JP5043360B2 - 所定のピン配列を有するメモリモジュール - Google Patents

所定のピン配列を有するメモリモジュール Download PDF

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Publication number
JP5043360B2
JP5043360B2 JP2006108504A JP2006108504A JP5043360B2 JP 5043360 B2 JP5043360 B2 JP 5043360B2 JP 2006108504 A JP2006108504 A JP 2006108504A JP 2006108504 A JP2006108504 A JP 2006108504A JP 5043360 B2 JP5043360 B2 JP 5043360B2
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JP
Japan
Prior art keywords
pins
pin
memory
ground
memory module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006108504A
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English (en)
Japanese (ja)
Other versions
JP2006303490A (ja
JP2006303490A5 (enExample
Inventor
イー． グッドウィン ジューン
シー． デイ マイケル
エム． ジョンソン ブライアン
エイ． ネール ジョン
エイ． シューマッハー リチャード
スミス ヴィッキー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2006303490A publication Critical patent/JP2006303490A/ja
Publication of JP2006303490A5 publication Critical patent/JP2006303490A5/ja
Application granted granted Critical
Publication of JP5043360B2 publication Critical patent/JP5043360B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
JP2006108504A 2005-04-18 2006-04-11 所定のピン配列を有するメモリモジュール Expired - Fee Related JP5043360B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/108,245 US7545651B2 (en) 2005-04-18 2005-04-18 Memory module with a predetermined arrangement of pins
US11/108,245 2005-04-18

Publications (3)

Publication Number Publication Date
JP2006303490A JP2006303490A (ja) 2006-11-02
JP2006303490A5 JP2006303490A5 (enExample) 2009-05-21
JP5043360B2 true JP5043360B2 (ja) 2012-10-10

Family

ID=37234201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006108504A Expired - Fee Related JP5043360B2 (ja) 2005-04-18 2006-04-11 所定のピン配列を有するメモリモジュール

Country Status (2)

Country Link
US (1) US7545651B2 (enExample)
JP (1) JP5043360B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103163974A (zh) * 2011-12-09 2013-06-19 鸿富锦精密工业（深圳）有限公司 固态硬盘组合
CN103163987A (zh) * 2011-12-15 2013-06-19 鸿富锦精密工业（深圳）有限公司 固态硬盘组合
CN103186178A (zh) * 2011-12-29 2013-07-03 鸿富锦精密工业（深圳）有限公司 主板
US9357649B2 (en) 2012-05-08 2016-05-31 Inernational Business Machines Corporation 276-pin buffered memory card with enhanced memory system interconnect
US9519315B2 (en) 2013-03-12 2016-12-13 International Business Machines Corporation 276-pin buffered memory card with enhanced memory system interconnect
CN104424150A (zh) * 2013-08-28 2015-03-18 鸿富锦精密电子(天津)有限公司 存储扩展系统
KR20220169545A (ko) * 2021-06-21 2022-12-28 삼성전자주식회사 인쇄 회로 기판 및 메모리 모듈

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012389A (en) * 1988-12-14 1991-04-30 Hand Held Products, Inc. Board wiring pattern for a high density memory module
KR940016243A (ko) * 1992-12-26 1994-07-22 김광호 싱글 인 라인 메모리 모듈(simm; single in line memory module)
US5513135A (en) * 1994-12-02 1996-04-30 International Business Machines Corporation Synchronous memory packaged in single/dual in-line memory module and method of fabrication
US6711666B1 (en) * 1995-11-29 2004-03-23 Zf Micro Solutions, Inc. IBM PC compatible multi-chip module
JP3718008B2 (ja) * 1996-02-26 2005-11-16 株式会社日立製作所 メモリモジュールおよびその製造方法
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
US5870325A (en) * 1998-04-14 1999-02-09 Silicon Graphics, Inc. Memory system with multiple addressing and control busses
US6097619A (en) * 1998-06-19 2000-08-01 Compaq Computer Corp. Symmetric memory board
US6061263A (en) * 1998-12-29 2000-05-09 Intel Corporation Small outline rambus in-line memory module
US6502161B1 (en) * 2000-01-05 2002-12-31 Rambus Inc. Memory system including a point-to-point linked memory subsystem
JP2001274323A (ja) * 2000-03-24 2001-10-05 Hitachi Ltd 半導体装置とそれを搭載した半導体モジュール、および半導体装置の製造方法
US6625687B1 (en) * 2000-09-18 2003-09-23 Intel Corporation Memory module employing a junction circuit for point-to-point connection isolation, voltage translation, data synchronization, and multiplexing/demultiplexing
US6658530B1 (en) * 2000-10-12 2003-12-02 Sun Microsystems, Inc. High-performance memory module
KR100454123B1 (ko) * 2001-12-06 2004-10-26 삼성전자주식회사 반도체 집적 회로 장치 및 그것을 구비한 모듈
US6956387B2 (en) * 2003-08-15 2005-10-18 Intel Corporation Socket connection test modules and methods of using the same
US7224595B2 (en) * 2004-07-30 2007-05-29 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance

Also Published As

Publication number Publication date
US20060245119A1 (en) 2006-11-02
JP2006303490A (ja) 2006-11-02
US7545651B2 (en) 2009-06-09

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