JP5118424B2 - ダイシング用補助部材 - Google Patents
ダイシング用補助部材 Download PDFInfo
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- JP5118424B2 JP5118424B2 JP2007230188A JP2007230188A JP5118424B2 JP 5118424 B2 JP5118424 B2 JP 5118424B2 JP 2007230188 A JP2007230188 A JP 2007230188A JP 2007230188 A JP2007230188 A JP 2007230188A JP 5118424 B2 JP5118424 B2 JP 5118424B2
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- semiconductor wafer
- dicing
- auxiliary member
- annular
- adhesive tape
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Description
3 粘着テープ
4 環状フレーム
4a 開口部
5 ダイシング用補助部材
23 面取り面
23a 上面
51 円環形状体
52 内周部
53 着接面
54 底面部
55 湾曲面
56 円環形状体
Claims (3)
- 環状フレームの開口部に粘着テープで固定された、外周縁部に面取り面を有する半導体ウエーハを固定するダイシング用補助部材であって、
前記半導体ウエーハ外周と同径の内径と所定の外径を有する円環形状に形成され、前記半導体ウエーハ厚みと同等の厚みを有する円環形状体からなり、該円環形状体は、前記半導体ウエーハの少なくとも前記面取り面上面の断面形状に一致する着接面を内周部に有し、底面部が前記粘着テープに固定されるとともに、前記半導体ウエーハをダイシングするダイシングブレードをドレッシングするためのドレス部材を兼用することを特徴とするダイシング用補助部材。 - 前記円環形状体は、前記着接面を含み前記半導体ウエーハの前記面取り面全体の断面形状に一致する湾曲面を内周部に有し、全体が放射状に複数に分割形成されていることを特徴とする請求項1に記載のダイシング用補助部材。
- 前記円環形状体は、前記内周部の前記湾曲面が前記半導体ウエーハの前記面取り面に接着固定されることを特徴とする請求項2に記載のダイシング用補助部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007230188A JP5118424B2 (ja) | 2007-09-05 | 2007-09-05 | ダイシング用補助部材 |
Applications Claiming Priority (1)
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JP2007230188A JP5118424B2 (ja) | 2007-09-05 | 2007-09-05 | ダイシング用補助部材 |
Publications (2)
Publication Number | Publication Date |
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JP2009064885A JP2009064885A (ja) | 2009-03-26 |
JP5118424B2 true JP5118424B2 (ja) | 2013-01-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007230188A Active JP5118424B2 (ja) | 2007-09-05 | 2007-09-05 | ダイシング用補助部材 |
Country Status (1)
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JP (1) | JP5118424B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013021110A (ja) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | 円板状被加工物の加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02133308U (ja) * | 1989-04-10 | 1990-11-06 | ||
JPH10172925A (ja) * | 1996-12-16 | 1998-06-26 | Fuji Electric Co Ltd | 半導体ウェハの切断方法 |
JP2004207591A (ja) * | 2002-12-26 | 2004-07-22 | Renesas Technology Corp | 半導体装置の製造方法 |
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- 2007-09-05 JP JP2007230188A patent/JP5118424B2/ja active Active
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JP2009064885A (ja) | 2009-03-26 |
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