JP5121020B2 - 多階調フォトマスク、フォトマスクブランク、及びパターン転写方法 - Google Patents
多階調フォトマスク、フォトマスクブランク、及びパターン転写方法 Download PDFInfo
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- JP5121020B2 JP5121020B2 JP2008247271A JP2008247271A JP5121020B2 JP 5121020 B2 JP5121020 B2 JP 5121020B2 JP 2008247271 A JP2008247271 A JP 2008247271A JP 2008247271 A JP2008247271 A JP 2008247271A JP 5121020 B2 JP5121020 B2 JP 5121020B2
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- 238000000034 method Methods 0.000 title claims description 31
- 238000012546 transfer Methods 0.000 title claims description 11
- 238000002834 transmittance Methods 0.000 claims description 123
- 239000000758 substrate Substances 0.000 claims description 54
- 230000008859 change Effects 0.000 claims description 34
- 239000011651 chromium Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 229910052750 molybdenum Inorganic materials 0.000 claims description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- 239000011733 molybdenum Substances 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010408 film Substances 0.000 description 414
- 229910016006 MoSi Inorganic materials 0.000 description 27
- 239000010410 layer Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 23
- 238000005530 etching Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 15
- 238000004544 sputter deposition Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000985 reflectance spectrum Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 238000000411 transmission spectrum Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- -1 oxynitrides Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008247271A JP5121020B2 (ja) | 2008-09-26 | 2008-09-26 | 多階調フォトマスク、フォトマスクブランク、及びパターン転写方法 |
KR1020090090091A KR101156658B1 (ko) | 2008-09-26 | 2009-09-23 | 다계조 포토마스크, 포토마스크 블랭크 및 패턴 전사방법 |
TW098132359A TWI465838B (zh) | 2008-09-26 | 2009-09-24 | 多色調光罩、光罩基底及圖案轉印方法 |
KR1020110086572A KR101543288B1 (ko) | 2008-09-26 | 2011-08-29 | 다계조 포토마스크, 포토마스크 블랭크 및 패턴 전사방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008247271A JP5121020B2 (ja) | 2008-09-26 | 2008-09-26 | 多階調フォトマスク、フォトマスクブランク、及びパターン転写方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010078923A JP2010078923A (ja) | 2010-04-08 |
JP2010078923A5 JP2010078923A5 (enrdf_load_stackoverflow) | 2011-10-13 |
JP5121020B2 true JP5121020B2 (ja) | 2013-01-16 |
Family
ID=42209448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008247271A Active JP5121020B2 (ja) | 2008-09-26 | 2008-09-26 | 多階調フォトマスク、フォトマスクブランク、及びパターン転写方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5121020B2 (enrdf_load_stackoverflow) |
KR (2) | KR101156658B1 (enrdf_load_stackoverflow) |
TW (1) | TWI465838B (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5917020B2 (ja) * | 2010-06-29 | 2016-05-11 | Hoya株式会社 | マスクブランクおよび多階調マスクの製造方法 |
JP6761255B2 (ja) * | 2016-02-15 | 2020-09-23 | 関東化学株式会社 | エッチング液およびエッチング液により加工されたフォトマスク |
JP6891099B2 (ja) * | 2017-01-16 | 2021-06-18 | Hoya株式会社 | 位相シフトマスクブランクおよびこれを用いた位相シフトマスクの製造方法、並びに表示装置の製造方法 |
CN112015044A (zh) * | 2019-05-28 | 2020-12-01 | 爱发科成膜株式会社 | 掩模坯、半色调掩模、制造方法、制造装置 |
JP6993530B1 (ja) * | 2020-12-25 | 2022-01-13 | 株式会社エスケーエレクトロニクス | フォトマスク、フォトマスクの製造方法、表示装置の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3262302B2 (ja) * | 1993-04-09 | 2002-03-04 | 大日本印刷株式会社 | 位相シフトフォトマスク、位相シフトフォトマスク用ブランクス及びそれらの製造方法 |
KR0172790B1 (ko) * | 1995-09-18 | 1999-03-20 | 김영환 | 위상반전 마스크 및 그 제조방법 |
JP4054951B2 (ja) * | 2001-08-06 | 2008-03-05 | 信越化学工業株式会社 | 位相シフトマスクブランクの製造方法及び位相シフトマスクの製造方法 |
TWI480675B (zh) * | 2004-03-31 | 2015-04-11 | Shinetsu Chemical Co | 半色調相移空白光罩,半色調相移光罩,以及圖案轉移方法 |
JP4933753B2 (ja) * | 2005-07-21 | 2012-05-16 | 信越化学工業株式会社 | 位相シフトマスクブランクおよび位相シフトマスクならびにこれらの製造方法 |
JP4695964B2 (ja) * | 2005-11-09 | 2011-06-08 | アルバック成膜株式会社 | グレートーンマスク及びその製造方法 |
JP4516560B2 (ja) * | 2005-12-26 | 2010-08-04 | Hoya株式会社 | マスクブランク及びフォトマスク |
JP4570632B2 (ja) * | 2006-02-20 | 2010-10-27 | Hoya株式会社 | 4階調フォトマスクの製造方法、及びフォトマスクブランク加工品 |
CN101025564B (zh) * | 2006-02-20 | 2010-12-15 | Hoya株式会社 | 四级光掩模制造方法和其中所使用的光掩模坯料 |
KR100886802B1 (ko) * | 2006-03-30 | 2009-03-04 | 주식회사 에스앤에스텍 | 블랭크마스크, 이를 이용한 투과 제어 슬릿 마스크 및 그제조방법 |
KR101329525B1 (ko) * | 2006-10-04 | 2013-11-14 | 주식회사 에스앤에스텍 | 그레이톤 블랭크 마스크와 그레이톤 포토마스크 및 그제조방법 |
JP4848932B2 (ja) * | 2006-11-13 | 2011-12-28 | 大日本印刷株式会社 | プロキシミティ露光用階調マスク |
KR101247768B1 (ko) * | 2007-10-12 | 2013-03-25 | 알박 세이마쿠 가부시키가이샤 | 그레이 톤 마스크의 제조 방법 |
JP5219201B2 (ja) * | 2008-07-31 | 2013-06-26 | Hoya株式会社 | フォトマスク、フォトマスク用ブランク、フォトマスクの製造方法、及びパターン転写方法 |
-
2008
- 2008-09-26 JP JP2008247271A patent/JP5121020B2/ja active Active
-
2009
- 2009-09-23 KR KR1020090090091A patent/KR101156658B1/ko active Active
- 2009-09-24 TW TW098132359A patent/TWI465838B/zh active
-
2011
- 2011-08-29 KR KR1020110086572A patent/KR101543288B1/ko active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010078923A (ja) | 2010-04-08 |
KR101543288B1 (ko) | 2015-08-11 |
KR101156658B1 (ko) | 2012-06-14 |
KR20100035599A (ko) | 2010-04-05 |
KR20110111342A (ko) | 2011-10-11 |
TWI465838B (zh) | 2014-12-21 |
TW201017328A (en) | 2010-05-01 |
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