JP5093011B2 - Electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting method in which an electronic component and a substrate are electrically connected, and then the electrical connection portion is sealed with a polyamide resin. It is suitable for use in a component mounting surface that is sealed with a mold resin together with the electronic component.

  In this conventional general mounting method of this type, the electronic component is mounted on one surface of the substrate with the lower end surface of the electronic component and the one surface of the substrate facing away from each other. A connection member such as a conductive adhesive, solder, or bump is interposed between one surface of the substrate and the electronic component and the substrate are electrically connected by this connection member.

  After that, for example, when one surface side of the substrate is sealed with a mold resin together with the electronic components mounted on the one surface, for improving the adhesion between the substrate and the mold resin, and for relaxing internal stress, A polyamide resin is provided on one surface of the substrate.

  Specifically, a liquid resin made of polyamide is interposed between one surface of the substrate and the lower end surface of the electronic component, and the connecting member is sealed with the polyamide resin. At the same time, on the outside of the electronic component, the polyamide resin is continuously extended from one surface of the substrate toward the upper side of the substrate to the side surface extending from the lower surface of the electronic component to the upper side of the substrate of the electronic component. And a polyamide resin is brought into contact with the side surface (see FIG. 1 described later).

  Thus, after the polyamide resin is arranged, the polyamide resin is heated and cured. Thereafter, for example, if a mold resin is applied to one side of the substrate and cured, the one side of the substrate is sealed with the mold resin together with the electronic components.

On the other hand, conventionally, as such a polyamide resin, there has been proposed a thermosetting coating composition that hardly generates voids during curing and can be used as a semiconductor package bonding material (see Patent Document 1).
JP 2008-19327 A

  However, according to the study of the present inventor, in the step of applying and curing the polyamide resin, the connection member is formed by applying the polyamide resin to the connection member that electrically connects the electronic component and the substrate. There was a new problem that the electrical connection resistance value increased.

  Specifically, when the polyamide resin is applied around the substrate and the electronic component and heated, the diluent on the surface of the polyamide resin is vaporized, and the outer surface of the polyamide resin is cured to form a film. Then, voids are generated under the cured film, that is, inside the polyamide resin, and the connecting member is peeled off by the stress caused by the voids.

  As described above, the cause of the increase in the electrical connection resistance value is that the connection strength of the connection member is reduced due to the stress caused by the expansion of the void generated inside the resin due to the curing of the polyamide resin, and the connection member and the substrate are peeled off. It depends.

  In Patent Document 1, the polyamide resin is improved from the material side so that voids are hardly generated at the time of curing. However, in this case, the material is restricted and a problem arises in versatility.

  The present invention has been made in view of the above problems, and is generally used in an electronic component mounting method in which an electronic component and a substrate are electrically connected and then the electrical connection portion is sealed with a polyamide resin. An object of the present invention is to provide a production method suitable for preventing a void from remaining inside a cured polyamide resin using a polyamide resin.

  In order to achieve the above object, in the invention according to claim 1, in the heating step of the polyamide resin (40), the outer surface of the polyamide resin (40) is more than the lower end surface (22) of the electronic component (20). The temperature of the part far from the one surface (11) of the substrate (10) is lower than the temperature of the part near the one surface (11) of the substrate (10) than the lower end surface (22) of the electronic component (20). Accordingly, the first step of curing the near portion while making the distant portion in a liquid state, and then the substrate (rather than the lower end surface (22) of the electronic component (20) of the outer surface of the polyamide resin (40)). 10) performing a second step of increasing the temperature of the part far from the one surface (11) and curing the part far away.

  According to this, in the first step of heating the polyamide resin (40), one surface (11) of the substrate (10) rather than the lower end surface (22) of the electronic component (20) among the outer surface of the polyamide resin (40). ) Near the lower end surface (22) of the electronic component (20) out of the outer surface of the polyamide resin (40). Since the part far from the one surface (11) of the substrate (10) remains in a liquid state, voids generated in the polyamide resin (40) escape from the liquid surface to the outside. Therefore, according to the present invention, it is possible to provide a mounting method suitable for preventing voids from remaining inside the cured polyamide resin using a general polyamide resin.

  Here, as in the invention described in claim 2, in the first step, the cooling member (50, 51) is used, and the upper end surface opposite to the lower end surface (22) of the electronic component (20) ( By cooling 21), the temperature of the far site can be made lower than the temperature of the near site.

  And like invention of Claim 3, a cooling member can be used as the cooling gas spraying means (50) which sprays a cooling gas on the upper end surface (21) of an electronic component (20). Moreover, like invention of Claim 4, a cooling member is a cooling jig (51) which contacts the upper end surface (21) of an electronic component (20), and cools the said upper end surface (21). it can.

  Moreover, in invention of Claim 5, a 1st process is from the one surface (11) of a board | substrate (10) rather than the lower end surface (22) of an electronic component (20) among the outer surfaces of a polyamide resin (40). One end of a tubular member (60) having a tubular shape with both ends opened is pierced into a far site, and after completion of the first step, the tubular member (60) is removed from the far site, and then the second member A process is performed.

  According to this, in the first step, the void generated in the distant portion in the liquid state can be easily removed to the outside through the tubular member (60).

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing a schematic cross-sectional configuration of an electronic component mounting structure according to the first embodiment of the present invention. The mounting structure of the present embodiment is roughly formed by electrically connecting the electronic component 20 and the substrate 10 via the connection member 30 and sealing the electrical connection portion with the polyamide resin 40. .

  The substrate 10 has a plate shape with the upper surface 11 in FIG. 1 as one plate surface and the lower surface 12 in FIG. 1 as the other plate surface. The board 10 is a general circuit board or wiring board of this type, and specifically includes various boards on which the electronic component 20 can be mounted, such as a ceramic board, a printed board, and a glass epoxy board.

  The electronic component 20 may be any component that can be mounted on the upper surface 11 of the substrate 10 such as an IC chip, a resistor, a capacitor, or a sensor element. The electronic component 20 is mounted on the upper surface 11 of the substrate 10 with its lower end surface 22 facing the upper surface 11 of the substrate 10. And the upper end surface 21 which is an end surface on the opposite side to the lower end surface 22 in the electronic component 20 has faced the upper direction of the board | substrate 10. FIG.

  Here, the lower end surface 22 of the electronic component 20 and the upper surface 11 of the substrate 10 facing each other are separated from each other, and the connection member 30 is interposed between the lower end surface 22 of the electronic component 20 and the upper surface 11 of the substrate 10. doing.

  The connection member 30 contacts the lower end surface 22 of the electronic component 20 and the upper surface 11 of the substrate 10 to electrically connect the electronic component 20 and the substrate 10. For example, a conductive adhesive or solder, Or a bump etc. are mentioned.

  Here, the polyamide resin 40 is provided on the upper surface 11 of the substrate 10. The polyamide resin 40 is a general one used for this type of mounting structure, and is disposed by being applied to the upper surface 11 of the substrate 10 and cured.

  The polyamide resin 40 is provided on the upper surface 11 of the substrate 10 in a region where the electronic component 20 and the substrate 10 overlap, that is, between the upper surface 11 of the substrate 10 and the lower end surface 22 of the electronic component 20 facing each other. The electronic component 20 and the substrate 10 are provided outside the overlapping region, that is, outside the electronic component 20.

  The connecting member 30 is sealed with a polyamide resin 40 interposed between the upper surface 11 of the substrate 10 and the lower end surface 22 of the electronic component 20. Further, outside the electronic component 20, the polyamide resin 40 continuously extends from the upper surface 11 of the substrate 10 to the side surface 23 of the electronic component 20 toward the upper side of the upper surface 11.

  Here, the side surface 23 of the electronic component 20 is a surface that is located at the outer peripheral ends of the upper end surface 21 and the lower end surface 22 of the electronic component 20 and extends in a direction orthogonal to the both end surfaces 21 and 22. That is, the side surface 23 of the electronic component 20 is a surface extending above the upper surface 11 of the substrate 10. Note that “above the upper surface 11 of the substrate 10” refers to a direction from the bottom to the top in FIG.

  Specifically, the polyamide resin 40 is continuously extended from the upper surface 11 of the substrate 10 to the side surface 23 of the electronic component 20 beyond the lower end surface 22 of the electronic component 20 outside the electronic component 20. The polyamide resin 40 is in contact with the side surface 23.

  Accordingly, in the example shown in FIG. 1, the polyamide resin 40 has a fillet shape that is inclined so that the hem expands from the side surface 23 of the electronic component 20 toward the upper surface 11 of the substrate 10 outside the electronic component 20. ing.

  Next, a method for mounting the electronic component 20 according to the present embodiment on the substrate 10 will be described. FIG. 2 is a process diagram illustrating a heating process of the polyamide resin 40 in the present mounting method, and is a diagram illustrating a schematic cross-sectional configuration of a workpiece in the heating process.

  First, the electronic component 20 is mounted on the upper surface 11 of the substrate 10 with the lower end surface 22 of the electronic component 20 and the upper surface 11 of the substrate 10 facing each other. At this time, the electronic component 20 and the substrate 10 are electrically connected with the connection member 30 interposed between the lower end surface 22 of the electronic component 20 and the upper surface 11 of the substrate 10. Specific examples of connection by the connection member 30 include application / curing of a conductive adhesive, solder printing / reflow, and thermocompression bonding of bumps. It should be noted that general connections can be employed for these conductive adhesives, solders, bumps, and the like.

  Thereafter, a liquid polyamide resin 40 made of polyamide is applied to the upper surface 11 of the substrate 10 by a general method such as potting or printing. The position where the polyamide resin 40 is applied is as described above. That is, between the one surface 11 of the substrate 10 and the lower end surface 22 of the electronic component 20, the polyamide resin 40 is interposed therebetween, and the connecting member 30 is sealed with the polyamide resin 40.

  Further, outside the electronic component 20, the polyamide resin 40 is continuously applied from the upper surface 11 of the substrate 10 to the side surface 23 of the electronic component 20 beyond the lower end surface 22 of the electronic component 20 toward the upper surface 11 of the substrate 10. It extends and the polyamide resin 40 is brought into contact with the side surface 23.

  Thus, after the polyamide resin 40 is applied, the polyamide resin 40 is subsequently heated and cured. This heating step is performed using a heater, an oven, etc., as in the general case. However, as described above, conventionally, when the polyamide resin is heated, the surface that appears outside the resin, that is, the outer surface of the resin When the diluent in the resin is vaporized, a film is generated on the outer surface, and the resin is cured therefrom.

  Then, the void generated in the resin has no escape space because the outer surface of the resin is cured first, and remains in the resin after curing. Here, without this film, voids inside the resin can escape to the outside. Focusing on this point, in the mounting method of the present embodiment, the heating process is performed in two stages, such as a first process and a second process, as will be further described below.

  First, in the first step, as shown in FIG. 2, the upper end surface 21 of the electronic component 20 is cooled using the cooling member 50. Here, the cooling member is a cooling gas spraying means 50 that sprays a cooling gas onto the upper end surface 21 of the electronic component 20. Examples of the cooling gas blowing means 50 include a blowing member that blows out air or an inert gas at a room temperature or lower temperature as a cooling gas.

  Then, the cooling gas blowing means 50 blows cooling gas (shown as cold air in FIG. 2) to the upper end surface 21 of the electronic component 20, and on the other hand, the substrate 10 side is applied to the polyamide resin 40 by a heater or the like. Heat it above the curing temperature.

  Then, the ambient temperature on the substrate 10 side becomes lower than the ambient temperature on the upper end surface 21 side of the electronic component 20, and the temperature of the electronic component 20 and the temperature of the substrate 10 are thus changed by changing the ambient temperature on both sides in this way. The temperature of the electronic component 20 becomes lower.

  Therefore, of the outer surface of the polyamide resin 40 extending from the one surface 11 of the substrate 10 to the side surface 23 of the electronic component 20 shown in FIG. Also, the temperature is lower than that of the outer surface 42 of the lower side, that is, the portion on the one surface 11 side of the substrate 10.

  In order to make the boundary between the outer surfaces 41 and 42 having this temperature difference more concrete, it will be described as follows. In the first step, the temperature of the component-side outer surface 41, which is a portion of the outer surface of the polyamide resin 40 that is farther from the upper surface 11 of the substrate 10 than the lower end surface 22 of the electronic component 20, is set below the electronic component 20. It is assumed that the temperature is lower than the temperature of the substrate-side outer surface 42 that is a portion closer to the one surface 11 of the substrate 10 than the end surface 22.

  FIG. 2 shows the component-side outer surface 41 on the upper side and the substrate-side outer surface 42 on the lower side of the outer surface of the polyamide resin 40 with the lower end surface 22 of the electronic component 20 as a boundary. In the first step, the temperature of the component-side outer surface 41 is lower than the curing temperature so that the component-side outer surface 41 of the outer surface of the polyamide resin 40 is liquid and the substrate-side outer surface 42 is cured, The temperature of the substrate side outer surface 42 is adjusted to be equal to or higher than the curing temperature.

  This temperature adjustment can be easily performed by adjusting the gas blowing amount of the cooling gas blowing means 50 or by adjusting the heater on the substrate 10 side.

  Thereby, in the first step, the polyamide film 40a is generated on the substrate-side outer surface 42 and the polyamide resin 40 is cured, but the polyamide film 40a is generated on the component-side outer surface 41 above it. It remains liquid. Therefore, the void B generated inside the polyamide resin 40 escapes from the liquid component side outer surface 41 to the outside. The above is the first step.

  In the heating process of the present embodiment, the second process is subsequently performed after the first process. In the second step, the temperature of the component-side outer surface 41 of the outer surface of the polyamide resin 40 is increased to cure the component-side outer surface 41. This may be achieved, for example, by gradually decreasing the flow rate of the cooling gas from the cooling gas spraying means 50. In this way, the entire polyamide resin 40 is cured with a small amount of void B and no part peeling.

  Thus, as the entire polyamide resin 40 is cured, the second step is completed, and the heating step of the polyamide resin 40 is completed. Then, the mounting structure of this embodiment as shown in FIG. 1 is completed. After that, if necessary, if a mold resin is applied to the upper surface 11 side of the substrate 10 and cured, a semiconductor package in which the upper surface 11 side of the substrate 10 is sealed together with the electronic component 20 with the mold resin is completed. .

  By the way, according to the present embodiment, in the first step of heating the polyamide resin 40, the substrate closer to the upper surface 11 of the substrate 10 than the lower end surface 22 of the electronic component 20 among the outer surfaces 41 and 42 of the polyamide resin 40. Curing occurs on the side outer surface 42, and void B is generated in the polyamide resin 40.

  However, since the component-side outer surface 41 that is farther from the upper surface 11 of the substrate 10 than the lower end surface 22 of the electronic component 20 among the outer surface of the polyamide resin 40 remains in a liquid state, the void B escapes from the liquid surface to the outside. . And since this liquid part in the polyamide resin 40 is cured in the second step, there is no problem.

  Therefore, according to the present embodiment, a mounting method suitable for preventing void B from remaining inside the cured polyamide resin 40 even when a polyamide resin 40 made of a general material is used is provided. be able to.

  The connection member 30 is an electrical connection portion that is interposed between the electronic component 20 and the substrate 10 and electrically connects the members 10 and 20, and is formed by the void B applied to the connection member 30. The stress can be reduced, and the connection member 30 can be prevented from being peeled off.

  In addition, as described above, a ceramic substrate, a printed circuit board, or the like can be adopted as the substrate 10. In particular, in the case of a ceramic substrate, adhesion between the ceramic substrate and the mold resin is ensured when sealing with the mold resin. For this purpose, it is common to apply a polyamide resin to the substrate, and if the electronic component is mounted at that time, the above-mentioned void problem is likely to occur. This is what the inventors have confirmed experimentally. That is, this embodiment is more effective when the substrate 10 is a ceramic substrate.

(Second Embodiment)
FIG. 3 is a process diagram illustrating a heating process of the polyamide resin 40 in the electronic component mounting method according to the second embodiment of the present invention, and is a diagram illustrating a schematic cross-sectional configuration of a workpiece in the heating process. The mounting method of this embodiment differs from the first embodiment in the cooling member used in the first step of the heating step, and here, the difference will be mainly described.

  As shown in FIG. 3, also in the first step of the heating step in the present embodiment, the cooling member 51 is used to cool the upper end surface 21 of the electronic component 20, and thus out of the outer surface of the polyamide resin 40. The temperature of the component-side outer surface 41 is made lower than the temperature of the substrate-side outer surface 42.

  Here, in the first embodiment, the cooling member is the cooling gas spraying means 50, but in this embodiment, the cooling member is a cooling that contacts the upper end surface 21 of the electronic component 20 and cools the upper end surface 21. This is a jig 51.

  The cooling jig 51 is a block body made of a material having excellent thermal conductivity such as aluminum or copper, and has a structure in which cooling water flows inside. Specifically, a tube 51a is provided inside the cooling jig 51, and cooling water flows through the tube 51a.

  The cooling jig 51 can be moved up and down by an actuator or the like. Further, here, in the cooling jig 51, a heater 51b made of a metal that generates heat when energized or the like is embedded. The heater 51b may not be provided.

  In the first step of this embodiment, the temperature of the electronic component 20 is made lower than the temperature of the substrate 10 by bringing the cooling jig 51 into contact with the upper end surface 21 of the electronic component 20 while flowing cooling water. Accordingly, the temperature of the component-side outer surface 41 is lower than the temperature of the substrate-side outer surface 42 among the outer surfaces of the polyamide resin 40, and the substrate-side outer surface 42 is made liquid while the component-side outer surface 41 is liquid. Harden.

  As a result, even in the first step of the present embodiment, the substrate-side outer surface 42 is cured, but the component-side outer surface 41 above it remains liquid, so that voids generated in the resin 40 are generated. B can be released to the outside from the component-side outer surface 41. The above is the first step of the present embodiment.

  Thereafter, in the second step of the present embodiment, the cooling jig 51 is moved upward from the position shown in FIG. 3 and separated from the upper end surface 21 of the electronic component 20. Alternatively, while the cooling jig 51 is in contact with the upper end surface 21 of the electronic component 20, the circulation of the cooling water is stopped and the electronic component 20 is heated by the heater 51 b in the cooling jig 51. By these methods, in the second step, the polyamide resin 40 on the component side surface 41 is cured, and the entire polyamide resin 40 is cured.

  Thus, according to the present embodiment, the mounting structure as shown in FIG. 1 is completed with the completion of the heating process of the polyamide resin 40. Also, according to this embodiment, a mounting method suitable for preventing the void B from remaining inside the cured polyamide resin 40 even when the polyamide resin 40 made of a general material is used is provided. Can do.

(Third embodiment)
FIG. 4 is a diagram showing a heating temperature profile in the first step of the heating step of the polyamide resin 40 in the electronic component mounting method according to the third embodiment of the present invention. In the profile, the temperature indicates the temperature of the substrate 10.

  The heating temperature profile in the first step of the heating step of the above embodiment may be a general one in which the substrate temperature rises substantially linearly with respect to time. However, if a stepwise temperature profile as in this embodiment is employed, void removal is promoted, which is more preferable.

  Since the polyamide resin 40 usually does not harden unless it becomes 100 ° C. or higher, in the first step of this embodiment, first, the temperature of the substrate 10 is set to a temperature lower than the curing temperature of the polyamide resin 40, for example, 80 ° C. to 100 ° C. Generate voids. At this time, if the atmosphere around the polyamide resin 40 is further reduced, a void generation amount increases.

  By doing so, voids are sufficiently generated in the first step, and voids in the resin 40 can be greatly reduced by the void releasing action via the liquid component side outer surface 41. Become. Thereafter, by raising the temperature of the substrate 10 to a temperature equal to or higher than the curing temperature of the resin 40, for example, 100 ° C. or higher, the same effect as the first step in each of the above embodiments is exhibited.

(Fourth embodiment)
FIG. 5 is a process diagram illustrating a heating process of the polyamide resin 40 in the electronic component mounting method according to the fourth embodiment of the present invention, and is a diagram illustrating a schematic cross-sectional configuration of a workpiece in the heating process. The mounting method of this embodiment is a modification of the first step of the heating step, and can be applied in combination with each of the above embodiments.

  In the first step of the heating step in each of the above embodiments, the component-side outer surface 41 of the outer surface of the polyamide resin 40 is temperature-controlled so as to maintain a liquid state. However, since the polyamide resin 40 cures faster on the outer surface than on the inside, the possibility that the component-side outer surface is cured cannot be completely excluded even in the first step. The present embodiment provides a method for forcibly taking out voids even in such a case.

  As shown in FIG. 5, in the first step of this embodiment, both ends of the outer surface of the polyamide resin 40 are formed on the component side outer surface farther from the one surface 11 of the substrate 10 than the lower end surface 22 of the electronic component 20. One end of a tubular member 60 having a tubular shape is pierced. In this state, the first process is performed.

  According to this, as shown in FIG. 5, even when the film 40a is formed on the component-side outer surface in the first step and the component-side outer surface is cured, the void generated in the liquid inside of the resin 40 B passes through the tubular member 60 to the outside. The tubular member 60 may be a rod-like member such as a straw or may be bent.

  Thus, in the present embodiment, after the first step is completed, the tubular member 60 is removed from the part-side outer surface and removed, and then the second step is performed in the same manner as in the above embodiments. Thus, in the present embodiment, the same mounting structure as described above is completed.

  Here, when the polyamide resin 40 is cured, a hole is formed in the trace of the tubular member 60 being pulled out. This hole exhibits an anchor effect when sealing with the mold resin later, and the mold resin Contributes to improved adhesion.

(Other embodiments)
In the first step, the ambient temperature on the upper end surface 21 side of the electronic component 20 is set lower than the ambient temperature on the substrate 10 side so that the temperature of the electronic component 20 is lower than the temperature of the substrate 10. The method is not limited to the method described in the above embodiment. Further, the cooling member is not limited to the cooling gas spraying means 50 or the cooling jig 51 shown in the above embodiment.

  Further, when the polyamide resin 40 is applied, the polyamide resin 40 is continuously extended from the upper surface 11 of the substrate 10 to the side surface 23 of the electronic component 20 outside the electronic component 20. The polyamide resin 40 may be applied from 23 to the upper end surface 21 of the electronic component 20.

It is a figure which shows schematic cross-sectional structure of the mounting structure of the electronic component which concerns on 1st Embodiment of this invention. It is process drawing which shows the heating process of the polyamide resin in the mounting method of the electronic component which concerns on 1st Embodiment. It is process drawing which shows the heating process of the polyamide resin in the mounting method of the electronic component which concerns on 2nd Embodiment of this invention. It is a figure which shows the heating temperature profile in the 1st process of the heating process of the polyamide resin in the mounting method of the electronic component which concerns on 3rd Embodiment of this invention. It is process drawing which shows the heating process of the polyamide resin in the mounting method of the electronic component which concerns on 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 11 Upper surface of substrate 20 Electronic component 21 Upper end surface of electronic component 22 Lower end surface of electronic component 23 Side surface of electronic component 30 Connection member 40 Polyamide resin 50 Cooling gas spraying means 51 Cooling jig 60 Tubular member

Claims (5)

With the lower end surface (22) of the electronic component (20) and the one surface (11) of the substrate (10) facing each other, the electronic component (20) is placed on the one surface (11) of the substrate (10). And mounting the connecting member (30) between the lower end surface (22) of the electronic component (20) and the one surface (11) of the substrate (10), the electronic component (20) and the electronic component (20) After electrically connecting the substrate (10),
A liquid polyamide resin (40) made of polyamide is interposed between one surface (11) of the substrate (10) and a lower end surface (22) of the electronic component (20), and the polyamide resin (40) Sealing the connection member (30);
Outside the electronic component (20), the polyamide resin (40) is moved upward from one surface (11) of the substrate (10) from one surface (11) of the substrate (10) to the electronic component (20). ) Continuously extending to the side surface (23) extending above the one surface (11) of the substrate (10) in the electronic component (20) beyond the lower end surface (22) of the electronic component (20). Contacting the polyamide resin (40);
Subsequently, in the mounting method of the electronic component for heating and curing the polyamide resin (40),
In the heating step of the polyamide resin (40), a portion of the outer surface of the polyamide resin (40) that is farther from one surface (11) of the substrate (10) than the lower end surface (22) of the electronic component (20). By making the temperature lower than the temperature of the portion closer to the one surface (11) of the substrate (10) than the lower end surface (22) of the electronic component (20), the distant portion is in a liquid state A first step of curing a nearby site;
Subsequently, the temperature of a part of the outer surface of the polyamide resin (40) farther from the one surface (11) of the substrate (10) than the lower end surface (22) of the electronic component (20) is increased and the farther away. And a second step of curing the part. An electronic component mounting method comprising:   In the first step, a cooling member (50, 51) is used to cool the upper end surface (21) opposite to the lower end surface (22) of the electronic component (20). The method for mounting an electronic component according to claim 1, wherein the temperature is lower than the temperature of the nearby portion.   3. The electronic component mounting method according to claim 2, wherein the cooling member is a cooling gas spraying means (50) for spraying a cooling gas to the upper end surface (21) of the electronic component (20).   The said cooling member is a cooling jig (51) which contacts the said upper end surface (21) of the said electronic component (20), and cools the said upper end surface (21), The electronic of Claim 2 characterized by the above-mentioned. Component mounting method. In the first step, both ends are opened in a portion of the outer surface of the polyamide resin (40) farther from the one surface (11) of the substrate (10) than the lower end surface (22) of the electronic component (20). The tubular member (60) that forms the tubular shape is pierced at one end of the tubular member (60),
5. The electron according to claim 1, wherein after the first step is finished, the tubular member (60) is removed from the remote part, and then the second step is performed. Component mounting method.

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