WO2017068942A1 - Transparent conductive film, method for manufacturing transparent conductive film, and touch sensor - Google Patents

Abstract

The present invention provides a transparent conductive film with which it is possible to prevent a conductive pattern part from being damaged even when support mediums on which conductive pattern parts are formed are laid one on top of another. A plurality of conductive pattern parts 2 are arranged on a surface 1A and a reverse surface 1B of a support medium 1 at mutually overlapping positions sandwiching the support medium 1, and a sacrificial pattern part 3 is formed along the transport direction of the support medium 1 at a position different from the conductive pattern parts 2 in the width direction DW of the support medium 1, the sacrificial pattern part 3 having a thickness greater than the sum of the thickness of the conductive pattern part 2 formed on the surface 1A of the support medium 1 and the thickness of the conductive pattern part 2 formed on the reverse surface 1B of the support medium 1.

Description

Transparent conductive film, method for manufacturing transparent conductive film, and touch sensor

The present invention relates to a transparent conductive film, and more particularly to a transparent conductive film in which a conductive pattern portion including an electrode made of a fine metal wire is formed on a surface of a support.
The present invention also relates to a method for producing a transparent conductive film and a touch sensor using the transparent conductive film.

In various electronic devices such as portable information devices, touch sensors that are used in combination with a display device such as a liquid crystal display device and perform an input operation to the electronic device by touching or approaching a screen are becoming widespread. .
For example, Patent Document 1 discloses a capacitive touch sensor using a transparent conductive film in which stripe-shaped metal wirings are formed so as to be orthogonal to each other on the front and back surfaces of a support made of a transparent film. . Such a transparent conductive film is preferably manufactured in a roll form in order to improve productivity, and Patent Document 1 also describes a manufacturing method using a roll-to-roll method.

That is, while conveying the long support fed from the feed roll, metal wiring is formed on the front and back surfaces of the support, respectively, and then the support is wound on the take-up roll. At this time, as shown in FIG. 15, a plurality of conductive pattern portions 42 each made of metal wiring are formed on both surfaces of the support 41 conveyed in the conveyance direction DT, and the plurality of conductive pattern portions 42 are separated from each other. A plurality of transparent conductive films are manufactured by cutting the support body 41.

JP 2014-10614 A

However, when the support body 41 having the conductive pattern portions 42 formed on both surfaces is wound up in a roll shape, the conductive pattern portions 42 that are vertically overlapped with each other as shown in FIG. FIG. 16 shows a cross section along the width direction DW of the support body 41 orthogonal to the transport direction DT.
Further, the conductive pattern portions 42 formed on both surfaces of the support 41 cannot avoid contact with the surface of the transport roller when transporting the support 41 by the roll-to-roll method.

In this way, each conductive pattern portion 42 comes into contact with the other conductive pattern portion 42 and the transport roller, and hence the surface of the conductive pattern portion 42 is rubbed due to winding deviation, slip, and the like of the support 41. Sometimes. When the surface of the conductive pattern portion 42 is rubbed, the surface of the conductive pattern portion 42 is damaged or deformed. As a result, when the transparent conductive film is incorporated in the module as a touch sensor, it is locally glaring. There was a risk of visible visibility failure. Since such a visibility failure causes a decrease in the yield of the transparent conductive film, a solution has been desired.
Further, the problem of visibility failure is not limited to the roll-to-roll method. For example, even when conductive pattern portions are formed on each of a plurality of sheet-like supports, the conductive patterns that overlap each other when the supports with the conductive pattern portions formed on both surfaces are placed on top of each other. The parts may come into contact with each other and cause a visibility failure.

The present invention has been made to solve such a conventional problem, and is capable of preventing the conductive pattern portion from being damaged even when the support on which the conductive pattern portion is formed is overlapped. An object is to provide a conductive film.
Another object of the present invention is to provide a method for producing such a transparent conductive film and a touch sensor using the transparent conductive film.

The transparent conductive film according to the present invention includes a transparent support, a conductive pattern portion formed on one or both surfaces of the support and including electrodes made of fine metal wires, and a position where the conductive pattern portion is formed. And a sacrificial pattern portion formed on one side or both sides of the support in a region other than the regions on both sides of the support, and the sum of the thicknesses of the sacrificial pattern portions on both sides of the support is This is larger than the sum of the thicknesses of the conductive pattern portions on the both surfaces.
Here, “the sum of the thicknesses of the sacrificial pattern portions on both surfaces of the support” means that when the sacrificial pattern portions are formed only on one surface of the support, the sacrificial pattern portions on the other surface. It is assumed that the thickness is 0, and means the thickness of the sacrificial pattern portion formed on one surface. Similarly, “the sum of the thicknesses of the conductive pattern portions on both surfaces of the support” means that when the conductive pattern portion is formed only on one surface of the support, the conductive pattern portion on the other surface. Assuming that the thickness is 0, it means the thickness of the conductive pattern portion formed on one surface.

The conductive pattern portion is formed on one surface of the support, and the sacrificial pattern portion is the same surface as the surface of the support on which the conductive pattern portion is formed or the surface of the support on which the conductive pattern portion is formed. It can be configured to be formed on the opposite side or on both sides of the support.
Alternatively, the conductive pattern portion may be formed on both surfaces of the support, and the sacrificial pattern portion may be formed on either one of the both surfaces of the support or on both surfaces of the support. .

The support has a long film shape and is rolled, and the plurality of conductive pattern portions are arranged in advance in the width direction of the support along the transport direction of the support and perpendicular to the transport direction of the support. The sacrificial pattern part is arranged at a set position, and the sacrificial pattern part is on one surface of both sides of the support body at a position different from the plurality of conductive pattern parts in the width direction of the support body along the transport direction of the support body. Or it can be formed on both sides of the support.
The support has a long film shape and is rolled, and the plurality of conductive pattern portions are along the transport direction of the support and are perpendicular to the transport direction of the support. The sacrificial pattern portion is arranged in a predetermined position of the support body, and the sacrificial pattern portion is either one of both surfaces of the support body along the transport direction of the support body and at the same position as the plurality of conductive pattern portions in the width direction of the support body. It can also be formed on top.

It is preferable that sacrificial pattern portions are respectively formed on both sides of the plurality of conductive pattern portions in the width direction of the support.
A plurality of sacrificial pattern portions may be arrayed in the transport direction of the support corresponding to the plurality of conductive pattern portions arranged along the transport direction of the support, or along the transport direction of the support. The sacrificial pattern part which continues over the some electroconductive pattern part arranged may be formed in the conveyance direction of the support body.

Sacrificial pattern portions are formed on both sides of the support and at the same position in the width direction of the support, and at least one of the sacrificial pattern portions formed on both sides of the support is in a direction opposite to the support. It is preferable to have a facing uneven surface. The sacrificial pattern portions formed on both surfaces of the support may each have an uneven surface facing in the opposite direction to the support.
Preferably, the sum of the thicknesses of the sacrificial pattern portions on both surfaces of the support is 0.1 μm or more larger than the sum of the thicknesses of the conductive pattern portions on both surfaces of the support.
The sacrificial pattern portion may be electrically connected to at least one conductive pattern portion.
The conductive pattern portion and the sacrificial pattern portion are preferably made of the same conductive material containing at least one metal among gold, silver, copper, nickel, palladium, platinum, lead, tin, and chromium.

In the method for producing a transparent conductive film according to the present invention, a first step of forming a conductive pattern portion including a conductive portion made of a fine metal wire on one surface or both surfaces of a transparent support, and the conductive pattern portion are formed. And a second step of forming a sacrificial pattern portion on one side or both sides of the support in a region other than the regions on both sides of the support at a certain position, and the thickness of the sacrificial pattern portion on both sides of the support Is made larger than the sum of the thicknesses of the conductive pattern portions on both surfaces of the support.

It is preferable that the support has a long film shape, and the conductive pattern portion and the sacrificial pattern portion are respectively formed on one surface or both surfaces of the support while the support is rolled.
The first step and the second step can be performed simultaneously.
The first step and the second step are a third step of forming a silver salt emulsion layer on one side or both sides of the support, a conductive pattern portion made of metallic silver by exposing and developing the silver salt emulsion layer, and A fourth step of forming a sacrificial pattern portion.
In the fourth step, by making the exposure amount for the sacrificial pattern portion larger than the exposure amount for the conductive pattern portion, the total thickness of the sacrificial pattern portion on both sides of the support is set to be equal to that of the conductive pattern portion on both sides of the support. It can be larger than the sum of the thicknesses.

The touch sensor according to the present invention is a touch sensor having a transparent view area, wherein the conductive pattern portion and the sacrificial pattern portion are at least one of gold, silver, copper, nickel, palladium, platinum, lead, tin, and chromium. The transparent conductive film is made of the same conductive material containing one kind of metal, the conductive pattern portion is disposed in the view area, and the sacrificial pattern portion is disposed outside the view area.
The sacrificial pattern portion may include a peripheral wiring electrically connected to the conductive pattern portion.

According to the present invention, since the sum of the thicknesses of the sacrificial pattern portions on both sides of the support is larger than the sum of the thicknesses of the conductive pattern portions on both sides of the support, the support on which the conductive pattern portions are formed. It is possible to prevent the conductive pattern portion from being damaged even if they are overlapped.

It is a perspective view which shows the structure of the transparent conductive film which concerns on Embodiment 1 of this invention. 2 is a cross-sectional view showing a transparent conductive film according to Embodiment 1. FIG. FIG. 3 is a partially enlarged view of FIG. 2. It is a top view which shows the structure of a touch sensor. It is a top view which shows the mesh pattern of an electrode. It is sectional drawing which shows the state which accumulated the transparent conductive film which concerns on Embodiment 1. FIG. 5 is a diagram showing a method for manufacturing the transparent conductive film according to Embodiment 1. FIG. 3 is a plan view showing a transparent conductive film of Embodiment 1. FIG. The area | region which can form a sacrificial pattern part is shown, (A) is a top view of the surface side of a support body when comprising a touch panel, (B) is a top view on the back surface side of a support body when comprising a touch panel. . 5 is a cross-sectional view showing a transparent conductive film according to Embodiment 2. FIG. It is sectional drawing which shows the state which accumulated the transparent conductive film which concerns on Embodiment 2. FIG. 6 is a partial enlarged cross-sectional view showing a transparent conductive film according to Embodiment 3. FIG. It is a partial expanded sectional view which shows the state which accumulated the transparent conductive film which concerns on Embodiment 3. FIG. It is a perspective view which shows the transparent conductive film which concerns on Embodiment 4. FIG. It is a perspective view which shows the structure of the conventional transparent conductive film. It is sectional drawing which shows the state which accumulated the conventional transparent conductive film. It is a top view which shows the example of a transparent conductive film.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1
FIG. 1 shows a configuration of a transparent conductive film according to Embodiment 1 of the present invention. This transparent conductive film is for forming a plurality of touch sensors, and a plurality of conductive patterns made of a transparent support 1 and a conductive material formed on the front surface 1A and the back surface 1B of the support 1, respectively. Part 2 and a sacrificial pattern part 3 formed only on the surface 1A of the support 1. Note that the surface 1A of the support 1 on which the sacrificial pattern portion 3 is formed is arranged on the viewing side when the touch sensor is formed.

The support 1 is made of an insulating material having a long film shape and flexibility, and is configured to be roll-transportable along the transport direction DT.
The plurality of conductive pattern portions 2 are arranged along the transport direction DT while forming rows at two preset positions in the width direction DW perpendicular to the transport direction DT of the support 1. As shown in FIG. 2, the plurality of conductive pattern portions 2 are arranged at positions where the front surface 1 </ b> A and the back surface 1 </ b> B of the support 1 overlap with each other with the support 1 interposed therebetween, and a pair of conductive pattern portions 2 that overlap each other. One touch sensor is formed by the portion of the support body 1 located between the pair of conductive pattern portions 2.

The sacrificial pattern portion 3 is formed along the transport direction DT of the support 1 at a position different from the conductive pattern portion 2 in the width direction DW of the support 1. Specifically, as shown in FIG. 2, on the surface 1A of the support 1, the conductive pattern portions 2 arranged in two rows are arranged on both sides in the width direction DW of the support 1 and in two rows. Sacrificial pattern portions 3 are formed at three locations between the conductive pattern portions 2 formed. The formation of the sacrificial pattern portion 3 is not limited to the above, and it is sufficient that the sacrificial pattern portion 3 is formed along the transport direction DT of the support 1 at least at both ends in the width direction DW of the support 1. Are formed in three or more rows.
Further, the sacrificial pattern portion 3 may be formed in the transport direction DT of the support 1 on at least both sides in the width direction DW of the conductive pattern portion 2. When the conductive pattern portions 2 are arranged in two or more rows, the sacrificial pattern portion 3 may be formed at least outside the conductive pattern portion 2, and the sacrificial pattern portion 3 is interposed between the conductive pattern portions 2. May not be formed.
Each sacrificial pattern part 3 is arranged at intervals in the width direction DW of the support 1 from the conductive pattern part 2 and is formed continuously in the transport direction DT of the support 1 so as to cover the plurality of conductive pattern parts 2. Has been. If the sacrificial pattern portion 3 is present at least partially in the width direction DW of the support 1, the sacrificial pattern portion 3 is electrically connected along the transport direction DT of the support 1. It may be cut into pieces.
More preferably, as shown in FIG. 17A, the sacrificial pattern portion 3 is preferably formed on both sides of the conductive pattern portion 2 in any width direction DW where the conductive pattern portion 2 exists. More preferably, as shown in FIG. 17B, it is preferable that the sacrificial pattern portion 3 is formed in any width direction DW in the range where the plurality of conductive pattern portions 2 are continuously formed. . Furthermore, it is desirable to be electrically connected.

As shown in FIG. 3, these sacrificial pattern portions 3 include a conductive pattern portion formed on a thickness T <b> 2 of the conductive pattern portion 2 formed on the front surface 1 </ b> A of the support 1 and a back surface 1 </ b> B of the support 1. The thickness T1 is greater than the sum of the two thicknesses T3 (T2 + T3). The thickness T1 of the sacrificial pattern portion 3 preferably has a value that is 0.1 μm or more larger than the sum (T2 + T3) of the thicknesses T2 and T3 of the conductive pattern portion 2.

The support 1 includes, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), polystyrene, ethylene vinyl acetate (EVA), cycloolefin polymer (COP), It can be composed of polyolefins such as cycloolefin copolymer (COC), vinyl resin, polycarbonate (PC), polyamide, polyimide, acrylic resin, and triacetyl cellulose (TAC). In addition, it is preferable to comprise the support body 1 from a polyethylene terephthalate from viewpoints, such as a light transmittance, heat shrinkability, and workability.

The conductive pattern portion 2 is arranged in a transparent view area of the touch sensor when the touch sensor is configured, and includes an electrode made of a fine metal wire.
Here, an example of one touch sensor is illustrated in FIG. 4, a transparent view area S1 is defined in the center, and a peripheral region S2 is defined outside the view area S1.
On the surface 1A of the support 1, a plurality of first electrodes that extend along the first direction D1 and are arranged in parallel in the second direction D2 perpendicular to the first direction D1 in the view area S1. 11 is formed, and a plurality of first peripheral wirings 12 connected to the plurality of first electrodes 11 are arranged close to each other in the peripheral region S2.
Similarly, a plurality of second electrodes 13 extending along the second direction D2 and arranged in parallel in the first direction D1 are formed on the back surface 1B of the support 1 in the view area S1, respectively. In the peripheral region S2, a plurality of second peripheral wirings 14 connected to the plurality of second electrodes 13 are arranged close to each other.

The plurality of first electrodes 11 on the front surface 1A of the support 1 and the plurality of second electrodes 13 on the back surface 1B of the support 1 constitute detection electrodes of the touch sensor, as shown in FIG. The first electrode 11 is formed by a mesh pattern made of the fine metal wires 11A, and the second electrode 13 is also made by a mesh pattern made of the fine metal wires 13A.

The conductive pattern part 2 is composed of a plurality of first electrodes 11 and a plurality of second electrodes 13 arranged in the view area S1 of such a touch sensor.
Although not shown in FIG. 4, the sacrificial pattern portion 3 is formed in an outer region of the view area S1. The sacrificial pattern portion 3 may be disposed on the surface 1A of the support 1 at a position that does not interfere with the first peripheral wiring 12, or may be formed so as to include the first peripheral wiring 12. That is, at least a part of the first peripheral wiring 12 may also serve as the sacrificial pattern portion 3 having the thickness T1. In addition, the sacrificial pattern portion 3 can be configured with only the first peripheral wiring 12.

The 1st electrode 11 and the 2nd electrode 13 which comprise the conductive pattern part 2 are comprised from the material containing at least 1 sort (s) of metal among gold | metal | money, silver, copper, nickel, palladium, platinum, lead, tin, chromium, for example. can do.
The thicknesses of the fine metal wire 11A of the first electrode 11 and the fine metal wire 13A of the second electrode 13 are not particularly limited, but are preferably 0.01 μm to 200 μm, more preferably 30 μm or less, and further preferably 20 μm or less. It is preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. Within the above range, an electrode having low resistance and excellent durability can be formed relatively easily.

The first peripheral wiring 12 and the second peripheral wiring 14 are also preferably formed from the same conductive material as the first electrode 11 and the second electrode 13.
Even when the sacrificial pattern portion 3 is disposed at a position where it does not interfere with the first peripheral wiring 12, the sacrificial pattern portion 3 is the same conductive material as the first electrode 11 and the second electrode 13 that constitute the conductive pattern portion 2. That is, it is preferably formed from a material containing at least one metal selected from gold, silver, copper, nickel, palladium, platinum, lead, tin, and chromium.

By forming the support 1 on which the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed, for example, in a roll form, the support 1 forms a plurality of layers and overlaps as shown in FIG. When the sacrificial pattern portion 3 formed on the front surface 1A of the support 1 comes into contact with the back surface 1B of the support 1 positioned immediately above, the sacrificial pattern portion 3 is interposed between the support 1 overlapping each other. An interval corresponding to the thickness T1 is formed.

As described above, the thickness T1 of the sacrificial pattern portion 3 is the sum of the thickness T2 of the conductive pattern portion 2 on the front surface 1A of the support 1 and the thickness T3 of the conductive pattern portion 2 on the back surface 1B of the support 1. Since it has a value larger than (T2 + T3), it is located on the back surface 1B of the conductive pattern portion 2 positioned on the front surface 1A of the lower layer support 1 and the upper layer support 1 which are opposed to each other. The conductive pattern portions 2 to be opposed to each other through a gap without contacting each other.
For this reason, it is possible to prevent the conductive pattern portions 2 facing each other from being rubbed and scratching the surface of the conductive pattern portion 2 or causing deformation such as smoothing. Therefore, when a transparent conductive film is incorporated in a module as a touch sensor, it is possible to avoid occurrence of a visibility failure that appears to be locally shining.

In addition, since the support body 1 is formed from the insulating material which has flexibility, when the support body 1 is made into a roll form, there exists a possibility that the support body 1 may bend and the conductive pattern part 2 which mutually opposes may contact. However, since the front surface 1A of the lower layer support 1 and the back surface 1B of the upper layer support 1 are supported by the sacrificial pattern portion 3, a large force acts on the conductive pattern portions 2 in contact with each other. The surface will not be damaged or deformed.
Further, even when the support 1 is not formed into a roll and the sheet-like support 1 in which the conductive pattern portions 2 are formed on both sides is placed on top of each other, the conductive pattern portion 2 is similarly mounted. Damage is prevented.

Next, the manufacturing method of a transparent conductive film is demonstrated. As shown in FIG. 7, the long support 1 sent out from the delivery roll 21 is roll-conveyed in the conveyance direction DT by the conveyance roller 22, reaches the conductive layer formation unit 23, and then reaches the conductive layer formation unit 23. The conductive pattern portions 2 are respectively formed on the front surface 1A and the back surface 1B of the support 1, and the sacrificial pattern portion 3 is formed on the front surface 1A of the support 1.
The support 1 on which the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed in the conductive layer forming portion 23 is further wound around the winding roll 24 via the transport roller 22.

The conductive layer forming part 23 forms, for example, a silver salt emulsion layer on the front surface 1A and the back surface 1B of the support 1, and the silver salt emulsion layer is exposed and developed to form a conductive pattern portion 2 and a sacrificial pattern made of metallic silver. Part 3 can be formed.
Specifically, the conductive layer forming portion 23 applies a silver salt emulsion layer containing a photosensitive silver halide salt on the front surface 1A and the back surface 1B of the support 1, and the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed. The silver salt emulsion layer coated on the support 1 is exposed through a photomask for formation.

For example, as shown in FIG. 8, the exposure is performed by taking a region including six conductive pattern portions 2 out of the conductive pattern portions 2 formed in two rows on the surface 1 </ b> A of the support 1 as one shot. Are sequentially repeated in the transport direction DT. Subsequently, the exposed silver salt emulsion layer is developed to remove the unexposed portion of the silver salt emulsion, and the exposed portion forms the conductive pattern portion 2 made of metallic silver.
Similarly, after the exposure, the exposed silver salt emulsion layer is subjected to development processing to remove the silver salt emulsion in the non-exposed portion, and the exposed portion from the metallic silver. A sacrificial pattern portion 3 is formed. At this time, by making the exposure amount for the sacrificial pattern portion 3 larger than the exposure amount for the conductive pattern portion 2, the sacrificial pattern portion 3 is obtained from the sum of the thicknesses of the conductive pattern portions 2 on both surfaces of the support 1 (T2 + T3). Can be set to a large value T1.

In addition, it is possible to perform the formation process of the conductive pattern part 2 and the formation process of the sacrificial pattern part 3 simultaneously.
Here, the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed using a method disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2011-129501, 2013-149236, and 2014-112512. can do.

Thus, the support 1 on which the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed in the conductive layer forming portion 23 is conveyed to the take-up roll 24 via the carry roller 22 and wound around the take-up roll 24. Taken.
At this time, since the sacrificial pattern portion 3 having a thickness T1 is formed on the surface 1A of the support 1, the surface of the conductive pattern portion 2 is damaged or deformed due to winding deviation, slip, or the like of the support 1. It is prevented from being damaged.

Further, instead of the roll-to-roll method, the conductive pattern portion 2 and the sacrificial pattern portion 3 are formed on the front surface 1A of the sheet-like support 1, and the conductive pattern portion 2 is formed on the back surface 1B of the support 1. Thus, a transparent conductive film can be produced in the same manner as a single wafer, and in this case as well, damage to the conductive pattern portions 2 arranged on both surfaces of the support 1 can be prevented.

In the first embodiment, the sacrificial pattern portion 3 is formed on the surface 1A of the support 1 at a position different from the conductive pattern portion 2 in the width direction DW of the support 1, but the present invention is not limited to this. Instead, the sacrificial pattern portion 3 can be formed in a region other than the regions on both sides of the support 1 at the position where the conductive pattern portion 2 is formed.
As shown in FIG. 9A, a region at a position different from the conductive pattern portion 2 on the surface 1A of the support 1 and in the width direction DW of the support 1 is a region R1 and the surface 1A of the support 1 Further, the region at the same position as the conductive pattern portion 2 in the width direction DW of the support 1 (excluding the region where the conductive pattern portion 2 is formed) is defined as a region R2, and as shown in FIG. The region at a position different from the conductive pattern portion 2 on 1B in the width direction DW of the support 1 is the region R3, the same position as the conductive pattern portion 2 on the back surface 1B of the support 1 and in the width direction DW of the support 1 This region (excluding the region where the conductive pattern portion 2 is formed) is defined as a region R4.

In the first embodiment, the sacrificial pattern portion 3 is formed only in the region R1 of the surface 1A of the support 1, but the sacrificial pattern portion 3 is formed only in the region R2 of the surface 1A of the support 1. Alternatively, it may be formed in both the region R1 and the region R2 of the surface 1A of the support 1.
Further, not only the front surface 1A of the support 1 but the sacrificial pattern portion 3 may be formed only in the region R3 of the back surface 1B of the support 1, or formed only in the region R4 of the back surface 1B of the support 1. Further, it may be formed in both the region R3 and the region R4 of the back surface 1B of the support 1.

Even if it does in this way, if the sacrificial pattern part 3 has thickness T1 larger than the sum (T2 + T3) of the thickness of the conductive pattern part 2 in both surfaces of the support body 1, the elongate support body 1 will be used. To prevent the conductive pattern portions 2 facing each other from being damaged or deformed when they are in a roll form or when a plurality of sheet-like supports 1 are stacked and placed. Can do.

Embodiment 2
FIG. 10 shows the configuration of the transparent conductive film according to the second embodiment. This transparent conductive film is sacrificed on the front surface 1A and the back surface 1B of the support 1 in place of the sacrificial pattern portion 3 formed only on the front surface 1A of the support 1 in the transparent conductive film of the first embodiment. The pattern portions 3A and 3B are formed, and the support 1 and the plurality of conductive pattern portions 2 are the same as the transparent conductive film of the first embodiment.

On the surface 1A of the support 1, the conductive pattern portions 2 arranged in two rows are arranged at three locations between the both sides in the width direction DW of the support 1 and between the conductive pattern portions 2 arranged in two rows, respectively. The sacrificial pattern portion 3A is formed, and on the back surface 1B of the support 1, the conductive patterns arranged in two rows on both sides in the width direction DW of the support 1 with respect to the conductive patterns 2 arranged in two rows. Sacrificial pattern portions 3B are formed at three locations between the portions 2, respectively. That is, the sacrificial pattern portion 3A is formed in the region R1 shown in FIG. 9A, and the sacrificial pattern portion 3B is formed in the region R3.

The sum of the thicknesses of the sacrificial pattern portions 3A and 3B on both surfaces of the support 1 is on the thickness T2 of the conductive pattern portion 2 formed on the front surface 1A of the support 1 and the back surface 1B of the support 1. The conductive pattern portion 2 is formed so as to have a thickness T1 larger than the sum (T2 + T3) of the thicknesses T3.

Even when such sacrificial pattern portions 3A and 3B are used, for example, by forming the support 1 in a roll form, as shown in FIG. The sacrificial pattern portion 3A formed on the surface 1A of the lower layer support 1 is brought into contact with the sacrificial pattern portion 3B formed on the back surface 1B of the upper layer support 1 so as to overlap each other. An interval corresponding to the sum T1 of the thicknesses of the sacrificial pattern portions 3A and 3B is formed between the supports 1.

Therefore, the conductive pattern portion 2 positioned on the surface 1A of the lower layer support 1 and the conductive pattern portion 2 positioned on the back surface 1B of the upper layer support 1 are not in contact with each other. Thus, the conductive pattern portions 2 are prevented from being rubbed and scratched on the surface of the conductive pattern portion 2 or causing deformation such as smoothing. Therefore, when a transparent conductive film is incorporated in a module as a touch sensor, it is possible to avoid occurrence of a visibility failure that appears to be locally shining.
Further, in addition to forming the sacrificial pattern portions 3A and 3B in the regions R1 and R3, respectively, in one of the regions R2 and R4 which are regions at the same position as the conductive pattern portion 2 in the width direction DW of the support 1 A sacrificial pattern portion having a thickness T1 may be formed.

Instead of forming the sacrificial pattern portions 3A and 3B in the regions R1 and R3 shown in FIG. 9A, respectively, a region R2 and a region R2 that are regions at the same position as the conductive pattern portion 2 in the width direction DW of the support 1 Sacrificial pattern portions 3A and 3B may be formed on R4, respectively. Even if it does in this way, damage to the conductive pattern part 2 arrange | positioned on both surfaces of the support body 1 can be prevented.
However, when the support body 1 is manufactured by the roll-to-roll method, when the sacrificial pattern portions 3A and 3B are formed only in the regions R2 and R4, the support body 1 forms a plurality of layers and overlaps. The surface of the conductive pattern portion 2 formed on the front surface 1A of the support 1 is rubbed by the sacrificial pattern portion 3B formed in the region R4 of the back surface 1B of the support 1 and at the same time on the back surface 1B of the support 1 The surface of the formed conductive pattern portion 2 is rubbed by the sacrificial pattern portion 3A formed in the region R2 of the surface 1A of the support 1, and either the front surface 1A side or the back surface 1B side of the support 1 is arranged on the viewing side. Even if the touch sensor is configured, a visibility failure may occur. Therefore, in addition to the regions R2 and R4, it is desirable to form a sacrificial pattern portion having a total thickness of T1 in at least one of the regions R1 and R3.
In addition, when manufacturing a transparent conductive film with a sheet | seat using the sheet-like support body 1, when the some support body 1 is piled up, the conductive pattern part 2 of the support body 1 which forms an upper layer, and Since the conductive pattern portion 2 of the support 1 forming the lower layer overlaps with each other and the sacrifice pattern portions 3A and 3B formed in the regions R2 and R4 do not overlap with the conductive pattern portion 2, only the regions R2 and R4 are present. Sacrificial pattern portions 3A and 3B can be formed.

Embodiment 3
As described in the second embodiment, when the sacrificial pattern portions 3A and 3B are formed on the front surface 1A and the back surface 1B of the support 1, respectively, the support 1 is formed at the same position in the width direction DW. An uneven surface facing in the direction opposite to the support 1 can be formed on at least one of the sacrificial pattern portions 3A and 3B.
For example, as shown in FIG. 12, the sacrificial pattern portion 3 </ b> A disposed on the surface 1 </ b> A of the support 1 has an uneven surface 31 that faces in the opposite direction to the support 1. As shown in FIG. 13, the support 1 on which the sacrificial pattern portion 3 </ b> A having the uneven surface 31 and the sacrificial pattern portion 3 </ b> B having no uneven surface are formed, for example, in the form of a roll. Is formed on the surface 1A of the support 1 of the lower layer, the uneven surface 31 of the sacrificial pattern portion 3A is on the back 1B of the support 1 of the upper layer. In contact with the sacrificial pattern portion 3B.

Thereby, the sacrificial pattern portion 3 </ b> A is formed on the concavo-convex surface 31 even when a force is applied to move the support 1 in the width direction DW or the transport direction DT due to a winding shift of the support 1. Therefore, it is difficult to move relative to the sacrificial pattern portion 3B of the corresponding upper layer, and it is possible to more reliably prevent the conductive pattern portions 2 facing each other from being rubbed and damaged.
The concavo-convex surface 31 can have, for example, a concavo-convex shape having a height of about 0.1 μm and a period of about 100 μm to 1 mm.
As shown in FIG. 12, when the concave / convex surface 31 is formed on one sacrificial pattern portion 3A among the sacrificial pattern portions 3A and 3B formed at the same position in the width direction DW of the support 1. The sum of the thickness of the sacrificial pattern portion 3A and the thickness of the other sacrificial pattern portion 3B in the convex portion of the uneven surface 31 is the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1. It shall be set so that it may become a value larger than the sum of.
Also, a sacrificial surface 31 is formed on both the sacrificial pattern portions 3A and 3B formed on the front surface 1A and the back surface 1B of the support 1, and the sacrificial surface formed on the front surface 1A of the support 1 of the lower layer. You may comprise so that the uneven surface 31 of the pattern part 3A and the uneven surface 31 of the sacrificial pattern part 3B currently formed on the back surface 1B of the support body 1 of the upper layer may mutually contact. In this case, the thickness of the sacrificial pattern portion 3A at the convex portion of the concavo-convex surface 31 on the surface 1A side of the support 1 and the thickness of the sacrificial pattern portion 3B at the convex portion of the concavo-convex surface 31 on the back surface 1B side of the support 1 are determined. It is assumed that the total is set to a value larger than the sum of the thicknesses of the conductive pattern portions 2 formed on the front surface 1A and the back surface 1B of the support 1.

Embodiment 4
In the first embodiment, as shown in FIG. 1, the sacrificial pattern portion 3 is continuously formed in the transport direction DT of the support 1 so as to cover the plurality of conductive pattern portions 2. 14, as shown in FIG. 14, the plurality of sacrificial pattern portions 3 are transferred to the support 1 corresponding to the plurality of conductive pattern portions 2 arranged along the transfer direction DT of the support 1. An array can also be formed in the direction DT.
Even if it does in this way, damage to the conductive pattern part 2 arrange | positioned on both surfaces of the support body 1 can be prevented.

Hereinafter, the present invention will be described in more detail based on examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the following examples.

Example 1
As shown in FIG. 8, on the front surface 1A and back surface 1B of the support 1 having a thickness of 40 μm, a width W = 50 cm and a length of 5000 m, a square having a line width of 3.0 μm and a pitch of 500 μm is formed by the pattern forming method shown below. A conductive pattern portion 2 is formed in which the lattice pattern is formed in an area where the width A = 15 cm and the length B = 20 cm and the intersection of each square lattice overlaps the center of each square opening with the support 1 interposed therebetween. In addition, on the surface 1A of the support 1, an opening of 20 μm is provided from the formation region of the conductive pattern portion 2 to form the sacrificial pattern portion 3 having a uniform solid pattern in the region R1 shown in FIG. Thus, a transparent conductive film in a roll form was produced. The sacrificial pattern portion 3 has a thickness larger than the sum of the thicknesses of the conductive pattern portions 2 formed on the front surface 1A and the back surface 1B of the support 1. Further, the surface of the sacrificial pattern portion 3 facing in the opposite direction to the support 1 is a flat surface.

The conductive pattern portion 2 is formed by repeating two shots in the transport direction DT, with six pieces arranged in two rows in the transport direction DT as one row, with two in the width direction DW of the support 1 being one row. did. Here, in one shot, the interval G1 between the conductive pattern portions 2 arranged in the width direction DW was 5 cm, and the interval G2 between the conductive pattern portions 2 arranged in the transport direction DT was 5 cm. The interval G3 between the conductive pattern portions 2 between shots was 10 cm. In this way, the conductive pattern portion 2 was formed over the entire length of the support 1.

<Pattern formation method>
(Preparation of silver halide emulsion)
To the following 1 liquid maintained at 38 ° C. and pH 4.5, an amount corresponding to 90% of each of the following 2 and 3 liquids was simultaneously added over 20 minutes while stirring to form 0.16 μm core particles. Subsequently, the following 4 and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

1 liquid:
750 ml of water
9g gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
Two liquids:
300 ml of water
150 g silver nitrate
3 liquids:
300 ml of water
Sodium chloride 38g
Potassium bromide 32g
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) 8 ml
Ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) 10 ml
4 liquids:
100ml water
Silver nitrate 50g
5 liquids:
100ml water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

Then, it was washed with water by a flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting step. The emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, and gelatin 3.9 g, sodium benzenethiosulfonate 10 mg, sodium benzenethiosulfinate 3 mg, sodium thiosulfate 15 mg and chloroauric acid 10 mg were added. Chemical sensitization to obtain optimum sensitivity at 0 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as preservative It was. The finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.

(Preparation of photosensitive layer forming composition)
1,3,3a, 7-tetraazaindene 1.2 × 10 −4 mol / mol Ag, hydroquinone 1.2 × 10 −2 mol / mol Ag, citric acid 3.0 × 10 −4 mol / Mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mol Ag, a trace amount of hardener was added, and the coating solution pH was adjusted to 5.6 using citric acid. Adjusted.
A polymer latex containing a dispersant composed of a polymer represented by (P-1) and a dialkylphenyl PEO sulfate with respect to gelatin contained in the coating solution (dispersant / polymer mass ratio is 2.0 / 100 = 0.02) and polymer / gelatin (mass ratio) = 0.5 / 1.

Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a crosslinking agent. In addition, the addition amount of the crosslinking agent was adjusted so that the amount of the crosslinking agent in the photosensitive layer described later would be 0.09 g / m ² .
A photosensitive layer forming composition was prepared as described above.
The polymer represented by the above (P-1) was synthesized with reference to Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

(Photosensitive layer forming step)
The polymer latex was applied to both surfaces of the support 1 to provide an undercoat layer having a thickness of 0.05 μm.
Next, an antihalation layer made of a mixture of the polymer latex and gelatin and a dye having an optical density of about 1.0 and decolorizing with an alkali of a developer was provided on the undercoat layer. The mixing mass ratio of polymer to gelatin (polymer / gelatin) was 2/1, and the polymer content was 0.65 g / m ² .
On the antihalation layer, the photosensitive layer forming composition was applied, a gelatin layer having a thickness of 0.15 μm was further provided, and a support having a photosensitive layer formed on both sides was obtained. Let the support body in which the photosensitive layer was formed in both surfaces be the film A. FIG. The formed photosensitive layer had a silver amount of 6.2 g / m ² and a gelatin amount of 1.0 g / m ² .

(Exposure development process)
8 on both sides of the film A through a photomask of the conductive pattern portion 2 and the sacrificial pattern portion 3 in FIG. 8 and a neutral density filter disposed only on the conductive pattern portion 2 on the light source side of the photomask. Exposure was performed using parallel light using a mercury lamp as a light source. The neutral density filter reduces the amount of light irradiated to the conductive pattern portion 2 from the amount of light irradiated to the sacrificial pattern portion 3, thereby reducing the thickness of the sacrificial pattern portion 3 on both surfaces of the film A. This is for making the value larger than the sum of the thicknesses of the pattern portions 2.
After the exposure, the film was developed with the following developer, and further developed using a fixer (trade name: N3X-R for CN16X, manufactured by Fuji Film Co., Ltd.). Furthermore, by rinsing with pure water and drying, a support having a functional pattern made of Ag fine wires, a thickness adjusting pattern made of Ag fine wires, and a gelatin layer on both surfaces was obtained. The gelatin layer was formed between the Ag fine wires. The resulting film is referred to as film B.

(Developer composition)
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037mol / L
N-methylaminophenol 0.016 mol / L
Sodium metaborate 0.140 mol / L
Sodium hydroxide 0.360 mol / L
Sodium bromide 0.031 mol / L
Potassium metabisulfite 0.187 mol / L

(Gelatin decomposition treatment)
The film B was immersed in an aqueous solution (proteolytic enzyme concentration: 0.5 mass%, liquid temperature: 40 ° C.) of a proteolytic enzyme (Biosease AL-15FG manufactured by Nagase ChemteX) for 120 seconds. The film B was taken out from the aqueous solution, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, and washed. The film after gelatin degradation is designated as film C.

(Low resistance treatment)
The film C was calendered at a pressure of 30 kN using a calender device comprising a metal roller. At this time, a PET film having a rough surface shape with a line roughness Ra = 0.2 μm, Sm = 1.9 μm (measured with a shape analysis laser microscope VK-X110 manufactured by Keyence Corporation (JIS-B-0601-1994)). Two sheets were conveyed together such that these rough surfaces faced the front and back surfaces of the film C, and a rough surface shape was transferred and formed on the front and back surfaces of the film C.
After the calendar treatment, a heat treatment was performed by passing through a superheated steam tank having a temperature of 150 ° C. over 120 seconds. The film after the heat treatment is referred to as film D. This film D is a transparent conductive film.
The average thickness of the silver portion of the conductive pattern portion 2 and the sacrificial pattern portion 3 of the film D was measured with a shape analysis laser microscope VK-X110 manufactured by Keyence Corporation. The results are shown in Table 1.

Example 2
The conductive pattern portion 2 is formed only on the surface 1A of the support 1, and the thickness of the sacrificial pattern portion 3 formed in the region R1 is greater than the thickness of the conductive pattern portion 2 formed on the surface 1A of the support 1. A roll-shaped transparent conductive film was prepared according to the same procedure as in Example 1 except that the type of neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so as to obtain a large value.

Example 3
The sacrificial pattern portion 3 is formed in the region R1 on the front surface 1A of the support 1 and the region R3 on the back surface 1B, and the thickness of the sacrificial pattern portion 3 formed in these regions R1 and R3 is the support 1 respectively. Example 1 except that the type of the neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so that the thickness was larger than the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B. A roll-shaped transparent conductive film was prepared according to the same procedure as described above.

Example 4
Sacrificial pattern portions 3 are formed in regions R1 and R2 on the surface 1A of the support 1, and the thicknesses of the sacrificial pattern portions 3 formed in these regions R1 and R2 are respectively on the surface 1A of the support 1 and Except for adjusting the type of neutral density filter used during exposure, the exposure amount, and the photomask so as to be larger than the sum of the thicknesses of the conductive pattern portions 2 formed on the back surface 1B, the same as in Example 1. A transparent conductive film in the form of a roll was prepared according to the above procedure.

Example 5
The sacrificial pattern portion 3 is formed only in the region R2 on the front surface 1A of the support 1, and the thickness of the sacrificial pattern portion 3 is the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1. A roll-shaped transparent conductive film was produced according to the same procedure as in Example 1 except that the type of neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so as to have a value larger than the sum of the thicknesses.

Example 6
The sacrificial pattern portion 3 is formed only in the region R3 on the back surface 1B of the support 1, and the thickness of the sacrificial pattern portion 3 is the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1. A roll-shaped transparent conductive film was produced according to the same procedure as in Example 1 except that the type of neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so as to have a value larger than the sum of the thicknesses.

Example 7
The sacrificial pattern portion 3 is formed only in the region R4 on the back surface 1B of the support 1, and the thickness of the sacrificial pattern portion 3 is the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1. A roll-shaped transparent conductive film was produced according to the same procedure as in Example 1 except that the type of neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so as to have a value larger than the sum of the thicknesses.

Example 8
In addition to the sacrificial pattern portion 3 formed in the region R1 on the front surface 1A of the support 1 and the region R3 on the back surface 1B, the region R2 on the front surface 1A of the support 1 includes the top surface 1A and back surface of the support 1 Except for adjusting the type and amount of light-reducing filter used for exposure, and the photomask so that a sacrificial pattern portion 3 having a thickness larger than the sum of the thicknesses of the conductive pattern portions 2 formed on 1B is formed. Produced a roll-shaped transparent conductive film according to the same procedure as in Example 3. Note that the thickness of the sacrificial pattern portion 3 formed in the region R2 is set to a value smaller than the total thickness of the sacrificial pattern portion 3 formed in the regions R1 and R3.

Example 9
Except for forming an uneven surface 31 facing away from the support 1 in the sacrificial pattern portion 3 formed in the region R1 on the front surface 1A and the region R3 on the back surface 1B of the support 1, the same as in Example 8. Thus, a roll-shaped transparent conductive film was produced. The concavo-convex surface 31 was formed by adjusting the exposure amount alternately in parallel with the transport direction DT of the support 1 and at a cycle of 1 mm. Note that the uneven surface 31 can be formed even if the difference in the average level difference is left by the calendar process for transferring the rough surface shape.

Example 10
The conductive pattern portion 2 is formed on the front surface 1A and the back surface 1B of the support 1 and the sacrificial pattern portion 3 is formed only in the region R1 on the front surface 1A of the support 1, and the thickness of the sacrificial pattern portion 3 is The type of the neutral density filter used during exposure, the exposure amount, and the photomask are adjusted so as to be larger than the sum of the thicknesses of the conductive pattern portions 2 formed on the front surface 1A and the back surface 1B of the support 1. A sheet-like transparent conductive film was produced according to the same procedure as in Example 1 except that.

Example 11
Conductive pattern portions 2 are respectively formed on the front surface 1A and the back surface 1B of the support 1, and a sacrificial pattern portion 3 is formed in the region R2 on the front surface 1A of the support 1 and the region R4 on the back surface 1B. Exposure is performed so that the thickness of the sacrificial pattern portion 3 formed in the regions R2 and R4 is larger than the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1, respectively. A sheet-shaped transparent conductive film was prepared according to the same procedure as in Example 1 except that the type of neutral density filter used, the exposure amount, and the photomask were adjusted.
In Examples 10 and 11, 5,000 sheet samples having one shot in Example 1 as one unit were stacked on a horizontal plane.

Comparative Example 1
Other than adjusting the type of the neutral density filter used during exposure, the exposure amount, and the photomask so that the conductive pattern portion 2 is formed only on the surface 1A of the support 1 and the sacrificial pattern portion 3 is not formed in any region. Produced a roll-shaped transparent conductive film according to the same procedure as in Example 1.

Comparative Example 2
Used during exposure so that the thickness of the sacrificial pattern portion 3 formed in the region R1 is equal to the sum of the thicknesses of the conductive pattern portions 2 formed on the front surface 1A and the back surface 1B of the support 1. A roll-shaped transparent conductive film was prepared according to the same procedure as in Example 1 except that the type of the neutral density filter, the exposure amount, and the photomask were adjusted.

Comparative Example 3
The sacrificial pattern portion 3 is formed in the region R1 on the front surface 1A of the support 1 and the region R3 on the back surface 1B, and the thickness of the sacrificial pattern portion 3 formed in the region R1 is formed on the surface 1A of the support 1 Although the thickness of the sacrificial pattern portion 3 formed in the regions R1 and R3 is larger than the thickness of the conductive pattern portion 2 to be formed, the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B of the support 1 is larger. A roll-shaped transparent conductive film was produced according to the same procedure as in Example 1 except that the type and amount of the neutral density filter used during exposure and the photomask were adjusted so that the value was smaller than the sum of the thickness.

Comparative Example 4
The sacrificial pattern portion 3 is formed in the region R1 on the front surface 1A of the support 1 and the region R3 on the back surface 1B, and the thickness of the sacrificial pattern portion 3 formed in these regions R1 and R3 is the support 1 respectively. Example 1 with the exception of adjusting the type and exposure amount of the neutral density filter used during exposure and the photomask so that the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B is the same as that of the first embodiment. A roll-shaped transparent conductive film was produced according to the same procedure.

Comparative Example 5
The sacrificial pattern portion 3 is formed in the region R2 on the front surface 1A and the region R4 on the back surface 1B of the support 1, and the thickness of the sacrificial pattern portion 3 formed in these regions R1 and R3 is the support 1 respectively. Example 1 except that the type of the neutral density filter used during exposure, the exposure amount, and the photomask were adjusted so that the thickness was larger than the thickness of the conductive pattern portion 2 formed on the front surface 1A and the back surface 1B. A roll-shaped transparent conductive film was prepared according to the same procedure as described above.

Comparative Example 6
The type, exposure amount, and photo of the neutral density filter used during exposure are such that the conductive pattern portion 2 is formed on the front surface 1A and the back surface 1B of the support 1 and the sacrificial pattern portion 3 is not formed in any region. A sheet-shaped transparent conductive film was prepared according to the same procedure as in Example 1 except that the mask was adjusted.
In Comparative Example 6, 5000 sheet samples each having one shot in Example 1 as one unit were stacked on a horizontal plane.

With respect to the transparent conductive films produced in Examples 1 to 11 and Comparative Examples 1 to 6, the conductive pattern portion 2 disposed on the front surface 1A side of the support 1 and the back surface 1B side of the support 1 are disposed. When the local glare of the conductive pattern portion 2 was evaluated, results as shown in Table 1 below were obtained.

The evaluation method of local glare is as follows.
First, for local glare observation from the surface 1A side of the support 1, the support is located between the 10th shot and the 30th shot inside the roll of the produced transparent conductive film and the conductive pattern portion 2 is formed on both sides 30 pieces of the body 1 are arbitrarily cut out, one surface of a transparent optical adhesive film (manufactured by 3M, 8146-2) is bonded to the surface 1A side of the support 1, and the other side of the bonded transparent optical adhesive film is bonded. A white plate glass is pasted on the surface, and then another transparent optical adhesive film (manufactured by 3M, 8146-2) is pasted on the back surface 1B side of the support 1, and then the pasted transparent optical adhesive film A conductive pattern including a mesh pattern electrode made of a fine metal wire by bonding a 100 μm thick PET (polyethylene terephthalate) film on the other surface of The evaluation sample SA1 which emission unit 2 is sandwiched by white plate glass and PET film were prepared 30 sheets.

Further, for local glare observation from the back surface 1B side of the support 1, the support is located between the 10th shot and the 30th shot inside the roll of the produced transparent conductive film, and the conductive pattern portion 2 is formed on both surfaces. 30 pieces of the body 1 are arbitrarily cut out, one side of a transparent optical adhesive film (manufactured by 3M, 8146-2) is bonded to the back surface 1B side of the support 1, and the other side of the bonded transparent optical adhesive film is further bonded. A white plate glass is pasted on the surface, and then, one surface of a transparent optical adhesive film (manufactured by 3M, 8146-2) is pasted on the surface 1A side of the support 1, and further, the pasted transparent optical adhesive is laminated. By attaching a 100 μm thick PET (polyethylene terephthalate) film on the other side of the film, an electrode in a mesh pattern made of fine metal wires is included. Conductive pattern section 2 was produced 30 pieces of evaluation sample SA2 sandwiched between white plate glass and PET film.

In addition, the transparent conductive film of the sheet form in Examples 10 and 11 and Comparative Example 6 is located between the 10th shot and the 30th shot inside the roll of the transparent conductive film, and the conductive pattern portions 2 are formed on both surfaces. Instead of the support 1, the same method as described above is used except that the support 1 is used which is located between the 10th sheet and the 30th sheet on the lower side of the sheet laminate and the conductive pattern portion 2 is formed on both surfaces. Then, evaluation samples SA1 and SA2 were produced.

The local glare from the surface 1A side of the support 1 was evaluated from the following viewpoints by observing 30 prepared evaluation samples SA1 under sunlight from a glass surface. Moreover, the local glare from the back surface 1B side of the support 1 was evaluated from the following viewpoints by observing the 30 evaluation samples SA2 produced under sunlight from the glass surface.

The evaluation result A shows that, in 28 or more evaluation samples out of 30, there are no locally strong regions of light reflection, and the in-plane uniform visibility can be suitably used.
Evaluation result B shows that 3 or more of 30 evaluation samples have locally strong light reflection areas, but the strong light reflection areas are within a narrow area of 5 mm square or increase in local light reflection. This is a small increase that cannot be seen under room light, indicating that there is no practical problem.
Evaluation result C indicates that 3 to 15 evaluation samples out of 30 have a region where the light reflection is locally strong, and the region where the light reflection is strong is wider than 5 mm square, or under the room light. However, it is a large increase that can be visually recognized, which indicates that there is a problem in practical use.
Evaluation result D indicates that 16 or more evaluation samples out of 30 have a region with strong light reflection locally, and the region with strong light reflection is wider than 5 mm square, or can be visually recognized even under room light. This is a large increase, which indicates that a big problem will occur in practice.

In Examples 1 to 11 in which the total thickness of the sacrificial pattern portion 3 has a value larger than the sum of the thicknesses of the conductive pattern portions 2, at least one of the front surface 1A side and the back surface 1B side of the support 1, The evaluation result of local glare was A or B, and it was confirmed that it can be suitably used when a touch sensor is configured.
In particular, in Examples 1, 3, 6 and 8-11, the evaluation result of local glare was A or B on both the front surface 1A side and the back surface 1B side of the support 1, and the surface 1A side of the support 1 and Regardless of which side of the back surface 1B is disposed on the viewing side, a touch sensor having suitable visibility can be configured.
In Example 8, the thickness of the sacrificial pattern portion 3 formed in the region R2 is formed in the regions R1 and R3 on the front surface 1A and the back surface 1B of the support 1 and in the same position in the width direction DW. In such a case, only the total thickness of the sacrificial pattern portion 3 formed in the regions R1 and R3 is considered, and these regions R1 are set. And the total thickness of the sacrificial pattern portion 3 formed in R3 only needs to have a value larger than the sum of the thicknesses of the conductive pattern portions 2.
Further, in Example 9, both the sacrificial pattern portions 3A and 3B formed on the front surface 1A and the back surface 1B of the support 1 have the uneven surface 31, but Table 1 shows the thickness of the sacrificial pattern portion. In addition, the thickness of the sacrificial pattern part in the convex part of the uneven surface 31 and the thickness of the sacrificial pattern part in the concave part are described together. In the case of the ninth embodiment, only the total thickness of the sacrificial pattern portion in the convex portion of the uneven surface 31 is considered, and the total thickness only needs to have a value larger than the sum of the thicknesses of the conductive pattern portions 2. .

In Examples 2, 4 and 5, the evaluation result of local glare is A or B on the surface 1A side of the support 1, and the surface 1A side of the support 1 is arranged on the viewing side, so that suitable visual recognition is possible. The touch sensor which has property can be comprised.
Furthermore, in Example 7, the evaluation result of local glare is B on the back surface 1B side of the support 1, and the touch sensor having suitable visibility is arranged by arranging the back surface 1B side of the support 1 on the viewing side. Can be configured.

On the other hand, Comparative Examples 1 and 6 having no sacrificial pattern portion 3 and Comparative Examples 2 to 4 in which the total thickness of the sacrificial pattern portion 3 is equal to or less than the sum of the thicknesses of the conductive pattern portions 2 When the evaluation result of local glare is C or D on any of the 1A side and the back surface 1B side, and the touch sensor is configured regardless of whether the front surface 1A side or the back surface 1B side of the support 1 is arranged on the viewing side In practice, it was confirmed that problems occur.

In addition, the sacrificial pattern portion 3 has a total thickness that is greater than the sum of the thicknesses of the conductive pattern portions 2 formed on the front surface 1A and the back surface 1B of the support 1. In Comparative Example 5 in which is formed on both surfaces of the regions R2 and R4, the evaluation result of local glare is D on both the front surface 1A side and the back surface 1B side of the support 1, and the surface 1A side of the support 1 It has been confirmed that no matter which of the rear surface 1B side and the rear surface 1B side is arranged on the viewing side, a problem is caused in practice when the touch sensor is configured.
This is because the sacrificial pattern portion 3 is formed in both the regions R2 and R4, and the sacrificial pattern portion 3 is not formed in the regions R1 and R3. The surface of the conductive pattern portion 2 formed on the surface 1A of the support 1 and the surface of the conductive pattern portion 2 formed on the back surface 1B of the support 1 are rubbed to cause a visibility failure. It is thought to have occurred.

1,41 support body, 1A support body surface, 1B support body back surface, 2,42 conductive pattern part, 3,3A, 3B sacrificial pattern part, 11 first electrode, 11A first metal wire, 12 first peripheral wiring , 13 2nd electrode, 13A 2nd metal fine wire, 14 2nd peripheral wiring, 21 delivery roll, 22 transport roller, 23 conductive layer forming part, 24 winding roll, 31 uneven surface, DT transport direction, DW width direction, T1 Sacrificial pattern part thickness, T2, T3 Conductive pattern part thickness, S1 view area, S2 peripheral area, D1 first direction, D2 second direction, A width, B length, G1-G3 spacing, R1 ~ R4 area.

Claims (20)

1. A transparent support,
   A conductive pattern portion formed on one or both surfaces of the support and including an electrode made of a fine metal wire;
   A sacrificial pattern portion formed on a region other than both regions of the support at a position where the conductive pattern portion is formed and on one surface or both surfaces of the support, and
   A transparent conductive film in which a sum of thicknesses of the sacrificial pattern portions on the both surfaces of the support is larger than a sum of thicknesses of the conductive pattern portions on the both surfaces of the support.
2. The conductive pattern portion is formed on one surface of the support,
   The sacrificial pattern portion is on the same surface as the surface of the support on which the conductive pattern portion is formed or on the surface opposite to the surface of the support on which the conductive pattern portion is formed or on both surfaces of the support. The transparent conductive film according to claim 1 formed on the top.
3. The conductive pattern portion is formed on both surfaces of the support,
   2. The transparent conductive film according to claim 1, wherein the sacrificial pattern portion is formed on either one of both surfaces of the support or on both surfaces of the support.
4. The support has a long film shape and is rolled.
   A plurality of the conductive pattern portions are arranged at preset positions in the width direction of the support body along the transport direction of the support body and orthogonal to the transport direction of the support body,
   The sacrificial pattern portion is along one of the surfaces of the support at a position different from the plurality of the conductive pattern portions in the width direction of the support and in the width direction of the support. The transparent conductive film according to any one of claims 1 to 3, which is formed on both surfaces of the support.
5. The support has a long film shape and is rolled.
   A plurality of the conductive pattern portions are arranged at preset positions in the width direction of the support body along the transport direction of the support body and orthogonal to the transport direction of the support body,
   The sacrificial pattern portion is formed on any one surface of both sides of the support body along the transport direction of the support body and at the same position as the plurality of conductive pattern portions in the width direction of the support body. The transparent conductive film according to any one of claims 1 to 3.
6. 6. The transparent conductive film according to claim 4, wherein the sacrificial pattern portions are respectively formed on both sides of the plurality of conductive pattern portions in the width direction of the support.
7. The plurality of sacrificial pattern portions are arranged in the transport direction of the support in correspondence with the plurality of conductive pattern portions arranged along the transport direction of the support. The transparent conductive film as described in the item.
8. The sacrificial pattern portion that is continuous over a plurality of the conductive pattern portions arranged along the transport direction of the support is formed in the transport direction of the support. Transparent conductive film.
9. The sacrificial pattern portions are respectively formed on the both surfaces of the support and at the same position in the width direction of the support,
   The transparent conductive film according to any one of claims 4 to 8, wherein at least one of the sacrificial pattern portions formed on the both surfaces of the support has an uneven surface facing a direction opposite to the support. .
10. The transparent conductive film according to claim 9, wherein each of the sacrificial pattern portions formed on the both surfaces of the support has an uneven surface facing a direction opposite to the support.
11. The sum of the thicknesses of the sacrificial pattern portions on the both surfaces of the support is 0.1 μm or more larger than the sum of the thicknesses of the conductive pattern portions on the both surfaces of the support. The transparent conductive film as described in any one of Claims.
12. The transparent conductive film according to any one of claims 1 to 11, wherein the sacrificial pattern portion is electrically connected to at least one of the conductive pattern portions.
13. The conductive pattern part and the sacrificial pattern part are made of the same conductive material containing at least one metal among gold, silver, copper, nickel, palladium, platinum, lead, tin, and chromium. The transparent conductive film according to any one of 1 to 12.
14. A first step of forming a conductive pattern portion including a conductive portion made of a fine metal wire on one side or both sides of a transparent support;
    A second step of forming a sacrificial pattern portion in a region other than regions on both sides of the support at a position where the conductive pattern portion is formed, and on one surface or both surfaces of the support. A method for producing a transparent conductive film, wherein a sum of thicknesses of the sacrificial pattern portions on both surfaces of the support is made larger than a sum of thicknesses of the conductive pattern portions on the both surfaces of the support.
15. The support has a long film shape,
    The method for producing a transparent conductive film according to claim 14, wherein the conductive pattern portion and the sacrificial pattern portion are formed on one surface or both surfaces of the support, respectively, while the support is rolled.
16. The method for producing a transparent conductive film according to claim 14 or 15, wherein the first step and the second step are simultaneously performed.
17. The first step and the second step are:
    A third step of forming a silver salt emulsion layer on one side or both sides of the support;
    The manufacturing method of the transparent conductive film of Claim 16 including the 4th process of exposing and developing the said silver salt emulsion layer and forming the said conductive pattern part which consists of metallic silver, and the said sacrificial pattern part.
18. In the fourth step, by making the exposure amount for the sacrificial pattern portion larger than the exposure amount for the conductive pattern portion, the total thickness of the sacrificial pattern portion on the both surfaces of the support is set to The manufacturing method of the transparent conductive film of Claim 17 made larger than the sum of the thickness of the said conductive pattern part on the said both surfaces.
19. A touch sensor having a transparent view area,
    The transparent conductive film according to claim 13 is provided,
    The touch sensor in which the conductive pattern portion is disposed in the view area and the sacrificial pattern portion is disposed outside the view area.
20. The touch sensor according to claim 19, wherein the sacrificial pattern part includes a peripheral wiring electrically connected to the conductive pattern part.
    

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