JP5004300B2 - 温度センサ付流路形成体 - Google Patents
温度センサ付流路形成体 Download PDFInfo
- Publication number
- JP5004300B2 JP5004300B2 JP2008112099A JP2008112099A JP5004300B2 JP 5004300 B2 JP5004300 B2 JP 5004300B2 JP 2008112099 A JP2008112099 A JP 2008112099A JP 2008112099 A JP2008112099 A JP 2008112099A JP 5004300 B2 JP5004300 B2 JP 5004300B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- flow path
- seal fitting
- temperature
- sheath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- OOYGSFOGFJDDHP-KMCOLRRFSA-N kanamycin A sulfate Chemical group OS(O)(=O)=O.O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CN)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O[C@@H]2[C@@H]([C@@H](N)[C@H](O)[C@@H](CO)O2)O)[C@H](N)C[C@@H]1N OOYGSFOGFJDDHP-KMCOLRRFSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 238000005219 brazing Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000012530 fluid Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 3
- 229910000856 hastalloy Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000809 Alumel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910001179 chromel Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Landscapes
- Micromachines (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
流路を形成するシール金具(11)と、
前記シール金具(11)に巻きつき、少なくとも測温部(37)が前記シール金具(11)に銀ろうで接合され、
一方が閉端で他方が開端である筒状のシース(31)と、
前記シース(31)の中に接合部38が配置された熱電対要素(32)と、
前記シースの中に入れられた充填部材(33)を有し、
前記熱電対要素の端子とリード線を接続するアダプタ(34)を有する
温度センサ(12)と、
前記シール金具(11)と前記温度センサ(12)の全体を含み前記アダプタ(34)のリード線側以外を被覆する断熱部材(13)を有する温度センサ付流路形成体(1)を提供する。
τ=C/(α・A)・・・・・・(1)
C:物体の熱容量 Kcal/℃
α:平均熱伝達率 Kcal/(m2・℃・s)
A:物体の表面積 m2
11 シール金具
12 温度センサ
13 断熱部材
21 流路
22 シール金具の肉厚
31 シース
32 熱電対要素
33 充填部材
34 アダプタ
35 リード線
36 測定器
37 測温部
38 接合点
40 ろう材
Claims (3)
- 流路を形成するシール金具(11)と、
前記シール金具(11)に巻きつき、少なくとも測温部(37)が前記シール金具(11)に銀ろうで接合され、
一方が閉端で他方が開端である筒状のシース(31)と、
前記シース(31)の中に接合部38が配置された熱電対要素(32)と、
前記シースの中に入れられた充填部材(33)を有し、
前記熱電対要素の端子とリード線を接続するアダプタ(34)を有する
温度センサ(12)と、
前記シール金具(11)と前記温度センサ(12)の全体を含み前記アダプタ(34)のリード線側以外を被覆する断熱部材(13)を有する温度センサ付流路形成体(1)。 - 前記シール金具(11)の流路断面積は1mm2乃至8mm2である請求項1に記載された温度センサ付流路形成体。
- 前記シール金具(11)はニッケル合金であって、流路肉厚は0.35mmである請求項1または2のいずれかの請求項に記載された温度センサ付流路形成体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008112099A JP5004300B2 (ja) | 2008-04-23 | 2008-04-23 | 温度センサ付流路形成体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008112099A JP5004300B2 (ja) | 2008-04-23 | 2008-04-23 | 温度センサ付流路形成体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009262015A JP2009262015A (ja) | 2009-11-12 |
JP5004300B2 true JP5004300B2 (ja) | 2012-08-22 |
Family
ID=41388546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008112099A Active JP5004300B2 (ja) | 2008-04-23 | 2008-04-23 | 温度センサ付流路形成体 |
Country Status (1)
Country | Link |
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JP (1) | JP5004300B2 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH624763A5 (en) * | 1978-04-27 | 1981-08-14 | Sulzer Ag | Temperature-measuring device having a sheathed thermocouple, and method for producing the same |
JPS55133334U (ja) * | 1979-03-16 | 1980-09-20 | ||
JPS59155731A (ja) * | 1983-02-25 | 1984-09-04 | Mitsubishi Heavy Ind Ltd | 測温体の装着方法 |
JPS63222233A (ja) * | 1987-03-12 | 1988-09-16 | Toa Nenryo Kogyo Kk | 流体処理系における温度計測方法 |
JPH01145537A (ja) * | 1987-12-02 | 1989-06-07 | Mitsubishi Heavy Ind Ltd | 温度測定用熱電対 |
JPH04191626A (ja) * | 1990-11-26 | 1992-07-09 | Mitsubishi Heavy Ind Ltd | 表面温度測定センサ |
JPH0712652A (ja) * | 1993-06-25 | 1995-01-17 | Toshiba Corp | シース形熱電対 |
JP3344603B2 (ja) * | 1994-05-12 | 2002-11-11 | 東京エレクトロン株式会社 | 温度測定装置及び温度測定方法 |
JPH0854289A (ja) * | 1994-08-11 | 1996-02-27 | Sokuon Kogyo:Kk | センサ取付構造 |
JP2002095958A (ja) * | 2000-09-27 | 2002-04-02 | Ymc Co Ltd | 液相の同時合成装置 |
DE10212249A1 (de) * | 2002-03-20 | 2003-10-02 | Behr Gmbh & Co | Wärmetauscher und Kühlsytem |
JP2005083831A (ja) * | 2003-09-05 | 2005-03-31 | Nippon Flaekt Kk | 配管用温度計 |
JP4313768B2 (ja) * | 2005-02-16 | 2009-08-12 | 株式会社日立製作所 | 反応システム |
JP4804091B2 (ja) * | 2005-09-30 | 2011-10-26 | 凸版印刷株式会社 | 反応容器 |
JP2007144288A (ja) * | 2005-11-25 | 2007-06-14 | Canon Inc | 化学装置 |
JP4695570B2 (ja) * | 2006-07-28 | 2011-06-08 | 東レエンジニアリング株式会社 | マイクロリアクタ流路形成体へのマイクロリアクタ用温度センサの取付構造 |
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2008
- 2008-04-23 JP JP2008112099A patent/JP5004300B2/ja active Active
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JP2009262015A (ja) | 2009-11-12 |
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