JP5008266B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
- Publication number
- JP5008266B2 JP5008266B2 JP2005085530A JP2005085530A JP5008266B2 JP 5008266 B2 JP5008266 B2 JP 5008266B2 JP 2005085530 A JP2005085530 A JP 2005085530A JP 2005085530 A JP2005085530 A JP 2005085530A JP 5008266 B2 JP5008266 B2 JP 5008266B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor
- substrate
- insulating film
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005085530A JP5008266B2 (ja) | 2004-03-25 | 2005-03-24 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004088613 | 2004-03-25 | ||
JP2004088613 | 2004-03-25 | ||
JP2005085530A JP5008266B2 (ja) | 2004-03-25 | 2005-03-24 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005311342A JP2005311342A (ja) | 2005-11-04 |
JP2005311342A5 JP2005311342A5 (zh) | 2008-04-10 |
JP5008266B2 true JP5008266B2 (ja) | 2012-08-22 |
Family
ID=35439690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005085530A Expired - Fee Related JP5008266B2 (ja) | 2004-03-25 | 2005-03-24 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5008266B2 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989304B2 (en) * | 2006-03-28 | 2011-08-02 | Sharp Kabushiki Kaisha | Method for transferring semiconductor element, method for manufacturing semiconductor device, and semiconductor device |
JP5460108B2 (ja) | 2008-04-18 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
JP2003229548A (ja) * | 2001-11-30 | 2003-08-15 | Semiconductor Energy Lab Co Ltd | 乗物、表示装置、および半導体装置の作製方法 |
-
2005
- 2005-03-24 JP JP2005085530A patent/JP5008266B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005311342A (ja) | 2005-11-04 |
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