JP5126662B2 - 静電チャック - Google Patents
静電チャック Download PDFInfo
- Publication number
- JP5126662B2 JP5126662B2 JP2007283377A JP2007283377A JP5126662B2 JP 5126662 B2 JP5126662 B2 JP 5126662B2 JP 2007283377 A JP2007283377 A JP 2007283377A JP 2007283377 A JP2007283377 A JP 2007283377A JP 5126662 B2 JP5126662 B2 JP 5126662B2
- Authority
- JP
- Japan
- Prior art keywords
- seal ring
- substrate
- protrusions
- electrostatic chuck
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 69
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 239000000112 cooling gas Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 241000135309 Processus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007283377A JP5126662B2 (ja) | 2007-10-31 | 2007-10-31 | 静電チャック |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007283377A JP5126662B2 (ja) | 2007-10-31 | 2007-10-31 | 静電チャック |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009111243A JP2009111243A (ja) | 2009-05-21 |
| JP2009111243A5 JP2009111243A5 (enExample) | 2010-12-16 |
| JP5126662B2 true JP5126662B2 (ja) | 2013-01-23 |
Family
ID=40779402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007283377A Active JP5126662B2 (ja) | 2007-10-31 | 2007-10-31 | 静電チャック |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5126662B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6119430B2 (ja) | 2013-05-31 | 2017-04-26 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP6782157B2 (ja) * | 2016-12-20 | 2020-11-11 | 日本特殊陶業株式会社 | 静電チャック |
| JP6627936B1 (ja) | 2018-08-30 | 2020-01-08 | 住友大阪セメント株式会社 | 静電チャック装置および静電チャック装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03163848A (ja) * | 1989-11-22 | 1991-07-15 | Hitachi Ltd | 真空吸着台 |
| JP2001185607A (ja) * | 1999-12-27 | 2001-07-06 | Canon Inc | 基板吸着保持装置およびデバイス製造方法 |
| US6664549B2 (en) * | 2000-01-28 | 2003-12-16 | Hitachi Tokyo Electronics Co., Ltd. | Wafer chuck, exposure system, and method of manufacturing semiconductor device |
| JP4094262B2 (ja) * | 2001-09-13 | 2008-06-04 | 住友大阪セメント株式会社 | 吸着固定装置及びその製造方法 |
| JP4288694B2 (ja) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
| JP4061131B2 (ja) * | 2002-06-18 | 2008-03-12 | キヤノンアネルバ株式会社 | 静電吸着装置 |
-
2007
- 2007-10-31 JP JP2007283377A patent/JP5126662B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009111243A (ja) | 2009-05-21 |
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