JP6396830B2 - Sensor panel and method for manufacturing sensor panel - Google Patents

Description

  The present invention relates to a sensor panel in which a decoration area outside an operation area is narrowed, and a method for manufacturing such a sensor panel.

  A transparent electrode for detecting capacitance is arranged in the operation area of the sensor panel, and a wiring portion connected to the transparent electrode is formed in a frame-shaped decoration area called a bezel outside the operation area. A decoration layer is formed above the wiring so as to cover the wiring portion. When the area of the decoration area is increased, the operation area is narrowed. Therefore, in the input device described in Patent Document 1, in order to reduce the area of the decoration area, the wiring portion and the transparent electrode are mutually connected. A transparent pad portion for stacking and connecting is provided, and the boundary between the operation region and the decoration region is positioned on the transparent pad portion.

Japanese Patent No. 5520162

  In the operation of the sensor panel, there is a situation in which the user's line of sight is obliquely directed from the operation area side on the panel surface to the wiring portion side. In such a situation, in the conventional sensor panel, there is a problem that the design property is deteriorated by visually recognizing the colored wiring portion existing below the decorative layer. The smaller the width of the region, the more easily it appears.

  In order to prevent the wiring part from being visually recognized from the operation area side, it is necessary to arrange the wiring part in a recessed position as far as possible from the operation area. However, the decoration area is required to be narrowed. If so, such an arrangement was difficult.

  Therefore, the present invention provides a sensor panel that can keep a colored wiring portion from being visually recognized from the operation region side even in a configuration in which a decoration region is narrowed, and can maintain a certain design, and a method for manufacturing the same. With the goal.

  In order to solve the above problems, a sensor panel of the present invention includes a transparent electrode layer formed on a transparent substrate, a wiring layer formed around the transparent electrode layer on the substrate, and an opaque facing the wiring layer. Sensor panel comprising a decorative layer and a cover layer positioned between the substrate and the decorative layer, wherein the cover layer is transparent in at least the operation region corresponding to the transparent electrode layer, and from the wiring layer A refracting portion is provided on the optical path leading to the operation region on the surface of the cover layer, and the refracting portion has a refractive index different from that of the surrounding constituent material.

  As a result, the light from the wiring layer side is refracted by the refracting part, so that it is difficult to reach the operation area on the panel surface, so that the wiring layer side below the decorative layer is viewed obliquely from the panel surface side. However, it is difficult to visually recognize the wiring layer. Therefore, it is possible to prevent the design from being deteriorated due to the visible colored wiring layer.

  In the sensor panel of the present invention, it is preferable that the refractive part is provided in the cover layer, and the refractive index of the refractive part is smaller than the refractive index of the cover layer.

  As a result, light from the wiring layer side is refracted by the refracting portion, and it is difficult to reach the operation area on the panel surface, so that it is possible to prevent deterioration in design due to the appearance of the colored wiring layer.

  In the sensor panel of the present invention, the refracting portion is preferably provided so as to extend in the thickness direction of the cover layer.

  This makes it difficult for light from the back side of the refracting part to reach the operation area on the panel surface in the facing area between the decorative layer and the substrate, thus preventing deterioration in design due to the appearance of the colored wiring layer. be able to.

  In the sensor panel of the present invention, it is preferable that the refracting portion has a shape in which the area decreases from the bottom surface portion provided on the lower surface of the cover layer toward the panel surface.

  Thereby, the light incident on the refracting portion from the wiring layer side is not easily emitted to the panel surface side, or is reflected on the incident surface to the refracting portion, so that it is difficult for the user to visually recognize the wiring layer.

  In the sensor panel of the present invention, the refracting portion is preferably provided in a region where the decorative layer and the substrate face each other.

  This makes it difficult to visually recognize the wiring layer when the user obliquely looks at the wiring layer side below the decorative layer from the panel surface side, and refracts when the user views from a direction perpendicular to the panel surface. Since the part is hidden behind the decorative layer and cannot be seen, the design can be maintained.

  In the sensor panel of the present invention, the refracting portion is preferably composed of the same color as the decorative layer.

  Thereby, since it becomes difficult to discriminate between the refracting portion and the decorative layer, the design can be maintained.

In the sensor panel of the present invention, the refracting portion is preferably made of a transparent material.
This makes it difficult to distinguish between the cover layer and the refracting portion, thereby ensuring design.

In the sensor panel of the present invention, it is preferable that the refracting portion is a hollow concave portion having a bottom surface provided on the lower surface of the cover layer .

  Thereby, a refraction effect can be obtained using air having a low refractive index, and design can be ensured without complicating the manufacturing process.

The sensor panel manufacturing method of the present invention includes a step of forming a transparent electrode layer on a transparent substrate, a step of forming a wiring layer around the transparent electrode layer on the substrate, a transparent resin, and a surface thereof. A step of forming a cover layer having an opaque decorative layer formed on a part thereof, and a step of covering the substrate provided with the transparent electrode layer and the wiring layer with the cover layer, A concave portion as a refracting portion is formed on the lower surface of the cover layer.

  Thereby, since the refracting portion can be formed simultaneously with the formation of the cover layer, the wiring layer can be hidden without complicating the manufacturing process.

  According to the present invention, even in a configuration in which the decoration area is narrowed, the colored wiring layer is less visible from the operation area side, and a certain design can be maintained.

It is a perspective view which shows the structure of the sensor panel which concerns on embodiment of this invention. It is sectional drawing along the Z direction of the sensor panel which concerns on embodiment of this invention, Comprising: It is sectional drawing in the II-II line of FIG. It is an enlarged view of the III part of FIG. It is sectional drawing which shows the formation process of the cover layer in embodiment of this invention.

  Hereinafter, a sensor panel and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to the drawings. The sensor panel according to the present invention is used in a touch panel for a vehicle, a portable device, and the like, and detects that a user's hand or finger has touched or approached an operation area. In the operation area, light can be transmitted from the front surface to the back surface.

(1) Configuration of Sensor Panel 10 FIG. 1 is a perspective view showing the configuration of the sensor panel 10 according to the present embodiment. FIG. 2 is a cross-sectional view of the sensor panel 10 along the Z direction, and is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is an enlarged view of a portion III in FIG. In each figure, XYZ coordinates are shown as reference coordinates. The Z direction is the thickness direction of the sensor panel, and the X direction is the width direction. Further, the XY plane is orthogonal to the Z direction, and the Z direction may be referred to as an upward direction.

  As shown in FIGS. 1 and 2, the sensor panel 10 has an operation area 12 and a decoration area 13 on the panel surface 11. As shown in FIG. 2 or 3, the sensor panel 10 includes a substrate 20, a plurality of transparent electrode layers 21, a plurality of wiring layers 22, an adhesive layer 24, and a recess 31 as a refracting portion. The cover layer 30 and the resin layer 40 including the decorative layer 41 and the light transmitting layer 42 are included.

  The substrate 20 is disposed along the XY plane, and is formed of a translucent material such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), or other resin, a hard substrate, or glass.

  A plurality of the transparent electrode layers 21 are provided on the substrate 20 and are formed in a predetermined pattern by, for example, sputtering of ITO (indium tin oxide), PVD (physical vapor deposition), or CVD (chemical vapor deposition). Alternatively, the transparent electrode layer 21 is formed of a conductive nanowire layer, a mesh-like metal thin film layer, or the like.

  A plurality of wiring layers 22 are arranged in a region around the transparent electrode layer 21 on the substrate 20, and each is connected to the corresponding transparent electrode layer 21. The wiring layer 22 is preferably formed by sputtering copper or an alloy of copper and nickel, for example, and further etched to have a predetermined wiring width. The wiring layer 22 may be configured as a conductive layer in which a low-resistance conductor is contained in a binder resin, and is formed by applying, for example, a silver paste, a gold paste, or a carbon paste.

  The adhesive layer 24 is formed by printing so as to cover the transparent electrode layer 21 and the wiring layer 22. The adhesive layer 24 is made of, for example, an ultraviolet curable or thermosetting optical transparent adhesive. The material constituting the adhesive layer 24 preferably has a high viscosity that does not enter the recess 31 when the cover layer 30 is placed on the adhesive layer 24.

  The cover layer 30 is made of a light-transmitting and flexible resin, such as polymethyl methacrylate or polycarbonate, and is provided between the adhesive layer 24 and the resin layer 40 by molding. The cover layer 30 is fixed to the transparent electrode layer 21 and the wiring layer 22 by the adhesive layer 24.

  The cover layer 30 includes a concave portion 31 as a refracting portion. The recess 31 is formed as a hollow recess by a protrusion provided on the mold (the protrusion 52c (FIG. 4) of the second mold 52) when the cover layer 30 is formed. The recess 31 is provided in a region where the decorative layer 41 and the substrate 20 face each other, that is, a region corresponding to the decorative region 13, and is formed in a frame shape surrounding the operation region 12. Thereby, the recess 31 is arranged on the optical path from the plurality of wiring layers 22 to the operation region 12 of the panel surface 11.

  As shown in FIGS. 2 and 3, the recess 31 has a shape in which the area becomes smaller toward the panel surface 11 of the sensor panel 10 with the lower surface 30 a of the cover layer 30 as the bottom surface. In this shape, the concave portion 31 is hollow with the bottom portion as an opening, and the inside is filled with air. For this reason, the concave portion 31 has a refractive index smaller than that of the cover layer 30 and the adhesive layer 24 surrounding the concave portion 31.

  By configuring and arranging the hollow recess 31 as described above, the light from the wiring layer 22 side is at an angle corresponding to the difference in refractive index between the recess 31 and the surrounding adhesive layer 24 or cover layer 30. The light is emitted after being refracted in the recess 31. Depending on the incident angle to the recess 31, the incident light is totally reflected at the boundary surface with the recess 31. Due to such a refraction effect, emitted light traveling from the wiring layer 22 side to the operation region 12 of the panel surface 11 can be reduced, and there is a situation where the user sees the wiring layer 22 side obliquely from the panel surface 11. However, the wiring layer 22 is less visible.

  The resin layer 40 includes a decorative layer 41 and a translucent layer 42, has flexibility, and is formed by printing, for example. The decoration layer 41 constituting the decoration region 13 is made of an opaque and non-conductive material. For example, a pigment is added to polymethyl methacrylate, polycarbonate, or other light-transmitting resin. An opaque material is mentioned. The translucent layer 42 constituting the operation region 12 is formed in an inner region surrounded by the decorative layer 41, and is formed of a translucent and non-conductive resin such as polymethyl methacrylate, polycarbonate or other resin. . The decorative layer 41 is formed so as to be positioned above the wiring layer 22 so as to correspond to the plurality of wiring layers 22, and the transparent layer 42 is formed of a transparent electrode so as to correspond to the plurality of transparent electrode layers 21. It is formed so as to be located above the layer 21.

  A surface coat layer may be provided outside the resin layer 40. This surface coat layer has flexibility and translucency, and is preferably composed of a non-conductive material such as polymethyl methacrylate, polycarbonate or other resin.

  With the above configuration, light can be transmitted along the Z direction from below the substrate 20 through the transparent electrode layer 21, the cover layer 30, and the translucent layer 42, and corresponds to the translucent layer 42 on the panel surface 11. The range to be set is set as the operation area 12. On the other hand, in the range corresponding to the decoration area 13 on the panel surface 11, when viewed from the direction along the Z direction, the plurality of wiring layers 22 are covered with the decoration area 13 and cannot be visually recognized. In the cover layer 30, since the decorative layer 41 is provided with the recess 31, even if the user of the sensor panel 10 looks into the lower side of the decorative layer 41 obliquely from the operation area 12, the wiring layer 22 side Is refracted in the recess 31, the wiring layer 22 cannot be visually recognized.

(2) Manufacturing Method of Sensor Panel 10 FIG. 4 is a view showing a process of forming the cover layer 30, and is a cross-sectional view corresponding to FIG. The sensor panel 10 is manufactured by the following steps (A) to (D).

(A) The transparent electrode layer 21 and the wiring layer 22 are formed on the substrate 20. The transparent electrode layer 21 is formed in a predetermined pattern by sputtering of ITO, for example, and the wiring layer 22 is formed in a predetermined pattern around the transparent electrode layer 21 by sputtering of copper, for example.

(B) A resin layer 40 is formed on a substrate such as glass by printing. In the formation of the resin layer 40, the decorative layer 41 is formed by printing the decorative layer ink in which an opaque and non-conductive material is dissolved in a solvent, and the translucent and non-conductive resin is dissolved in the solvent. The translucent layer 42 is formed by printing the translucent layer ink. The decorative layer 41 and the translucent layer 42 are dried and solidified by heating, and are peeled from the substrate as an integrated film. In order to peel the resin layer 40 from the base material, it is preferable to apply a release agent on the base material before printing the decorative layer 41 and the translucent layer 42.

(C) The cover layer 30 is formed using the first mold 51 and the second mold 52 shown in FIG. First, the upper surface 40 b of the film-like resin layer 40 formed in the step (B) is disposed along the inner surface 51 a of the first mold 51. Next, a cavity 52b surrounded by the resin layer 40 in the first mold 51 and the second mold 52 is filled with translucent resin from the gate 52a of the second mold 52, and a predetermined pressure / temperature is set. Cool and solidify under conditions. Thereby, the translucent cover layer 30 is formed along the lower surface 40 a of the resin layer 40.

  Here, the second mold 52 is provided with a protrusion 52c having a shape corresponding to the recess 31 at a position corresponding to the recess 31. When the cover layer 30 is formed by filling the cavity 52b with resin, the second mold 52 is hollow. Are formed at the same time.

(D) An optical transparent adhesive is applied on the substrate 20 to form the adhesive layer 24 by printing so as to cover the transparent electrode layer 21 and the wiring layer 22 formed in the step (A). Next, the cover layer 30 fixed to the resin layer 40 in the step (C) is disposed on the adhesive layer 24. At this time, the decoration layer 41 is disposed above the plurality of wiring layers 22 and the recesses 31, and the light transmitting layer 42 is disposed above the plurality of transparent electrode layers 21. Further, the adhesive layer 24 is cured by irradiating ultraviolet rays, whereby the sensor panel 10 in which the substrate 20, the transparent electrode layer 21, the wiring layer 22, the adhesive layer 24, the cover layer 30, and the resin layer 40 are integrated is formed. Complete.

With the configuration described above, the following effects are achieved according to the above embodiment.
(1) In the sensor panel 10, even when the wiring layer 22 side below the decorative layer 41 is viewed obliquely from the operation region 12 side of the panel surface 11, the recess 31 provided on the optical path to the wiring layer 22. It is difficult to visually recognize the wiring layer 22 due to the refraction effect. For this reason, it is possible to prevent the design from being deteriorated due to the visible colored wiring layer 22. Even if the decoration region 13 is narrowed, it is not necessary to arrange the wiring layer 22 in the back, so that a region for forming the wiring layer 22 can be secured and viewed obliquely from the operation region 12. In this case, the wiring layer 22 can be prevented from being visually recognized.

(2) Since the recess 31 can be formed at the same time as the cover layer 30 is formed, the wiring layer 22 can be hidden without complicating the manufacturing process.

Hereinafter, modifications of the present embodiment will be described.
Although the concave portion 31 of the above embodiment is hollow, the inside may be filled with a material having a lower refractive index than the constituent material of the surrounding adhesive layer 24 and cover layer 30. This low refractive material is filled, for example, by printing after the cover layer 30 is formed, and then solidified. When the inside of the recess 31 is filled with such a material, it is possible to prevent the constituent material of the adhesive layer 24 from being mixed into the recess 31 when the cover layer 30 is bonded to the adhesive layer 24. The refraction effect by the concave portion 31 can be surely exhibited.

  When the inside of the recess 31 is filled with the low refractive material, this material is preferably the same color as the decorative layer 41 or transparent. Thereby, it becomes difficult for the user to visually recognize the recess 31, and in particular, by using the same color as the decorative layer 41, the user of the sensor panel 10 is inclined from the operation area 12, that is, at an angle with respect to the Z direction. Even when looking down below the decoration layer 41, it becomes difficult to distinguish it from the decoration layer 41, and the design is not impaired.

  The cross-sectional shape of the recess 31 is not limited to a shape in which the area decreases toward the panel surface 11 when the cross-sectional shape is provided in a region where the decorative layer 41 and the substrate 20 are opposed to each other. In this case, the light emitted from the upper surface of the recess 31 is blocked by the decorative layer 41, and the light emitted from the side surface does not easily travel to the operation region 12 side of the panel surface 11 due to the refraction effect. Can be prevented.

  When providing the recessed part 31 in the area | region which the decorating layer 41 and the board | substrate 20 oppose, the number of the recessed parts 31 may be plural. Further, in this case, the recess 31 may be provided so as to cover the entire opposing region.

  In the above embodiment, the recess 31 is provided in the region where the decorative layer 41 and the substrate 20 face each other. However, as long as the area decreases toward the panel surface 11, the transparent electrode layer 21 does not cover the transparent electrode layer 21. The optical layer 42 and the substrate 20 may enter a region facing each other.

  A second recess having a shape that is continuous with the recess 31 may be formed in the adhesive layer 24, and the recess 31 and the second recess that are connected to each other may be used as a refracting portion. The second recess is formed, for example, by masking a corresponding portion in the application of the adhesive layer 24.

  As long as the light from the wiring layer 22 side can be prevented from being emitted to the operation region 12 of the panel surface 11, the refractive index of the constituent material in the recess 31 is changed to the surrounding cover layer 30 or the adhesive layer 24. The refractive index may be larger than the refractive index.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment, and can be improved or changed within the scope of the purpose of the improvement or the idea of the present invention.

  As described above, the sensor panel according to the present invention is useful for a panel having a colored wiring layer, and is particularly useful as the distance between the decorative layer and the substrate is large.

DESCRIPTION OF SYMBOLS 10 Sensor panel 11 Panel surface 12 Operation area 13 Decoration area 20 Board | substrate 21 Transparent electrode layer 22 Wiring layer 24 Adhesive layer 30 Cover layer 31 Recessed part (refraction part)
40 resin layer 41 decorative layer 42 translucent layer 51 first mold 52 second mold 52c protrusion

Claims (9)

A transparent electrode layer formed on a transparent substrate; a wiring layer formed on the substrate around the transparent electrode layer; an opaque decorative layer facing the wiring layer; the substrate and the decoration A sensor panel with a cover layer located between the layers,
The cover layer is transparent at least in the operation region corresponding to the transparent electrode layer,
A refractive part is provided on the optical path from the wiring layer to the operation region on the surface of the cover layer,
The sensor panel according to claim 1, wherein the refractive part has a refractive index different from that of the surrounding constituent material. The sensor panel according to claim 1, wherein the refractive portion is provided in the cover layer, and a refractive index of the refractive portion is smaller than a refractive index of the cover layer. The sensor panel according to claim 2, wherein the refracting portion is provided so as to extend in a thickness direction of the cover layer. The sensor panel according to claim 3, wherein the refracting portion has a shape that decreases in area as it goes from a bottom surface portion provided on the lower surface of the cover layer toward the panel surface. The sensor panel according to any one of claims 2 to 4, wherein the refracting portion is provided in a region where the decorative layer and the substrate are opposed to each other. The sensor panel according to claim 5, wherein the refracting portion is configured in the same color as the decorative layer. The sensor panel according to claim 2, wherein the refracting portion is made of a transparent material. The sensor panel according to any one of claims 2 to 5 , wherein the refracting portion is a hollow recess having a bottom surface portion provided on a lower surface of the cover layer . Forming a transparent electrode layer on a transparent substrate;
Forming a wiring layer around the transparent electrode layer on the substrate;
Forming a cover layer formed of a transparent resin and having an opaque decorative layer formed on a part of its surface;
A step of covering the substrate provided with the transparent electrode layer and the wiring layer with the cover layer;
In the cover layer forming step, a concave portion as a refracting portion is formed on the lower surface of the cover layer.

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