JP4986495B2 - 加熱プレート温度測定装置 - Google Patents
加熱プレート温度測定装置 Download PDFInfo
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- JP4986495B2 JP4986495B2 JP2006109447A JP2006109447A JP4986495B2 JP 4986495 B2 JP4986495 B2 JP 4986495B2 JP 2006109447 A JP2006109447 A JP 2006109447A JP 2006109447 A JP2006109447 A JP 2006109447A JP 4986495 B2 JP4986495 B2 JP 4986495B2
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- heating plate
- temperature
- heating
- substrate
- measured
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- 238000010438 heat treatment Methods 0.000 title claims description 161
- 239000000758 substrate Substances 0.000 claims description 41
- 230000005855 radiation Effects 0.000 claims description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 238000009529 body temperature measurement Methods 0.000 description 12
- 230000001133 acceleration Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004886 process control Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Radiation Pyrometers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
理想的には、加熱プレートに複数の熱電対の測温点を埋め込み、なお且つ基板の温度を2色輻射温度計により測定位置を変えながら基板の温度分布を測定し、プロセス制御と加熱監視をしていくのが望ましい。
以下、本発明を実施するための最良の形態について、実施例をあげて詳細に説明する。
このようにして加熱プレート2が加熱制御される時に、前記の輻射温度計5でプラグ4の温度を測定し、これにより加熱プレート2の温度を把握しながら加熱制御を行う。
4 プラグ
5 輻射温度計
7 孔
Claims (4)
- 基板を載せて加熱する加熱プレート(2)の内部の温度を輻射温度計(5)により測定する加熱プレート温度測定装置であって、加熱プレート(2)に同加熱プレート(2)の側面に開口する直線状の孔(7)を設け、この孔(7)の異なる位置に配置可能にその中にプラグ(4)を1個だけ加熱プレート(2)に密着して埋め込み、前記孔(7)を通してプラグ(4)の輻射熱を同孔(7)の外側に検知部を配置した輻射温度計(5)により測定することを特徴とする加熱プレート温度測定装置。
- プラグ(4)は輻射率が1.0に近い黒鉛からなることを特徴とする請求項1に記載の加熱プレート温度測定装置。
- 孔(7)は、加熱プレート(2)の側面に開口していることを特徴とする請求項1または2に記載の加熱プレート温度測定装置。
- 加熱プレート(2)を加熱する手段が背面電子衝撃加熱方式ヒータであることを特徴とする請求項1〜3の何れかに記載の加熱プレート温度測定装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006109447A JP4986495B2 (ja) | 2006-04-12 | 2006-04-12 | 加熱プレート温度測定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006109447A JP4986495B2 (ja) | 2006-04-12 | 2006-04-12 | 加熱プレート温度測定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007278999A JP2007278999A (ja) | 2007-10-25 |
JP4986495B2 true JP4986495B2 (ja) | 2012-07-25 |
Family
ID=38680578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006109447A Active JP4986495B2 (ja) | 2006-04-12 | 2006-04-12 | 加熱プレート温度測定装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4986495B2 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61219456A (ja) * | 1985-03-26 | 1986-09-29 | Sumitomo Metal Ind Ltd | 鋳造温度測定装置 |
JPS63277941A (ja) * | 1987-04-22 | 1988-11-15 | Inax Corp | ロ−ラ−ハ−スキルンの窯内温度の測定方法 |
JP2912613B1 (ja) * | 1998-06-17 | 1999-06-28 | 助川電気工業株式会社 | 板体加熱装置 |
WO2000058700A1 (fr) * | 1999-03-30 | 2000-10-05 | Tokyo Electron Limited | Systeme de mesure de temperature |
JP2001274092A (ja) * | 2000-03-23 | 2001-10-05 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
JP3753375B2 (ja) * | 2002-01-24 | 2006-03-08 | 株式会社堀場製作所 | 半導体プロセスにおけるウエハの温度計測方法 |
JP3902125B2 (ja) * | 2002-12-03 | 2007-04-04 | 東京エレクトロン株式会社 | 温度測定方法及びプラズマ処理装置 |
-
2006
- 2006-04-12 JP JP2006109447A patent/JP4986495B2/ja active Active
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JP2007278999A (ja) | 2007-10-25 |
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