JP5026580B2 - Cover glass integrated sensor - Google Patents

Description

  The present invention relates to a cover glass integrated sensor in which a capacitive film sensor is bonded to the back surface of a cover glass attached to a liquid crystal display unit of an electronic device.

  Usually, PDAs, handheld terminals and other portable information terminals, copy machines, facsimile and other office automation equipment, smartphones, mobile phones, portable game devices, electronic dictionaries, car navigation systems, small PCs, digital cameras, video cameras, portable MDs (PMD) A cover glass is attached to a liquid crystal display window of an electronic device or the like to protect it. Conventionally, this cover glass has a black frame-shaped light shielding layer formed on the peripheral edge of the back surface of a transparent glass substrate.

  In addition, touch panels are often used in the electronic devices described above, and the recent trend is to enlarge or reduce the image by tapping, flipping, and picking the screen with the fingertips compared to the current mainstream resistive film method. Due to its excellent multi-touch function, visibility, and durability, there is a great need for a capacitive method. In particular, since there is a demand for thinning the sensor part of the capacitive touch panel, a capacitive film sensor 103 as disclosed in Patent Document 1 is used and bonded to the back surface of the cover glass 102. The market for the bar glass integrated sensor 101 (see FIG. 6) is expected to expand.

JP 2009-70191 A

  However, since the frame-shaped light-shielding layer 105 of the cover glass 102 is formed by screen printing using a light-shielding ink such as black on the periphery of the back surface of the transparent glass substrate 104, the frame-shaped light shielding layer formed by this method is used. Layer 105 has very poor inner edge linearity. Therefore, there is a problem that the outline of the display screen viewed through the cover glass 102 looks blurred (see FIG. 7).

  In addition, the frame-shaped light shielding layer of the cover glass formed by screen printing has to be overprinted by about three layers of the printed film in order to obtain light shielding properties. A big step is generated between them. Because of this step, bubbles (bubbles) are likely to be generated when the film sensor is attached to the back of the cover glass with a transparent adhesive, and the generated bubbles can be moved to the outside by pressing to slide. It is difficult to remove, resulting in poor visibility of the display screen.

  In order to solve this problem, it was considered that the inner edge of the black mask surrounding the display screen in the display device is positioned closer to the center side than the inner edge of the frame-shaped light shielding layer of the cover glass. Is located behind the polarizing plate and the upper glass substrate, and there is a large depth difference between the exposed part of the black mask and the frame-shaped light shielding layer of the cover glass, so that the part surrounding the display screen has no sense of unity in appearance. Another problem arises.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and the display screen viewed through the cover glass has a sharp outline, excellent visibility, and a cover having an appearance and a sense of unity around the display screen. The object is to provide a glass integrated sensor.

According to the first aspect of the present invention, a cover glass for an electronic device display window in which a first frame-shaped light-shielding layer made of a screen printing film is formed on the peripheral edge of the back surface of a transparent glass substrate;
A cover glass integrated sensor comprising a capacitive film sensor bonded to the back surface of the cover glass,
The film sensor is
A transparent substrate sheet;
A transparent conductive film formed on both surfaces of the base sheet so as to have an electrode pattern of a central window part and a thin line drawing circuit pattern of an outer frame part, and the thin line on the thin line drawing circuit pattern of the transparent conductive film, respectively. A light-shielding conductive film laminated with the same width as the routing circuit pattern;
A rust preventive functional layer laminated on both surfaces of the base sheet on which the transparent conductive film and the light-shielding conductive film are formed, so as to cover the outer frame part other than the terminal part,
A second frame-shaped light-shielding layer made of an exposed developer of a color resist material, formed on a peripheral surface of the base sheet on which the transparent conductive film, the light-shielding conductive film and the rust preventive functional layer are formed;
With
Furthermore, the inner edge of the second frame-shaped light-shielding layer is located closer to the center than the inner edge of the first frame-shaped light-shielding layer.
A cover glass integrated sensor is provided.

  According to the 2nd aspect of this invention, the distance between the back surface of the said glass substrate and said 2nd frame-shaped light shielding layer is 10 micrometers-100 micrometers, The cover glass integrated sensor of a 1st aspect is provided.

  According to the third aspect of the present invention, the color in the vicinity of the inner edge of the first frame-shaped light-shielding layer and the color of the second frame-shaped light-shielding layer are the same color or similar colors. An embodiment of the integrated cover glass sensor is provided.

According to the fourth aspect of the present invention, the CIE (International Commission on Illumination) 1976 (JIS Z8729) L color between the color in the vicinity of the inner edge of the first frame-shaped light shielding layer and the color of the second frame-shaped light shielding layer. ^{* A *} b ^* The cover glass integrated sensor according to the third aspect, in which the color difference ΔE in the color system is 10 or less.

  According to a fifth aspect of the present invention, there is provided the cover glass integrated sensor according to the first to fourth aspects, wherein the color of the second frame-shaped light shielding layer is black or white.

  According to the sixth aspect of the present invention, the first frame-shaped light shielding layer has a thickness of 7 μm to 30 μm, and the second frame-shaped light shielding layer has a thickness of 2 μm to 25 μm. Provide a glass integrated sensor.

  According to the seventh aspect of the present invention, the difference between the inner edge dimension of the second frame-shaped light shielding layer and the inner edge dimension of the first frame-shaped light shielding layer is 0.1 mm to 0.3 mm. The cover glass integrated sensor according to any one of the first to sixth aspects is provided.

  The cover glass integrated sensor of the present invention is formed so that the film sensor has a transparent base sheet and an electrode pattern of the central window part and a thin line drawing circuit pattern of the outer frame part on both sides of the base sheet. On each of the transparent conductive film and the thin conductive circuit pattern of the transparent conductive film, a light shielding conductive film laminated with the same width as the thin conductive circuit pattern, the transparent conductive film, and the light shielding conductive film were formed. The rust preventive functional layer laminated on both surfaces of the base sheet so as to cover the outer frame portion other than the terminal portion, and the transparent conductive film, the light shielding conductive film, and the rust preventive functional layer are formed. A second frame-shaped light-shielding layer made of an exposure developer of a color resist material, formed on the peripheral edge of the surface of the base sheet, and the inner edge of the second frame-shaped light-shielding layer Than the inner edge of the frame-shaped light shielding layer of the cover glass (the first frame-shaped light shielding layer) is positioned on the center side. Therefore, since the second frame-shaped light-shielding layer has very good linearity at the inner edge made of the color resist material exposed developer, the outline of the display screen seen through the cover glass looks sharp.

  In addition, since the film sensor includes the second frame-shaped light-shielding layer, light is shielded by a laminated structure of the second frame-shaped light-shielding layer and the first frame-shaped light shielding layer of the cover glass formed by screen printing. Sex can be obtained. That is, the first frame-shaped light-shielding layer may be thinner than the conventional one, and the level difference between the back surface peripheral edge portion and the back surface center portion of the glass substrate can be suppressed small. Therefore, when the film sensor is bonded to the back surface of the cover glass with a transparent adhesive, bubbles (bubbles) are not easily generated, and even if they are generated, they are moved to the outside by pressing to slide the bubbles and removed. As a result, the visibility of the display screen is excellent.

  In addition, since the film sensor includes the second frame-shaped light shielding layer, there is almost no difference in depth between the exposed portion of the second frame-shaped light shielding layer and the first frame-shaped light shielding layer of the cover glass. A sense of unity in appearance can be obtained at the part surrounding the screen.

It is an exploded sectional view showing one example of a cover glass integrated sensor concerning the present invention. It is a top view which shows one Example of the cover glass integrated sensor which concerns on this invention. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is sectional drawing which shows the process of manufacturing the film sensor shown in FIG. It is a figure explaining the electrode pattern and thin wire drawing circuit pattern of a capacitive film sensor. It is a top view explaining an example of the shape and arrangement | positioning aspect of the electrode pattern formed in the center window part of a film sensor. It is an exploded sectional view showing an example of a conventional cover glass integrated sensor. It is a top view which shows an example of the cover glass integrated sensor of a prior art.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

    Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is an exploded cross-sectional view showing an embodiment of the cover glass integrated sensor according to the present invention, and FIG. 2 is a plan view showing an embodiment of the cover glass integrated sensor according to the present invention. In the figure, 1 is a cover glass integrated sensor, 2 is a cover glass, 3 is a film sensor 4 is a glass substrate, 5 is a first frame-shaped light shielding layer, 6 is a base sheet, 7 is a central window portion, and 8 is an outer frame. Part, 9 is a transparent conductive film, 10 is an electrode pattern, 11 is a thin line drawing circuit pattern, 12 is a light-shielding conductive film, 13 is a terminal part, 14 is a rust prevention functional layer, and 15 is a second frame-shaped light shielding layer. Show.

  As shown in FIG. 1, the cover glass integrated sensor 1 of the present invention is an electronic device display window in which a first frame-shaped light-shielding layer 5 made of a screen printing film is formed on the back peripheral edge of a transparent glass substrate 4. The cover glass integrated sensor includes a cover glass 2 and a capacitive film sensor 3 bonded to the back surface of the cover glass 2.

  The cover glass 2 of the electronic device display window is arranged on a display device of an electronic device (not shown) to protect it.

  As the glass substrate 4 of the cover glass 2, for example, a transparent glass plate made of colorless and transparent soda lime silicate glass, aluminosilicate glass, lithium aluminosilicate glass, quartz glass, alkali-free glass, and other various glasses can be used. . The thickness of the glass substrate 4 is preferably 0.3 to 0.7 mm, and more preferably 0.4 to 0.55 mm. When the thickness of the glass substrate 4 is within this range, it is preferable because the obtained cover glass 2 of the present invention has an excellent balance of strength, thickness and weight. Further, the glass substrate 4 is not particularly required to be a flat one, and a curved glass substrate may be used. Further, an antireflection film may be provided as a countermeasure against reflection on the glass surface due to reflection. Further, a hard coat film may be provided in order to improve wear resistance.

  The first frame-shaped light shielding layer 5 of the cover glass 2 is made of polyvinyl resin, polyamide resin, polyester resin, polyacryl resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, alkyd resin, or the like. It is preferable to use a colored ink containing the above resin as a binder and containing an appropriate color pigment or dye as a colorant.

  The film sensor 3 of the present invention has a transparent base sheet 6 and transparent electrodes formed on both sides of the base sheet 6 so as to have the electrode pattern 10 of the central window portion 7 and the thin line drawing circuit pattern 11 of the outer frame portion 8 respectively. A light-shielding conductive film 12, a transparent conductive film 9, and a light-shielding conductive film 12 are formed on the conductive film 9 and the thin conductive circuit pattern 11 of the transparent conductive film 9. A rust preventive functional layer 14, a transparent conductive film 9, a light-shielding conductive film 12, and a rust preventive functional layer 14 laminated on both surfaces of the base sheet 6 so as to cover the outer frame portion 8 other than the terminal portion 13, respectively. A second frame-shaped light shielding layer 15 made of an exposure developer of a color resist material is provided on the peripheral edge of the surface of the formed substrate sheet 6, and the inner edge of the second frame-shaped light shielding layer 15 is the first The inner edge of the frame-shaped shading layer 5 Even those that are located closer to the center.

  Here, the electrode pattern 10 formed on the central window portion 7 of the film sensor 3 will be supplementarily described. The electrode pattern 10 has different patterns on the front and back sides. For example, as shown in FIG. 5, on the back surface of the base sheet 6, a rhombus electrode 46 having a rhombus shape in plan view, and a connection wiring 469 penetrating a plurality of rhombus electrodes 46 in the vertical direction (Y direction) in the figure. And. The plurality of rhombus electrodes 46 and the connection wiring 469 are electrically connected to each other. Further, such a connection wiring 469 and a plurality of rhombus electrodes 46 penetrating therethrough are taken as a set, and the set is repeatedly arranged in the horizontal direction (X direction) in the drawing. On the other hand, in the same manner, a plurality of rhombus electrodes 47 and connection wirings 479 penetrating them are provided on the surface of the base sheet 6. However, in this case, the extending direction of the connection wiring 479 is different from that of the connection wiring 469 in the horizontal direction (X direction) in the drawing. Along with this, the direction in which a set of the connection wiring 479 and the plurality of rhombus electrodes 47 penetrating the connection wiring 479 is repeatedly arranged is the vertical direction (Y direction) in the drawing. As is apparent from FIG. 5, the rhombus electrode 46 is disposed so as to fill the gaps between the plurality of connection wirings 479, while the rhombus electrode 47 is disposed so as to fill the gaps between the plurality of connection wirings 469. Is done. Further, in FIG. 5, the positional relationship between the diamond electrode 46 and the diamond electrode 47 is complementary. That is, the plurality of rhombus electrodes 47 are arranged so as to fill in the rhombus-shaped gaps that occur when the rhombus electrodes 46 are arranged in a matrix.

  As described above, the X direction electrode and the Y direction electrode are arranged so as to form a lattice in plan view, so that if a user's finger or the like touches any position on the lattice via the cover glass 2 ( For example, a capacitor is formed between the finger and the X-direction electrode touched by the finger or the like, and a capacitor is formed between the finger or the Y-direction electrode touched by the finger or the like. . By forming this capacitor, the capacitance of the X direction electrode and the Y direction electrode increases. The position detector of the external circuit detects the amount of change in capacitance that occurs in such a case, or even the X-direction electrode and Y-direction electrode having the maximum capacitance, and touches anywhere in the central window portion 7. Can be acquired as a set of an X coordinate value and a Y coordinate value as a specific value.

  A method for obtaining the film sensor 3 having the above configuration will be described in detail below.

<Patterning of transparent conductive film 9>
First, transparent conductive films 9 and 9, light-shielding conductive films 12 and 12, and first photoresist layers 16 and 16 were sequentially formed on the front and back surfaces of the transparent substrate sheet 6 to obtain a conductive sheet (FIG. 3 (a)), a mask 17 having a desired pattern is placed on each of the front and back sides, and the first photoresist layer 16 is patterned by exposure (see FIG. 3 (b)) and development. Note that the position of the mask 17 shown in FIG. 3B is the case where the first photoresist layer 16 is a negative type (when exposed, the solubility in the developer is lowered and the exposed portion remains after development). Show. In the case of the positive type (when exposed, the solubility in the developer increases and the exposed portion is removed), the portion shielded from light by the mask is reversed.

  Examples of the base sheet 6 include plastic films such as polyester resins, polystyrene resins, olefin resins, polybutylene terephthalate resins, polycarbonate resins, and acrylic resins.

  The transparent conductive film 9 may be a layer made of a metal oxide such as indium tin oxide or zinc oxide, and may be formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method, or the like. Further, the transparent conductive film 9 is formed with a thickness of about several tens to several hundreds nm, and is easily etched together with the light-shielding conductive film 12 in a solution such as ferric chloride, but hydrogen peroxide in an acidic atmosphere. It is necessary that the etching solution for the light-shielding conductive film 12 such as water is not easily etched. And it is preferable to show a light transmittance of 80% or more and a surface resistance value of several mΩ to several hundred Ω.

  Examples of the light-shielding conductive film 12 include a single metal film having high conductivity and good light-shielding properties, and a layer made of an alloy or a compound thereof, such as a vacuum deposition method, a sputtering method, an ion plating method, and a plating method. It is good to form with. Further, the light-shielding conductive film 12 needs to have an etchant that is not etched by the transparent conductive film 9 but the light-shielding conductive film 12 itself is etched. Examples of the preferable metal include aluminum, nickel, copper, silver, and tin. In particular, a metal film made of copper foil with a thickness of 20 to 1000 nm is very preferable because it is excellent in conductivity and light shielding properties, and the transparent conductive film can be easily etched with hydrogen peroxide even in an acidic atmosphere where etching is not performed. More preferably, the thickness is 30 nm or more. More preferably, it is good to set it as 100-500 nm. This is because a highly conductive light-shielding conductive film 12 can be obtained by setting the thickness to 100 nm or more, and a light-shielding conductive film 12 that is easy to handle and excellent in workability can be obtained by setting the thickness to 500 nm or less.

  The first photoresist layer 16 is made of an acrylic photoresist material having a thickness of 10 to 20 [mu] m that can be exposed to a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a laser beam or a metal halide lamp and developed with an alkaline solution or the like. The first photoresist layer 16 may be formed by a general printing method such as gravure, screen, and offset, as well as by various coater methods, coating and dipping methods, and various methods such as a dry film resist method. Although patterning may be performed by exposure and development, the dry film resist method is more preferable.

  A dry film resist (DFR) used in the dry film resist method is a film in which a photosensitive layer serving as each photoresist layer described above is sandwiched by a base film and a cover film. The above printing method, coating method, painting method, etc. have problems such as only one side coating and poor efficiency, whereas the dry film resist method bonds the photosensitive layer with a heating roll after peeling the cover film. This method is mainstream because it is highly productive and can meet various requirements. The exposure is usually performed by placing a mask on the base film (not shown), and development is performed after the base film is peeled off. As the base film of the dry film resist, a film made of polyethylene terephthalate or the like can be used. Moreover, what consists of polyethylene etc. can be used as a cover film of a dry film resist.

  Incidentally, the base sheet 6 made of a plastic film has a problem of elongation. Therefore, the patterning of the first photoresist layer 16 on both sides of the conductive sheet is preferably performed by double-sided simultaneous exposure as in the present invention. This is because when the patterning of the first photoresist layer 16 is performed by exposing one side at a time, the patterning on one side is finished, and the base sheet 6 is stretched when the conductive sheet is replaced with the front and back sides of the exposure apparatus. This is because the pattern on the front surface and the pattern on the back surface will be misaligned. In the case of the example shown in FIG. 5, the arrangement relationship between the rhombus electrode 46 and the rhombus electrode 47 is complementary. Therefore, if the front surface pattern and the back surface pattern are misaligned, the film sensor 3 does not function correctly.

  In the present invention, since the light-shielding conductive film 12 blocks the exposure light beam 32 on the opposite surface during exposure, the pattern of the first photoresist layer 16 on the opposite side is affected even if exposure is performed simultaneously with a different mask pattern. Does not affect. Therefore, since both sides can be exposed simultaneously, the front and back of the first photoresist layer 16 can be easily aligned, and both sides can be patterned in a single process, and the productivity is improved.

  In addition, the well-known mask alignment method of a double-sided exposure apparatus can be used for alignment of a front mask and a back mask. For example, a mask alignment mark is formed on each of the front mask and the back mask, and an optical reading sensor such as a camera reads the overlapping state of the pair of mask alignment marks, thereby relative to the front mask and the back mask. Get location information. Then, based on the obtained position information, the mask position adjusting mechanism relatively moves the front mask and the back mask so that the pair of mask alignment marks overlap with each other. For example, a method of aligning the back mask.

  Next, the transparent conductive films 9 and 9 and the light-shielding conductive films 12 and 12 are simultaneously etched with an etching solution such as ferric chloride, so that the patterned first photoresist layers 16 and 16 are not stacked. By removing the transparent conductive films 9 and 9 and the light-shielding conductive films 12 and 12, the transparent conductive films 9 and 9 and the light-shielding conductive films 12 and 12 are laminated without misalignment in the central window portions 7 on both sides of the base sheet, respectively. The formed electrode pattern 10 is formed, and the thin line drawing circuit pattern 11 in which the transparent conductive films 9 and 9 and the light-shielding conductive films 12 and 12 are laminated without misalignment is formed on the outer frame portions 8 on both sides of the base sheet. (See FIG. 3C).

<Removal of unnecessary light-shielding conductive film 12>
Next, the first photoresist layers 16 and 16 are stripped with a resist stripping solution to expose the light-shielding conductive films 12 and 12, and then second photoresist layers 18 and 18 are formed on both surfaces (FIG. 3). (See (d)). Thereafter, masks 19 and 19 are placed, exposed (see FIG. 3E) and developed to pattern the second photoresist layer 18 (see FIG. 3F). Note that the position of the mask 19 shown in FIG. 3 (e) is the case where the second photoresist layer 18 is a negative type (when exposed, the solubility with respect to the developer decreases, and the exposed portion remains after development). Show. Further, the material and the formation method of the second photoresist layer 18 can be the same material and the formation method as the first photoresist layer 16.

  Next, by etching with a special etching solution such as acidified hydrogen peroxide and removing only the light-shielding conductive films 12 and 12 where the patterned second photoresist layers 18 and 18 are not stacked, The transparent conductive films 9 and 9 are exposed at the central window portion 7 on both sides of the base sheet and the terminal portion 25 in the outer frame portion 8 (see FIGS. 3G and 4). In FIG. 4, the thin line drawing circuit pattern 11 formed on the surface of the substrate 6 is drawn with the laminated portion of the light-shielding conductive film 12 in black and the exposed portion of the transparent conductive film 9 in white, and both ends of the black portion. Coincides with the boundary with the central window portion 7 and the boundary 2 with the terminal portion 13. As is clear from FIG. 4, the light-shielding conductive film 12 is laminated on the fine line routing circuit pattern 11 with the same width as that of the fine line routing circuit pattern 11. The frame-shaped light shielding layer 15 cannot be substituted.

  If the transparent conductive film 9 is an amorphous material, it is preferably crystallized by a method such as heat treatment before the etching. This is because the etching resistance is improved by crystallization, and only the light-shielding metal film 12 can be easily etched selectively.

<Formation of rust prevention functional layer 14>
Next, the second photoresist layers 18 and 18 are stripped with a resist stripping solution, and the light-shielding conductive films 12 and 12 laminated with the same width as the thin line-drawing circuit pattern 11 are exposed on the thin-line drawing circuit pattern 11. Then, third photoresist layers 28 and 28 having rust prevention properties were formed on the entire surface (see FIG. 3H). Thereafter, masks 29 and 29 are placed, exposed (see FIG. 3 (i)) and developed to pattern the third photoresist layers 28 and 28, which are used as the rust prevention functional layers 14 and 14 (FIG. 3 (j )reference). Note that the position of the mask 29 shown in FIG. 3 (i) is the case where the third photoresist layer 28 is a negative type (when exposed, the solubility in the developer is lowered and the exposed portion remains after development). Show.

  As the third photoresist layer 28 having rust prevention property, the same photoresist material as that of the first photoresist layer 16 with a rust inhibitor added thereto is used, or the above-described photoresist material makes the rust prevention property. A good one should be used. Further, the method for forming the third photoresist layer 28 can be the same as the method for forming the first photoresist layer 16. As the rust preventive agent, a material that is already used as a rust preventive agent is used. As specific examples, for example, imidazole, triazole, benzotriazole, benzimidazole, benzthiazole, pyrazole and the like may be used. In addition, monocyclic or polycyclic azoles such as halogen, alkyl, and phenyl-substituted products, aromatic amines such as aniline, aliphatic amines such as alkylamine, salts thereof, and the like. There is no need to be limited to the materials described herein.

  Since the anticorrosive functional layer 14 is formed in this way, even if corrosive liquid from the outside enters, or even under an environmental test such as high temperature and high humidity, the routing circuit does not proceed with corrosion, and the electrical characteristics Can be maintained.

<Formation of the second frame-shaped light shielding layer 15>
Finally, a fourth photoresist layer 30 made of a color resist material was formed on the entire surface only (see FIG. 3 (k)). Thereafter, masks 31 and 31 are placed, exposed (see FIG. 3 (l)) and developed to pattern the fourth photoresist layer 30, which is used as the second frame-shaped light shielding layer 15 (FIG. 3 (m)). reference). The position of the mask 31 shown in FIG. 3 (l) is the case where the fourth photoresist layer 30 is a negative type (when exposed, the solubility in the developing solution is reduced and the exposed portion remains after development). Show.

  Since the second frame-shaped light shielding layer 15 is formed by a photo process as shown in FIGS. 3K to 3M, the linearity of the inner edge is very good. In the present invention, the inner edge of the second frame-shaped light-shielding layer 15 is configured to be located closer to the center than the inner edge of the first frame-shaped light-shielding layer 5 of the cover glass 2 formed by screen printing. Therefore, the effect that the outline of the display screen viewed through the cover glass 2 looks sharp can be obtained. The difference between the inner edge dimension of the second frame-shaped light shielding layer 15 and the inner edge dimension of the first frame-shaped light shielding layer 5 is preferably 0.1 mm to 0.3 mm. If it is less than 0.1 mm, there may be a side where the second frame-shaped light shielding layer 15 is not exposed due to a printing error or a bonding error of the first frame-shaped light shielding layer 5, and if it exceeds 0.3 mm, the frame is narrowed. Becomes difficult.

  The color resist material used for the fourth photoresist layer 30 can be the same as the resists such as RGB and black matrix constituting the color filter for liquid crystal display. Further, the fourth photoresist layer 30 can be formed in the same manner as the first photoresist layer 16.

  Here, instead of the second frame-shaped light shielding layer 15 by the photo process using the color resist material, the reason for not forming the first frame-shaped light shielding layer 5 of the cover glass 2 by the photo process using the color resist material. explain. Certainly, if the first frame-shaped light-shielding layer 5 of the cover glass 2 is formed by a photo process using a color resist material, it is also possible to obtain linearity at the inner edge of the first frame-shaped light-shielding layer 5. Let's go. However, when the photo process is performed on the cover glass 2, the application, exposure, and development of the color resist material must be performed on a sheet-by-sheet basis of the glass substrate 4. Even if a large glass substrate 4 is used, the size of the glass substrate 4 is limited, and as the size increases, the weight increases and handling becomes difficult. There is also a problem that a coating machine, an exposure machine, and a developing machine suitable for the large-sized glass substrate 4 are required. This is not suitable for mass production and leads to cost increase. On the other hand, when the photo sensor is performed in the film sensor 3 as in the present invention, the second frame-shaped light shielding layer 15 can be obtained at a relatively high speed by roll-to-roll.

When the color of the second frame-shaped light shielding layer 15 is the same color or similar to the color near the inner edge of the first frame-shaped light shielding layer 5 of the cover glass 2, the first frame-shaped light shielding layer 5 is exposed. The boundary between the portion, the laminated portion of the first frame-shaped light-shielding layer 5 and the second frame-shaped light-shielding layer 15 is inconspicuous, and an effect that it looks assimilated is obtained. Preferably, the L ^* a ^* b ^* color of the CIE (International Commission on Illumination) 1976 (JIS Z8729) between the color in the vicinity of the inner edge of the first frame-shaped light shielding layer 5 and the color of the second frame-shaped light shielding layer 15 The color difference ΔE in the system is preferably 10 or less.

  Further, when the color of the second frame-shaped light shielding layer 15 is black or white, an effect of increasing the contrast of the display screen can be obtained. Also,

  Moreover, it is more preferable that the distance between the back surface of the glass substrate 4 and the 2nd frame-shaped light shielding layer 15 is 10 micrometers-100 micrometers. If it is less than 10 μm, the thickness of the transparent pressure-sensitive adhesive layer becomes thin and the adhesion between the film sensor and the cover glass becomes low, and if it exceeds 100 μm, the external sense of unity surrounding the display screen becomes low.

  More preferably, the thickness of the first frame-shaped light shielding layer 5 is 7 μm to 30 μm, and the thickness of the second frame-shaped light shielding layer 15 is 2 μm to 25 μm. In any case, when the upper limit is exceeded, the level difference between the non-formed part becomes large and bubbles (bubbles) are likely to be generated when pasting. Further, if both of them do not satisfy the lower limit value, it is difficult to obtain a light-shielding property even by a laminated structure, and film production becomes difficult.

  Although one embodiment of the cover glass integrated sensor has been described above, the present invention is not limited to this. For example, the base sheet 6 is not limited to the one constituted by a single plastic film as illustrated, and a plurality of plastic films may be stacked to form a laminate as the base sheet 6. In this case, as a plastic film laminating means, thermal lamination, dry lamination via an adhesive layer, or the like can be used. When a plastic film is laminated with an adhesive layer, the thickness of the entire laminate can be adjusted by using an adhesive layer having a core material. The plastic film may be laminated at any timing after the transparent conductive film 9 is formed on the plastic film, after the light-shielding conductive film 12 is laminated, or after the first photoresist layer 16 is laminated.

  Further, when removing the unnecessary light-shielding conductive film 12, not only the part of the light-shielding conductive film 12 where the second photoresist layer 18 is not laminated is removed, but further etching is performed, that is, side etching is performed. By doing so, both ends of the laminated portion (black portion in FIG. 4) of the light-shielding conductive film 12 may be set back from the boundary with the central window portion 7 and the boundary 2 with the terminal portion 13. In this case, both ends of the light-shielding conductive film 12 can be protected by the rust prevention functional layer 14 laminated so as to cover the outer frame portion 8 in a later step.

Example 1
A colorless polyester film having a thickness of 200 μm unwound from a roll is used as a base sheet, a transparent conductive film is formed with a thickness of 200 nm by sputtering made of indium tin oxide, and a copper film is formed thereon as a light-shielding conductive film Was formed by sputtering to a thickness of 500 nm to prepare a conductive film. Then, after laminating a set of conductive films using a transparent adhesive to obtain a laminate in which a transparent conductive film and a light-shielding conductive film are laminated on both sides, a negative type that can be developed with a 1% sodium carbonate solution. A first photoresist layer having a thickness of 10 nm is formed on both surfaces of the laminate, and a mask having an X-direction electrode pattern is placed on the front side. On the back side, a mask having an electrode pattern in the Y direction was placed, and both front and back surfaces were exposed simultaneously by a metal halide lamp, and developed by being immersed in a 1% sodium carbonate solution.

  Next, the portion of the indium tin oxide film and the copper film where the patterned first photoresist layer is not laminated is simultaneously etched away with an etching solution of ferric chloride. Is an electrode pattern in the X direction, and a Y direction electrode pattern is exposed on the back side, and a thin line drawing pattern with an average line width of 20 μm is exposed on both the front and back surfaces on the outer frame surrounding the central window. It had been.

  Next, after peeling off the first photoresist layer, a dry film resist that can be developed with a 1% sodium carbonate solution and has a negative type acrylic photosensitive layer is used, and a second photoresist layer having a thickness of 10 nm is formed on both surfaces. Then, a mask was placed on the outer frame portion excluding the front and back terminal portions, and both the front and back surfaces were exposed simultaneously by a metal halide lamp, and developed by being immersed in a 1% sodium carbonate solution.

  Next, the exposed copper film in the central window that was exposed when immersed in hydrogen peroxide in an acidic atmosphere was etched away, leaving only the indium tin oxide film formed therebelow.

  Next, after peeling off the second photoresist layer, using a dry film resist provided with a negative acrylic photosensitive layer that can be developed with sodium carbonate 1% solution and benzoimidar is added as a rust preventive agent, A third photoresist layer having a thickness of 10 nm is formed on both surfaces, and a mask is placed on the outer frame portion excluding the terminal portion, and both the front and back surfaces are exposed simultaneously by a metal halide lamp, and immersed in 1% sodium carbonate solution. The remaining third photoresist layer was used as a rust prevention functional layer.

  Next, a fourth photoresist layer having a thickness of 5 μm is formed on the entire surface using a dry film resist that can be developed with a 1% sodium carbonate solution and has a negative acrylic photosensitive layer made of a black color resist material. Then, a mask is placed thereon, only the surface is exposed by a metal halide lamp, developed by being immersed in a 1% sodium carbonate solution, and the remaining black fourth photoresist layer is used as a second frame-shaped light shielding layer, Next, one film sensor was cut.

  Meanwhile, a cover glass was obtained by forming a first frame-shaped light-shielding layer having a thickness of 7 μm by screen printing using black ink on the peripheral edge of the back surface of a glass substrate made of borosilicate glass having a thickness of 0.7 mm. . Finally, the previous film sensor was bonded with a transparent adhesive on the back surface of the cover glass to form a cover glass integrated sensor. In this cover glass integrated sensor, the inner edge of the second frame-shaped light-shielding layer is located at the center side by 0.1 mm from the inner edge of the first frame-shaped light-shielding layer. The distance from the frame-shaped light shielding layer was 25 μm. The cover glass integrated sensor has a sharp outline of the display screen viewed through the cover glass, is excellent in visibility, and has a sense of unity in appearance at a portion surrounding the display screen.

  The present invention relates to PDAs, handheld terminals and other portable information terminals, copiers, OA devices such as facsimiles, smartphones, mobile phones, portable game devices, electronic dictionaries, car navigation systems, small PCs, digital cameras, video cameras, portable MDs (PMDs). This is an invention of a cover glass integrated sensor attached to a liquid crystal display part of an electronic device such as

DESCRIPTION OF SYMBOLS 1 Cover glass integrated sensor 2 Cover glass 3 Film sensor 4 Glass substrate 5 1st frame-shaped light shielding layer 6 Transparent base sheet 7 Central window part 8 Outer frame part 9 Transparent electrically conductive film 10 Electrode pattern 11 Thin wire drawing circuit pattern 12 Light shielding Conductive film 13 terminal portion 14 rust prevention functional layer 15 second frame-shaped light shielding layer 16 first photoresist layer 17 mask 18 second photoresist layer 19 mask 28 third photoresist layer 29 mask 30 fourth photoresist layer 31 Mask 32 Exposure beam 46, 47 Diamond electrode 469.479 Connection wiring

Claims (7)

A cover glass for an electronic device display window in which a first frame-shaped light-shielding layer made of a screen printing film is formed on the periphery of the back surface of a transparent glass substrate;
A cover glass integrated sensor comprising a capacitive film sensor bonded to the back surface of the cover glass,
The film sensor is
A transparent substrate sheet;
A transparent conductive film formed on both surfaces of the base sheet so as to have an electrode pattern of a central window part and a thin line drawing circuit pattern of an outer frame part, and the thin line on the thin line drawing circuit pattern of the transparent conductive film, respectively. A light-shielding conductive film laminated with the same width as the routing circuit pattern;
A rust preventive functional layer laminated on both surfaces of the base sheet on which the transparent conductive film and the light-shielding conductive film are formed, so as to cover the outer frame part other than the terminal part,
A second frame-shaped light-shielding layer made of an exposed developer of a color resist material, formed on a peripheral surface of the base sheet on which the transparent conductive film, the light-shielding conductive film and the rust preventive functional layer are formed;
With
Furthermore, the inner edge of the second frame-shaped light-shielding layer is located closer to the center than the inner edge of the first frame-shaped light-shielding layer.
An integrated cover glass sensor.   The cover glass integrated sensor according to claim 1, wherein a distance between the back surface of the glass substrate and the second frame-shaped light shielding layer is 10 µm to 100 µm.   The cover glass integrated sensor according to claim 1 or 2, wherein a color in the vicinity of an inner edge of the first frame-shaped light shielding layer and a color of the second frame-shaped light shielding layer are the same color or similar colors. Color difference in the L ^* a ^* b ^* color system of CIE (International Commission on Illumination) 1976 (JIS Z8729) between the color near the inner edge of the first frame-shaped light-shielding layer and the color of the second frame-shaped light-shielding layer The cover glass integrated sensor according to claim 3, wherein ΔE is 10 or less.   The cover glass integrated sensor according to any one of claims 1 to 4, wherein a color of the second frame-shaped light shielding layer is black or white.   The cover glass integrated sensor according to any one of claims 1 to 5, wherein the thickness of the first frame-shaped light shielding layer is 7 µm to 30 µm, and the thickness of the second frame-shaped light shielding layer is 2 µm to 25 µm.   The difference between the inner edge dimension of said 2nd frame-shaped light shielding layer and the inner edge dimension of said 1st frame-shaped light shielding layer is 0.1 mm-0.3 mm in any one of Claims 1-6. Cover glass integrated sensor.

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