JP5101026B2 - 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法 - Google Patents

導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法 Download PDF

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Publication number
JP5101026B2
JP5101026B2 JP2006053430A JP2006053430A JP5101026B2 JP 5101026 B2 JP5101026 B2 JP 5101026B2 JP 2006053430 A JP2006053430 A JP 2006053430A JP 2006053430 A JP2006053430 A JP 2006053430A JP 5101026 B2 JP5101026 B2 JP 5101026B2
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JP
Japan
Prior art keywords
epoxy resin
resin layer
group
pattern
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006053430A
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English (en)
Japanese (ja)
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JP2007146103A (ja
JP2007146103A5 (enExample
Inventor
弘司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2006053430A priority Critical patent/JP5101026B2/ja
Priority to PCT/JP2006/322508 priority patent/WO2007052846A1/en
Priority to US12/092,531 priority patent/US20090123642A1/en
Priority to CN2006800410993A priority patent/CN101300284B/zh
Publication of JP2007146103A publication Critical patent/JP2007146103A/ja
Publication of JP2007146103A5 publication Critical patent/JP2007146103A5/ja
Application granted granted Critical
Publication of JP5101026B2 publication Critical patent/JP5101026B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2006053430A 2005-11-04 2006-02-28 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法 Expired - Fee Related JP5101026B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006053430A JP5101026B2 (ja) 2005-11-04 2006-02-28 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法
PCT/JP2006/322508 WO2007052846A1 (en) 2005-11-04 2006-11-06 Epoxy resin composition, conductive film forming method, conductive pattern forming method, and multilayered wiring board manufacturing method
US12/092,531 US20090123642A1 (en) 2005-11-04 2006-11-06 Epoxy resin composition, conductive film forming method, conductive pattern forming method, and multilayered wiring board manufacturing method
CN2006800410993A CN101300284B (zh) 2005-11-04 2006-11-06 环氧树脂组合物，导电薄膜形成方法，导电图案形成方法，以及多层布线板制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005320962 2005-11-04
JP2005320962 2005-11-04
JP2006053430A JP5101026B2 (ja) 2005-11-04 2006-02-28 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法

Publications (3)

Publication Number Publication Date
JP2007146103A JP2007146103A (ja) 2007-06-14
JP2007146103A5 JP2007146103A5 (enExample) 2011-09-29
JP5101026B2 true JP5101026B2 (ja) 2012-12-19

Family

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Family Applications (1)

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JP2006053430A Expired - Fee Related JP5101026B2 (ja) 2005-11-04 2006-02-28 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法

Country Status (4)

Country Link
US (1) US20090123642A1 (enExample)
JP (1) JP5101026B2 (enExample)
CN (1) CN101300284B (enExample)
WO (1) WO2007052846A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866579B2 (ja) * 2002-01-25 2007-01-10 富士フイルムホールディングス株式会社 薄層金属膜
KR20090098983A (ko) * 2007-01-15 2009-09-18 다이요 잉키 세이조 가부시키가이샤 열 경화성 수지 조성물
JP5394003B2 (ja) * 2007-08-30 2014-01-22 株式会社ダイセル 共重合体
JP5227570B2 (ja) * 2007-11-13 2013-07-03 セーレン株式会社 透明導電性部材の製造方法
JP5241304B2 (ja) * 2008-04-23 2013-07-17 富士フイルム株式会社 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、及び金属パターン材料
JP4994305B2 (ja) * 2008-06-03 2012-08-08 横浜ゴム株式会社 高熱伝導性エポキシ樹脂系組成物
KR101536662B1 (ko) * 2009-01-08 2015-07-14 해성디에스 주식회사 인쇄회로기판의 제조 방법 및 이로 인해 제조된 인쇄회로기판
US8563873B2 (en) * 2009-03-31 2013-10-22 Ibiden Co., Ltd. Substrate with metal film and method for manufacturing the same
CN102030913B (zh) * 2009-09-29 2012-09-05 中国科学院理化技术研究所 一种环氧树脂薄膜的制备方法
JP5630241B2 (ja) * 2010-02-15 2014-11-26 日立化成株式会社 絶縁樹脂、配線板及び配線板の製造方法
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US20130273797A1 (en) * 2012-04-17 2013-10-17 E I Du Pont De Nemours And Company Conductive polymer layers grafted onto insulating polymer surfaces
JP6105858B2 (ja) * 2012-05-17 2017-03-29 太陽インキ製造株式会社 パターン形成方法、アルカリ現像型の熱硬化性樹脂組成物、及びプリント配線板
JP6011534B2 (ja) * 2012-06-22 2016-10-19 三菱レイヨン株式会社 導光体予備成形物用樹脂組成物、導光体予備成形物、積層導光体予備成形物、面光源装置用導光体及び面光源装置
TWI713737B (zh) * 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
US10962703B1 (en) 2017-10-12 2021-03-30 Facebook Technologies, Llc Nanoparticle dispersion for increasing optical index of refraction
KR102258616B1 (ko) * 2018-01-10 2021-05-28 주식회사 엘지화학 반도체 패키지용 절연층 제조방법 및 이에 의해 형성된 반도체 패키지용 절연층
CN113195631A (zh) * 2018-12-18 2021-07-30 住友电木株式会社 Lds用热固性树脂组合物和半导体装置的制造方法
CN112409521B (zh) * 2019-11-20 2022-06-17 山东诺尔生物科技有限公司 一种镀膜剂及其制备方法和应用
CN118251458B (zh) * 2021-08-05 2025-08-05 三菱瓦斯化学株式会社 固化性组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板
US11596066B1 (en) * 2022-03-22 2023-02-28 Thintronics. Inc. Materials for printed circuit boards

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260763A (ja) * 1993-03-08 1994-09-16 Hitachi Ltd 多層配線基板の製造方法
JP3557023B2 (ja) * 1995-01-11 2004-08-25 積水化学工業株式会社 基材密着性の良好な表面層を有する物品および該物品の製造方法
JPH11186725A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
US6620719B1 (en) * 2000-03-31 2003-09-16 International Business Machines Corporation Method of forming ohmic contacts using a self doping layer for thin-film transistors
JP2003165827A (ja) * 2001-11-29 2003-06-10 Mitsubishi Gas Chem Co Inc 感光性熱硬化樹脂組成物
US20050129895A1 (en) * 2002-05-27 2005-06-16 Ajinomoto Co., Inc. Adhesive film and prepreg
JP2005037881A (ja) * 2003-04-21 2005-02-10 Fuji Photo Film Co Ltd パターン形成方法、画像形成方法、微粒子吸着パターン形成方法、導電性パターン形成方法、パターン形成材料、及び平版印刷版
TWI321975B (en) * 2003-06-27 2010-03-11 Ajinomoto Kk Resin composition and adhesive film for multi-layered printed wiring board
JP4252919B2 (ja) * 2004-03-25 2009-04-08 富士フイルム株式会社 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法
US7291427B2 (en) * 2004-03-19 2007-11-06 Fujifilm Corporation Surface graft material, conductive pattern material, and production method thereof

Also Published As

Publication number Publication date
JP2007146103A (ja) 2007-06-14
US20090123642A1 (en) 2009-05-14
CN101300284A (zh) 2008-11-05
CN101300284B (zh) 2011-05-11
WO2007052846A1 (en) 2007-05-10

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