JP5126662B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP5126662B2
JP5126662B2 JP2007283377A JP2007283377A JP5126662B2 JP 5126662 B2 JP5126662 B2 JP 5126662B2 JP 2007283377 A JP2007283377 A JP 2007283377A JP 2007283377 A JP2007283377 A JP 2007283377A JP 5126662 B2 JP5126662 B2 JP 5126662B2
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JP
Japan
Prior art keywords
seal ring
substrate
protrusions
electrostatic chuck
processed
Prior art date
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Active
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JP2007283377A
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English (en)
Japanese (ja)
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JP2009111243A (ja
JP2009111243A5 (enExample
Inventor
拓真 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
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Toto Ltd
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Priority to JP2007283377A priority Critical patent/JP5126662B2/ja
Publication of JP2009111243A publication Critical patent/JP2009111243A/ja
Publication of JP2009111243A5 publication Critical patent/JP2009111243A5/ja
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Publication of JP5126662B2 publication Critical patent/JP5126662B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007283377A 2007-10-31 2007-10-31 静電チャック Active JP5126662B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007283377A JP5126662B2 (ja) 2007-10-31 2007-10-31 静電チャック

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007283377A JP5126662B2 (ja) 2007-10-31 2007-10-31 静電チャック

Publications (3)

Publication Number Publication Date
JP2009111243A JP2009111243A (ja) 2009-05-21
JP2009111243A5 JP2009111243A5 (enExample) 2010-12-16
JP5126662B2 true JP5126662B2 (ja) 2013-01-23

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ID=40779402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007283377A Active JP5126662B2 (ja) 2007-10-31 2007-10-31 静電チャック

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JP (1) JP5126662B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6119430B2 (ja) 2013-05-31 2017-04-26 住友大阪セメント株式会社 静電チャック装置
JP6782157B2 (ja) * 2016-12-20 2020-11-11 日本特殊陶業株式会社 静電チャック
JP6627936B1 (ja) 2018-08-30 2020-01-08 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03163848A (ja) * 1989-11-22 1991-07-15 Hitachi Ltd 真空吸着台
JP2001185607A (ja) * 1999-12-27 2001-07-06 Canon Inc 基板吸着保持装置およびデバイス製造方法
US6664549B2 (en) * 2000-01-28 2003-12-16 Hitachi Tokyo Electronics Co., Ltd. Wafer chuck, exposure system, and method of manufacturing semiconductor device
JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
JP4061131B2 (ja) * 2002-06-18 2008-03-12 キヤノンアネルバ株式会社 静電吸着装置

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Publication number Publication date
JP2009111243A (ja) 2009-05-21

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