JP4994365B2 - ホール素子及び磁気センサ - Google Patents
ホール素子及び磁気センサ Download PDFInfo
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- JP4994365B2 JP4994365B2 JP2008509820A JP2008509820A JP4994365B2 JP 4994365 B2 JP4994365 B2 JP 4994365B2 JP 2008509820 A JP2008509820 A JP 2008509820A JP 2008509820 A JP2008509820 A JP 2008509820A JP 4994365 B2 JP4994365 B2 JP 4994365B2
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- 239000012535 impurity Substances 0.000 claims description 70
- 239000000758 substrate Substances 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 35
- 230000035945 sensitivity Effects 0.000 description 24
- 238000010586 diagram Methods 0.000 description 17
- 238000009792 diffusion process Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000015556 catabolic process Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
- G01R33/072—Constructional adaptation of the sensor to specific applications
- G01R33/075—Hall devices configured for spinning current measurements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/101—Semiconductor Hall-effect devices
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
Description
図3は、本発明のホール素子の抵抗値と磁気感度の関係を示す図で、低濃度のnウェルが感度上昇に及ぼす影響を示すグラフを示している。図中の実線丸印がクロス型、破線丸印が角型のホール素子を示し、右上の丸印が本発明のホール素子、左下の丸印がノーマルなホール素子を示している。ホール素子は、一定電流で駆動されており、磁気感度は単位電流、単位磁場当たりの出力電圧で表されている。より理解しやすくするために、数値を表1に示す。この表1は、本発明のホール素子の抵抗値と磁気感度をまとめた表である。
12 n型の半導体領域(nウェル)
13a,13d,13e コンタクト領域(n+拡散層)
14 p型拡散層(pウェル)
21 p型半導体基板層
21a p型基板領域
22 n型不純物領域(nウェル)
23 p型不純物領域(p+拡散層)
24 n型領域(n+拡散層)
25 p型領域(p+拡散層)
26 感磁部
27 電極
28 空乏層
C1,C2,C3 接合容量
31a〜31h ホール素子(クロス型)
32 磁性体
33 配線パターン
41 回路ユニット
42a〜42h 端子
51a X方向ホール素子(4個)とその駆動用スイッチ
51b Y方向ホール素子(4個)とその駆動用スイッチ
52a,52b,52c,52d チャネル選択用マルチプレクサ
53 プレアンプの基準電圧発生回路
54 クロック
55a,55b Z方向検出用極性切り替えスイッチ
56 プレアンプ(DDA)
57 チョッパスイッチ
58 モニタスイッチ
59 バッファアンプの基準電圧発生回路
60 バッファアンプ
Claims (4)
- p型半導体基板層の表面にn型不純物領域を設け、該n型不純物領域が感磁部として機能する、前記p型半導体基板層に対して垂直な磁界成分を検出するホール素子において、
前記n型不純物領域の表面にp型不純物領域を設けるとともに、前記n型不純物領域が、前記p型半導体基板層のp型基板領域で囲まれており、前記n型不純物領域の表面の不純物濃度Nが、1×10 16 (atoms/cm 3 )≦N≦3×10 16 (atoms/cm 3 )であり、かつ前記n型不純物領域の表面から前記n型不純物領域の表面の不純物濃度が一桁下がる深さまでの分布深さDが、3.0μm≦D≦5.0μmであることを特徴とするホール素子。 - 前記p型基板領域が、前記p型半導体基板層と同じ抵抗率を有していることを特徴とする請求項1に記載のホール素子。
- 請求項1又は2に記載のホール素子を半導体基板上に複数個設け、該ホール素子上に磁気収束機能を有する磁性体を設けたことを特徴とする磁気センサ。
- 請求項3に記載の磁気センサを用いたことを特徴とする方位計測装置。
Priority Applications (1)
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---|---|---|---|
JP2008509820A JP4994365B2 (ja) | 2006-04-03 | 2007-03-30 | ホール素子及び磁気センサ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006102314 | 2006-04-03 | ||
JP2006102314 | 2006-04-03 | ||
PCT/JP2007/057099 WO2007116823A1 (ja) | 2006-04-03 | 2007-03-30 | ホール素子及び磁気センサ |
JP2008509820A JP4994365B2 (ja) | 2006-04-03 | 2007-03-30 | ホール素子及び磁気センサ |
Publications (2)
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JPWO2007116823A1 JPWO2007116823A1 (ja) | 2009-08-20 |
JP4994365B2 true JP4994365B2 (ja) | 2012-08-08 |
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JP2008509820A Active JP4994365B2 (ja) | 2006-04-03 | 2007-03-30 | ホール素子及び磁気センサ |
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US (1) | US8085035B2 (ja) |
JP (1) | JP4994365B2 (ja) |
WO (1) | WO2007116823A1 (ja) |
Cited By (1)
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KR101768254B1 (ko) * | 2013-06-12 | 2017-08-16 | 매그나칩 반도체 유한회사 | 반도체 기반의 자기 센서 및 그 제조 방법 |
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US9107436B2 (en) | 2011-02-17 | 2015-08-18 | Purecircle Sdn Bhd | Glucosylated steviol glycoside as a flavor modifier |
JP2010281764A (ja) * | 2009-06-08 | 2010-12-16 | Sanyo Electric Co Ltd | オフセットキャンセル回路 |
US10696706B2 (en) | 2010-03-12 | 2020-06-30 | Purecircle Usa Inc. | Methods of preparing steviol glycosides and uses of the same |
EP2402779A1 (en) * | 2010-07-02 | 2012-01-04 | Liaisons Electroniques-Mecaniques Lem S.A. | Hall sensor system |
JP5679906B2 (ja) * | 2010-07-05 | 2015-03-04 | セイコーインスツル株式会社 | ホールセンサ |
JP5815986B2 (ja) * | 2010-07-05 | 2015-11-17 | セイコーインスツル株式会社 | ホールセンサ |
JP5612398B2 (ja) * | 2010-08-30 | 2014-10-22 | 旭化成エレクトロニクス株式会社 | 磁気センサ |
US9771434B2 (en) | 2011-06-23 | 2017-09-26 | Purecircle Sdn Bhd | Products from stevia rebaudiana |
JP6043076B2 (ja) * | 2012-03-23 | 2016-12-14 | エスアイアイ・セミコンダクタ株式会社 | ホールセンサ |
WO2013168353A1 (ja) * | 2012-05-11 | 2013-11-14 | 旭化成エレクトロニクス株式会社 | 磁気検出装置及び磁気検出方法 |
JP6085460B2 (ja) * | 2012-12-10 | 2017-02-22 | 旭化成エレクトロニクス株式会社 | ホール素子及びその製造方法 |
US9134383B2 (en) * | 2012-12-28 | 2015-09-15 | Asahi Kasei Microdevices Corporation | Hall device, magnetic sensor having same, and signal correcting method thereof |
WO2014197898A1 (en) | 2013-06-07 | 2014-12-11 | Purecircle Usa Inc. | Stevia extract containing selected steviol glycosides as flavor, salty and sweetness profile modifier |
US10952458B2 (en) | 2013-06-07 | 2021-03-23 | Purecircle Usa Inc | Stevia extract containing selected steviol glycosides as flavor, salty and sweetness profile modifier |
US9267781B2 (en) * | 2013-11-19 | 2016-02-23 | Infineon Technologies Ag | On-axis magnetic field angle sensors, systems and methods |
EP2966462B1 (en) | 2014-07-11 | 2022-04-20 | Senis AG | Vertical hall device |
US11230567B2 (en) | 2014-09-02 | 2022-01-25 | Purecircle Usa Inc. | Stevia extracts enriched in rebaudioside D, E, N and/or O and process for the preparation thereof |
KR101903828B1 (ko) | 2014-10-27 | 2018-10-04 | 매그나칩 반도체 유한회사 | 반도체 기반의 홀 센서 |
US9741924B2 (en) * | 2015-02-26 | 2017-08-22 | Sii Semiconductor Corporation | Magnetic sensor having a recessed die pad |
LU93151B1 (en) | 2016-07-15 | 2018-01-23 | Luxembourg Inst Science & Tech List | Hall Probe |
CN107644611B (zh) * | 2016-07-22 | 2020-04-03 | 京东方科技集团股份有限公司 | Oled显示装置及其压力触控驱动方法 |
US10109787B2 (en) * | 2016-10-27 | 2018-10-23 | Texas Instruments Incorporated | Well-based vertical hall element with enhanced magnetic sensitivity |
US10211392B2 (en) * | 2017-01-10 | 2019-02-19 | Globalfoundries Singapore Pte. Ltd. | Hall element for 3-D sensing and method for producing the same |
JP2018148166A (ja) * | 2017-03-09 | 2018-09-20 | エイブリック株式会社 | 半導体装置 |
JP7133968B2 (ja) * | 2018-04-24 | 2022-09-09 | エイブリック株式会社 | 半導体装置 |
JP2019201097A (ja) * | 2018-05-16 | 2019-11-21 | エイブリック株式会社 | 半導体装置 |
KR102699879B1 (ko) * | 2019-12-06 | 2024-08-29 | 삼성전기주식회사 | 홀 센서 출력단자 전압 감시 회로 및 렌즈 모듈 구동 제어기 지원 회로 |
KR102535002B1 (ko) | 2021-04-23 | 2023-05-26 | 주식회사 키파운드리 | Cmos 공정 기반의 홀 센서를 포함하는 반도체 소자 및 그 제조 방법 |
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JPH08330646A (ja) * | 1995-03-30 | 1996-12-13 | Toshiba Corp | 横型ホール素子 |
JPH10270773A (ja) * | 1997-03-26 | 1998-10-09 | Toshiba Corp | ホール素子 |
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JP2005333103A (ja) * | 2004-03-30 | 2005-12-02 | Denso Corp | 縦型ホール素子およびその製造方法 |
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2007
- 2007-03-30 US US12/225,371 patent/US8085035B2/en active Active
- 2007-03-30 JP JP2008509820A patent/JP4994365B2/ja active Active
- 2007-03-30 WO PCT/JP2007/057099 patent/WO2007116823A1/ja active Application Filing
Patent Citations (4)
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JPH08330646A (ja) * | 1995-03-30 | 1996-12-13 | Toshiba Corp | 横型ホール素子 |
JPH10270773A (ja) * | 1997-03-26 | 1998-10-09 | Toshiba Corp | ホール素子 |
JP2004257995A (ja) * | 2003-02-27 | 2004-09-16 | Asahi Kasei Electronics Co Ltd | 3次元磁気検出装置および半導体装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101768254B1 (ko) * | 2013-06-12 | 2017-08-16 | 매그나칩 반도체 유한회사 | 반도체 기반의 자기 센서 및 그 제조 방법 |
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JPWO2007116823A1 (ja) | 2009-08-20 |
WO2007116823A1 (ja) | 2007-10-18 |
US8085035B2 (en) | 2011-12-27 |
US20100164483A1 (en) | 2010-07-01 |
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