブル |
JP2004111477A (ja) * | 2002-09-13 | 2004-04-08 | Nec Tokin Corp | フェライト薄膜、その製造方法およびそれを用いた電磁雑音抑制体 |
-
2005
- 2005-01-05 JP JP2005000421A patent/JP5128050B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006190524A (ja) | 2006-07-20 |
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