JP5123489B2 - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- JP5123489B2 JP5123489B2 JP2006105933A JP2006105933A JP5123489B2 JP 5123489 B2 JP5123489 B2 JP 5123489B2 JP 2006105933 A JP2006105933 A JP 2006105933A JP 2006105933 A JP2006105933 A JP 2006105933A JP 5123489 B2 JP5123489 B2 JP 5123489B2
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- JP
- Japan
- Prior art keywords
- region
- plate
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- leaf spring
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000007689 inspection Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 230000003014 reinforcing effect Effects 0.000 description 10
- 239000007769 metal material Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006105933A JP5123489B2 (ja) | 2006-04-07 | 2006-04-07 | 電気的接続装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006105933A JP5123489B2 (ja) | 2006-04-07 | 2006-04-07 | 電気的接続装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007278861A JP2007278861A (ja) | 2007-10-25 |
| JP2007278861A5 JP2007278861A5 (enrdf_load_stackoverflow) | 2009-04-30 |
| JP5123489B2 true JP5123489B2 (ja) | 2013-01-23 |
Family
ID=38680449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006105933A Expired - Fee Related JP5123489B2 (ja) | 2006-04-07 | 2006-04-07 | 電気的接続装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5123489B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5548339B2 (ja) * | 2008-02-07 | 2014-07-16 | 株式会社日本マイクロニクス | 電気的接続装置 |
| KR102447833B1 (ko) * | 2018-02-09 | 2022-09-27 | 주성엔지니어링(주) | 전력 인터페이스 |
| JP7301582B2 (ja) * | 2019-04-04 | 2023-07-03 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547864A (ja) * | 1991-08-12 | 1993-02-26 | Advantest Corp | プローブ |
| JP3487190B2 (ja) * | 1998-08-20 | 2004-01-13 | 三菱マテリアル株式会社 | プローブ装置の微調整機構 |
| JP4004241B2 (ja) * | 2001-04-16 | 2007-11-07 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP2005083863A (ja) * | 2003-09-08 | 2005-03-31 | Kobe Steel Ltd | 電気的接続検査装置 |
| JP4455940B2 (ja) * | 2004-06-17 | 2010-04-21 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2006
- 2006-04-07 JP JP2006105933A patent/JP5123489B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007278861A (ja) | 2007-10-25 |
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