JP5094232B2 - 半導体装置を内包する用紙およびその作製方法 - Google Patents

半導体装置を内包する用紙およびその作製方法 Download PDF

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Publication number
JP5094232B2
JP5094232B2 JP2007164594A JP2007164594A JP5094232B2 JP 5094232 B2 JP5094232 B2 JP 5094232B2 JP 2007164594 A JP2007164594 A JP 2007164594A JP 2007164594 A JP2007164594 A JP 2007164594A JP 5094232 B2 JP5094232 B2 JP 5094232B2
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paper
layer
semiconductor device
film
circuit
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Japanese (ja)
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JP2008033907A5 (enExample
JP2008033907A (ja
Inventor
芳隆 道前
智幸 青木
秀和 高橋
大幹 山田
香 荻田
直人 楠本
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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  • Recrystallisation Techniques (AREA)
  • Paper (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2007164594A 2006-06-26 2007-06-22 半導体装置を内包する用紙およびその作製方法 Expired - Fee Related JP5094232B2 (ja)

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JP2007164594A JP5094232B2 (ja) 2006-06-26 2007-06-22 半導体装置を内包する用紙およびその作製方法

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JP2006175678 2006-06-26
JP2006175678 2006-06-26
JP2007164594A JP5094232B2 (ja) 2006-06-26 2007-06-22 半導体装置を内包する用紙およびその作製方法

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JP2008033907A JP2008033907A (ja) 2008-02-14
JP2008033907A5 JP2008033907A5 (enExample) 2010-05-27
JP5094232B2 true JP5094232B2 (ja) 2012-12-12

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010005064A1 (en) * 2008-07-10 2010-01-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
JP5586920B2 (ja) * 2008-11-20 2014-09-10 株式会社半導体エネルギー研究所 フレキシブル半導体装置の作製方法
CN102576653B (zh) * 2009-08-20 2015-04-29 财团法人生产技术研究奖励会 半导体基板、半导体层的制造方法、半导体基板的制造方法、半导体元件、发光元件、显示面板、电子元件、太阳能电池元件及电子设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634482B2 (ja) * 1990-06-12 1997-07-23 三田工業株式会社 画像形成装置のクリーニング方法
JP3925101B2 (ja) * 2001-04-19 2007-06-06 特種製紙株式会社 偽造防止用シート状物の製造方法
JP5041681B2 (ja) * 2004-06-29 2012-10-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4749062B2 (ja) * 2004-07-16 2011-08-17 株式会社半導体エネルギー研究所 薄膜集積回路を封止する装置及びｉｃチップの作製方法
JP4563122B2 (ja) * 2004-09-14 2010-10-13 株式会社中戸研究所 バリア性積層フィルム及びその製造方法
JP5072210B2 (ja) * 2004-10-05 2012-11-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4799130B2 (ja) * 2004-11-09 2011-10-26 株式会社半導体エネルギー研究所 Ｉｃチップおよびｉｃチップの作製方法
JP4811561B2 (ja) * 2005-04-19 2011-11-09 大日本印刷株式会社 無効化可能非接触ｉｃタグ

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