JP5089686B2 - 真空回路搭載プラズマ容器処理機 - Google Patents
真空回路搭載プラズマ容器処理機 Download PDFInfo
- Publication number
- JP5089686B2 JP5089686B2 JP2009513728A JP2009513728A JP5089686B2 JP 5089686 B2 JP5089686 B2 JP 5089686B2 JP 2009513728 A JP2009513728 A JP 2009513728A JP 2009513728 A JP2009513728 A JP 2009513728A JP 5089686 B2 JP5089686 B2 JP 5089686B2
- Authority
- JP
- Japan
- Prior art keywords
- pickup
- vacuum circuit
- mounting section
- traffic
- auxiliary vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/22—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to internal surfaces, e.g. of tubes
- B05D7/227—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to internal surfaces, e.g. of tubes of containers, cans or the like
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Measuring Fluid Pressure (AREA)
- Drying Of Semiconductors (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Discharge Heating (AREA)
- Treatment Of Fiber Materials (AREA)
Description
[発明の効果]
Claims (10)
- 処理容器(4)の受け入れに適するとともに主真空回路(12)に接続される取付区画(8)、該取付区画(8)に接続される圧力ピックアップ(15)、該圧力ピックアップ(15)が制御される該取付区画(8)との往来に利用される第1手段(18)を含むプラズマ容器(4)処理機であって、該主回路(12)から独立すると同時に該圧力ピックアップ(15)に接続される補助真空回路(19)と、該圧力ピックアップ(15)の該補助真空回路(19)との往来に利用される第2手段(23)が含まれることを特徴とするプラズマ容器処理機(1)。
- 該補助真空回路(19)に主回路(12)の主減圧源(13)とこれと別に搭載される補助減圧源(20)が含まれることを特徴とする請求項1に記載のプラズマ容器処理機(1)。
- 該減圧ピックアップ(15)が該取付区画(8)と補助減圧回路(19)に同時に接続される単一チャンバー(24)のピックアップであることを特徴とする請求項1または請求項2に記載のプラズマ容器処理機(1)。
- 該圧力ピックアップ(15)がその第1チャンバー(26)が、該取付区画(8)に、また第2チャンバー(27)が該補助真空回路(19)に接続される差分ピックアップであることを特徴とする請求項1または請求項2に記載のプラズマ容器処理機(1)。
- 該ピックアップ(15)の2つのチャンバー(26,27)の往来に利用される第3手段(29)が含まれる請求項4に記載のプラズマ容器処理機(1)。
- 往来に利用される該第3手段(29)が該差分ピックアップ(15)の2つの該チャンバー(26,27)間に挿入される電磁弁の形態であることを特徴とする請求項5に記載のプラズマ容器処理機(1)。
- 往来に利用される該第1および第2手段(18,23)がそれぞれ該ピックアップ(15)と該取付区画(8)との間に挿入される主電磁弁の形態と、該ピックアップ(15)と該補助真空回路(19)の該補助減圧源(20)間に挿入される補助電磁弁の形態であることを特徴とする請求項1から請求項6のいずれか1項に記載のプラズマ容器処理機(1)。
- 該ピックアップ(15)と該取付区画(8)との間の往来が遮断され、該ピックアップ(15)が該補助真空回路(19)との往来状態にされて、該補助真空回路(19)を支配する圧力値が測定されるとともに、この値が該ピックアップ(15)の参照圧力値とされる請求項3に記載の該処理機(1)の該ピックアップ(15)の較正方法。
- 該ピックアップ(15)と該取付区画(8)との間の往来が遮断され、該ピックアップ(15)が該補助真空回路(19)との往来状態にされ、該ピックアップ(15)の2つのチャンバー(26,27)が往来状態にされて、該第2チャンバー(27)を通じて該補助真空回路(19)を支配する圧力値が測定されるとともに、この値が該第2チャンバー(27)の参照圧力値とされる請求項5または請求項6に記載の処理機のピックアップ較正方法。
- ピックアップ(15)の動的応答を評価する請求項8または請求項9に記載の較正方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0605089A FR2902027B1 (fr) | 2006-06-08 | 2006-06-08 | Machine de traitement de recipients par plasma, comprenant un circuit de vide embarque |
FR0605089 | 2006-06-08 | ||
PCT/FR2007/000938 WO2007141426A2 (fr) | 2006-06-08 | 2007-06-07 | Machine de traitement de récipients par plasma, comprenant un circuit de vide embarqué |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009540117A JP2009540117A (ja) | 2009-11-19 |
JP5089686B2 true JP5089686B2 (ja) | 2012-12-05 |
Family
ID=37835289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009513728A Expired - Fee Related JP5089686B2 (ja) | 2006-06-08 | 2007-06-07 | 真空回路搭載プラズマ容器処理機 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9279180B2 (ja) |
EP (1) | EP2024104B1 (ja) |
JP (1) | JP5089686B2 (ja) |
CN (1) | CN101460259A (ja) |
AT (1) | ATE548129T1 (ja) |
FR (1) | FR2902027B1 (ja) |
WO (1) | WO2007141426A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3035881B1 (fr) * | 2015-05-04 | 2019-09-27 | Sidel Participations | Installation pour le traitement de recipients par plasma micro-ondes, comprenant un generateur a etat solide |
FR3093665A1 (fr) | 2019-03-15 | 2020-09-18 | Sidel Participations | Machine de traitement de récipients par plasma et procédé de contrôle de la machine de traitement |
KR102421985B1 (ko) * | 2020-01-23 | 2022-07-18 | 주식회사 히타치하이테크 | 플라스마 처리 장치 및 플라스마 처리 장치의 운전 방법 |
CN111370286B (zh) * | 2020-03-24 | 2023-02-07 | 中国科学院近代物理研究所 | 一种用于治疗装备的等离子体源及其使用方法 |
DE102021120056A1 (de) * | 2021-08-02 | 2023-02-02 | Khs Gmbh | Verfahren zum Beschichten von Behältern aus Kunststoff |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4866640A (en) * | 1987-08-20 | 1989-09-12 | Granville-Phillips Company | Temperature compensation for pressure gauge |
JP2826409B2 (ja) * | 1992-03-19 | 1998-11-18 | 山口日本電気株式会社 | ドライエッチング装置 |
US5308649A (en) * | 1992-06-26 | 1994-05-03 | Polar Materials, Inc. | Methods for externally treating a container with application of internal bias gas |
JPH10308383A (ja) * | 1997-05-06 | 1998-11-17 | Sony Corp | 真空処理装置及び真空処理装置の駆動方法 |
US5808176A (en) * | 1997-06-03 | 1998-09-15 | Vanguard International Semiconductor Corporation | Solving production downtime with parallel low pressure sensors |
SE9900077D0 (sv) * | 1999-01-14 | 1999-01-14 | Gambro Ab | Verfahren und Vorrichtung zum Uberprüfen von Sensoren |
JP3490397B2 (ja) * | 1999-01-11 | 2004-01-26 | ベクトン・ディキンソン・アンド・カンパニー | 殺菌圧力変換器のための隔離された校正アダプタ |
FR2847912B1 (fr) * | 2002-11-28 | 2005-02-18 | Sidel Sa | Procede et dispositif pour deposer par plasma micro-ondes un revetement sur une face d'un recipient en materiau thermoplastique |
JP4437647B2 (ja) * | 2003-07-17 | 2010-03-24 | 三菱商事プラスチック株式会社 | ガスバリア膜コーティングプラスチック容器の製造方法 |
-
2006
- 2006-06-08 FR FR0605089A patent/FR2902027B1/fr not_active Expired - Fee Related
-
2007
- 2007-06-07 JP JP2009513728A patent/JP5089686B2/ja not_active Expired - Fee Related
- 2007-06-07 US US12/303,871 patent/US9279180B2/en not_active Expired - Fee Related
- 2007-06-07 EP EP07765981A patent/EP2024104B1/fr not_active Not-in-force
- 2007-06-07 WO PCT/FR2007/000938 patent/WO2007141426A2/fr active Application Filing
- 2007-06-07 AT AT07765981T patent/ATE548129T1/de active
- 2007-06-07 CN CNA2007800208864A patent/CN101460259A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN101460259A (zh) | 2009-06-17 |
FR2902027B1 (fr) | 2008-12-05 |
FR2902027A1 (fr) | 2007-12-14 |
JP2009540117A (ja) | 2009-11-19 |
WO2007141426A2 (fr) | 2007-12-13 |
EP2024104B1 (fr) | 2012-03-07 |
ATE548129T1 (de) | 2012-03-15 |
US20110252861A1 (en) | 2011-10-20 |
US9279180B2 (en) | 2016-03-08 |
WO2007141426A3 (fr) | 2008-03-20 |
EP2024104A2 (fr) | 2009-02-18 |
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