JP4808557B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP4808557B2 JP4808557B2 JP2006184514A JP2006184514A JP4808557B2 JP 4808557 B2 JP4808557 B2 JP 4808557B2 JP 2006184514 A JP2006184514 A JP 2006184514A JP 2006184514 A JP2006184514 A JP 2006184514A JP 4808557 B2 JP4808557 B2 JP 4808557B2
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- imaging device
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- 238000003384 imaging method Methods 0.000 title claims description 42
- 230000010354 integration Effects 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001444 catalytic combustion detection Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/58—Control of the dynamic range involving two or more exposures
- H04N25/581—Control of the dynamic range involving two or more exposures acquired simultaneously
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Description
Claims (2)
- 共通の構成を有するM×N個の画素部P 1,1 〜P M,N がM行N列に2次元配列され、各画素部P m,n が第m行第n列に位置し、各画素部P m,n がK個のフォトダイオードPD 1 〜PD K およびK個のスイッチSW 1 〜SW K を含み、各画素部P m,n においてフォトダイオードPD k で発生した電荷をスイッチSW k が閉じているときに配線L n,k へ出力する受光部と、
各配線L n,k に個々に接続されたN×K個の積分回路を含み、行毎に順次に、前記受光部の各画素部P m,n のフォトダイオードPD k からスイッチSW k を経て配線L n,k に出力された電荷を入力し、その入力した電荷を前記積分回路の容量素子に蓄積して、その蓄積電荷量に応じた電圧値V n,k を出力する信号読出部と、
前記信号読出部から出力された電圧値V n,k を入力しAD変換して、この入力電圧値V n,k に応じたデジタル値D n,k を出力するAD変換部と、
前記受光部の各画素部P m,n について、該画素部P m,n に含まれるK個のフォトダイオードPD 1 〜PD K それぞれで発生した電荷の量に応じて前記AD変換部から出力されるデジタル値D n,1 〜D n,K の総和を演算し、その総和値であるデジタル値を出力する加算部と、
を備え、
前記受光部の各画素部に含まれるK個のフォトダイオードそれぞれの光感応領域が全体として正方形である、
ことを特徴とする固体撮像装置(ただし、M,N,Kそれぞれは2以上の整数、mは1以上M以下の各整数、nは1以上N以下の各整数、kは1以上K以下の各整数)。 - 前記受光部の各画素部に含まれるK個のフォトダイオードそれぞれの光感応領域が互いに等しい面積を有している、ことを特徴とする請求項1記載の固体撮像装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006184514A JP4808557B2 (ja) | 2006-07-04 | 2006-07-04 | 固体撮像装置 |
KR1020087027608A KR101407807B1 (ko) | 2006-07-04 | 2007-07-03 | 고체 촬상 장치 |
CN2007800253982A CN101485195B (zh) | 2006-07-04 | 2007-07-03 | 固体拍摄装置 |
EP07768080A EP2037674B1 (en) | 2006-07-04 | 2007-07-03 | Solid-state imaging device |
US12/307,173 US8482644B2 (en) | 2006-07-04 | 2007-07-03 | Solid-state imaging device |
PCT/JP2007/063306 WO2008004551A1 (fr) | 2006-07-04 | 2007-07-03 | dispositif d'imagerie à semi-conducteurs |
TW096124323A TWI424741B (zh) | 2006-07-04 | 2007-07-04 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006184514A JP4808557B2 (ja) | 2006-07-04 | 2006-07-04 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008017019A JP2008017019A (ja) | 2008-01-24 |
JP4808557B2 true JP4808557B2 (ja) | 2011-11-02 |
Family
ID=38894519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006184514A Active JP4808557B2 (ja) | 2006-07-04 | 2006-07-04 | 固体撮像装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8482644B2 (ja) |
EP (1) | EP2037674B1 (ja) |
JP (1) | JP4808557B2 (ja) |
KR (1) | KR101407807B1 (ja) |
CN (1) | CN101485195B (ja) |
TW (1) | TWI424741B (ja) |
WO (1) | WO2008004551A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5091695B2 (ja) * | 2008-01-24 | 2012-12-05 | 浜松ホトニクス株式会社 | 固体撮像装置 |
US7495228B1 (en) * | 2008-03-31 | 2009-02-24 | General Electric Company | Dual function detector device |
JP5058057B2 (ja) * | 2008-04-24 | 2012-10-24 | 浜松ホトニクス株式会社 | 医療用x線撮像システム |
JP5101402B2 (ja) | 2008-06-18 | 2012-12-19 | 浜松ホトニクス株式会社 | 固体撮像装置 |
JP5155759B2 (ja) * | 2008-07-17 | 2013-03-06 | 浜松ホトニクス株式会社 | 固体撮像装置 |
US8547458B2 (en) | 2009-02-04 | 2013-10-01 | Rosnes Corporation | Solid-state image pickup device |
US8576312B2 (en) * | 2009-02-04 | 2013-11-05 | Rosnes Corporation | Solid-state image pickup device with particular pixel arrangement |
JP2011242261A (ja) * | 2010-05-18 | 2011-12-01 | Fujifilm Corp | 放射線検出器 |
JP5582945B2 (ja) * | 2010-09-28 | 2014-09-03 | キヤノン株式会社 | 撮像システム |
JP6149369B2 (ja) * | 2012-09-27 | 2017-06-21 | 株式会社ニコン | 撮像素子 |
EP2738812B8 (en) | 2012-11-29 | 2018-07-18 | ams Sensors Belgium BVBA | A pixel array |
CN111479066B (zh) * | 2013-09-26 | 2022-11-18 | 株式会社尼康 | 摄像元件以及摄像装置 |
JP6530593B2 (ja) * | 2014-08-11 | 2019-06-12 | キヤノン株式会社 | 撮像装置及びその制御方法、記憶媒体 |
JP6218799B2 (ja) * | 2015-01-05 | 2017-10-25 | キヤノン株式会社 | 撮像素子及び撮像装置 |
JP6527035B2 (ja) | 2015-06-30 | 2019-06-05 | 浜松ホトニクス株式会社 | 固体撮像装置 |
WO2017052879A1 (en) | 2015-09-23 | 2017-03-30 | Exxonmobil Research And Engineering Company | Stabilization of bulk catalysts with organo-metalloxane framework |
CN115628808A (zh) | 2017-11-24 | 2023-01-20 | 浜松光子学株式会社 | 光子计数装置和光子计数方法 |
JP6849107B2 (ja) * | 2020-01-06 | 2021-03-24 | 株式会社ニコン | 撮像素子および撮像装置 |
Family Cites Families (19)
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JPH03187686A (ja) * | 1989-12-18 | 1991-08-15 | Shimadzu Corp | 撮像装置 |
US4996413A (en) * | 1990-02-27 | 1991-02-26 | General Electric Company | Apparatus and method for reading data from an image detector |
US6744912B2 (en) | 1996-11-29 | 2004-06-01 | Varian Medical Systems Technologies, Inc. | Multiple mode digital X-ray imaging system |
JP2001284562A (ja) * | 2000-03-30 | 2001-10-12 | Toshiba Corp | X線検出装置用アレイ基板およびその検査方法 |
US6510202B2 (en) | 2000-03-31 | 2003-01-21 | Canon Kabushiki Kaisha | Imaging apparatus, imaging method, and storage medium |
JP3945738B2 (ja) * | 2000-03-31 | 2007-07-18 | キヤノン株式会社 | 放射線撮像装置、撮像装置、放射線撮像方法及び記録媒体 |
JP2002076317A (ja) * | 2000-08-28 | 2002-03-15 | Canon Inc | 固体撮像装置および撮像システム |
US6750437B2 (en) | 2000-08-28 | 2004-06-15 | Canon Kabushiki Kaisha | Image pickup apparatus that suitably adjusts a focus |
US6759641B1 (en) | 2000-09-27 | 2004-07-06 | Rockwell Scientific Licensing, Llc | Imager with adjustable resolution |
JP4500434B2 (ja) * | 2000-11-28 | 2010-07-14 | キヤノン株式会社 | 撮像装置及び撮像システム、並びに撮像方法 |
AU2002349455A1 (en) | 2001-12-05 | 2003-06-17 | Hamamatsu Photonics K.K. | Light detection device, imaging device and distant image acquisition device |
KR101068326B1 (ko) * | 2003-01-22 | 2011-09-28 | 하마마츠 포토닉스 가부시키가이샤 | 광검출 장치 |
US7119341B2 (en) * | 2003-12-08 | 2006-10-10 | General Electric Company | Split scan line and combined data line x-ray detectors |
JP2005197379A (ja) * | 2004-01-06 | 2005-07-21 | Sony Corp | 固体撮像装置および信号処理回路 |
JP4307322B2 (ja) | 2004-05-18 | 2009-08-05 | キヤノン株式会社 | 放射線撮像装置及び放射線撮像システム |
JP2006068512A (ja) * | 2004-08-06 | 2006-03-16 | Canon Inc | 撮像装置、撮像システム、撮像方法、およびコンピュータプログラム |
JP2006121650A (ja) * | 2004-09-24 | 2006-05-11 | Fuji Photo Film Co Ltd | 固体撮像装置 |
JP2006238410A (ja) | 2005-01-31 | 2006-09-07 | Fuji Photo Film Co Ltd | 撮像装置 |
JP4750512B2 (ja) * | 2005-09-01 | 2011-08-17 | キヤノン株式会社 | 放射線撮像装置、その制御方法及び放射線撮像システム |
-
2006
- 2006-07-04 JP JP2006184514A patent/JP4808557B2/ja active Active
-
2007
- 2007-07-03 EP EP07768080A patent/EP2037674B1/en active Active
- 2007-07-03 US US12/307,173 patent/US8482644B2/en active Active
- 2007-07-03 WO PCT/JP2007/063306 patent/WO2008004551A1/ja active Application Filing
- 2007-07-03 KR KR1020087027608A patent/KR101407807B1/ko active IP Right Grant
- 2007-07-03 CN CN2007800253982A patent/CN101485195B/zh active Active
- 2007-07-04 TW TW096124323A patent/TWI424741B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20090295954A1 (en) | 2009-12-03 |
KR20090026133A (ko) | 2009-03-11 |
TW200818890A (en) | 2008-04-16 |
CN101485195A (zh) | 2009-07-15 |
EP2037674A4 (en) | 2009-10-28 |
US8482644B2 (en) | 2013-07-09 |
TWI424741B (zh) | 2014-01-21 |
EP2037674B1 (en) | 2011-10-26 |
EP2037674A1 (en) | 2009-03-18 |
KR101407807B1 (ko) | 2014-06-17 |
WO2008004551A1 (fr) | 2008-01-10 |
JP2008017019A (ja) | 2008-01-24 |
CN101485195B (zh) | 2011-10-19 |
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