JP5097471B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting device capable of emitting various colors by a combination of a light emitting element and a phosphor.

  Light emitting devices having various colors of light emission have been developed by combining a blue light emitting diode and a phosphor that absorbs part of the light output from the blue light emitting diode and outputs light of different wavelengths. . In particular, a pseudo white light emitting device is realized by a combination of a blue light emitting diode and a yellow phosphor. When white is realized by combining the blue light emitting diode and the yellow phosphor as described above, the color tone changes depending on the balance between the light emission intensity of the blue light emitting diode and the light emission intensity of the phosphor. The phosphor is mixed with a light-transmitting resin and applied around the light-emitting diode, but if there is a difference in the amount of resin applied to each of the plurality of light-emitting diodes, the content of the phosphor contained in the resin is increased. A difference occurs, and as a result, a difference in color tone occurs between the plurality of light emitting diodes.

  As a first conventional technique in a method for applying a resin containing a phosphor (hereinafter referred to as a phosphor-containing resin), there is a line coating method. FIG. 15 is a schematic view showing a step of applying a phosphor-containing resin to a light emitting diode by a line coating method. As shown in FIG. 15, while discharging a predetermined amount of phosphor-containing resin from the dispenser 103, the dispenser 103 is moved along the arrangement of the light emitting diodes 101 provided on the base material 102, and the phosphors connected in a line shape The containing resin layer 104 is formed on the base material 102 and the light emitting diode 101. If this line coating method is used, it is possible to manufacture a light emitting device with high mass productivity and a stable shape of the phosphor-containing resin layer 104 (see, for example, Patent Document 1).

JP 2006-229055 A

  When the phosphor-containing resin is applied around the light-emitting diode 101 along the arrangement of the light-emitting diodes 101 by the line coating method, if the surface tension of the phosphor-containing resin is small, the phosphor-containing resin flows out and the light-emitting diodes There is a possibility that the amount of the phosphor-containing resin applied within a predetermined range centering on 101 may decrease, but if the light-emitting diodes 101 are arranged on both sides, the flow-out of the phosphor-containing resin is stopped, and a certain amount The coating amount of the phosphor-containing resin is maintained. FIG. 16 is a diagram showing a light emitting diode 101 coated with a phosphor-containing resin. FIG. 17 is a cross-sectional view of the light-emitting diode 101 coated with the phosphor-containing resin as seen from the XIX-XIX section line of FIG. When the light emitting diode 101 does not exist on one side like the light emitting diodes 101a and 101b provided on both ends of each array of light emitting diodes, the phosphor-containing resin flows out from one side of 101a and 101b as shown in FIG. The shape of the phosphor-containing resin layer 104 is different, and the amount of the phosphor-containing resin applied within a predetermined range centering on the light-emitting diode 101 is reduced as compared with the case where the light-emitting diodes are provided on both sides. Accordingly, there is a problem in that a light emitting device equipped with the light emitting diodes 101a and 101b provided on both ends of each array of light emitting diodes cannot be used due to low chromaticity, resulting in a decrease in yield.

  Also, a method of widening the interval between the light emitting diodes arranged in a row so that the amount of the phosphor-containing resin applied is not affected by the phosphor-containing resin applied to the adjacent light emitting diode, or As described in Patent Document 1, there is a method of providing walls, grooves, steps, or the like on both sides in a direction perpendicular to the arrangement direction of the light emitting diodes arranged in a plurality of rows. However, the former method reduces the number of light emitting devices that can be taken from a single substrate, and is not appropriate in view of production efficiency during manufacturing. Also, the latter method cannot suppress the flow-out of the phosphor-containing resin from the outermost side of the light emitting diodes located at both ends of each array of light emitting diodes.

  Accordingly, an object of the present invention is to provide a method for manufacturing a light emitting device capable of improving the yield by eliminating the difference in chromaticity of the light emitting device and manufacturing the light emitting device with high production efficiency from a single substrate. That is.

The present invention includes a step of providing a plurality of light emitting elements in a row on one surface in the thickness direction of a plate-shaped substrate;
Of the plurality of light emitting elements, a light emitting element provided at an end in the arrangement direction is provided outside the arrangement direction at a predetermined interval from the light emitting element and protrudes in one of the thickness directions Providing a part on the substrate;
A synthetic resin material that emits a color different from the emission color of the light emitting element when the phosphor is dispersed in a liquid state and the phosphor is excited to emit light by the emitted light of the light emitting element, the light emitting element , the protrusion And a step of coating the base material from one side in the thickness direction of the base material and then curing the synthetic resin material to form a resin layer.

  Further, the present invention provides a rectangular shape that is provided on the one surface of the base material, surrounds the plurality of light emitting elements provided in a row from the light emitting elements, and can reflect light emitted from the light emitting elements. Including a step of forming the frame.

According to the present invention, a method for manufacturing a light-emitting device is provided in advance by arranging a plurality of light-emitting elements in a row on a plate-like base material and outside the arrangement direction of the light-emitting elements provided at the end in the arrangement direction. Protrusions are provided at spaced positions, and the liquid phosphor-containing resin is applied to the light emitting element , the protrusions, and the base material from one side in the thickness direction of the base material, and then the synthetic resin material is cured. Forming a resin layer; Accordingly, the phosphor-containing resin in which the protrusions provided on the outermost side of the light emitting elements located at both ends of each array of the light emitting elements arranged in a line on the base material are applied on the light emitting elements of the both end arrays. The outflow to the outside of the is suppressed. For this reason, there is no difference in the coating amount of the phosphor-containing resin due to the flow of the phosphor-containing resin from the light-emitting elements arranged at both ends, and the chromaticity and difference between the light-emitting elements are also suppressed. Will improve. Further, in order to eliminate the difference in the coating amount of the phosphor-containing resin, it is not necessary to increase the arrangement interval of the light emitting elements, and the number of light emitting devices that can be manufactured from one base material is not reduced.

  According to the invention, the method for manufacturing a light emitting device encloses a plurality of light emitting elements arranged in a row on a substrate and forms a rectangular frame that can reflect light emitted from the light emitting elements. Since the process is included, a light-emitting device that can efficiently extract emitted light to a predetermined region can be manufactured.

  FIG. 1 is a cross-sectional view showing a configuration of a light emitting device 50 manufactured by the manufacturing method according to the first embodiment of the present invention.

  In the light emitting device 50, positive and negative electrodes 3 are formed on a flat upper surface that is one surface in the thickness direction of a substantially rectangular substrate 2 made of an insulating material. The substrate 2 is realized by a BT (bismaleimide triazine) resin copper-clad laminated substrate or the like. A positive / negative electrode 3 composed of a pair of positive and negative electrodes is connected to a mounting electrode (not shown) formed on the back surface of the substrate 2 via a conductor portion (not shown) formed in a through hole. The light emitting diode 1 which is a light emitting element is mounted on the positive and negative electrodes 3 of the substrate 2, the negative electrode of the light emitting diode 1 is the negative electrode 3 a on the substrate 2, the positive electrode is the positive electrode 3 b on the substrate 2, Each is connected by a bonding wire 5. As the light emitting diode 1, for example, a blue light emitting diode made of a GaN compound semiconductor is used.

A semi-cylindrical first resin layer 4 is formed so as to cover the light emitting diode 1. The first resin layer 4 is realized by a resin such as epoxy, silicone, or modified silicone. In the first resin layer 4, a filler such as silica or a diffusing material may be dispersed. Thereby, the viscosity of the first resin layer 4 can be adjusted. The first resin layer 4 contains a phosphor (not shown) that emits light having a wavelength different from that of the light emitting diode 1 by excitation light emission when irradiated with light emitted from the light emitting diode 1. For example, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce can be used as the phosphor having a complementary color relationship with blue in order to realize white. On the outside of the first resin layer 4, a second resin layer 6 that does not contain a phosphor is formed so as to overlap the light emitting diode 1 and the first resin layer 4. The second resin layer 6 is formed of a resin such as epoxy, silicone, or modified silicone, and the same material as the first resin layer 4 may be used, or a different material may be used.

  Next, the manufacturing method of the light-emitting device 50 which is the 1st Embodiment of this invention is demonstrated. First, the positive and negative electrodes 3 are formed in a matrix on one surface of the plate-like base material 20, and the light emitting diode 1 is die-bonded at a predetermined position on each positive and negative electrode 3. FIG. 2 is a perspective view showing the light emitting diode 1 provided on the substrate 20. As shown in FIG. 2, the light emitting diodes 1 are arranged in a matrix on the base material 20 and die-bonded, and then wired using bonding wires 5.

  Next, before forming the first resin layer 4 by the line coating method, in order to suppress the flow of the first resin, at the extreme end in the predetermined direction of each row of the light emitting diodes 1 arranged in the predetermined direction. A protruding portion 7 that protrudes in one direction in the thickness direction of the base material 20 is provided at a position that is spaced from the light emitting diode 1 positioned in a predetermined direction outwardly in a predetermined direction. FIG. 3 is a plan view showing the base material 20 provided with the protrusions 7. In FIG. 3, the arrow A indicates the direction in which the dispenser that supplies the first resin moves. As shown in FIG. 3, when supplying the light-emitting diodes 1 onto the row, the endmost row where the dispenser starts discharging is the frontmost row 8, and the endmost row where discharge ends is the last row 9. To do. The base material 20 is formed of a BT resin copper-clad laminated substrate or the like. Moreover, the protrusion part 7 may be formed with the same material as a base material, and may be formed with a semiconductor, a synthetic resin, and a resist. The shape of the protrusion 7 is, for example, a rectangular parallelepiped, a cylinder, a sphere, a pyramid, a prism, or a cone. FIG. 4 is a perspective view showing a state in which the first resin layer 4 is formed on the base material 20. FIG. 5 is a cross-sectional view of the first resin layer 4 when the protruding portion 7 is formed as seen from the VV cut plane line of FIG.

Next, a method for forming the first resin layer 4 will be described. A phosphor is dispersed in the first resin layer 4 in advance. The first resin layer 4 is formed by a line coating method. FIG. 6 is a diagram illustrating a process of forming the first resin layer 4 by a line coating method. As shown in FIG. 6, a predetermined amount of liquid first resin is applied and discharged from the dispenser 10 to the light emitting diode 1 , the protruding portion 7, and the base material 20 from one side in the thickness direction of the base material 20, that is, from the top. However, the dispenser 10 is moved in the direction of the arrow A along the arrangement of the light emitting diodes 1 provided on the base material 20, and the first resin layer 4 containing phosphors connected in a line shape is projected on the base material 20 . Formed on the portion 7 and the light emitting diode 1. When applying by the line application method, the shape of the first resin layer 4 can be determined by the viscosity of the resin. The viscosity of the first resin can be adjusted by mixing, for example, silica in the resin. The amount of silica may be mixed by about 0.1 wt% to 20 wt% of the first resin layer 4. FIG. 7 is a cross-sectional view showing a resist formed outside the light emitting diode 1. As shown in FIG. 7, when the viscosity of the first resin is low, the shape of the first resin layer 4 can be formed more stably if the resist 17 is formed outside the light emitting diode 1.

  If the discharge amount of the first resin is appropriate, the first resin layer 4 can be formed in the proximity region of the light emitting diode 1 and can be made closer to a point light source. As shown in FIG. 1, the cross-sectional shape of the first resin layer 4 is substantially semicircular or semielliptical.

  Subsequently, after the first resin layer 4 is formed, the first resin layer 4 is cured. If the 1st resin layer 4 is a thermosetting resin, after apply | coating at normal temperature, it will heat and harden | cure.

  By forming a protrusion 7 that suppresses resin flow from the front row 8 and the last row 9 of the arrangement of the light emitting diodes 1 at a predetermined interval w1, the front row 8 and the last row 9 of the light emitting diodes 1 are formed. As shown in FIG. 5, the first resin containing the phosphor within the predetermined range as the center is damped to the protruding portion 7, and is out of a predetermined direction with respect to the front row 8 and the last row 9 of the light emitting diode 1. It is suppressed that it flows out to the direction. As shown in FIG. 18 described above, conventionally, the first resin on the light emitting diodes 1 in the front row 8 and the last row 9 has flowed outward, so that it is compared with the light emitting diode 1 in which the light emitting diodes are arranged on both sides. The light emitting diodes 1 in the front row 8 and the last row 9 have a reduced phosphor content, and the light emitting device equipped with the light emitting diodes 1 in the front row 8 or the last row 9 is used because the chromaticity is lowered. However, according to the present invention, it is possible to use the light emitting device in which the light emitting diodes 1 in the front row 8 or the last row 9 are mounted without any decrease in chromaticity.

  Further, the predetermined interval w1 differs depending on the viscosity of the first resin, the shape and size of the protruding portion 7. For example, if the protruding portion 7 has the same shape as the light emitting diodes 1 in the array of light emitting diodes 1, the distance between the light emitting diodes 1 in the front row 8 and the last row 9 and the protruding portion 7 is an arrangement in which the light emitting diodes 1 are arranged. The interval may be the same as the pitch.

  Thus, about the position which forms the protrusion part 7, by suppressing the 1st resin layer 4 on the light emitting diode 1 located in the foremost row 8 and the last row 9 from flowing out by the protrusion part 7, The resin amount of the first resin layer 4 within a predetermined range centered on the light emitting diodes 1 located in the front row 8 and the last row 9 and the resin amount within a predetermined range centered on the other light emitting diodes 1 are What is necessary is just to form in the position which becomes equal.

  Next, the second resin layer 6 is formed. For the formation of the second resin layer 6, methods such as transfer molding, compression molding, and injection molding can be used. For example, in compression molding, after the second resin is applied to the entire surface of the base material 20 after the application of the first resin, it is pressed from the upper surface with a compression molding die and heated to be cured. FIG. 8 is a view showing the base material 20 in which the light emitting diode 1 is sealed with resin. When the same resin as the first resin layer 4 is used for the second resin layer 6, after the first resin layer 4 is applied, the first resin layer 4 is temporarily cured to the extent that the shape of the first resin layer 4 can be maintained. And the second resin layer 6 may be cured simultaneously. By simultaneously curing the first resin layer 4 and the second resin layer 6, the entire curing time can be shortened.

  Next, the light emitting device is completed by cutting out the light emitting device with a predetermined width and length from the base material 20 on which the light emitting diode 1 is sealed with resin. 9 and 10 are diagrams showing the dicing direction. As shown in FIG. 9, the light-emitting device may be cut out and used by dicing from the two-direction dancing lines 12a and 12b. Alternatively, as shown in FIG. It may be used as a linear light source in which a plurality of light emitting diodes 1 are arranged on the material 20. FIG. 11 is a cross-sectional view of a light emitting device formed from a linear light source. In another embodiment of the present invention, a linear light source may be cut by cutting along a line application direction perpendicular to the one direction. Furthermore, you may use as a planar light source, without cut | disconnecting.

  Moreover, when the base material 20 in which the reflecting wall which can reflect the light radiated | emitted from the light emitting diode 1 is used, the method of pouring 2nd resin in a reflecting wall can be used. FIG. 12 is a cross-sectional view showing a light emitting device provided with a reflecting wall 14 outside the light emitting diode 1. FIG. 13 is a cross-sectional view showing a light emitting device provided with a reflecting wall 15 outside the light emitting diode 1 in the linear light source. FIG. 14 is a view showing a base material 20 provided with a reflecting wall 16 made of a rectangular frame formed so as to surround each row of the light emitting diodes 1. By providing the reflecting wall 16, the emitted light can be efficiently extracted to a predetermined region. For example, polyphthalamide is used for the reflecting walls 14 to 16. In this case, a predetermined amount is poured onto the base material 20 on which the first resin layer 4 is line-coated so that the second resin does not exceed the reflection walls 14 to 16 so as to have a uniform height, and is heated and cured. . Furthermore, in the present invention, the presence or absence of the second resin layer 6 does not matter.

  Further, as another embodiment of the present invention, a light emitting diode on a base material when a coating method other than a line coating method, for example, when intermittently coating or when applying a first resin simultaneously with a plurality of dispensers Even when the distance between them is approaching, the same effects as in the above-described embodiment can be achieved by providing the same steps as in the above-described embodiment.

  Further, a position at a predetermined interval outward from the light emitting diodes 1 positioned at the end of each row of the light emitting diodes 1 arranged in the direction perpendicular to the A direction in which the dispenser moves. In addition, the protruding portion 7 may be provided.

Example 1
An outline of a method for manufacturing a light emitting device according to the present invention will be described.

A polyphthalamide reflecting wall made of a rectangular frame as shown in FIG. 14 is pasted on a BT resin substrate, and 20 columns × 4 rows of light emitting diodes (240 μm × 140 μm × 480 μm) are mounted on the substrate. Die bond at a pitch of 800 μm. Next, protrusions having the same shape (240 μm × 140 μm × 480 μm) as the 20 columns of light emitting diodes are arranged outside the front row and the last row at the same arrangement pitch as the light emitting diode columns, as shown in FIG. To do. Next, wire bonding is performed on the light emitting diode. A first resin in which a modified silicone resin is mixed with 10 wt% of a yellow phosphor and 8 wt% of silica is subjected to line coating with a dispenser moving speed of 1 mm / sec and a discharge pressure of 0.4 kg / cm ^2. Heat cure at 100 ° C. for 1 hour. Next, a second resin made of a modified silicone resin is poured into the reflecting wall, and the first resin and the second resin are heated and cured at 100 ° C. for 1 hour and further at 150 ° C. for 3 hours. Finally, by dicing, the light emitting device is manufactured by dividing into pieces with a width of 600 μm and a length of 9 mm.

  As described above, according to the method for manufacturing a light emitting device of the present invention, there is no difference in the amount of the phosphor-containing resin applied between the light-emitting diodes due to the phosphor-containing resin flowing out from the light-emitting diodes positioned in the both ends. The yield of the light emitting device is improved by suppressing the difference in chromaticity between the light emitting diodes. Moreover, in order to eliminate the difference in the application amount of the phosphor-containing resin, it is not necessary to widen the arrangement interval of the light emitting elements, and the number of light emitting devices that can be manufactured from one substrate is not reduced.

It is sectional drawing which shows the structure of the light-emitting device 50 manufactured by the manufacturing method which is the 1st Embodiment of this invention. 2 is a perspective view showing a light emitting diode 1 provided on a base material 20. FIG. It is a top view which shows the base material 20 which provided the protrusion part 7. FIG. 2 is a perspective view showing a state in which a first resin layer 4 is formed on a substrate 20. FIG. It is sectional drawing which looked at the 1st resin layer 4 at the time of forming the protrusion part 7 from the VV cut surface line of FIG. It is a figure which shows the process of forming the 1st resin layer 4 by the line application method. 2 is a cross-sectional view showing a resist formed on the outside of the light-emitting diode 1. FIG. It is a figure which shows the base material 20 with which the light emitting diode 1 was sealed with resin. It is a figure which shows the direction which carries out dicing. It is a figure which shows the direction which carries out dicing. It is sectional drawing of the light-emitting device formed from a linear light source. FIG. 3 is a cross-sectional view showing a base material 20 provided with a reflecting wall 14 outside the light emitting diode 1. It is sectional drawing which shows the base material 20 provided with the reflective wall 15 on the outer side of the light emitting diode 1 in a linear light source. It is a figure which shows the base material 20 provided with the reflective wall 16 which consists of a rectangular frame formed so that each row | line | column of the light emitting diode 1 might be enclosed. It is the schematic which shows the process of apply | coating fluorescent substance containing resin to a light emitting diode by the line application | coating method. It is a figure which shows the light emitting diode 101 which apply | coated fluorescent substance containing resin. It is sectional drawing which looked at the light emitting diode 101 which apply | coated fluorescent substance containing resin from the XIX-XIX cut surface line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Board | substrate 3 Electrode 4 1st resin layer 5 Wire 6 2nd resin layer 7 Protrusion part 14,15,16 Reflecting wall 20 Base material 50 Light-emitting device

Claims (2)

A step of providing a plurality of light emitting elements in a row on one surface in the thickness direction of the plate-shaped substrate;
Of the plurality of light emitting elements, a light emitting element provided at an end in the arrangement direction is provided outside the arrangement direction at a predetermined interval from the light emitting element and protrudes in one of the thickness directions Providing a part on the substrate;
A synthetic resin material that emits a color different from the emission color of the light emitting element when the phosphor is dispersed in a liquid state and the phosphor is excited to emit light by the emitted light of the light emitting element, the light emitting element , the protrusion And a step of coating the base material from one side in the thickness direction of the base material and then curing the synthetic resin material to form a resin layer.   Formed on the one surface of the base material to form a rectangular frame that surrounds the plurality of light emitting elements provided in a row from the light emitting elements and that can reflect light emitted from the light emitting elements. The manufacturing method of the light-emitting device according to claim 1, further comprising:

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