JP5044577B2 - 二機能検出器装置 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/617—Noise processing, e.g. detecting, correcting, reducing or removing noise for reducing electromagnetic interference, e.g. clocking noise
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
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- Apparatus For Radiation Diagnosis (AREA)
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- Transforming Light Signals Into Electric Signals (AREA)
Description
24 X線源
26 X線ビーム
28 関心領域
30 患者
32 X線検出器
33 X線検出器
36 モニタ
38 走査サーキットリ
40 走査線
40a、40b 新たな走査線
42 読み出し電子回路又はサーキットリ
44 データ線
46 バイアス・サーキットリ
48 取得制御及び画像処理回路
50 制御器
60 ピクセル単位セル
60a、60b 分割ピクセル部分
62 FET
64 ピクセル・フォトダイオード
64a、64b 分割フォトダイオード
65a、65b バイア
70 ゲート端子
72 ドレイン端子
75 ソース端子
76 共通電極
74a、74b アノード
80 電圧供給源
82a、82b 関連する伝導性ブリッジ
84a、84b カソード
132 ピクセル構造
134 走査線
136 データ線
146 FET
148 フォトダイオード
150 ゲート端子
152 ドレイン端子
154 ソース端子
156 カソード
158 アノード
160 電圧供給源
162 共通電極
164 共通接地
300 検出器表示
302 検出器部分
304 ピクセル
304a1、304a2、304a3 ピクセル部分
304b ピクセル
306 ピクセル
306a1、306a2、306a3 ピクセル部分
312、320 検出器表示部分
322a、322e ピクセル
326a、326e ピクセル
330、332、334 ピクセル単位セル
336b1、316b2 ピクセル部分
340 検出器部分(図12)
348 検出器
350 ピクセル単位セル
400 検出器部分
402 ピクセル
404 データ線
404a 第一のデータ線
404b 新たなデータ線
406 共通電極
408 FET
410 関連する縦列
412 ダイオード
420 走査線
482 伝導性ブリッジ
304a、304b ピクセル
304a1、304a2 ピクセル部分
304b1、304b2 ピクセル部分
306a、306b ピクセル
306b1、306b2 ピクセル部分
314、316、318 ピクセル
314a、318a ピクセル
314c、318c ピクセル
316d1、316d1 ピクセル部分
318b1、318b2 ピクセル部分
318d1、318d1 ピクセル部分
322、324、326、328 ビニング型ピクセル
324c1、324f1 ピクセル部分
324c2、324f2 ピクセル部分
328c1、328f2 ピクセル部分
328f1、328f2 ピクセル部分
332、334 ピクセル単位セル
342 単位ピクセルのセル・パターン
344、346 ピクセル
404 ピクセル(検出器340)
404a 新たなデータ線
408 FET
412a、412b 分割ダイオード
Claims (5)
- ピクセル単位セルを形成する少なくとも第一および第二のピクセルを含む複数のピクセルと、少なくとも第一および第二の線を含む複数の走査線と、複数のデータ線とを含み、
前記第一および第二のピクセルは各々が光検出器部分及び光検出器でない部分を有し、
前記第一の線は、前記第一のピクセルの前記部分の各々に動作自在に結合して前記第一のピクセルの前記光検出器部分を選択的に起動し、かつ、前記第一のピクセルの前記光検出器部分および前記第二のピクセルの前記光検出器部分のいずれも分離しないように構成されて、前記第二のピクセルに動作自在に結合されておらず、
前記第二の線は、前記第二のピクセルの前記部分の各々に動作自在に結合して前記第二のピクセルの前記光検出器部分を選択的に起動し、かつ、前記第一のピクセルの前記光検出器部分を分離するように構成されて、前記第一のピクセルに動作自在に結合されておらず、
前記第一のピクセルの前記光検出器部分は、並列に結合されていると共に前記第二の線により分離されている2個のフォトダイオードを含んでおり、
前記第一のピクセルの前記光検出器でない部分は、前記第一の線により受信された信号に応答して電荷を蓄積するように前記2個のフォトダイオードを起動し、
前記第二のピクセルの前記光検出器部分は、並列に結合されていると共に前記第二の線により分離されている2個のフォトダイオードを含んでおり、
前記第二のピクセルの前記光検出器でない部分は、前記第二の線により受信された信号に応答して電荷を蓄積するように前記2個のフォトダイオードを起動し、
前記第一および第二のピクセルの少なくとも一方が、前記第一の線の選択的起動の後に、前記光検出器部分の内部に蓄積された電荷を表わす信号を関連するデータ線に伝送し、前記第一および第二のピクセルの少なくとも一方が、前記第二の線の選択的起動の後に、前記第一および第二のピクセルのピクセルの他方での電磁干渉(EMI)を補正するように電磁干渉(EMI)補正データを関連するデータ線へ伝送する、
検出器装置(33)。 - 前記複数のピクセルの各々は、FETにより画定される光検出器でない部分及びフォトダイオードにより画定される光検出器部分を有し、
前記複数の走査線は、前記複数のピクセルの各選択部分に関連する選択された個数のFETに結合された複数の走査線であって、当該走査線の各部分は、前記FETを起動するように選択された個数のFETのゲートに結合しており、
前記複数のデータ線は、選択された光検出器部分の内部に蓄積された電荷を関連する読み出し電子回路に読み出すように、前記光検出器部分と直列に、選択された個数のFETに結合されている
請求項1に記載の検出器装置。 - 前記第一の線の前記光検出器部分の起動に応答して前記光検出器部分に蓄積されている電荷を表わす信号を読み出すように前記光検出器部分及び光検出器でない部分の各々に動作自在に結合されている第三の線をさらに含んでいる請求項1に記載の検出器装置。
- 前記光検出器でない部分を画定するFETと、前記光検出器部分を画定するフォトダイオードとをさらに含んでいる請求項1に記載の検出器装置。
- 前記第二の線は、前記第一のピクセルから電気的に絶縁されている、請求項1に記載の検出器装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/971,533 | 2008-03-31 | ||
US11/971,533 US7495228B1 (en) | 2008-03-31 | 2008-03-31 | Dual function detector device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009246948A JP2009246948A (ja) | 2009-10-22 |
JP2009246948A5 JP2009246948A5 (ja) | 2011-11-10 |
JP5044577B2 true JP5044577B2 (ja) | 2012-10-10 |
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Application Number | Title | Priority Date | Filing Date |
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JP2009001236A Expired - Fee Related JP5044577B2 (ja) | 2008-03-31 | 2009-01-07 | 二機能検出器装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7495228B1 (ja) |
JP (1) | JP5044577B2 (ja) |
CN (1) | CN101551462B (ja) |
FR (1) | FR2926164B1 (ja) |
Families Citing this family (31)
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US8786873B2 (en) * | 2009-07-20 | 2014-07-22 | General Electric Company | Application server for use with a modular imaging system |
CN102053252B (zh) * | 2009-11-03 | 2012-11-21 | 上海天马微电子有限公司 | 平板x光传感器及其驱动方法 |
US8217358B2 (en) * | 2009-12-14 | 2012-07-10 | General Electric Company | System and method of eliminating image artifacts |
US8405038B2 (en) * | 2009-12-30 | 2013-03-26 | General Electric Company | Systems and methods for providing a shared charge in pixelated image detectors |
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WO2013188498A2 (en) * | 2012-06-12 | 2013-12-19 | Arizona Board Of Regents Acting For And On Behalf Of Arizona State University | Imaging system and methods of manufacturing and using the same |
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JP6527035B2 (ja) * | 2015-06-30 | 2019-06-05 | 浜松ホトニクス株式会社 | 固体撮像装置 |
CN106551701B (zh) * | 2015-09-18 | 2020-04-10 | 上海奕瑞光电子科技股份有限公司 | 一种无线平板探测器及其图像校正方法 |
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US10156645B2 (en) | 2016-12-23 | 2018-12-18 | General Electric Company | Systems and methods for sub-pixel location determination at sidewalls and corners of detectors |
US9983320B1 (en) | 2017-05-15 | 2018-05-29 | General Electric Company | Systems and methods for improved collimation sensitivity |
US10145964B1 (en) | 2017-05-15 | 2018-12-04 | General Electric Company | Systems and methods for improved collimation sensitivity |
US10324200B2 (en) | 2017-05-15 | 2019-06-18 | General Electric Company | Systems and methods for improved collimation sensitivity |
US10794758B2 (en) * | 2017-09-29 | 2020-10-06 | General Electric Company | System and method for verifying the integrity of a radiation detector |
US10761224B2 (en) | 2018-06-06 | 2020-09-01 | General Electric Company | Systems and methods for improved detector assembly sizing |
US10481285B1 (en) | 2018-08-13 | 2019-11-19 | General Electric Company | Systems and methods for determination of depth of interaction |
US10976452B2 (en) | 2018-08-13 | 2021-04-13 | General Electric Medical Systems Israel, Ltd. (Il) | Systems and methods for improved medical imaging |
US10591619B2 (en) | 2018-08-15 | 2020-03-17 | GE Precision Healthcare LLC | Anodes for improved detection of non-collected adjacent signals |
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US10828003B2 (en) | 2019-03-18 | 2020-11-10 | GE Precision Healthcare, LLC | System and method for mitigating electromagnetic interference when acquiring image data |
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-
2008
- 2008-03-31 US US11/971,533 patent/US7495228B1/en active Active
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2009
- 2009-01-07 JP JP2009001236A patent/JP5044577B2/ja not_active Expired - Fee Related
- 2009-01-08 FR FR0950085A patent/FR2926164B1/fr active Active
- 2009-01-09 CN CN200910118727.9A patent/CN101551462B/zh active Active
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Publication number | Publication date |
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FR2926164B1 (fr) | 2014-01-10 |
CN101551462B (zh) | 2013-09-18 |
JP2009246948A (ja) | 2009-10-22 |
FR2926164A1 (fr) | 2009-07-10 |
US7495228B1 (en) | 2009-02-24 |
CN101551462A (zh) | 2009-10-07 |
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