JP5108437B2 - Non-lead glass fine particle dispersion paste composition - Google Patents

Description

The present invention is a non-lead that can be suitably applied when used in a non-lead-based glass sealing material, has little residual carbon after sintering, and can be degreased even in a low-temperature atmosphere. The present invention relates to a glass fine particle dispersed paste composition.

In recent years, inorganic fine particle-dispersed paste compositions in which inorganic fine particles such as conductive powder, ceramic powder, and glass powder are dispersed in a binder resin have been used to obtain fired bodies having various shapes. For example, ceramic paste or glass paste in which ceramic powder or glass powder is dispersed is used for manufacturing a dielectric layer of a plasma display panel (hereinafter also referred to as PDP) or a multilayer ceramic capacitor.
In particular, as a sealant for electronic parts such as semiconductors, PDPs, and fluorescent display tubes, it contains lead because it is required to be able to be sealed at the lowest possible temperature in order to prevent damage to the electronic parts. Glass pastes using low melting glass powders have been widely used.

However, in recent years, there has been a strong demand for glass pastes using low-melting-point glass powders that do not contain lead because of concerns over environmental problems and the safety of workers. A glass paste using a powder has been studied.

At present, ethyl cellulose is often used as a binder resin used for non-lead glass sealing materials. Actually, a paste prepared by mixing a vehicle in which a binder resin made of ethyl cellulose is dissolved in an organic solvent and a non-lead glass powder is applied using a dispenser, degreased, and then fired for sealing. ing.
However, since lead-free glass has a low melting point, the degreasing temperature and the melting temperature of the glass are close to each other, and in the process of monotonically increasing the temperature and firing, a phenomenon that a resin residue remains on the glass occurs. As a result, there is a problem that bubbles are generated on the surface of the glass sintered body or the adhesive strength is lowered.

On the other hand, although it has been studied to lower the degreasing temperature of the binder resin, ethyl cellulose has poor thermal decomposability, and thus cannot be degreased at such a low temperature.
Therefore, it has been studied to use nitrocellulose as a binder that can be degreased at low temperatures. However, when it is used at the same time as the non-lead glass frit, there is a problem that a problem occurs when metal impurities are mixed.
Accordingly, there has been a demand for a resin that has a low-temperature decomposability that decomposes 99.5% by weight or more when held at 300 ° C. for 1 hour and can be suitably used as a binder for non-lead glass sealing materials. .
JP-A-11-71132

The present invention is a non-lead that can be suitably applied when used in a non-lead-based glass sealing material, has little residual carbon after sintering, and can be degreased even in a low-temperature atmosphere. An object of the present invention is to provide a glass particle-dispersed paste composition.

The present invention relates to a lead-free glass fine particle-dispersed paste composition used for a lead-free glass sealing material, the segment derived from isobutyl methacrylate being 40 to 95% by weight and the segment derived from polyoxyalkylene ether monomethacrylate Lead-free glass particles containing a binder resin containing 5 to 40% by weight, an organic solvent, and lead-free glass particles comprising bismuth-based glass particles or phosphate-based glass particles having a softening point of 280 to 400 ° C. It is a dispersion paste composition.
The present invention is described in detail below.

As a result of diligent study, the inventors of the present invention found that when isobutyl methacrylate and polyoxyalkylene ether monomethacrylate were used as a copolymer and these ratios were within a predetermined range, it was surprisingly possible that the degradation was predicted to deteriorate. It was found that the decomposition property was remarkably improved, and that the decomposition time was significantly shortened particularly when heated at 300 ° C. In addition, it has been found that when the binder resin having such a configuration is used, generation of soot during combustion is suppressed, and residual carbon after sintering can be reduced.
Furthermore, as a result of intensive studies, when the binder resin having such a configuration is used in a paste composition for a non-lead glass sealing material, the paste composition has a sufficient viscosity and is applied using a dispenser or the like. In some cases, the present invention was completed by finding that it can be suitably applied without excessively spreading.

The lead-free glass fine particle dispersion paste composition of the present invention is used for a lead-free glass sealing material. The lead-free glass fine particle dispersion paste composition of the present invention has a small amount of residual carbon after sintering and can be degreased even in a low-temperature atmosphere. Therefore, it is used for a lead-free glass sealing material. In such a case, bubbles are not generated on the surface of the glass sintered body after the firing step, and the adhesive strength is not reduced. Moreover, since it has sufficient viscosity, when apply | coating using a dispenser etc., it can apply | coat suitably, without spreading too much.

The lead-free glass fine particle dispersion paste composition of the present invention contains a binder resin having a segment derived from isobutyl methacrylate and a segment derived from polyoxyalkylene ether monomethacrylate. Sintering while achieving degreasing at a low temperature when used as a binder resin of the inorganic fine particle dispersed paste composition by having the above two types of segments and making the content of each segment a predetermined amount It becomes possible to reduce the residual carbon later.
In the present specification, low temperature degreasing means that 99.5% by weight or more of the initial weight of the binder resin is decomposed when held at 300 ° C. for 1 hour in a normal air atmosphere in which nitrogen substitution or the like is not performed. Means that.

The binder resin has a segment derived from polyoxyalkylene ether monomethacrylate. By having the segment derived from the polyoxyalkylene ether monomethacrylate, the binder resin is decomposed at a temperature of about 200 ° C. in the degreasing step, so that the volume of the binder resin can be greatly reduced.

The polyoxyalkylene ether monomethacrylate is not particularly limited, and examples thereof include polymethylene glycol, polyacetal, polyethylene glycol, polypropylene glycol, polytrimethylene glycol, polytetramethylene glycol, and polybutylene glycol monomethacrylate. However, polyethylene glycol monomethacrylate, polypropylene glycol monomethacrylate, and polytetramethylene glycol monomethacrylate are preferred. In addition, when the repeating unit is PPO, it is more preferable to use polypropylene glycol monomethacrylate because the decomposability is better than when the repeating unit is PEO and the decomposition is possible at a low temperature. Further, a copolymer of a plurality of polyalkylene ethers may be used.

The lower limit of the content of segments derived from polyoxyalkylene ether monomethacrylate in the binder resin is 5% by weight, and the upper limit is 40% by weight. If it is less than 5% by weight, the thermal decomposition temperature becomes high. Further, since the decomposition of the segment derived from the polyoxyalkylene ether monomethacrylate is caused by combustion, when it exceeds 40% by weight, the residual carbon after sintering increases. A preferred lower limit is 5% by weight and a preferred upper limit is 20% by weight.

The binder resin has a segment derived from isobutyl methacrylate.
By having the segment derived from the isobutyl methacrylate, the low-temperature decomposition characteristic originally possessed by the segment derived from methyl methacrylate can be sufficiently exhibited.
In general, as the number of carbon atoms in the acrylic side chain increases, the thermal decomposition temperature of the resin increases, but by combining the segment derived from methyl methacrylate and the segment derived from isobutyl methacrylate, the number of carbon atoms in the acrylic side chain decreases. Thus, the thermal decomposition temperature can be lowered.

The lower limit of the content of segments derived from isobutyl methacrylate in the binder resin is 40% by weight, and the upper limit is 95% by weight. If it is less than 40% by weight, the residual carbon after sintering increases, and if it exceeds 95% by weight, the thermal decomposition temperature becomes high. A preferred lower limit is 45% by weight and a preferred upper limit is 80% by weight.

The binder resin preferably further has a segment derived from methyl methacrylate.
Although the above methyl methacrylate is a resin that decomposes at low temperatures, its higher order structure brings about the function of increasing the decomposition temperature. Therefore, copolymerization with isobutyl methacrylate eliminates the higher order structure of methyl methacrylate, resulting in low temperature decomposition characteristics. It can be sufficiently exerted, and degreasing at a lower temperature can be realized.
In addition, the segment derived from methyl methacrylate and the segment derived from isobutyl methacrylate are thermally decomposed by depolymerization, and the decomposed volatiles become respective monomers.
In addition, methyl methacrylate has the function of reducing the molecular weight of the decomposition gas generated when copolymerizing with polyoxyalkylene ether monomethacrylate, and has the function of suppressing the adsorption of decomposition products on the surface of inorganic particles after degreasing. I think that.
In addition to combining the segment derived from methyl methacrylate with the segment derived from isobutyl methacrylate and polyoxyalkylene ether monomethacrylate, by setting the content of each segment to a predetermined amount, the segment derived from methyl methacrylate is originally The low-temperature decomposition characteristics possessed can be fully exhibited, and degreasing at a lower temperature can be realized.

The preferable lower limit of the content of segments derived from methyl methacrylate in the binder resin is 15% by weight, and the preferable upper limit is 45% by weight. If it is less than 15% by weight, the residual carbon after sintering may increase, and if it exceeds 45% by weight, the thermal decomposition temperature may increase.

In addition to the segment derived from isobutyl methacrylate, the segment derived from polyoxyalkylene ether monomethacrylate, and the segment derived from methyl methacrylate, the binder resin adds the desired functionality, so that the effect of the present invention is achieved. It may have a segment derived from a monomer having a polar group as long as it is not impaired.
Examples of the monomer having a polar group include 2-hydroxyethyl methacrylate, hydroxypropyl methacrylate, methacrylic acid, glycidyl methacrylate, and glycerol monomethacrylate.

When it has the segment derived from the monomer which has the said polar group, it is preferable that content of the segment derived from the monomer which has the said polar group is less than 5 weight%. If it is 5% by weight or more, thermal decomposability at low temperatures may be impaired, soot that adheres to the inorganic fine particles may increase, and residual carbon in the sintered body may increase.

The binder resin preferably has at least one hydrogen bonding functional group only at the molecular end. The presence of the hydrogen-bonding functional group only at the molecular end allows the inorganic fine particle-dispersed paste composition to be appropriate even if it is not incorporated in a large amount without impairing the effects of the present invention such as low-temperature thermal decomposability. A high viscosity can be secured.

The hydrogen bonding functional group is not particularly limited, and examples thereof include a hydroxyl group, a carboxyl group, and an amino group. Of these, a hydroxyl group and a carboxyl group are preferable because of less influence during thermal decomposition. Further, it is sufficient that at least one hydrogen bonding functional group is present. However, the larger the number, the more the phase separation structure is stabilized and the dispersibility of the inorganic fine particles of the inorganic fine particle dispersed paste composition is improved.

The said binder resin has a preferable minimum of a weight average molecular weight by polystyrene conversion of 20,000, and a preferable upper limit of 200,000. When the weight average molecular weight is in the above range, the amount of the binder resin added can be reduced, and sufficient viscosity can be obtained, so that the spread of the paste when applied using a dispenser can be prevented. it can. If it is less than 20,000, a sufficient viscosity may not be obtained when an inorganic fine particle-dispersed paste composition is used, and if it is 200,000 or more, the viscosity becomes too large to be applied using a dispenser. There is. A more preferred lower limit is 50,000, and a still more preferred lower limit is 80,000.
In addition, the measurement of the weight average molecular weight by polystyrene conversion can be obtained by performing GPC measurement using, for example, a column LF-804 manufactured by SHOKO as a column.

Although it does not specifically limit as content of the binder resin in the non-lead-type glass fine particle dispersion paste composition of this invention, A preferable minimum is 0.01 weight% and a preferable upper limit is 10 weight%. If it is less than 0.5% by weight, the viscosity becomes low, so that it is difficult to handle at the time of coating, and if it exceeds 10% by weight, the viscosity becomes high, so that it becomes difficult to produce a paste. A more preferred lower limit is 0.05% by weight, and a more preferred upper limit is 5% by weight.

The method for producing the binder resin is not particularly limited. For example, after preparing a monomer mixed solution containing methyl methacrylate, isobutyl methacrylate and polyoxyalkylene ether monomethacrylate as raw materials monomers and containing a chain transfer agent and an organic solvent. And a method of adding a polymerization initiator to the monomer mixed solution and copolymerizing the raw material monomers.

The lead-free glass fine particle dispersion paste composition of the present invention contains an organic solvent.
The organic solvent is not particularly limited. For example, ethylene glycol ethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoisobutyl ether, trimethylpentanediol monoisobutyrate. Butyl carbitol, butyl carbitol acetate, terpineol, terpineol acetate, dihydroterpineol, dihydroterpineol acetate texanol, isophorone, butyl lactate, dioctyl phthalate, dioctyl adipate, benzyl alcohol, phenylpropylene glycol, cresol and the like.
Among them, terpineol acetate, dihydroterpineol acetate, dihydroterpineol acetate, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoisobutyl ether, butyl carbitol, butyl carbitol acetate, and texanol are preferable, and terpineol, terpineol acetate, dihydroterpineol, dihydroterpineol. Acetate is more preferred. In addition, these organic solvents may be used independently and may use 2 or more types together.

The organic solvent preferably has a boiling point of 100 ° C. or higher. If it is lower than 100 ° C., the solvent volatilizes during the printing process, the viscosity of the paste increases, and it may become impossible to apply.

The organic solvent preferably has a vapor pressure at 20 ° C. of 0.001 mmHg or more. If it is less than 0.001 mmHg, the organic solvent may remain when the binder resin is decomposed.

Although it does not specifically limit as content of the said organic solvent in the inorganic fine particle dispersion paste composition of this invention, A preferable minimum is 5 weight% and a preferable upper limit is 60 weight%. When the content of the organic solvent is out of this range, it may be difficult to disperse the inorganic fine particles.

The lead-free glass fine particle dispersion paste composition of the present invention contains lead-free glass fine particles.
The lead-free glass fine particles are not particularly limited as long as they are glass fine particles not containing lead. For example, bismuth-based glass fine particles containing bismuth, bismuth oxide or the like, or phosphoric acid-based glass fine particles containing phosphoric acid or the like. Etc.

The lead-free glass fine particles have a preferable upper limit of the melting point of 400 ° C. and a preferable lower limit of 280 ° C. If it is lower than 280 ° C., the low-temperature decomposition characteristics of the binder resin may not be fully exhibited.

The content of the lead-free glass fine particles in the lead-free glass fine particle dispersed paste composition of the present invention is not particularly limited, but a preferred lower limit is 10% by weight and a preferred upper limit is 90% by weight. When the content of the non-lead glass fine particles is less than 10% by weight, the viscosity of the non-lead glass fine particle dispersed paste composition may not be sufficiently obtained. When the content of the lead-free glass fine particles exceeds 90% by weight, it may be difficult to disperse the lead-free glass fine particles in the lead-free glass fine particle dispersion paste composition.

The lead-free glass fine particle dispersion paste composition of the present invention has a segment derived from isobutyl methacrylate and polyoxyalkylene ether monomethacrylate, and contains a binder resin whose content of these segments is within a predetermined range. Since the thermal decomposability can be greatly improved, degreasing can be performed in a low temperature process such as less than 300 ° C., and generation of soot at the time of combustion can be prevented, and residual after sintering It becomes possible to reduce carbon. In addition, when used in a paste composition for non-lead-based glass sealing materials, the paste composition has a sufficient viscosity, and when applied using a dispenser or the like, it is preferably applied without being excessively spread. Can do.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

Example 1
(Preparation of binder resin)
In a 2 L separate flask equipped with a stirrer, a cooler, a thermometer, a hot water bath and a nitrogen gas inlet, 60 parts by weight of isobutyl methacrylate (IBMA) as a monomer, 40 parts by weight of polypropylene glycol monomethacrylate (manufactured by NOF Corporation, Blemmer PP1000) Part of the reaction mixture, 0.05 part by weight of mercaptopropanediol as the chain transfer agent, and 100 parts by weight of terpineol as the organic solvent were obtained to obtain a monomer mixture.

The obtained monomer mixture was bubbled with nitrogen gas for 20 minutes to remove dissolved oxygen, and then the temperature inside the separable flask system was replaced with nitrogen gas and heated until the hot water bath boiled with stirring. A solution obtained by diluting the polymerization initiator with ethyl acetate was added to initiate the polymerization. Further, an ethyl acetate solution containing a polymerization initiator was added several times during the polymerization.

After 7 hours from the start of polymerization, the polymerization was terminated by cooling to room temperature to obtain a binder resin.

(Production of vehicle composition)
To 5 parts by weight of the binder resin thus obtained, 95 parts by weight of terpineol was added and dispersed with a high-speed disperser to prepare a vehicle composition.

(Preparation of non-lead-based fine glass particle dispersed paste composition)
To 10 parts by weight of the obtained vehicle composition, 90 parts by weight of a bismuth oxide-containing lead-free low melting glass frit having a softening point of 350 ° C. is added as lead-free glass fine particles, and kneaded sufficiently using a high-speed stirring device. Thus, a lead-free glass fine particle dispersed paste composition was prepared.

(Example 2)
In Example 1 (preparation of binder resin), 95 parts by weight of isobutyl methacrylate (IBMA) as a monomer, 5 parts by weight of polypropylene glycol monomethacrylate (Nippon Yushi Co., Ltd., Blenmer PP1000), 0.1 mercaptosuccinic acid as a chain transfer agent A binder resin, a vehicle composition and a lead-free glass fine particle dispersion paste composition are obtained in the same manner as in Example 1 except that 100 parts by weight of terpineol as an organic solvent is mixed to obtain a monomer mixture. It was.

(Example 3)
In Example 1 (preparation of binder resin), 15 parts by weight of methyl methacrylate (MMA), 80 parts by weight of isobutyl methacrylate (IBMA), 5 parts by weight of polypropylene glycol monomethacrylate (Nippon Yushi Co., Ltd., Blenmer PP1000), chain Binder resin, vehicle composition and lead-free system were the same as in Example 1 except that 0.05 part by weight of mercaptopropanediol as a transfer agent and 100 parts by weight of terpineol as an organic solvent were mixed to obtain a monomer mixture. A glass fine particle dispersed paste composition was obtained.

Example 4
In Example 1 (preparation of binder resin), 45 parts by weight of methyl methacrylate (MMA), 50 parts by weight of isobutyl methacrylate (IBMA), 5 parts by weight of polypropylene glycol monomethacrylate (Blenmer PP1000, manufactured by NOF Corporation), chain, Binder resin, vehicle composition and non-lead as in Example 1 except that 0.1 part by weight of mercaptosuccinic acid as a transfer agent and 100 parts by weight of terpineol as an organic solvent were mixed to obtain a monomer mixture. A glass fine particle dispersed paste composition was obtained.

(Example 5)
In Example 1 (preparation of binder resin), 15 parts by weight of methyl methacrylate (MMA), 45 parts by weight of isobutyl methacrylate (IBMA), 40 parts by weight of polypropylene glycol monomethacrylate (Nippon Yushi Co., Ltd., Blenmer PP1000), chain Binder resin, vehicle composition and lead-free system were the same as in Example 1 except that 0.05 part by weight of mercaptopropanediol as a transfer agent and 100 parts by weight of terpineol as an organic solvent were mixed to obtain a monomer mixture. A glass fine particle dispersed paste composition was obtained.

(Example 6)
In Example 1 (preparation of binder resin), 25 parts by weight of methyl methacrylate (MMA), 70 parts by weight of isobutyl methacrylate (IBMA), 5 parts by weight of polypropylene glycol monomethacrylate (Nippon Yushi Co., Ltd., Blenmer PP1000), chain Binder resin, vehicle composition and non-lead as in Example 1 except that 0.1 part by weight of mercaptosuccinic acid as a transfer agent and 100 parts by weight of terpineol as an organic solvent were mixed to obtain a monomer mixture. A glass fine particle dispersed paste composition was obtained.

(Comparative Example 1)
A lead-free glass fine particle dispersion paste composition was obtained in the same manner as in Example 1 except that 10 parts by weight of ethyl cellulose was dissolved in 90 parts by weight of terpineol and this was used as a vehicle composition.

(Comparative Example 2)
A lead-free low-melting glass paste was obtained in the same manner as in Example 1 except that 1 part by weight of ethyl cellulose was dissolved in 99 parts by weight of terpineol and this was used as a vehicle composition.

(Comparative Example 3)
In Example 1 (preparation of binder resin), 100 parts by weight of polypropylene glycol monomethacrylate (manufactured by NOF Corporation, Blenmer PP1000) as a monomer, 1.5 parts by weight of mercaptopropanediol as a chain transfer agent, and terpineol as an organic solvent A binder resin, a vehicle composition, and a lead-free glass fine particle dispersion paste composition were obtained in the same manner as in Example 1 except that 100 parts by weight were mixed to obtain a monomer mixed solution.

(Comparative Example 4)
In Example 1 (preparation of binder resin), 100 parts by weight of isobutyl methacrylate (IBMA) as a monomer, 2 parts by weight of mercaptosuccinic acid as a chain transfer agent, and 100 parts by weight of terpineol as an organic solvent are mixed, and the monomer mixture A binder resin, a vehicle composition and a lead-free glass fine particle dispersion paste composition were obtained in the same manner as in Example 1 except that the liquid was obtained.

(Comparative Example 5)
In Example 1 (preparation of binder resin), 50 parts by weight of isobutyl methacrylate (IBMA) as a monomer, 50 parts by weight of polypropylene glycol monomethacrylate (Nippon Yushi Co., Ltd., Blenmer PP1000), and mercaptopropanediol 1.5 as a chain transfer agent A binder resin, a vehicle composition and a lead-free glass fine particle dispersion paste composition are obtained in the same manner as in Example 1 except that 100 parts by weight of terpineol as an organic solvent is mixed to obtain a monomer mixture. It was.

(Comparative Example 6)
In Example 1 (preparation of binder resin), 20 parts by weight of methyl methacrylate (MMA) as a monomer, 80 parts by weight of isobutyl methacrylate (IBMA), 2 parts by weight of mercaptosuccinic acid as a chain transfer agent, and terpineol 100 as an organic solvent A binder resin, a vehicle composition, and a non-lead-based fine glass particle dispersion paste composition were obtained in the same manner as in Example 1 except that a monomer mixture was obtained by mixing with parts by weight.

(Comparative Example 7)
In Example 1 (preparation of binder resin), 10 parts by weight of methyl methacrylate (MMA), 40 parts by weight of isobutyl methacrylate (IBMA), 50 parts by weight of polypropylene glycol monomethacrylate (Blenmer PP1000, manufactured by NOF Corporation), chain, Binder resin, vehicle composition and non-lead as in Example 1 except that 1.5 parts by weight of mercaptopropanediol as a transfer agent and 100 parts by weight of terpineol as an organic solvent were mixed to obtain a monomer mixture. A glass fine particle dispersed paste composition was obtained.

(Evaluation)
The binder resin and the lead-free glass fine particle dispersion paste composition obtained in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Table 1.
(1) Average molecular weight measurement About the obtained binder resin, the column average LF-804 by SHOKO company was used as a column, and the weight average molecular weight by polystyrene conversion was measured by performing the analysis by a gel permeation chromatography.

(2) Decomposition temperature (TG / DTA evaluation)
The obtained binder resin was heated to 300 ° C. at a temperature rising temperature of 10 ° C./min in an air atmosphere using a thermal decomposition apparatus (TA instruments, simulated SDT 2960), and the state was maintained for 60 minutes. Degradability was evaluated. A case where the resin was completely decomposed within 60 minutes was evaluated as “◯”, a case where 95% or more was decomposed was evaluated as “Δ”, and a case where the thermal decomposition was less than 95% was evaluated as “X”. In addition, when all the resin decomposed | disassembled within 60 minutes, the time when decomposition | disassembly was complete | finished was shown.

(3) Sinterability The obtained lead-free glass fine particle dispersed paste composition was applied to a glass substrate with a thickness of 1.2 mm using an applicator, and cured in an oven at 150 ° C. for 60 minutes. Terpineol was evaporated to obtain a glass particle layer. The obtained glass particle layer was heated in an oven at 300 ° C. for 90 minutes to degrease the binder resin. The obtained particle layer was visually confirmed, and the presence or absence of coloring was evaluated. Thereafter, the glass frit was further heated in an oven at 480 ° C. to completely dissolve the glass frit, and the obtained glass plate was visually checked for glossiness and evaluated according to the following criteria. The case where the glass had a gloss specific to it was indicated as “◯”, and the case where it did not have a gloss was indicated as “x”.

(4) Sealing performance The obtained lead-free glass fine particle dispersion paste composition was applied onto a glass substrate using a dispenser, dried, degreased at 300 ° C., and then bonded to two glass substrates. It was. Thereafter, the glass was completely melted at 480 ° C. and sealed. It was visually confirmed that a bubble was able to be sealed without unevenness, ○ was a bubble, and a bubble was uneven, Δ, and a dispenser was clogged and could not be applied.

According to the present invention, when used in a lead-free glass sealing material, it can be suitably applied, has little residual carbon after sintering, and can be degreased even in a low-temperature atmosphere. A lead-free glass fine particle dispersion paste composition can be provided.

Claims (2)

A lead-free glass fine particle dispersion paste composition used for a lead-free glass sealing material,
Bismuth glass having a binder resin containing 40 to 95% by weight of a segment derived from isobutyl methacrylate and 5 to 40% by weight of a segment derived from polyoxyalkylene ether monomethacrylate, an organic solvent, and a softening point of 280 to 400 ° C. A lead-free glass fine particle-dispersed paste composition comprising fine particles or non-lead glass fine particles made of phosphate glass fine particles . The binder resin further has a segment derived from methyl methacrylate, the segment derived from methyl methacrylate is 15 to 45% by weight, the segment derived from isobutyl methacrylate is 40 to 80% by weight, and derived from polyoxyalkylene ether monomethacrylate. The non-lead-based glass fine particle dispersion paste composition according to claim 1, further comprising 5 to 40% by weight of a segment.