JP2007158009A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2007158009A
JP2007158009A JP2005350953A JP2005350953A JP2007158009A JP 2007158009 A JP2007158009 A JP 2007158009A JP 2005350953 A JP2005350953 A JP 2005350953A JP 2005350953 A JP2005350953 A JP 2005350953A JP 2007158009 A JP2007158009 A JP 2007158009A
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light emitting
light
transparent resin
plane
emitting device
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JP4956977B2 (en
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Michihide Miki
倫英 三木
Kenji Takine
研二 滝根
Ryohei Yamashita
良平 山下
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a very thin light-emitting device which has proper light extracting efficiency from a light-emitting face, and can adjust the color tone in a manufacturing process. <P>SOLUTION: The light-emitting device 1 has a substantially long rectangular substrate 2, having a pair of long sides L and a pair of short sides T, a light-emitting diode 8 connected to a positive electrode 6 and a negative electrode 4 on the substrate 2, a first plane 40 containing the one long side L of the substrate 2, and a second plane 42 facing the first plane 40 and containing the other long side L of the substrate 2. Then, the device comprises a resin, covering the light-emitting diode 8. The resin has a first transparent resin 12, covering the light-emitting diode 8 and containing a phosphor 16, and a second transparent resin 14 covering the first transparent resin 12. Furthermore, both the first transparent resin 12 and the second transparent resin 14 are exposed to the first plane 40 and to the second plane 42, and a reflection member 17 is formed in at least one of the first plane 40 and the second plane 42. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光ダイオードと蛍光体との組合せによって種々の色を発光可能な発光装置に関し、特に導光板等と組み合わせて平面光源を形成する薄型の発光装置に関する。   The present invention relates to a light emitting device capable of emitting various colors by a combination of a light emitting diode and a phosphor, and more particularly to a thin light emitting device that forms a planar light source in combination with a light guide plate or the like.

窒化物半導体を用いた青色発光ダイオードが開発されたことから、該発光ダイオードから出力される光の一部を吸収して異なる波長の光を出力する蛍光体と組み合わせることにより、種々の色調の発光色を有する発光装置を作製することが可能となった。特に、発光ダイオードが青色発光ダイオードであり、蛍光体が青色発光ダイオードの発光の一部を吸収して青色の補色に変換すれば、白色を発光する発光ダイオードが得られる。   Blue light-emitting diodes using nitride semiconductors have been developed. By combining with phosphors that absorb part of the light output from the light-emitting diodes and output light of different wavelengths, light emission of various colors A light emitting device having a color can be manufactured. In particular, if the light emitting diode is a blue light emitting diode and the phosphor absorbs part of the light emitted from the blue light emitting diode and converts it into a blue complementary color, a light emitting diode that emits white light can be obtained.

このような青色発光ダイオードと蛍光体とを組み合わせた発光ダイオードとしては、用途に応じて種々の形状のものが知られている（例えば特許文献１及び２参照）。発光素子を覆い蛍光剤を含む立体状の第１の樹脂層と、第１の樹脂層の全表面又は上面のみを覆う老化防止剤入りの第２の樹脂層と、を備えた表面実装型の発光装置が知られている。この発光装置は、発光素子の周囲に蛍光物質を集めることができ、蛍光物質を理想的な最適位置への混入状態にすることができると共に、第２の樹脂層により、第１の樹脂層、蛍光体及び発光素子を紫外線から保護している。   As light emitting diodes combining such blue light emitting diodes and phosphors, those having various shapes are known depending on the application (see, for example, Patent Documents 1 and 2). A surface-mount type comprising a three-dimensional first resin layer that covers a light-emitting element and includes a fluorescent agent, and a second resin layer containing an anti-aging agent that covers only the entire surface or top surface of the first resin layer Light emitting devices are known. In this light emitting device, the fluorescent material can be collected around the light emitting element, the fluorescent material can be mixed in an ideal optimum position, and the second resin layer allows the first resin layer, The phosphor and the light emitting element are protected from ultraviolet rays.

特許文献３には、発光素子を封止した第１の樹脂層と、第１の樹脂層の外側を覆う第２の樹脂層と、第２の樹脂層の側面に形成された反射部とを備え、第１の樹脂層又は第２の樹脂層のいずれかに、蛍光物質を混入した発光装置が開示されている。この発光装置では、側面に向かった光が反射部によって反射され樹脂内部に戻ることになり、やがては光の射出面側である上方に向かうので、輝度が向上する。   Patent Document 3 includes a first resin layer in which a light emitting element is sealed, a second resin layer that covers the outside of the first resin layer, and a reflection portion that is formed on a side surface of the second resin layer. And a light emitting device in which a fluorescent substance is mixed in either the first resin layer or the second resin layer is disclosed. In this light-emitting device, the light directed toward the side surface is reflected by the reflecting portion and returns to the inside of the resin, and eventually travels upward on the light emission surface side, so that the luminance is improved.

特許文献４には、絶縁性部材から成り凹部を有するパッケージと、パッケージの凹部内からパッケージ底部まで配線されたリード部材と、パッケージの凹部に固定されリード部材に電気的に接続された発光素子と、パッケージの凹部の開口面を覆っている蛍光物質含有の透光性被覆部材とを備えた薄型の発光装置が開示されている。
特開２０００−２００９２８号公報 特開２０００−１２４５０７号公報 特開２００２−３６８２８６号公報 特開２００５−２５２１６８号公報 Patent Document 4 discloses a package made of an insulating member and having a recess, a lead member wired from the inside of the package to the bottom of the package, and a light emitting element fixed to the recess of the package and electrically connected to the lead member. A thin light-emitting device including a fluorescent material-containing translucent covering member covering an opening surface of a recess of a package is disclosed.
JP 2000-200908 A JP 2000-124507 A JP 2002-368286 A JP 2005-252168 A

特許文献４に示すような白色の薄型発光装置は、平板状の導光板と組み合わせて携帯電話等のバックライト用平面光源として利用されている。近年では、より薄型で、且つ高輝度の平面光源への要求が高まっており、これに伴って薄型発光装置に対しても、さらなる薄型化と光の取出し効率向上とが求められている。また、平面光源の色調を一定に維持しつつ欠陥品の発生率を低下するために、製造工程において発光装置ごとの色調を調節できることが望まれている。   A white thin light-emitting device as shown in Patent Document 4 is used as a planar light source for a backlight of a mobile phone or the like in combination with a flat light guide plate. In recent years, there has been an increasing demand for thinner and higher-brightness planar light sources, and accordingly, further reduction in thickness and improvement in light extraction efficiency are required for thin light-emitting devices. In addition, it is desired that the color tone of each light emitting device can be adjusted in the manufacturing process in order to reduce the incidence of defective products while maintaining the color tone of the planar light source constant.

そこで本発明は、極めて薄型で、発光面からの光の取出し効率が良好な発光装置を提供することを目的とする。また、本発明は、製造工程において、色調調節が可能な発光装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a light-emitting device that is extremely thin and has good light extraction efficiency from a light-emitting surface. Another object of the present invention is to provide a light emitting device capable of adjusting the color tone in the manufacturing process.

本発明の発光装置は、発光観測面から観察したときに１対の長辺と１対の短辺とを有する略長矩形の基板と、前記基板上に形成された正極及び負極の電極と、前記正極及び負極に接続された発光ダイオードと、前記基板の一方の長辺を含む第１の平面と該第１の平面に対面し前記基板の他方の長辺を含む第２の平面とを有し、前記発光ダイオードを覆っている樹脂と、を備えた発光装置であって、前記樹脂は、前記発光ダイオードを覆い且つ該発光ダイオードの出射光により励起されて発光する蛍光体を含む第１透明樹脂と、該第１透明樹脂を覆う第２透明樹脂とを有しており、さらに、前記第１の平面と前記第２の平面とには、前記第１透明樹脂と第２透明樹脂とが共に露出しており、前記第１の平面と前記第２の平面の少なくとも一方に、反射部材が形成されていることを特徴とする。   The light emitting device of the present invention comprises a substantially long rectangular substrate having a pair of long sides and a pair of short sides when observed from a light emission observation surface, positive and negative electrodes formed on the substrate, A light emitting diode connected to the positive electrode and the negative electrode; a first plane including one long side of the substrate; and a second plane including the other long side of the substrate facing the first plane. And a resin covering the light emitting diode, wherein the resin includes a phosphor that covers the light emitting diode and is excited by light emitted from the light emitting diode to emit light. And a second transparent resin that covers the first transparent resin, and further, the first transparent resin and the second transparent resin are provided on the first plane and the second plane. Both are exposed and at least one of the first plane and the second plane Wherein the reflecting member is formed.

導光板と組み合わせて平面光源を構成する場合など、発光装置のある用途においては、導光板の幅方向には広い角度範囲に光を出射等の配光制御が必要であるが、導光板の厚さ方向には正面方向を含む狭い角度範囲に光を出射すれば十分である。本発明の発光装置は、第１の平面及び第２の平面に平行な方向（長辺方向と称する）には広い角度範囲で光を出射したり、又はそれらを平行光として出射したりするなど、目的に応じた自由な配光制御ができるように、第１の平面及び第２の平面は基板の長辺に合わせて幅広にする一方、長辺方向と垂直な方向（短辺方向と称する）では、そのような配光制御を必要とせず、正面方向に光が出射できればよいため基板の短辺相当の狭幅にして発光装置を薄型にしている。そして、蛍光体を含む第１透明樹脂層を、第１及び第２の平面から露出させると共に、第１及び第２の平面のいずれか一方に反射部材を一体に形成している。これによって全体が薄型になると共に、第１又は第２の平面からの漏れ光を反射して発光面から効率良く光を出射できる。さらに、反射部材形成前に第１及び第２の平面を研磨することで蛍光体量を調整でき、しかも、第１及び第２の平面を研磨しても配光特性への影響が少ないので、色調の調整が容易にできる。   In some applications of light-emitting devices, such as when a planar light source is configured in combination with a light guide plate, light distribution control such as emitting light over a wide angle range in the width direction of the light guide plate is necessary. In the vertical direction, it is sufficient to emit light in a narrow angle range including the front direction. The light emitting device of the present invention emits light in a wide angle range in a direction parallel to the first plane and the second plane (referred to as a long side direction), or emits them as parallel light. The first plane and the second plane are widened in accordance with the long side of the substrate so as to allow free light distribution control according to the purpose, while the direction perpendicular to the long side direction (referred to as the short side direction). However, such light distribution control is not required, and it is only necessary that light can be emitted in the front direction, so that the light emitting device is made thin by making it narrow corresponding to the short side of the substrate. Then, the first transparent resin layer containing the phosphor is exposed from the first and second planes, and the reflection member is integrally formed on one of the first and second planes. As a result, the entire structure becomes thin, and light leaking from the first or second plane can be reflected to efficiently emit light from the light emitting surface. Furthermore, the amount of the phosphor can be adjusted by polishing the first and second planes before the reflecting member is formed, and even if the first and second planes are polished, there is little influence on the light distribution characteristics. Color tone can be easily adjusted.

このように、本発明は、長辺方向では配光状態の制御を必須とし、短辺方向では配光状態の制御を必要としない薄型の発光装置において、薄型のまま光の取出し効率を向上すると共に、色調不良による欠陥品発生率を低減することができる。   As described above, the present invention improves light extraction efficiency while maintaining a thin shape in a thin light-emitting device that requires control of the light distribution state in the long side direction and does not require control of the light distribution state in the short side direction. At the same time, it is possible to reduce the occurrence rate of defective products due to poor color tone.

実施の形態１．
本実施の形態の発光装置１は、図１の斜視図に示すように、上面が平坦な略直方体形状の絶縁基板２の上面に、蛍光体が分散された第１透明樹脂層１２と、その第１透明樹脂層１２と絶縁基板２のほぼ全面とを覆う第２透明樹脂層１４が順次形成されている。第１透明樹脂層１２の中には、発光ダイオード８が絶縁基板２に固定された状態で配置されている。第１及び第２透明樹脂層１２、１４は、実装基板２上面の長辺Ｌを含む２つの平面４０、４２と、実装基板２上面の短辺Ｔを含む２つの平面４４、４６によって周囲を囲まれている。そして、第１透明樹脂層１４の上面が、発光装置１の光を取り出す発光面１４ｂである。なお、本実施の形態では、発光面１４ｂを凸状の曲面にすることにより発光装置にレンズ機能を持たせている。レンズ機能については、後で詳細に説明する。 Embodiment 1 FIG.
As shown in the perspective view of FIG. 1, the light-emitting device 1 of the present embodiment includes a first transparent resin layer 12 in which phosphors are dispersed on the upper surface of a substantially rectangular parallelepiped insulating substrate 2 having a flat upper surface, A second transparent resin layer 14 that covers the first transparent resin layer 12 and substantially the entire surface of the insulating substrate 2 is sequentially formed. In the first transparent resin layer 12, the light emitting diode 8 is arranged in a state of being fixed to the insulating substrate 2. The first and second transparent resin layers 12 and 14 are surrounded by two planes 40 and 42 including the long side L on the top surface of the mounting substrate 2 and two planes 44 and 46 including the short side T on the top surface of the mounting substrate 2. being surrounded. And the upper surface of the 1st transparent resin layer 14 is the light emission surface 14b which takes out the light of the light-emitting device 1. FIG. In the present embodiment, the light emitting device has a lens function by making the light emitting surface 14b a convex curved surface. The lens function will be described in detail later.

第１及び第２透光性樹脂層１２、１４の周囲を囲む平面のうち、長辺Ｌを含む２つの平面が第１平面４０と第２平面４２である。本実施の形態の発光装置１は、第１平面４０及び第２平面４２と、図２に示したＸ−Ｘ’断面とが、ほぼ同一の形状を備えており、これらの平面４０、４２及び断面では、上縁４０Ｅ、４２Ｅが発光面１４ｂの凸状形状に合わせて山形の曲線形状を描いている。
そして、第１及び第２透光性樹脂層１２、１４の周囲を囲む平面のうち、短辺Ｔを含む２つの平面が第３平面４４及び第４平面４６である。この平面は、第１平面４０、第２平面４２、及び発光面１４ｂと交差して、それらの平面の端部を規定している。本発明では、図１及び図２に図示したような第３平面４４及び第４平面４６を備えた発光装置１の形態の他にも、発光面１４ｂが絶縁基板２の上面まで達しており、第３平面及び第４平面が存在しない発光装置１の形態も含む。 Of the planes surrounding the first and second translucent resin layers 12 and 14, two planes including the long side L are the first plane 40 and the second plane 42. In the light emitting device 1 of the present embodiment, the first plane 40 and the second plane 42 and the XX ′ cross section shown in FIG. 2 have substantially the same shape, and these planes 40, 42 and In the cross section, the upper edges 40E and 42E have a mountain-shaped curved shape in accordance with the convex shape of the light emitting surface 14b.
Of the planes surrounding the first and second translucent resin layers 12 and 14, the two planes including the short side T are the third plane 44 and the fourth plane 46. This plane intersects the first plane 40, the second plane 42, and the light emitting surface 14b, and defines the ends of those planes. In the present invention, in addition to the form of the light emitting device 1 having the third plane 44 and the fourth plane 46 as shown in FIGS. 1 and 2, the light emitting surface 14b reaches the upper surface of the insulating substrate 2, The form of the light-emitting device 1 in which the third plane and the fourth plane do not exist is also included.

本実施形態の発光装置１は、引用文献４に開示された薄型発光装置のような絶縁材料のパッケージを備えていないので、実装基板２の短辺Ｔをパッケージの肉厚分だけ薄型化することができる。特に、本発明のような薄型発光装置では、基板２の長辺Ｌは、短辺Ｔの１．５倍以上１０倍以下にするのが好ましく、薄型でありながら、長辺方向の配光制御の自由度を高めるのに要求される光の広がりを十分に確保して、導光板と組合せた平面光源に使用するのに好適な発光装置を得ることができる。また、発光装置１の短辺Ｔを０．１ｍｍ以上２．０ｍｍ以下にするのが好ましく、バックライトに組み込むのに適した薄型の発光装置を得ることができる。   Since the light emitting device 1 of the present embodiment does not include a package made of an insulating material like the thin light emitting device disclosed in the cited document 4, the short side T of the mounting substrate 2 is thinned by the thickness of the package. Can do. In particular, in the thin light emitting device as in the present invention, the long side L of the substrate 2 is preferably 1.5 times or more and 10 times or less of the short side T, and the light distribution control in the long side direction is thin. It is possible to obtain a light emitting device suitable for use in a planar light source combined with a light guide plate by sufficiently ensuring the spread of light required to increase the degree of freedom. Moreover, it is preferable that the short side T of the light-emitting device 1 is 0.1 mm or more and 2.0 mm or less, and a thin light-emitting device suitable for incorporation in a backlight can be obtained.

図２に示すように、第１透明樹脂１２の形状は、第１平面４０側及び前記第２平面４２側からみたとき、すなわち長辺方向において略半円状であるのが好ましい。このような発光装置１では、発光素子８から発光して長辺方向に広がる光は、蛍光体１６を含む第１透明樹脂層１２の中を等しい距離だけ進行することになるので、長辺方向の光を均一な色調にすることができる。これに対して、図３に示したＹ−Ｙ’断面にあるように、第１透明樹脂層１２の短辺方向における形状は矩形になっているので、短辺方向に広がる光は、第１透明樹脂層１２の中を異なる距離だけ進み、その進行距離によって異なる色調になる。それらの異なる色調の光は、第２平面４２に形成した反射部材１７によって反射されて、発光面１４ｂから取り出される。しかしながら、本発明の発光装置１は、短辺の短い薄型の発光装置であり、出射光の短辺方向への広がり角度が狭いので、様々な色調を有する光は、混色された状態で視認されることになり、観察方向による色調の差を生じることがない。
このように、第１透明樹脂層１２を、長辺方向を含む平面内において略半円形にすることにより、長辺方向における色むらを減らして、光学的特性（配光特性）の良好な発光装置を得ることができる。 As shown in FIG. 2, the shape of the first transparent resin 12 is preferably substantially semicircular when viewed from the first plane 40 side and the second plane 42 side, that is, in the long side direction. In such a light emitting device 1, the light emitted from the light emitting element 8 and spreading in the long side direction travels the same distance in the first transparent resin layer 12 including the phosphor 16. Can be made to have a uniform color tone. On the other hand, since the shape in the short side direction of the first transparent resin layer 12 is rectangular as shown in the YY ′ cross section shown in FIG. 3, the light spreading in the short side direction is the first. Advancing through the transparent resin layer 12 by different distances, the color tone varies depending on the traveling distance. The light of different colors is reflected by the reflecting member 17 formed on the second plane 42 and is extracted from the light emitting surface 14b. However, the light-emitting device 1 of the present invention is a thin light-emitting device with a short short side, and since the spread angle of the emitted light in the short-side direction is narrow, light having various color tones is visually recognized in a mixed state. Therefore, there is no difference in color tone depending on the viewing direction.
As described above, the first transparent resin layer 12 is formed into a substantially semicircular shape in a plane including the long side direction, thereby reducing color unevenness in the long side direction and emitting light with good optical characteristics (light distribution characteristics). A device can be obtained.

本実施の形態の発光装置１は、第２平面４２に金属膜から成る反射部材１７が形成されている。この反射部材１７は、第２平面４２に直接密着して一体に形成するのが好ましい。それにより、別体の反射部材を後で接着するのに比べて接着剤の厚さ分だけ薄くでき、さらに第２平面４２からの漏れ光を反射して発光面から効率良く光を出射できる。反射部材１７は、発光素子８で発光した光と、蛍光体により波長変換された光とのいずれの波長の反射率も高い材料から形成するのが好ましく、第２平面４２の方向に向かった光を確実に反射して、発光装置内に戻すことができる。   In the light emitting device 1 according to the present embodiment, the reflecting member 17 made of a metal film is formed on the second plane 42. The reflecting member 17 is preferably formed in close contact with the second plane 42 and integrally formed. As a result, the thickness of the adhesive can be reduced compared to the case where a separate reflecting member is bonded later, and the light leaked from the second plane 42 can be reflected to efficiently emit light from the light emitting surface. The reflecting member 17 is preferably formed of a material having a high reflectance at any wavelength of the light emitted from the light emitting element 8 and the light whose wavelength is converted by the phosphor, and the light directed toward the second plane 42. Can be reliably reflected back into the light emitting device.

金属材料から成る反射部材１７は、第２平面４２に露出した負電極４及び正電極６に接触して電極間の短絡を起こさないように、それらの電極から間隔ｄをあけて形成されている。しかし、負電極４及び正電極６の露出部分を絶縁処理等によって短絡を防止すれば、反射部材１７は、正及び負電極６、４を覆うように形成することもできる。また、反射部材１７が酸化膜等の絶縁材料から成る場合には、正及び負電極６、４上を覆う反射部材を形成することができる。   The reflection member 17 made of a metal material is formed at a distance d from these electrodes so as not to contact the negative electrode 4 and the positive electrode 6 exposed on the second plane 42 and cause a short circuit between the electrodes. . However, if the exposed portions of the negative electrode 4 and the positive electrode 6 are prevented from being short-circuited by an insulation process or the like, the reflecting member 17 can be formed so as to cover the positive and negative electrodes 6 and 4. When the reflecting member 17 is made of an insulating material such as an oxide film, a reflecting member that covers the positive and negative electrodes 6 and 4 can be formed.

絶縁基板２には、負電極４、正電極６が所定の間隔を空けて形成されている。負電極４及び正電極６は、絶縁基板２の裏面に形成された実装用電極（図示せず）とスルーホール（図示せず）を介して接続されている。正電極及び負電極を半導体面側に備えた発光ダイオード８は、絶縁基板２の負電極４上に実装されており、発光ダイオード８の負電極が絶縁基板２上の負電極４と、正電極が絶縁基板２上の正電極６と、各々ワイヤ１０によって接続されている。   A negative electrode 4 and a positive electrode 6 are formed on the insulating substrate 2 at a predetermined interval. The negative electrode 4 and the positive electrode 6 are connected to a mounting electrode (not shown) formed on the back surface of the insulating substrate 2 through a through hole (not shown). The light emitting diode 8 provided with a positive electrode and a negative electrode on the semiconductor surface side is mounted on the negative electrode 4 of the insulating substrate 2, and the negative electrode of the light emitting diode 8 is connected to the negative electrode 4 on the insulating substrate 2 and the positive electrode. Are connected to the positive electrode 6 on the insulating substrate 2 by wires 10 respectively.

本実施の形態の発光装置１は、第１平面４０及び第２平面４２に第１透明樹脂層１２が露出しているので、反射部材形成前に第１及び第２平面４０、４２を研磨する等によって第１透明樹脂層１２に含まれる蛍光体１６の量を調整して、発光装置の色調を容易に調整することができる。すなわち、第１平面４０又は第２平面４２を研磨等により薄くすれば、第１透明樹脂層１２に含まれる蛍光体１６の量を減らすことができる。これによって製造工程の途中において、発光ダイオード８と蛍光体１６の発光強度比を調節して、個々の発光装置の色調の補正を行うことができる。
なお、本実施の形態のようにシリンドリカルレンズを備えた発光装置１は、色調補正のために第１平面４０及び第２平面４２を切削してもレンズ形状が変わらない。よって、レンズを備えた発光装置１にも、レンズ性能を変化させずに色調補正を行うことができる。 In the light emitting device 1 according to the present embodiment, since the first transparent resin layer 12 is exposed on the first plane 40 and the second plane 42, the first and second planes 40 and 42 are polished before forming the reflecting member. The color tone of the light-emitting device can be easily adjusted by adjusting the amount of the phosphor 16 contained in the first transparent resin layer 12 by, for example. That is, if the first plane 40 or the second plane 42 is thinned by polishing or the like, the amount of the phosphor 16 contained in the first transparent resin layer 12 can be reduced. In this way, the color tone of each light emitting device can be corrected by adjusting the light emission intensity ratio between the light emitting diode 8 and the phosphor 16 during the manufacturing process.
Note that the light emitting device 1 having a cylindrical lens as in the present embodiment does not change the lens shape even if the first plane 40 and the second plane 42 are cut for color tone correction. Therefore, the color tone correction can be performed on the light emitting device 1 including the lens without changing the lens performance.

図４及び図５は、図１乃至図３に示した発光装置１を実装基板上に実装した様子を示す斜視図である。なお、図４の発光装置１は、説明のために反射部材１７を除いた状態で図示している。発光装置１は、該装置の長手方向に平行な第１平面４０を実装面として、実装基板３の上に実装されている。このとき発光面である第２透明樹脂層１４の発光面１４ｂは、実装基板３に対して略垂直となる。発光装置１は、実装基板３と接する第１平面４０において、絶縁基板２、第１透明樹脂層１２及び第２透明樹脂層１４が全て略面一になっているため、実装面が広面積かつ平坦であり、安定した実装が可能である。実装基板３の表面には、正及び負のリード電極１８及び２０が形成されており、発光装置１の絶縁基板３の裏面に形成された実装用電極（図示せず）と半田２２によって接続されている。   4 and 5 are perspective views showing a state in which the light emitting device 1 shown in FIGS. 1 to 3 is mounted on a mounting substrate. In addition, the light-emitting device 1 of FIG. 4 is illustrated in a state where the reflection member 17 is removed for the sake of explanation. The light emitting device 1 is mounted on the mounting substrate 3 with a first plane 40 parallel to the longitudinal direction of the device as a mounting surface. At this time, the light emitting surface 14 b of the second transparent resin layer 14 that is the light emitting surface is substantially perpendicular to the mounting substrate 3. In the light emitting device 1, the insulating substrate 2, the first transparent resin layer 12, and the second transparent resin layer 14 are all substantially flush with each other on the first plane 40 in contact with the mounting substrate 3. Flat and stable mounting is possible. Positive and negative lead electrodes 18 and 20 are formed on the surface of the mounting substrate 3, and are connected to mounting electrodes (not shown) formed on the back surface of the insulating substrate 3 of the light emitting device 1 by solder 22. ing.

発光装置１の実装面が第１平面４０であるときには、反射部材１７は、第２平面４２に形成されているのが好ましい。発光装置１の中の発光ダイオード８で発生した光は、一部は第２透明樹脂層１４の上面（レンズ形成面）１４ｂに直進するが、多くは第１平面４０及び第２平面４２に進み、反射されながらレンズ形成面１４ｂに進む。第１平面４０は、実装基板３により反射されやすくなっているのに対して、第２平面４２は反射率が低いので、第２平面４２から漏れていた光は、発光装置の光の損失になっていた。本実施の形態にかかる発光装置では、第２平面４２に反射部材１７を一体に形成することによって、漏れ光を発光装置に戻して発光面から取り出すことができるので、発光装置１の発光効率を著しく向上することができる。   When the mounting surface of the light emitting device 1 is the first plane 40, the reflecting member 17 is preferably formed on the second plane 42. A part of the light generated by the light emitting diode 8 in the light emitting device 1 goes straight to the upper surface (lens forming surface) 14 b of the second transparent resin layer 14, but most goes to the first plane 40 and the second plane 42. The light advances to the lens forming surface 14b while being reflected. The first plane 40 is easily reflected by the mounting substrate 3, whereas the second plane 42 has a low reflectance, so that light leaking from the second plane 42 is lost to the light of the light emitting device. It was. In the light emitting device according to the present embodiment, by integrally forming the reflecting member 17 on the second plane 42, the leakage light can be returned to the light emitting device and taken out from the light emitting surface. It can be significantly improved.

本実施の形態に係る発光装置は、発光装置１の一方の側面に反射部材１７を形成し、その反射面が実装基板３への実装面と対向するように実装することにより、発光装置１の発光効率を向上させることができる。また、発光装置１の製造途中で、発光装置１の第２平面４２の表面上に反射部材１７を直接形成すれば、発光装置１と反射部材１７とを直接密着させることができる。このことは、例えば反射部材１７を発光装置１に接着剤によって付着させた場合や、単に反射部材１７を発光装置１に隣接配置させた場合に比べて、発光装置１と反射部材１７との隙間が生じず、発光装置１の厚さを抑えることができるので好ましい。また、発光装置１と反射部材１７との間に接着剤や空間による隙間があると、発光装置１から漏れだした光が、反射部材１７で反射されて発光装置１内に戻ってくる間に、光の損失が生じてしまう。これに対して、本実施の形態では、発光装置１と反射部材１７とが密着しているので、光の損失が起こるのを抑制できる点でも有効である。さらに、本発明では、反射部材１７を第２平面４２上に直接形成することにより、厚さが極めて薄くて別体として取り扱うことのできないような薄膜状の反射部材１７を利用することができるので、発光装置１の薄型化に有利である。   In the light emitting device according to the present embodiment, the reflecting member 17 is formed on one side surface of the light emitting device 1 and mounted so that the reflecting surface faces the mounting surface on the mounting substrate 3. Luminous efficiency can be improved. Further, if the reflecting member 17 is directly formed on the surface of the second plane 42 of the light emitting device 1 during the manufacturing of the light emitting device 1, the light emitting device 1 and the reflecting member 17 can be directly adhered to each other. This is because, for example, the gap between the light emitting device 1 and the reflecting member 17 is larger than when the reflecting member 17 is attached to the light emitting device 1 with an adhesive or when the reflecting member 17 is simply disposed adjacent to the light emitting device 1. This is preferable because the thickness of the light emitting device 1 can be suppressed. If there is a gap due to an adhesive or space between the light emitting device 1 and the reflecting member 17, the light leaked from the light emitting device 1 is reflected by the reflecting member 17 and returns into the light emitting device 1. Loss of light will occur. On the other hand, in this Embodiment, since the light-emitting device 1 and the reflection member 17 are closely_contact | adhered, it is effective also at the point which can suppress that the loss of light arises. Furthermore, in the present invention, by forming the reflecting member 17 directly on the second plane 42, it is possible to use the thin-film reflecting member 17 that is extremely thin and cannot be handled separately. This is advantageous for reducing the thickness of the light emitting device 1.

図１及び図２に示すように、発光装置１の発光面１４ｂを凸状の曲面に成形してレンズ機能を持たせると、別体のレンズを必要とせず、発光装置の光学的特性（配光特性）を良好にできるので好ましい。図１及び図２の発光装置１では、発光面１４ｂのレンズ形状は、半円柱状のシリンドリカルレンズである。このシリンドリカルレンズは、発光装置１の長辺方向（長辺方向）の断面においては曲率を有しているので、光を正面方向に曲げることができる。すなわち、シリンドリカルレンズは、発光ダイオード８や蛍光体１６から発光して発光装置１の長辺方向に広がった光を、発光方向Ａに向かう平行光に変換することができる。また、このシリンドリカルレンズは、発光装置１の短辺方向の断面においては曲率を有していないので光を直進させる。本発明のように薄型の発光装置１では、発光ダイオード等８で発光した光は、短辺方向にはそれほど広がらないので、短辺方向のレンズ効果はそれほど必要とはされない。よって、本発明の発光装置１は、シリンドリカルレンズのように異方的なレンズ機能によって、十分に配光を制御することができる。   As shown in FIGS. 1 and 2, when the light emitting surface 14b of the light emitting device 1 is formed into a convex curved surface to have a lens function, a separate lens is not required, and the optical characteristics (arrangement) of the light emitting device are not required. It is preferable because the optical characteristics can be improved. In the light emitting device 1 of FIGS. 1 and 2, the lens shape of the light emitting surface 14b is a semi-cylindrical cylindrical lens. Since this cylindrical lens has a curvature in the cross section in the long side direction (long side direction) of the light emitting device 1, light can be bent in the front direction. That is, the cylindrical lens can convert the light emitted from the light emitting diode 8 and the phosphor 16 and spreading in the long side direction of the light emitting device 1 into parallel light traveling in the light emitting direction A. In addition, since this cylindrical lens does not have a curvature in the cross section in the short side direction of the light emitting device 1, it advances light straight. In the thin light emitting device 1 as in the present invention, the light emitted from the light emitting diode 8 or the like does not spread so much in the short side direction, so that the lens effect in the short side direction is not so necessary. Therefore, the light-emitting device 1 of the present invention can sufficiently control the light distribution by an anisotropic lens function like a cylindrical lens.

また、図に示したような凸状のシリンドリカルレンズ以外にも、発光素子から第１樹脂層を通過した光を所望の方向に曲げることのできるレンズであれば、本発明の発光装置に利用することができる。例えば、凹状のシリンドリカルレンズにして、横方向への光を広げる導光板と組合せることもできる。   In addition to the convex cylindrical lens as shown in the figure, any lens that can bend the light passing through the first resin layer from the light emitting element in a desired direction is used for the light emitting device of the present invention. be able to. For example, a concave cylindrical lens can be combined with a light guide plate that spreads light in the lateral direction.

第１及び第２透明樹脂層１２、１４のうち、レンズ形状に加工に適しているのは第２透明樹脂層１４である。第２透明樹脂層１４には、光散乱の原因にもなる蛍光体１６は分散されていないので、第２透明樹脂層１４のレンズ作用が阻害される恐れがないからである。尚、第２透明樹脂層１４には、レンズ作用を阻害しない程度の少量であれば、蛍光体を分散させることができる。このとき、第２透明樹脂層１４に含まれる蛍光体の平均密度は、第１透明樹脂層１２に含まれる蛍光体の平均密度の１／１０以下、特に好ましくは１／１００以下であることが好ましい。
このように、第２透明樹脂層１４は、発光ダイオード８等を保護する封止層として機能すると同時に、発光装置の光線方向を制御するレンズ層として機能する。 Of the first and second transparent resin layers 12 and 14, the second transparent resin layer 14 is suitable for processing into a lens shape. This is because the fluorescent material 16 that also causes light scattering is not dispersed in the second transparent resin layer 14, so that the lens action of the second transparent resin layer 14 is not hindered. In the second transparent resin layer 14, the phosphor can be dispersed if the amount is small enough not to inhibit the lens action. At this time, the average density of the phosphor contained in the second transparent resin layer 14 is 1/10 or less, particularly preferably 1/100 or less, of the average density of the phosphor contained in the first transparent resin layer 12. preferable.
As described above, the second transparent resin layer 14 functions as a sealing layer that protects the light emitting diode 8 and the like, and at the same time functions as a lens layer that controls the light beam direction of the light emitting device.

さらに、本実施の形態に係る発光装置は、後述するように、第１透明樹脂１４をライン塗布又は印刷法によって形成できるため、簡易に製造することができる利点もある。   Furthermore, since the light emitting device according to the present embodiment can form the first transparent resin 14 by line coating or printing as described later, there is an advantage that it can be easily manufactured.

以下、発光装置１の各構成について詳細に説明する。
（第１透明樹脂層１２）
第１透明樹脂層１２は、できるだけ発光ダイオード８の近傍に形成されることが好ましい。これは、第１透明樹脂層１２の内部に分散された蛍光体１６が発光するため、その分布が狭い方が理想的な点光源に近づくからである。また、第１透明樹脂層１２の高さは、できるだけ低い方が好ましい。但し、ワイヤ１０よりも低くなると、ワイヤ１０が第１透明樹脂層１２と第２透明樹脂層１４にまたがることになり、ワイヤ１０が切れ易くなる。従って、第１透明樹脂層１０の高さは、少なくともワイヤ１０を越えることが好ましい。また、より理想的な点光源に近づける目的で、第１透明樹脂層１２内において蛍光体１６を沈降させることが好ましい。但し、蛍光体１６が沈降し過ぎると、第１透明樹脂層１２の研磨によって色調が補正しにくくなるため、適当な程度に沈降させることが好ましい。また、第１透明樹脂層１２は、略半円柱状であり、実装面に平行な断面（＝発光面に直交する断面）が半円状又は半楕円状であることが好ましい。これによって観察方位による色ムラが小さくなる。尚、第１透明樹脂層１２を上記形状に形成するには、本実施の形態で説明するライン塗布法を用いることが好ましい。尚、第１透明樹脂層１２は、実施の形態２で説明するように印刷で形成しても良い。 Hereinafter, each structure of the light-emitting device 1 is demonstrated in detail.
(First transparent resin layer 12)
The first transparent resin layer 12 is preferably formed as close to the light emitting diode 8 as possible. This is because the phosphor 16 dispersed inside the first transparent resin layer 12 emits light, and the narrower distribution approaches the ideal point light source. Further, the height of the first transparent resin layer 12 is preferably as low as possible. However, if it becomes lower than the wire 10, the wire 10 will straddle the 1st transparent resin layer 12 and the 2nd transparent resin layer 14, and the wire 10 will become easy to cut | disconnect. Therefore, it is preferable that the height of the first transparent resin layer 10 exceeds at least the wire 10. Moreover, it is preferable that the phosphor 16 is settled in the first transparent resin layer 12 for the purpose of bringing it closer to an ideal point light source. However, if the phosphor 16 is excessively settled, it is difficult to correct the color tone by polishing the first transparent resin layer 12, and therefore it is preferable to settle the phosphor 16 to an appropriate degree. The first transparent resin layer 12 is preferably substantially semi-cylindrical, and the cross section parallel to the mounting surface (= the cross section perpendicular to the light emitting surface) is preferably semicircular or semielliptical. This reduces color unevenness due to the viewing direction. In addition, in order to form the 1st transparent resin layer 12 in the said shape, it is preferable to use the line coating method demonstrated in this Embodiment. Note that the first transparent resin layer 12 may be formed by printing as described in the second embodiment.

第１透明樹脂層１２の材料は、発光ダイオード８と蛍光体１６の発光を透過し、蛍光体１６を安定に分散可能な材料であれば特に限定されない。例えば、エポキシ、シリコーン、変成シリコーン、ウレタン樹脂、オキセタン樹脂、アクリル、ポリカーボネイト、ポリイミドなどの樹脂を用いることができる。さらに、樹脂以外にガラスを用いることができる。第１透明樹脂層１２中にフィラーや拡散材が分散されていても良い。尚、第１透明樹脂層１２は、発光ダイオード８の熱を受け易いため、耐熱性の良好な樹脂であることが好ましい。例えば、エポキシ、シリコーン樹脂、変成シリコーン樹脂、オキセタン樹脂を用いることが好ましい。第１透明樹脂層１２の粘度は、硬化前で１００〜２０００ｍＰa・sであることが好ましい。尚、ここでいう「粘度」は、円錐平板型回転粘度計を用い、常温下で測定したものを指す。また、第１透明樹脂は、硬化条件が８０℃〜１８０℃、数分〜数時間の下で形状を維持できる程度の硬さになる樹脂であることが望ましい。   The material of the first transparent resin layer 12 is not particularly limited as long as it is a material that transmits light emitted from the light emitting diode 8 and the phosphor 16 and can stably disperse the phosphor 16. For example, resins such as epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, and polyimide can be used. Furthermore, glass can be used in addition to the resin. A filler or a diffusing material may be dispersed in the first transparent resin layer 12. In addition, since the 1st transparent resin layer 12 is easy to receive the heat | fever of the light emitting diode 8, it is preferable that it is resin with favorable heat resistance. For example, it is preferable to use an epoxy, a silicone resin, a modified silicone resin, or an oxetane resin. The viscosity of the first transparent resin layer 12 is preferably 100 to 2000 mPa · s before curing. In addition, "viscosity" here refers to what was measured at normal temperature using the cone-plate type rotational viscometer. In addition, the first transparent resin is desirably a resin having a hardness that can maintain the shape under curing conditions of 80 ° C. to 180 ° C. and several minutes to several hours.

（第２透明樹脂層１４）
第２透明樹脂層１４に形成するレンズは、実装面に平行な方向に大きなレンズ径を有することが好ましい。これは実装面に平行な方向は、実装面に垂直な方向に比べて配光特性を制御する必要性が高いからである。一方、実装面に垂直な方向には薄型にする必要があるため、レンズ径を小さくすることが好ましい。また、実装面に垂直な方向には、レンズの曲率も小さなことが好ましい。これは、実装面に垂直な方向に大きな曲率を持ったレンズを形成すると、第１及び第２透明樹脂層１２、１４の側面を研磨して色調を補正する際に、レンズ特性が変化し易くなるからである。例えば、第２透明樹脂層１４に形成するレンズを、実装面に平行な方向にだけ曲率を有するシリンドリカルレンズとしても良い。尚、実装面に垂直な方向における第２透明樹脂層１４の断面は、完全に平らである必要はなく、ある程度の曲率を有していても構わない。 (Second transparent resin layer 14)
The lens formed on the second transparent resin layer 14 preferably has a large lens diameter in a direction parallel to the mounting surface. This is because the direction parallel to the mounting surface needs to control the light distribution characteristics higher than the direction perpendicular to the mounting surface. On the other hand, since it is necessary to reduce the thickness in the direction perpendicular to the mounting surface, it is preferable to reduce the lens diameter. In addition, the curvature of the lens is preferably small in the direction perpendicular to the mounting surface. This is because, when a lens having a large curvature in the direction perpendicular to the mounting surface is formed, the lens characteristics are likely to change when the side surfaces of the first and second transparent resin layers 12 and 14 are polished to correct the color tone. Because it becomes. For example, the lens formed on the second transparent resin layer 14 may be a cylindrical lens having a curvature only in a direction parallel to the mounting surface. The cross section of the second transparent resin layer 14 in the direction perpendicular to the mounting surface does not have to be completely flat, and may have a certain degree of curvature.

また、第２透明樹脂層１４の材料は、発光ダイオード８と蛍光体１６の発光を透過する材料であれば特に限定されない。例えば、エポキシ、シリコーン、変成シリコーン、ウレタン樹脂、オキセタン樹脂、アクリル、ポリカーボネイト、ポリイミド等を用いることができる。さらに、樹脂以外にガラスを用いることもできる。第２透明樹脂層１４中に、フィラーや拡散剤が分散されていてもよい。第２透明樹脂層１４は、第１透明樹脂層１２や発光ダイオード８を保護する役割も果たすため、絶縁基板２との密着性、耐候性、硬度に優れ、ごみの付着しにくいものが好ましい。例えば、エポキシ、シリコーン、変成シリコーン、オキセタン樹脂を用いることが好ましい。   The material of the second transparent resin layer 14 is not particularly limited as long as it is a material that transmits light emitted from the light emitting diode 8 and the phosphor 16. For example, epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, polyimide, or the like can be used. Furthermore, glass can be used in addition to the resin. A filler or a diffusing agent may be dispersed in the second transparent resin layer 14. Since the 2nd transparent resin layer 14 also plays the role which protects the 1st transparent resin layer 12 and the light emitting diode 8, it is excellent in the adhesiveness with the insulating substrate 2, a weather resistance, and hardness, and a thing to which dust does not adhere easily is preferable. For example, it is preferable to use epoxy, silicone, modified silicone, or oxetane resin.

（絶縁基板２／電極４、６）
絶縁基板２は、適当な機械的強度と絶縁性を有する材料であれば特に限定されない。例えば、ＢＴレジン、ガラスエポキシ等を用いることができる。また、エポキシ系樹脂シートを多層張り合わせたものでも良い。また、絶縁基板２に形成する負及び正電極４，６は、Ｃｕを主成分とする金属層とすることが好ましい。例えば、負及び正電極４，６は、Ｃｕ／Ｎｉ／Ａｇによって構成することができる。 (Insulating substrate 2 / electrodes 4, 6)
The insulating substrate 2 is not particularly limited as long as it is a material having appropriate mechanical strength and insulating properties. For example, BT resin, glass epoxy, or the like can be used. Moreover, what laminated | stacked the multilayered epoxy resin sheet may be used. In addition, the negative and positive electrodes 4 and 6 formed on the insulating substrate 2 are preferably metal layers mainly composed of Cu. For example, the negative and positive electrodes 4 and 6 can be made of Cu / Ni / Ag.

（発光ダイオード８／蛍光体１６）
発光ダイオード８と蛍光体１６は、発光ダイオード８の一部又は全部の発光を蛍光体１６が波長変換できるような組合せであれば特に限定されない。例として、現在最も需要の多い白色の発光装置を構成するために適した発光ダイオード８と蛍光体１６の組合せについて説明する。
−発光ダイオード８
白色の発光装置を構成するために適した発光ダイオードとして、窒化物半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）を用いたものを用いることができる。この発光ダイオードは、ＩｎｘＧａ1-ｘＮ（０＜ｘ＜１）を発光層として有しており、その混晶度によって発光波長を約３６５ｎｍから６５０ｎｍで任意に変えることができる。 (Light emitting diode 8 / phosphor 16)
The light emitting diode 8 and the phosphor 16 are not particularly limited as long as the phosphor 16 can convert the wavelength of part or all of the light emission of the light emitting diode 8. As an example, a combination of the light-emitting diode 8 and the phosphor 16 suitable for forming a white light-emitting device that is currently in the highest demand will be described.
-Light emitting diode 8
As a light-emitting diode suitable for configuring a white light emitting device, the use of which using a nitride semiconductor (In X Al Y Ga 1- X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) Can do. This light emitting diode has In x Ga 1-x N (0 <x <1) as a light emitting layer, and the light emission wavelength can be arbitrarily changed from about 365 nm to 650 nm depending on the degree of mixed crystal.

白色系の光を発光させる場合は、蛍光体から出射される光との補色関係を考慮すると、発光ダイオード８の発光波長は４００ｎｍ以上５３０ｎｍ以下に設定することが好ましく、４２０ｎｍ以上４９０ｎｍ以下に設定することがより好ましい。なお、蛍光体の種類を選択することにより、４００ｎｍより短い紫外域の波長の光を発光するＬＥＤチップを適用することもできる。   In the case of emitting white light, considering the complementary color relationship with the light emitted from the phosphor, the emission wavelength of the light emitting diode 8 is preferably set to 400 nm or more and 530 nm or less, and set to 420 nm or more and 490 nm or less. It is more preferable. An LED chip that emits light having a wavelength in the ultraviolet region shorter than 400 nm can also be applied by selecting the type of phosphor.

−蛍光体１６
蛍光体１６は、例えば、窒化物系半導体を発光層とする半導体発光ダイオード８からの光を吸収し異なる波長の光に波長変換するものであればよい。例えば、Ｅｕ、Ｃｅ等のランタノイド系元素で主に賦活される窒化物系蛍光体・酸窒化物系蛍光体、Ｅｕ等のランタノイド系、Ｍｎ等の遷移金属系の元素により主に付活されるアルカリ土類ハロゲンアパタイト蛍光体、アルカリ土類金属ホウ酸ハロゲン蛍光体、アルカリ土類金属アルミン酸塩蛍光体、アルカリ土類ケイ酸塩、アルカリ土類硫化物、アルカリ土類チオガレート、アルカリ土類窒化ケイ素、ゲルマン酸塩、又は、Ｃｅ等のランタノイド系元素で主に付活される希土類アルミン酸塩、希土類ケイ酸塩又はＥｕ等のランタノイド系元素で主に賦活される有機及び有機錯体等から選ばれる少なくともいずれか１以上であることが好ましい。 -Phosphor 16
The phosphor 16 may be any material that absorbs light from the semiconductor light emitting diode 8 having a nitride semiconductor as a light emitting layer and converts the light into light having a different wavelength. For example, it is mainly activated by nitride-based phosphors / oxynitride-based phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid-based phosphors such as Eu, and transition metal elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth nitriding Selected from silicon, germanate, or rare earth aluminate mainly activated by lanthanoid elements such as Ce, organic and organic complexes mainly activated by lanthanoid elements such as rare earth silicate or Eu It is preferable that it is at least any one or more.

（反射部材１７）
反射部材１７は、発光ダイオード８からの発光と蛍光体１６により変換された光とを高効率で反射できる材料であれば特に限定されない。例としては、Ａｌ、Ａｇ、Ｐｔ、Ｒｈ、Ｎｉ等の金属や、酸化チタン、アルミナ、シリカ等の酸化物を用いることができる。金属材料から成る反射部材１７は、無電解メッキや蒸着によって膜状に形成することができる。また、酸化物材料から成る反射部材１７は、粉末状にした酸化物材料をバインダーに分散させた後に塗布して膜状に形成することができる。 (Reflection member 17)
The reflecting member 17 is not particularly limited as long as it is a material that can reflect light emitted from the light emitting diode 8 and light converted by the phosphor 16 with high efficiency. For example, metals such as Al, Ag, Pt, Rh, and Ni, and oxides such as titanium oxide, alumina, and silica can be used. The reflecting member 17 made of a metal material can be formed into a film by electroless plating or vapor deposition. Further, the reflecting member 17 made of an oxide material can be formed into a film shape by applying a powdered oxide material after dispersing it in a binder.

（色調の補正方法）
次に、本実施の形態における色調の補正方法について説明する。同時に多数の発光装置の色調補正を行う場合、次のような方法で行うことが好ましい。 (Color correction method)
Next, a color tone correction method according to this embodiment will be described. When correcting the color tone of a large number of light emitting devices at the same time, it is preferable to perform the following method.

−ステップ１．
ステップ１では、第１及び第２透明樹脂層を硬化させた後の発光装置の色度を全数測定する（初期色度測定工程）。 -Step 1.
In step 1, the chromaticities of the light emitting devices after the first and second transparent resin layers are cured are measured in total (initial chromaticity measuring step).

−ステップ２．
ステップ２では、ステップ１で測定された色度に基づいて、前記測定された色度と目標色度との差があらかじめ設定された範囲内にあるものをそれぞれ１つのグループとすることにより色度範囲ごとに分類する（グループ化工程）。分類するグループ数は、調整後の色度バラツキを小さくするためには多い程よいが、要求される色度の範囲（規格）及び製造効率を考慮して適当な分類数とする。 -Step 2.
In step 2, based on the chromaticity measured in step 1, chromaticity is determined by grouping a group in which the difference between the measured chromaticity and the target chromaticity is within a preset range. Sort by range (grouping process). The number of groups to be classified is preferably as large as possible to reduce the chromaticity variation after adjustment, but the number of groups is set to an appropriate number in consideration of the required chromaticity range (standard) and manufacturing efficiency.

−ステップ３．
最後に、ステップ３で、各グループごとに、目標色度との差に基づいて設定された量だけ第１及び第２透明樹脂層の側面を研磨する（研磨工程）。すなわち、同一のグループに属する発光素子は、同じ研磨量（グループごとに設定された値）だけ研磨される。以上のような調整方法によれば、グループごとに一括して色度を調整できるので、効率よく色度を調整でき、かつ色度バラツキを小さくできる。尚、研磨は実装面と逆側の側面で行うことが好ましい。実装面の平坦性を損なわないためである。 -Step 3.
Finally, in step 3, the side surfaces of the first and second transparent resin layers are polished for each group by an amount set based on the difference from the target chromaticity (polishing step). That is, light emitting elements belonging to the same group are polished by the same polishing amount (value set for each group). According to the adjustment method as described above, chromaticity can be adjusted collectively for each group, so that chromaticity can be adjusted efficiently and chromaticity variation can be reduced. The polishing is preferably performed on the side surface opposite to the mounting surface. This is because the flatness of the mounting surface is not impaired.

研磨は、例えば次のような方法で行うことができる。研磨装置上に複数個配列して、目標色度になるように研磨する。研磨するための工具は、回転軸の先に、例えば、円盤形状の砥石を設けたものを用い、第１透明樹脂層１２及び第２透明樹脂層１４を、目標色度と測定色度との差に対応した量だけ研磨する。この研磨の際、研磨装置上に配列した複数の発光装置の各々に対して砥石を設けることにより、複数の発光装置を一度に調整することができる。また、この際、削り量に応じてグルーピングして一括して削るようにもできるし、１つ１つ光センサーにより色度を測定しながら目標色度になるまで削るようにしてもよい（この場合でも、光センサーと砥石をそれぞれの発光装置に設けて各発光素子ごとに削り量を制御するようにすれば、複数の発光素子を同時に並列処理できることはいうまでもない）。   Polishing can be performed, for example, by the following method. A plurality are arranged on a polishing apparatus and polished so as to achieve a target chromaticity. As a tool for polishing, for example, a disk-shaped grindstone is provided at the tip of the rotating shaft, and the first transparent resin layer 12 and the second transparent resin layer 14 are made to have a target chromaticity and a measured chromaticity. Polish by the amount corresponding to the difference. During this polishing, a plurality of light emitting devices can be adjusted at a time by providing a grindstone for each of the plurality of light emitting devices arranged on the polishing apparatus. At this time, grouping can be performed in accordance with the amount of shaving, and shaving can be performed all at once, or shaving until the target chromaticity is achieved while measuring the chromaticity one by one with an optical sensor (this Even in such a case, it is needless to say that a plurality of light emitting elements can be simultaneously processed in parallel if an optical sensor and a grindstone are provided in each light emitting device to control the amount of shaving for each light emitting element.

（製造方法）
次に、本実施の形態に係る発光装置の製造方法について説明する。
１、パッケージアッセンブリ
本実施の形態の製造方法において、複数の発光装置を一括して製造できるように、第２透明樹脂層１４を硬化させるまでは複数のパッケージが集合したパッケージアッセンブリを用いる。このパッケージアッセンブリにおいては、大面積の絶縁基板２上に、各発光ダイオード８の実装領域がマトリックス状に配置されている（図８Ａ参照）。また、各発光ダイオード８の実装領域を両側から挟むように、各々の発光ダイオード８に対応する負電極４及び正電極６が形成されている。また、各列のパッケージは、互いの負電極同士及び正電極同士がつながっている。すなわち、各列の負電極４及び正電極６は、各々、１本の連続した電極となっている（図６Ａ参照）。絶縁性基板２は、例えば厚さが０．０６ｍｍ〜２．０ｍｍの樹脂積層品等からなり、厚さ方向に貫通する複数のスルーホール（図示せず）が形成されている。負電極４と正電極６は、このスルーホールを介して、絶縁基板２の裏面に形成された実装用電極とつながっている。 (Production method)
Next, a method for manufacturing the light emitting device according to this embodiment will be described.
1. Package assembly In the manufacturing method of the present embodiment, a package assembly in which a plurality of packages are gathered is used until the second transparent resin layer 14 is cured so that a plurality of light emitting devices can be manufactured collectively. In this package assembly, mounting regions for the respective light-emitting diodes 8 are arranged in a matrix on a large-area insulating substrate 2 (see FIG. 8A). Moreover, the negative electrode 4 and the positive electrode 6 corresponding to each light emitting diode 8 are formed so as to sandwich the mounting region of each light emitting diode 8 from both sides. In addition, the negative electrodes and the positive electrodes of the packages in each row are connected to each other. That is, the negative electrode 4 and the positive electrode 6 in each column are each one continuous electrode (see FIG. 6A). The insulating substrate 2 is made of a resin laminate having a thickness of 0.06 mm to 2.0 mm, for example, and has a plurality of through holes (not shown) penetrating in the thickness direction. The negative electrode 4 and the positive electrode 6 are connected to the mounting electrode formed on the back surface of the insulating substrate 2 through this through hole.

２、発光ダイオード８の実装
上述のように構成されたパッケージアッセンブリの各負電極４の所定の位置に、発光ダイオード８をダイボンディングする。そして、ワイヤ１０により所定の配線をする（図５Ａ参照）。 2. Mounting of Light-Emitting Diode 8 The light-emitting diode 8 is die-bonded at a predetermined position of each negative electrode 4 of the package assembly configured as described above. Then, predetermined wiring is performed with the wire 10 (see FIG. 5A).

３、第１透明樹脂層１２の形成
次に、第１透明樹脂層１２を形成する。第１透明樹脂層１２には予め所定量の蛍光体１６が分散されている。第１透明樹脂層１２は、図６Ａ〜Ｃに示すライン塗布法で形成することが好ましい。ライン塗布法によれば、第１透明樹脂層１２を薄膜化できると共に、製造工程が簡易になる。また、ライン塗布法では表面張力を利用して第１透明樹脂層１２を形成できるため、ワイヤ１０と負電極４及び正電極６のパターンに沿って第１透明樹脂層１２は形成することができる。また、負電極４及び正電極６のパターンを適切にすれば、第１透明樹脂層１２の形成領域を発光ダイオード８の近くに制限することができる。 3. Formation of first transparent resin layer 12 Next, the first transparent resin layer 12 is formed. A predetermined amount of phosphor 16 is dispersed in the first transparent resin layer 12 in advance. The first transparent resin layer 12 is preferably formed by a line coating method shown in FIGS. According to the line coating method, the first transparent resin layer 12 can be thinned and the manufacturing process is simplified. In addition, since the first transparent resin layer 12 can be formed using surface tension in the line coating method, the first transparent resin layer 12 can be formed along the pattern of the wire 10, the negative electrode 4, and the positive electrode 6. . Moreover, if the pattern of the negative electrode 4 and the positive electrode 6 is made appropriate, the formation region of the first transparent resin layer 12 can be limited to the vicinity of the light emitting diode 8.

ライン塗布法とは、図６Ａに示すように、ディスペンサ２４から所定量の第１透明樹脂を吐出させながら、ディスペンサ２４を発光ダイオード８の配列に沿って移動させ、ライン状につながった樹脂層を形成する方法である。ライン塗布法で形成した場合、第１透明樹脂層１２の形状を、樹脂の表面張力によって決めることができる。例えば、電極４及び正電極６の外縁は、その厚み分だけ絶縁基板２の表面よりも高い位置にある。従って、両者の高さの差が十分にあれば、図６Ｂ及び図６Ｃに示すように、第１透明樹脂１２は表面張力によって負電極４及び正電極６の外縁４ａ及び６ａから先には流れ出さない。また、第１透明樹脂１２は、吐出量を適切にすれば、表面張力によってワイヤ１０を少し越えた高さで維持させることができる。さらに、第１透明樹脂１２の断面形状は、図６Ｃに示すように、略半円形又は略半楕円形となる。このようにライン塗布法によれば、極めて簡易な構成によって短時間に多数のチップを同時処理でき、しかも形状が安定する。従って、ライン塗布法によって第１透明樹脂層１２を形成すれば、量産性が高く、また色調バラツキが少なくなるという利点が得られる。   The line coating method, as shown in FIG. 6A, moves the dispenser 24 along the arrangement of the light emitting diodes 8 while discharging a predetermined amount of the first transparent resin from the dispenser 24, thereby forming a resin layer connected in a line shape. It is a method of forming. When formed by a line coating method, the shape of the first transparent resin layer 12 can be determined by the surface tension of the resin. For example, the outer edges of the electrode 4 and the positive electrode 6 are higher than the surface of the insulating substrate 2 by the thickness. Therefore, if there is a sufficient difference in height between the two, the first transparent resin 12 flows from the negative electrode 4 and the outer edges 4a and 6a of the positive electrode 6 first due to surface tension, as shown in FIGS. 6B and 6C. Not issued. Further, the first transparent resin 12 can be maintained at a height slightly exceeding the wire 10 by surface tension if the discharge amount is appropriate. Furthermore, as shown in FIG. 6C, the cross-sectional shape of the first transparent resin 12 is a substantially semicircular shape or a substantially semielliptical shape. Thus, according to the line coating method, a large number of chips can be simultaneously processed in a short time with a very simple configuration, and the shape is stabilized. Therefore, if the first transparent resin layer 12 is formed by a line coating method, there are advantages that mass productivity is high and color variation is reduced.

尚、第１透明樹脂の表面張力が小さい場合は、電極４，６の厚み分の段差だけでは形状が維持できない場合がある。そこで、第１透明樹脂の流れだしを防止するための構造を設けても良い。例えば、図７Ａでは、負電極４及び正電極６の外側に、レジスト等からなる壁３２を形成している。図７Ｂでは、負電極４及び正電極６の外側に、溝３４を形成している。さらに、図７Ｃでは、負電極４及び正電極の外側に、絶縁基板２を高くした段差３６を設けている。   In addition, when the surface tension of the first transparent resin is small, the shape may not be maintained with only the steps corresponding to the thicknesses of the electrodes 4 and 6. Therefore, a structure for preventing the first transparent resin from flowing out may be provided. For example, in FIG. 7A, a wall 32 made of resist or the like is formed outside the negative electrode 4 and the positive electrode 6. In FIG. 7B, a groove 34 is formed outside the negative electrode 4 and the positive electrode 6. Further, in FIG. 7C, a step 36 is formed on the outside of the negative electrode 4 and the positive electrode, in which the insulating substrate 2 is raised.

第１透明樹脂１２をライン塗布した後、第１透明樹脂１２を硬化させる。第１透明樹脂が熱硬化性の樹脂であれば、常温でライン塗布した後、加熱して硬化させれば良い。第１透明樹脂１２内における蛍光体１６の沈降程度は、例えば、ライン塗布が終了してから硬化開始までの時間や、硬化前又は硬化途中における透明樹脂の粘度によって制御できる。すなわち、ライン塗布が終了してから硬化開始までの時間が長いほど、第１透明樹脂１２内における蛍光体１６の沈降が進行する。また、硬化前における第１透明樹脂１２の粘性が低いほど、蛍光体１６の沈降が進行する。硬化前に粘性が高い透明樹脂であっても、エポキシのように加熱によって一旦粘性が低下する材料であれば、粘性が低下したときに蛍光体１６の沈降を進行させることができる。   After line application of the first transparent resin 12, the first transparent resin 12 is cured. If the first transparent resin is a thermosetting resin, it may be heated and cured after line coating at room temperature. The degree of sedimentation of the phosphor 16 in the first transparent resin 12 can be controlled by, for example, the time from the end of line coating to the start of curing, or the viscosity of the transparent resin before or during curing. That is, the longer the time from the end of line application to the start of curing, the more the phosphor 16 settles in the first transparent resin 12. Further, the lower the viscosity of the first transparent resin 12 before curing, the more the phosphor 16 settles. Even if it is a transparent resin having a high viscosity before curing, if the material once decreases in viscosity by heating, such as epoxy, the phosphor 16 can be allowed to settle when the viscosity decreases.

４、第２透明樹脂層１４の形成
次に、第２透明樹脂層１４を形成する。第２透明樹脂層１４の形成には、トランスファモールド、圧縮成形、射出成形などの方法を用いることができる。トランスファモールドの場合を例にして、説明する。まず、図８Ａに示すように、第１透明樹脂層１２を形成したパッケージアッセンブリ５を準備する。次に、図８Ｂに示すように、パッケージアッセンブリ５の上下をトランスファモールド用の金型２６及び２８で挟む。図８Ｂに示す例では、下側金型２６は平坦であり、上側金型２８には第２透明樹脂層を形成するためのレンズ型２８ａが設けられている。次に、図８Ｃに示すように、上側金型２６とパッケージアセンブリ５の間に形成された樹脂の注入口を通じて第２透明樹脂１４を流し込む。このとき、第２透明樹脂１４は、半溶性のペレットとして準備し、注入口から圧入しながら樹脂を溶かす。そして、金型内で短時間加熱して硬化させた後、金型を外してさらに加熱することにより、第２透明樹脂層１４が形成できる。トランスファモールドで形成する場合、第２透明樹脂１４は、ある程度粘度が高い樹脂であることが必要である。例えば、エポキシ樹脂等がトランスファ成形に適している。 4. Formation of second transparent resin layer 14 Next, the second transparent resin layer 14 is formed. For the formation of the second transparent resin layer 14, methods such as transfer molding, compression molding, and injection molding can be used. The case of the transfer mold will be described as an example. First, as shown to FIG. 8A, the package assembly 5 in which the 1st transparent resin layer 12 was formed is prepared. Next, as shown in FIG. 8B, the upper and lower sides of the package assembly 5 are sandwiched between transfer mold dies 26 and 28. In the example shown in FIG. 8B, the lower mold 26 is flat, and the upper mold 28 is provided with a lens mold 28a for forming a second transparent resin layer. Next, as shown in FIG. 8C, the second transparent resin 14 is poured through a resin injection port formed between the upper mold 26 and the package assembly 5. At this time, the second transparent resin 14 is prepared as a semi-soluble pellet, and the resin is melted while being pressed from the injection port. And after heating for a short time within a metal mold and hardening, the 2nd transparent resin layer 14 can be formed by removing a metal mold and heating further. In the case of forming by transfer molding, the second transparent resin 14 needs to be a resin having a certain degree of viscosity. For example, an epoxy resin or the like is suitable for transfer molding.

トランスファモールドに代えて、圧縮成形で第２透明樹脂層１４を形成しても良い。特に使用する樹脂が、液状である場合は、トランスファモールドではなく、圧縮成形で第２透明樹脂層１４を形成することが好ましい。第２透明樹脂層１４を圧縮成形で形成する場合、第２透明樹脂をパッケージアッセンブリ５の全面に塗布した後、圧縮成形用の金型で上面から押さえつけ、加熱して硬化させる。   Instead of the transfer mold, the second transparent resin layer 14 may be formed by compression molding. In particular, when the resin to be used is liquid, it is preferable to form the second transparent resin layer 14 not by transfer molding but by compression molding. In the case where the second transparent resin layer 14 is formed by compression molding, the second transparent resin is applied to the entire surface of the package assembly 5 and then pressed from the upper surface with a compression molding die and heated and cured.

５、ダイシング
次に、図８Ｄに示すように、パッケージアセンブリ５を２方向からダイシングし、所定幅と所定長さで発光装置を切り出す。 5. Dicing Next, as shown in FIG. 8D, the package assembly 5 is diced from two directions, and the light emitting device is cut out with a predetermined width and a predetermined length.

６、反射部材１７の形成
ダイシング後の個々の装置状態で、第２平面４２に金属材料又は酸化物からなる反射部材１７を形成することによって、発光装置が完成する。無電解メッキなどで形成するときには、反射部材を形成しない表面領域をマスキングしてから反射部材１７を形成するのが好ましい。 6. Formation of Reflecting Member 17 By forming the reflecting member 17 made of a metal material or an oxide on the second plane 42 in the individual device state after dicing, the light emitting device is completed. When forming by electroless plating or the like, it is preferable to form the reflecting member 17 after masking the surface area where the reflecting member is not formed.

実施の形態２．
本実施の形態の発光装置は、図９に示すように、第２平面４２に反射部材１７ｂを形成するのみでなく、第１平面４０にも反射部材１７ａを形成すること以外は、実施の形態１と同様である。
第１平面４０及び第２平面４２には、金属膜から成る反射部材１７ａ、１７ｂがそれぞれ形成されている。この反射部材１７は、第１平面４０に密着して一体に形成されているので、別体の反射部材を後で接着するのに比べて接着剤の厚さ分だけ薄くでき、さらに第１平面４０及び第２平面４２からの漏れ光を反射して発光面から効率良く光を出射できる。反射部材１７ａ、１７ｂは、実施の形態１の反射部材１７と同様の材料から形成することができる。第１平面４０の反射部材１７ａと第２平面４２の反射部材１７ｂとは、異なる材料から形成することもできるが、同じ材料から形成すると、無電解メッキや蒸着のように広い範囲を同時に処理できる方法によって同時に形成することができるので好ましい。 Embodiment 2. FIG.
As shown in FIG. 9, the light emitting device of the present embodiment is not limited to forming the reflecting member 17 b on the second plane 42, but also forming the reflecting member 17 a on the first plane 40. Same as 1.
Reflective members 17a and 17b made of a metal film are formed on the first plane 40 and the second plane 42, respectively. Since the reflecting member 17 is integrally formed in close contact with the first plane 40, the reflecting member 17 can be made thinner by the thickness of the adhesive as compared with the case where a separate reflecting member is bonded later, and further the first plane. Light leaking from 40 and the second plane 42 can be reflected and light can be emitted efficiently from the light emitting surface. The reflecting members 17a and 17b can be formed from the same material as the reflecting member 17 of the first embodiment. The reflecting member 17a on the first plane 40 and the reflecting member 17b on the second plane 42 can be formed from different materials, but if formed from the same material, a wide range can be processed simultaneously, such as electroless plating or vapor deposition. Since it can form simultaneously by the method, it is preferable.

本実施の形態の発光装置１を、図５と同様に第１平面４０を実装面として実装すると、第１平面４０及び第２平面４２のいずれにも反射部材１７が形成されていると、第１平面４０及び第２平面４２からの漏れ光を抑えることができるので好ましい。すなわち、発光装置１の中の発光ダイオード８で発生した光は、一部は第２透明樹脂層１４の上面（レンズ形成面）１４ｂに直進するが、多くは第１平面４０及び第２平面４２に進み、反射されながらレンズ形成面１４ｂに進む。第１平面４０は、実装基板３により反射されやすくなっているが、より反射能の高い反射部材１７ｂを密着して備えることにより、発光装置１の発光効率を向上させることができる。また、実施の形態１と同様に、第２平面４２に反射部材１７ａを密着して形成することによって、発光装置１の発光効率を著しく向上することができる。
このように、本実施の形態にかかる発光装置では、第１平面４０及び第２平面４２に反射部材１７を一体に形成することによって、漏れ光を発光装置に戻して発光面から取り出すことができるので、発光装置１の発光効率を著しく向上することができる。 When the light emitting device 1 of the present embodiment is mounted using the first plane 40 as a mounting surface in the same manner as in FIG. 5, if the reflecting member 17 is formed on both the first plane 40 and the second plane 42, This is preferable because light leakage from the first plane 40 and the second plane 42 can be suppressed. That is, a part of the light generated by the light emitting diode 8 in the light emitting device 1 goes straight to the upper surface (lens forming surface) 14 b of the second transparent resin layer 14, but most of them are the first plane 40 and the second plane 42. The process proceeds to the lens forming surface 14b while being reflected. Although the first plane 40 is easily reflected by the mounting substrate 3, the luminous efficiency of the light emitting device 1 can be improved by closely attaching the reflective member 17 b having higher reflectivity. Similarly to the first embodiment, the light emitting efficiency of the light emitting device 1 can be remarkably improved by forming the reflecting member 17 a in close contact with the second plane 42.
As described above, in the light emitting device according to the present embodiment, by integrally forming the reflecting member 17 on the first plane 40 and the second plane 42, the leakage light can be returned to the light emitting device and extracted from the light emitting surface. Therefore, the luminous efficiency of the light emitting device 1 can be significantly improved.

本実施の形態に係る発光装置１は、図９に示すように、基板２の裏面を実装面として実装する場合にも適している。すなわち、第１平面４０及び第２平面４２のいずれもが、実装基板３に面していない実装方法であっても、それぞれの平面から漏れる光を反射部材１７ａ、１７ｂによって反射することができるので、発光装置の発光効率を下げることなく実装面を変更することができる。   As shown in FIG. 9, the light emitting device 1 according to the present embodiment is also suitable when the back surface of the substrate 2 is mounted as a mounting surface. That is, even if the mounting method is such that neither the first plane 40 nor the second plane 42 faces the mounting substrate 3, the light leaking from the respective planes can be reflected by the reflecting members 17a and 17b. The mounting surface can be changed without lowering the light emission efficiency of the light emitting device.

実施の形態２の変形例として、図１０に示すように、発光装置１の第１平面４０及び第２平面４２に加えて、第３平面４４及び第４平面４６に反射部材１７ｃ、１７ｄを形成している。
第３平面４４及び第４平面４６に反射部材１７ｃ、１７ｄを形成すると、第３平面４４及び第４平面４６からのわずかな漏れ光も反射して、発光面からの発光効率を向上することができる。第３及び第４平面４４、４６の反射部材１７ｃ、１７ｄは、第１及び第２平面４０、４２の反射部材１７ａ、１７ｂと同じく、実施の形態１の反射部材１７と同様の材料から形成することができる。第１〜第４平面の反射部材１７ａ〜１７ｄは、異なる材料から形成することもできるが、同じ材料から形成すると、無電解メッキや蒸着のように広い範囲を同時に処理できる方法によって同時に形成することができるので好ましい。 As a modification of the second embodiment, as shown in FIG. 10, reflecting members 17 c and 17 d are formed on the third plane 44 and the fourth plane 46 in addition to the first plane 40 and the second plane 42 of the light emitting device 1. is doing.
When the reflecting members 17c and 17d are formed on the third plane 44 and the fourth plane 46, slight leakage light from the third plane 44 and the fourth plane 46 is also reflected, and the luminous efficiency from the light emitting surface can be improved. it can. The reflecting members 17c and 17d of the third and fourth planes 44 and 46 are formed of the same material as that of the reflecting member 17 of the first embodiment, similarly to the reflecting members 17a and 17b of the first and second planes 40 and 42. be able to. The reflecting members 17a to 17d of the first to fourth planes can be formed from different materials, but if they are formed from the same material, they are simultaneously formed by a method capable of simultaneously processing a wide range such as electroless plating or vapor deposition. Is preferable.

このように、本実施の形態に係る発光装置１は、発光面である発光面１４ｂから射出される光以外の漏れ光を装置内部に反射させることにより、光の取出し効率を向上させることができる。   As described above, the light emitting device 1 according to the present embodiment can improve the light extraction efficiency by reflecting the leakage light other than the light emitted from the light emitting surface 14b, which is the light emitting surface, into the device. .

実施の形態３．
本実施の形態の発光装置は、第１透明樹脂層１２の形状が異なる以外は、実施の形態１〜３と同様である。
蛍光体１６を含む第１透明樹脂層１２は、発光素子８の近傍のみに形成されていると点光源に近くなるので好ましく、ワイヤ１０の強度が十分にあれば、図１１に示すように、第１透明樹脂がワイヤの一部を覆うようにしても良い。このとき、第１透明樹脂層１２が第３表面４２及び第４平面４４に露出すると、第３及び第４の平面の研磨によって、第３及び第４の平面の方向に向かう光の色調整が可能となるので好ましい。
本実施の形態は、実施の形態３と同様に第３及び第４の平面に反射部材１７ｃ、１７ｄが形成されていると、第３及び第４の平面４４、４６に向かう光が透明樹脂層の発光面１４ｂから効率良く取り出せるので、第３及び第４の平面の研磨による色調整が、一層効果を表すことができる。 Embodiment 3 FIG.
The light emitting device of the present embodiment is the same as Embodiments 1 to 3 except that the shape of the first transparent resin layer 12 is different.
If the first transparent resin layer 12 including the phosphor 16 is formed only in the vicinity of the light emitting element 8, it is preferable because it is close to a point light source. If the strength of the wire 10 is sufficient, as shown in FIG. The first transparent resin may cover a part of the wire. At this time, when the first transparent resin layer 12 is exposed to the third surface 42 and the fourth plane 44, the color adjustment of the light toward the third and fourth planes is performed by polishing the third and fourth planes. This is preferable because it becomes possible.
In the present embodiment, similarly to the third embodiment, when the reflecting members 17c and 17d are formed on the third and fourth planes, the light directed toward the third and fourth planes 44 and 46 is transparent resin layer. Therefore, the color adjustment by polishing the third and fourth planes can be more effective.

実施の形態４．
本実施の形態では、第１透明樹脂層１２を印刷法によって形成する例について説明する。その他の事項は、実施の形態１と同様である。
まず、図１２Ａに示すように、パッケージアッセンブリ５の全面に印刷によって第１透明樹脂層１２を形成する。第１透明樹脂層１２は、絶縁基板２の全面に形成されており、かつ、上面が平坦になる。尚、第１透明樹脂層１２の印刷によってワイヤ１０の折れ、切断などが起きないように、第１透明樹脂層１２の厚さをワイヤ１０の高さよりも十分大きくなるようにする。その後、第１透明樹脂層１２を加熱して硬化させる。 Embodiment 4 FIG.
In the present embodiment, an example in which the first transparent resin layer 12 is formed by a printing method will be described. Other matters are the same as those in the first embodiment.
First, as shown in FIG. 12A, the first transparent resin layer 12 is formed on the entire surface of the package assembly 5 by printing. The first transparent resin layer 12 is formed on the entire surface of the insulating substrate 2 and has a flat upper surface. Note that the thickness of the first transparent resin layer 12 is made sufficiently larger than the height of the wire 10 so that the wire 10 is not bent or cut by printing the first transparent resin layer 12. Thereafter, the first transparent resin layer 12 is heated and cured.

次に、絶縁基板２の全面に形成された第１透明樹脂層１２の上に、実施の形態１と同様の方法によってレンズ付きの第２透明樹脂層１４を形成する。そして、第２透明樹脂層１４を硬化した後、パッケージアッセンブリ５を２方向からダイシングすれば、図１２Ｂに示すように、発光装置１が得られる。尚、本実施の形態の方法によって形成された第１透明樹脂層１２は、絶縁基板２と略同一面積の直方体状となる。   Next, a second transparent resin layer 14 with a lens is formed on the first transparent resin layer 12 formed on the entire surface of the insulating substrate 2 by the same method as in the first embodiment. And after hardening the 2nd transparent resin layer 14, if the package assembly 5 is diced from two directions, as shown to FIG. 12B, the light-emitting device 1 will be obtained. The first transparent resin layer 12 formed by the method of the present embodiment has a rectangular parallelepiped shape having substantially the same area as the insulating substrate 2.

本実施の形態のように印刷法によって第１透明樹脂層１２を形成すれば、実施の形態１のライン塗布に比べて短時間で第１透明樹脂層１２を形成することができる。しかしながら、印刷法では、第１透明樹脂層の上面がワイヤ１０よりも十分高いところに位置するようにしないとならないため、ライン塗布法に比べて、第１透明樹脂層１２の厚さが厚くなり易い。また、図１２Ａ及びＢに示すように、蛍光体１６の分布が絶縁基板２の全面に広がるため、観察方向に依存した色ムラが発生し易くなる。   If the first transparent resin layer 12 is formed by a printing method as in the present embodiment, the first transparent resin layer 12 can be formed in a shorter time than the line coating of the first embodiment. However, in the printing method, the upper surface of the first transparent resin layer must be positioned higher than the wire 10, so that the thickness of the first transparent resin layer 12 is thicker than in the line coating method. easy. Further, as shown in FIGS. 12A and 12B, since the distribution of the phosphor 16 spreads over the entire surface of the insulating substrate 2, color unevenness depending on the observation direction is likely to occur.

実施の形態５．
そこで実施の形態３では、印刷法によって第１透明樹脂層を形成しながら、蛍光体１６の広がりを抑制する方法について説明する。
まず、図１３Ａに示すように、第１透明樹脂層１２を印刷する前に、第１透明樹脂層１２の印刷範囲を制限するためのマスク３０を絶縁基板２上に形成する。マスク３０は、例えばレジスト等から成る。またマスク３０は、第１透明樹脂の印刷範囲を発光ダイオード８の近傍に制限するように、発光ダイオード８の配列を左右から挟む平行なストライプ状にすることができる。 Embodiment 5 FIG.
In the third embodiment, a method for suppressing the spread of the phosphor 16 while forming the first transparent resin layer by a printing method will be described.
First, as shown in FIG. 13A, before printing the first transparent resin layer 12, a mask 30 for limiting the printing range of the first transparent resin layer 12 is formed on the insulating substrate 2. The mask 30 is made of, for example, a resist. In addition, the mask 30 can be formed in parallel stripes sandwiching the arrangement of the light emitting diodes 8 from the left and right so as to limit the printing range of the first transparent resin to the vicinity of the light emitting diodes 8.

第１透明樹脂層１２を硬化した後、マスク３０を除去する。そして実施の形態１と同様の方法によって、第２透明樹脂層１４を形成する。第２透明樹脂層１４を硬化した後、パッケージアッセンブリ５を２方向からダイシングすれば、図１３Ｂに示すように、発光装置１が得られる。   After the first transparent resin layer 12 is cured, the mask 30 is removed. Then, the second transparent resin layer 14 is formed by the same method as in the first embodiment. If the package assembly 5 is diced from two directions after the second transparent resin layer 14 is cured, the light emitting device 1 is obtained as shown in FIG. 13B.

本実施の形態において形成された第１透明樹脂層１２は、図１３Ｂに示すように、略直方体形状をしており、発光装置の長手方向における幅が絶縁基板２よりも短い。すなわち、第１透明樹脂層１２の形成範囲は、発光ダイオード８の近傍に制限されている。従って、実施の形態５に比べて、観察方向に依存した色ムラが抑制される。   As shown in FIG. 13B, the first transparent resin layer 12 formed in the present embodiment has a substantially rectangular parallelepiped shape, and the width in the longitudinal direction of the light emitting device is shorter than that of the insulating substrate 2. That is, the formation range of the first transparent resin layer 12 is limited to the vicinity of the light emitting diode 8. Therefore, color unevenness depending on the observation direction is suppressed as compared with the fifth embodiment.

尚、上記実施の形態では印刷法で第１透明樹脂層１２を形成する例について説明したが、スプレーや金型による成形を用いて第１透明樹脂層１２を形成することもできる。   In the above embodiment, an example in which the first transparent resin layer 12 is formed by a printing method has been described. However, the first transparent resin layer 12 can also be formed by spraying or molding using a mold.

以上の実施の形態１〜６の発光装置では、発光ダイオード８として電極側から光を出射するものを用い、発光ダイオード８の電極と絶縁基板２上の電極とをワイヤーボンディングした例について示した。しかしながら、本発明はこれに限られるものではなく、発光ダイオード８を絶縁基板２上にフリップチップボンディングするようにしてもよい。具体的には、発光ダイオード８のｐ側の電極とｎ側の電極とがそれぞれ、絶縁基板２上に形成された正負の電極に対向するように発光ダイオードを載置して、対向する電極間をそれぞれ半田等の導電性接着部材で接合することにより実装する。   In the light emitting devices of Embodiments 1 to 6 described above, the light emitting diode 8 that emits light from the electrode side is used, and the electrode of the light emitting diode 8 and the electrode on the insulating substrate 2 are wire bonded. However, the present invention is not limited to this, and the light emitting diode 8 may be flip-chip bonded onto the insulating substrate 2. Specifically, the light-emitting diode is placed so that the p-side electrode and the n-side electrode of the light-emitting diode 8 are opposed to the positive and negative electrodes formed on the insulating substrate 2, respectively. Each is mounted by bonding with a conductive adhesive member such as solder.

尚、フリップチップボンディング用の発光ダイオードは、基本的にはワイヤーボンディング用の発光ダイオードと同様に構成される。例えば、窒化物半導体発光素子の場合では、光透光性の基板の一方の主面上にｎ型およびｐ型窒化物半導体層を含む複数の窒化物半導体層を積層して、最上層のｐ型窒化物半導体層（ｐ型コンタクト層）の上にｐ側の電極を形成し、ｐ型窒化物半導体層の一部を除去することにより露出させたｎ型窒化物半導体層上にｎ側の電極を形成することにより構成し、光透光性基板の他方の主面を主光取り出し面とすればよい。   The light emitting diode for flip chip bonding is basically configured in the same manner as the light emitting diode for wire bonding. For example, in the case of a nitride semiconductor light emitting device, a plurality of nitride semiconductor layers including n-type and p-type nitride semiconductor layers are stacked on one main surface of a light-transmitting substrate, and the uppermost p is formed. Forming a p-side electrode on the n-type nitride semiconductor layer (p-type contact layer) and removing the p-type nitride semiconductor layer to remove a portion of the p-type nitride semiconductor layer; An electrode is formed, and the other main surface of the light-transmitting substrate may be a main light extraction surface.

実施の形態６．
本実施の形態は、上記の実施の形態１〜６により形成したサイドビュー型発光装置１と導光板とを組み合わせたバックライトである。
図１４は、透明樹脂層の発光面１４ｂをシリンドリカルレンズに成形した発光装置１と、導光板５０とを組み合わせた形態を示している。導光板５０の一端５２には、発光装置１のレンズ形状に対応した切除部５４が形成されている。この切除部５４に発光装置１の上面１４ｂをはめ合わせることにより、発光装置１からの光は、導光板５０の端部５２に導入されて導光板５０の全体に広げられる。 Embodiment 6 FIG.
The present embodiment is a backlight in which the side-view type light emitting device 1 formed by the above first to sixth embodiments and a light guide plate are combined.
FIG. 14 shows a configuration in which the light emitting device 1 in which the light emitting surface 14b of the transparent resin layer is formed into a cylindrical lens and the light guide plate 50 are combined. A cutout 54 corresponding to the lens shape of the light emitting device 1 is formed at one end 52 of the light guide plate 50. By fitting the upper surface 14 b of the light emitting device 1 to the cut portion 54, the light from the light emitting device 1 is introduced into the end portion 52 of the light guide plate 50 and spread over the entire light guide plate 50.

図１５に示すように、バックライト６０に使用する導光板５０の厚みは、反射部材１７を含めた発光装置１の厚みとほぼ一致させると、発光装置１からの光を全て導光板５０に導入できるので好ましい。よって、導光板５０の厚みを薄くするには、発光装置１の厚みを薄くし、特に反射部材１７を含めた厚みを薄くするのが効果的である。本発明にかかる発光装置１は、反射部材１７を発光装置１と一体に形成することにより、反射部材１７を含む発光装置１の厚さを薄くすることができるので、導光板５０と組み合わせたバックライト６０として使用するのに好適である。   As shown in FIG. 15, if the thickness of the light guide plate 50 used for the backlight 60 is substantially equal to the thickness of the light emitting device 1 including the reflecting member 17, all the light from the light emitting device 1 is introduced into the light guide plate 50. It is preferable because it is possible. Therefore, in order to reduce the thickness of the light guide plate 50, it is effective to reduce the thickness of the light emitting device 1, and particularly to reduce the thickness including the reflecting member 17. The light emitting device 1 according to the present invention can reduce the thickness of the light emitting device 1 including the reflecting member 17 by forming the reflecting member 17 integrally with the light emitting device 1. It is suitable for use as the light 60.

本発明の実施の形態１に係る発光装置の斜視図である。1 is a perspective view of a light emitting device according to Embodiment 1 of the present invention. 図１のＸ−Ｘ’断面における断面図である。It is sectional drawing in the X-X 'cross section of FIG. 図１のＹ−Ｙ’断面における断面図である。It is sectional drawing in the Y-Y 'cross section of FIG. 実施の形態１に係る発光装置の実装状態を示す斜視図である。FIG. 3 is a perspective view showing a mounted state of the light emitting device according to Embodiment 1. 実施の形態１に係る発光装置の実装状態を示す斜視図である。FIG. 3 is a perspective view showing a mounted state of the light emitting device according to Embodiment 1. 第１透明樹脂層をライン塗布法で形成する様子を示す模式図である。It is a schematic diagram which shows a mode that a 1st transparent resin layer is formed with the line coating method. 第１透明樹脂層をライン塗布法で形成する様子を示す平面図である。It is a top view which shows a mode that a 1st transparent resin layer is formed by the line coating method. 第１透明樹脂層をライン塗布法で形成する様子を示す断面図である。It is sectional drawing which shows a mode that a 1st transparent resin layer is formed by the line coating method. 図６Ｃに示すライン塗布法のバリエーションを示す断面図である。It is sectional drawing which shows the variation of the line coating method shown to FIG. 6C. 図６Ｃに示すライン塗布法の別のバリエーションを示す断面図である。It is sectional drawing which shows another variation of the line coating method shown to FIG. 6C. 図６Ｃに示すライン塗布法のさらに別のバリエーションを示す断面図である。It is sectional drawing which shows another variation of the line coating method shown to FIG. 6C. 第１透明樹脂層を形成したパッケージアッセンブリを模式的に示す斜視図である。It is a perspective view which shows typically the package assembly in which the 1st transparent resin layer was formed. 第２樹脂層をトランスファモールド法によって形成する様子を模式的に示す断面図である。It is sectional drawing which shows typically a mode that a 2nd resin layer is formed by the transfer mold method. 第２樹脂層をトランスファモールド法によって形成する様子を模式的に示す断面図である。It is sectional drawing which shows typically a mode that a 2nd resin layer is formed by the transfer mold method. ダイシング工程を模式的に示す断面図である。It is sectional drawing which shows a dicing process typically. 本発明の実施の形態２に係る発光装置の斜視図である。It is a perspective view of the light-emitting device which concerns on Embodiment 2 of this invention. 本発明の実施の形態３に係る発光装置の斜視図である。It is a perspective view of the light-emitting device which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Embodiment 4 of this invention. 本発明の実施の形態５の途中工程を示す断面図である。It is sectional drawing which shows the middle process of Embodiment 5 of this invention. 本発明の実施の形態５に係る発光装置を示す断面図である。It is sectional drawing which shows the light-emitting device which concerns on Embodiment 5 of this invention. 本発明の実施の形態６の途中工程を示す断面図である。It is sectional drawing which shows the middle process of Embodiment 6 of this invention. 本発明の実施の形態６に係る発光装置を示す断面図である。It is sectional drawing which shows the light-emitting device based on Embodiment 6 of this invention. 本発明の実施の形態７に係るバックライトの正面図である。It is a front view of the backlight which concerns on Embodiment 7 of this invention. 本発明の実施の形態７に係るバックライトの斜視図である。It is a perspective view of the backlight which concerns on Embodiment 7 of this invention.

符号の説明Explanation of symbols

１ 発光装置、
２ 絶縁基板
４ 負電極、
６ 正電極、
８ 発光ダイオード、
１０ ワイヤ
１２ 第１透明樹脂層、
１４ 第２透明樹脂層、
１６ 蛍光体
１７ 反射部材
１８ 正のリード電極
２０ 負のリード電極
４０ 第１平面
４２ 第２平面
４４ 第３平面
４５ 第４平面
５０ 導光板
６０ バックライト
1 light emitting device,
2 Insulating substrate 4 Negative electrode,
6 Positive electrode,
8 Light-emitting diodes,
10 wire 12 first transparent resin layer,
14 second transparent resin layer,
16 Phosphor 17 Reflecting member 18 Positive lead electrode 20 Negative lead electrode 40 First plane 42 Second plane 44 Third plane 45 Fourth plane 50 Light guide plate 60 Backlight

Claims (9)

発光観測面から観察したときに１対の長辺と１対の短辺とを有する略長矩形の基板と、
前記基板上に形成された正極及び負極の電極と、
前記正極及び負極に接続された発光ダイオードと、
前記基板の一方の長辺を含む第１の平面と該第１の平面に対面し前記基板の他方の長辺を含む第２の平面とを有し、前記発光ダイオードを覆っている樹脂と、を備えた発光装置であって、
前記樹脂は、前記発光ダイオードを覆い且つ該発光ダイオードの出射光により励起されて発光する蛍光体を含む第１透明樹脂と、該第１透明樹脂を覆う第２透明樹脂とを有しており、
さらに、前記第１の平面と前記第２の平面とには、前記第１透明樹脂と第２透明樹脂とが共に露出しており、
前記第１の平面と前記第２の平面の少なくとも一方に、反射部材が形成されていることを特徴とする発光装置。 A substantially long rectangular substrate having a pair of long sides and a pair of short sides when observed from a light emission observation surface;
A positive electrode and a negative electrode formed on the substrate;
A light emitting diode connected to the positive and negative electrodes;
A first plane including one long side of the substrate and a second plane including the other long side of the substrate facing the first plane and covering the light emitting diode; A light emitting device comprising:
The resin includes a first transparent resin that covers the light emitting diode and includes a phosphor that emits light when excited by light emitted from the light emitting diode, and a second transparent resin that covers the first transparent resin,
Furthermore, both the first transparent resin and the second transparent resin are exposed on the first plane and the second plane,
A light emitting device, wherein a reflective member is formed on at least one of the first plane and the second plane. 前記長辺が、上記短辺の１．５倍以上１０倍以下であることを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the long side is 1.5 to 10 times the short side. 前記短辺が、０．１ｍｍ以上２．０ｍｍ以下であることを特徴とする請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, wherein the short side is 0.1 mm or more and 2.0 mm or less. 前記第２透明樹脂の発光観測面が、レンズを形成するように加工されていることを特徴とする請求項１乃至３のいずれか１項に記載の発光装置。   4. The light emitting device according to claim 1, wherein a light emission observation surface of the second transparent resin is processed so as to form a lens. 5. 前記第２透明樹脂の発光観察面の形状が、前記第１の平面側及び前記第２の平面側からみて略半円状であることを特徴とする請求項４に記載の発光装置。   5. The light emitting device according to claim 4, wherein a shape of a light emission observation surface of the second transparent resin is substantially semicircular when viewed from the first plane side and the second plane side. 前記第１透明樹脂の形状は、前記第１の平面側及び前記第２の平面側からみて略半円状であることを特徴とする請求項１乃至５のいずれか１項に記載の発光装置。   6. The light emitting device according to claim 1, wherein the first transparent resin has a substantially semicircular shape when viewed from the first plane side and the second plane side. . 前記反射部材が上記第１平面及び／又は第２平面に直接密着して形成された酸化物部材又は金属部材であることを特徴とする請求項１乃至６のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein the reflecting member is an oxide member or a metal member formed in close contact with the first plane and / or the second plane. . 請求項１乃至７のいずれか１項に記載の発光装置が、導光板に取り付けられてなるバックライト。   A backlight in which the light-emitting device according to claim 1 is attached to a light guide plate. 請求項１に記載の発光装置を製造する方法であって、
前記正極及び前記負極を複数組設けた前記基板上に、前記発光ダイオードを複数設置し、前記各発光ダイオードを前記正極及び前記負極と電気的に接続する実装工程と、
前記複数の発光ダイオードを、前記蛍光体を含有する前記第１透明樹脂で封止する第１樹脂形成工程と、
前記第１透明樹脂を、前記第２透明樹脂で被覆する第２樹脂形成工程と、
前記第１透明樹脂、前記第２透明樹脂及び前記基板を、前記発光ダイオードを少なくとも１つ含む区画毎に切断して前記第１の平面及び前記第２の平面を形成する切断工程と、
前記第１の平面の少なくも一方に反射部材を形成する反射部材形成工程と、を有することを特徴とする発光装置の製造方法。
A method for manufacturing the light emitting device according to claim 1, comprising:
A mounting step of installing a plurality of the light emitting diodes on the substrate on which a plurality of sets of the positive electrodes and the negative electrodes are provided, and electrically connecting each of the light emitting diodes to the positive electrode and the negative electrode;
A first resin forming step of sealing the plurality of light emitting diodes with the first transparent resin containing the phosphor;
A second resin forming step of covering the first transparent resin with the second transparent resin;
A cutting step of cutting the first transparent resin, the second transparent resin, and the substrate into sections each including at least one light emitting diode to form the first plane and the second plane;
And a reflecting member forming step of forming a reflecting member on at least one of the first planes.
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