JP4985447B2 - Substrate transfer device - Google Patents

Description

  The present invention relates to a substrate transfer apparatus.

  In general, in a manufacturing process of a thin film solar cell or the like, a silicon film is formed on a glass substrate, and a substrate transfer device that holds a plurality of glass substrates vertically at a predetermined interval is used. Moreover, in order to reduce the cost of the solar cell, the glass substrate has been increased in size. For example, the size of the glass substrate is 1000 mm or more × 1000 mm or more, the plate thickness is 4 to 5 mm, and the weight is 10 to 30 kg. It is required to automate this and set and fix it on the substrate transport apparatus. Furthermore, when the substrate becomes large, it is necessary to hold the substrate facing the electrode with high accuracy in order to make the film thickness of the thin film formed on the substrate surface uniform.

2. Description of the Related Art Conventionally, a substrate processing carrier disclosed in Patent Document 1 is known as a substrate processing carrier used for blackening processing of an inner layer substrate. This is because the guide bar parallel to the left and right of the rectangular outer frame is fixed vertically, and a clip that clamps the top edge of the board is attached to the fixed support plate at both ends, and both ends move to the guide bar. The clip which clamps the lower end of a board | substrate is attached to the support plate attached possible, and the upper end and lower end of a board | substrate are clamped with a both-ends clip.
As another example, in a substrate transfer apparatus that holds a glass substrate vertically, two people are mounted on the substrate holding frame one by one, and each side of the substrate 1 is placed at two locations as shown in FIG. It was clamped at clamp point 2. The purpose of the clamp was mainly to prevent the substrate 1 from falling.
Japanese Patent No. 3243044

However, in the substrate transfer apparatus described in Patent Document 1, since humans have clamped or released two positions on each side of the substrate by a spring operation, the work is troublesome and it is not compatible with a mass production apparatus.
In addition, in the example in which the clamp points are two positions on each side of the substrate, the main purpose is to prevent the overturn, so that the deformation of the held substrate being convex toward the film formation surface during film formation cannot be prevented. There was a problem that a uniform thin film could not be formed as a whole.

  The present invention has been proposed in view of the above, and automates the clamping and releasing of the substrate, reduces the amount of deflection of the substrate accompanying an increase in size, and holds it fixed. It is an object of the present invention to provide a substrate transfer device capable of preventing deformation that becomes convex on the surface side.

The substrate transport apparatus according to the present invention employs the following means in order to solve the above problems.
The present invention is a substrate transport apparatus for transporting while holding a substrate on a substrate holding frame, and a clamp shaft rotatably supported by the substrate holding frame, and a substrate periphery attached to the clamp shaft. A holding mechanism comprising a clamp arm for pressing and holding and a spring for biasing the clamp shaft in the direction of pressing the substrate is provided.

  In the present invention, the clamp shafts are respectively arranged along the four sides of the substrate holding frame, and a plurality of the clamp shafts are connected to be interlocked to release the clamp arm against the biasing force of the spring. It is possible.

In the present invention, the spring is a coil spring.
In the present invention, the spring is a constant load spring.

  In the present invention, the clamp arm is arranged to press two types of clamp points on each side of the substrate.

  Further, the present invention is characterized in that a mounting pad is provided on the lower end of the substrate holding frame for mounting the substrate.

According to the present invention, the following effects can be obtained.
According to the present invention, it is possible to automate the clamping and releasing of the substrate, and to prevent deformation that protrudes toward the film forming surface during film formation, thereby achieving uniform film formation.

  Further, by operating the clamp shaft, the clamp arm can be opened and closed to automatically hold and take out the substrate.

Further, by providing the coil spring, the space for mounting the spring can be made small, and the substrate transfer apparatus can be made compact.
Further, by providing a constant load spring, it is possible to reduce the torque required for opening and closing the clamp arm and always open and close with a constant torque. Further, the clamp shaft can be opened and closed without applying a load more than necessary.

Further, since the clamp arm presses at least one side of the substrate, it is possible to suppress warpage during deposition of the substrate and warpage due to the flatness of the substrate.
In addition, since the mounting pad is provided, the substrate can be accurately positioned, and it is possible to cope with automation of the substrate attaching / detaching operation using the robot arm.

Hereinafter, the board | substrate conveyance apparatus 10 which concerns on 1st embodiment of this invention is demonstrated with reference to drawings.
FIG. 1 is a perspective view showing a substrate transfer apparatus 10, and FIG. 2 is a perspective view showing a substrate holding frame 11 of the substrate transfer apparatus 10 of the present invention.

  The substrate transfer device 10 holds and transfers a substrate 12 to a substrate holding frame 11, and includes a clamp shaft 13 that is rotatably supported by the substrate holding frame 11, and a substrate attached to the clamp shaft 13. A holding mechanism 16 including a clamp arm 14 that presses and holds the periphery and a coil spring 15 that biases the clamp shaft 13 in the direction of pressing the substrate is provided.

The substrate transfer apparatus 10 is provided with a plurality of substrate holding frames 11 standing at a predetermined interval in a direction perpendicular to the traveling direction. In this embodiment, six substrate holding frames 11 are provided. Moreover, the board | substrate conveyance apparatus 10 is equipped with the wheel 10a in the lower end, and can move along a manufacturing line.
The substrate transfer device 10 holds a plurality of substrates mounted at a mounting position with a substrate holding frame 11, transfers the substrate into a plasma CVD apparatus, forms a silicon thin film on the substrate surface, and then transfers the substrate to a substrate take-out position. It is.

The substrate holding frame 11 has an opening 11a that is slightly smaller than the substrate 12, and a clamp shaft 13 is disposed along the periphery of the opening 11a.
The clamp shaft 13 is rotatably supported by a support arm 17 fixed to the substrate holding frame 11. Further, as shown in FIG. 3, the clamp shafts 13 orthogonal to each other are engaged with each other by bevel gears 18 attached to the ends of the clamp shafts. Furthermore, the clamp shaft 13 that is vertically attached has a lower end extending below the substrate holding frame 11 and serves as an operation end 19.
The operation end 19 is rotated by an external driving unit when the substrate transport apparatus 10 is at the mounting position or the taking-out position of the substrate 12. A mounting pad 22 for mounting the substrate 12 is disposed at the lower end of the opening 11 a of the substrate holding frame 11.

A coil spring 15 is attached to the clamp shaft 13 to bias the clamp arm 14 in the direction in which the substrate 12 is pressed. One end of the coil spring 15 is fixed to the clamp shaft 13, and the other end is fixed to the support arm 17.
Therefore, the coil spring 15 is always released by the clamp arm 14 against the spring force when the clamp arm 14 constantly urges the substrate in the pressing direction and the operation end 19 is operated by an external driving means. .
In the present embodiment, two coil springs 15 are attached to one clamp shaft 13. Further, the operation end 19 rotates about 180 degrees.

A clamp arm 14 that presses and holds the vicinity of the periphery of the substrate 12 is fixed to the clamp shaft 13.
As shown in FIG. 4, the clamp arm 14 has a U-shaped member fixed by a nut 20, and an annular member 21 for pressing the substrate 12 is attached to the tip portion.
The clamp arm 14 is arranged so that each side of the substrate 12 is pressed by two types of clamp points A and B. That is, it arrange | positions so that it may be pressed down by the clamp point A located in the four corners of the board | substrate 12, and the clamp point B located between each clamp point A. FIG. The number of clamp points B may be different between the long side and the short side.

In the present embodiment, as shown in FIG. 5, the clamp arm 12 is disposed so that the long side of the substrate 12 is pressed by five clamp points and the short side is pressed by five clamp points.
Specifically, five clamp arms 14 are attached to the clamp shaft 13 that holds the upper and lower sides of the substrate 12, and three clamp arms 14 are attached to the clamp shafts 13 at both ends. That is, the clamp arms 14 attached to both ends of the clamp shaft 13 that presses the upper side and the lower side of the substrate 12 press the clamp points A at the four corners of the substrate 12 and press the long side and the short side in an overlapping manner.
By arranging the clamp arm 14 in this way, each side of the substrate 12 is pressed by five clamp points.

As shown in FIG. 5, the meaning of each clamp point is that the clamp point A reduces the amount of deflection of the substrate 12 and holds it fixed, and accordingly, prevents the substrate 12 from warping during film formation. Is.
Since the substrate 12 is convexly deformed toward the film formation surface during film formation, the four corners of the substrate 12 are pressed at clamp points A so that no gap is formed between the substrate 12 and the mask due to the deformation.
Also, the clamp point B forces prevention of warpage due to the flatness of the substrate.
Each side is pressed with a pressing force that allows the flatness of the substrate 12 to be deflected. Therefore, the clamp point B also presses the center of each side and the center between the clamp point A and the center point of the side.
That is, there are three clamp points B on each side. In addition, the clamp point B should just be 1 or more places on each side, and the number and arrangement | positioning can be changed suitably.

  By arranging the clamp points A and B as described above, it is possible not only to prevent the substrate 12 from falling, but also to prevent warpage during film formation and warpage due to the flatness of the substrate.

Next, the operation of the substrate transport apparatus 10 of the present invention configured as described above will be described.
First, the substrate 12 placed horizontally is inverted by a robot arm (not shown) at the substrate mounting position of the plasma CVD production line and placed on the mounting pad 22 of the substrate holding frame 11. At this time, the operation end 19 is rotated by a driving means (not shown), and the clamp arm 14 is released against the spring force of the coil spring 15.

Further, when the substrate 12 is pressed to the correct position by the robot arm, the operation end 19 is released from the driving means (not shown), and the clamp arm 14 holds and fixes the substrate 12 by the spring force of the coil spring 15.
Since the clamp shafts 13 are connected two by two by the bevel gears 18, all the clamp arms 14 are opened and closed by operating the two operation end portions 19 arranged at the lower end of the substrate holding frame 11. be able to.

In this embodiment, the substrate transfer apparatus can mount six substrates. By repeating the above-described operation, the substrate transfer apparatus 10 on which six substrates are mounted by the robot arm is transferred to the plasma CVD apparatus, and a silicon film is formed.
The substrate 12 on which the silicon film is formed is discharged from the plasma CVD apparatus by the substrate transfer apparatus 10 and is carried to the substrate take-out position on the production line.

  At the substrate take-out position, after the substrate 12 is sucked and held by a robot arm (not shown), the operation end 19 is rotated by a driving means (not shown), and the clamp arm 14 is moved against the spring force of the coil spring 15. To be released. In this way, the deposited substrates are sequentially taken out.

As described above, in the substrate transfer apparatus 10 of the present invention, the substrate mounting operation and the clamping operation that have been conventionally performed by humans can be automated by the robot.
In addition, warping of the substrate during film formation and warping due to flatness can be suppressed by disposing the clamp arm 14 at an appropriate position, and a uniform film thickness can be formed even for a large substrate.

  Next, the board | substrate conveyance apparatus 50 which concerns on 2nd embodiment of this invention is demonstrated with reference to FIGS. 6 to 9, the same components as those in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 6 is a diagram illustrating a part of the holding mechanism 56 of the substrate transport apparatus 50. The substrate transfer device 50 has substantially the same configuration as the substrate transfer device 1 described above, but has a holding mechanism 56 different from the holding mechanism 16.

  The substrate transfer device 50 includes four clamp shafts 53 that are rotatably supported by the substrate holding frame 11, a clamp arm portion 54 that is attached to the clamp shaft 53 and holds the periphery of the substrate, and the clamp shaft 53. A holding mechanism 56 including a coil spring 55 that biases the spring in the substrate pressing direction is provided.

The clamp shaft 53 has two shafts 53a and 53b fastened by a coupling 53c. The clamp shaft 53 is disposed along the periphery of the opening 11a and is fixed to the substrate holding frame 11. Is supported rotatably.
Note that the clamp shaft 53 that is vertically attached has a lower end that extends to the bottom of the substrate holding frame 11 and serves as an operation end portion 19.

  A bevel gear 18 is provided at the opposite end of the shaft fastening portion of the shaft 53a, and the bevel gears 18 of the two shaft shafts 53 that are orthogonal to each other mesh with each other. The set of bevel gears 18 is accommodated in two gear housings 58, respectively.

  The gear housing 58 is fixed to the L-shaped member 58a fixed to the substrate holding frame 11, the adjustment portion 58b fixed to the L-shaped member 58a, and the L-shaped member 58a and the adjustment portion 58b. And two angular bearings 58c that rotatably support the shaft 53a.

The L-shaped member 58a is fixed to the outer side of the substrate holding frame 11 so that two surfaces forming a right angle are along the axial direction of the two shafts 53a. An angular bearing 58c that rotatably supports one shaft 53a is provided at one end portion of the two surfaces, and an adjustment portion 58b fixed by a bolt is provided at the other end portion. Yes.
The adjusting portion 58b is fixed with an angular bearing 58c that rotatably supports the other shaft 53a.

  The gear housing 58 is configured such that the members are fixed and integrated, and when the shafts 53a are attached to the angular bearings 58c, the bevel gears 18 provided on the shafts 53a are in an optimal meshing state. It is set to be.

FIG. 7 is a view showing a mounting state of the coil spring 55 in the holding mechanism 56.
The coil springs 55 (55R, 55L) are wound so that a gap is formed by increasing the pitch, and two coil springs 55 are provided near the center of each clamp shaft 53. In addition, the two coil springs 55 of each clamp shaft 53 are a set of a right-handed coil spring 55R and a left-handed coil spring 55L, and one end of each coil spring 55 is fixed to the substrate holding frame 11. The other end is fixed to the clamp shaft 53.

  The coil spring 55 is fixed after being twisted to the outside of the substrate holding frame 11, the clamp arm portion 54 is constantly biased in the pressing direction of the substrate 12, and the operation end 19 is operated by an external driving means. In this case, the clamp arm portion 54 is released against the spring force.

FIG. 8 is an assembly configuration diagram of the clamp arm portion 54.
The clamp arm portion 54 includes the clamp arm 14, a semi-cylindrical portion 61 in which two through holes 61 a are provided in a plane formed on the peripheral surface, and a semi-cylindrical portion 61 and a cylinder that are fixed to the semi-cylindrical portion 61. The semi-cylindrical portion 62 and the tubular member 63 attached to the clamp arm 14 are roughly configured.

  A tubular member 63 that contacts the substrate 12 is attached to the clamp arm 14 at the tip. In the clamp arm 14, a part of the screw portion 14a at both ends of the clamp arm 14 is inserted into the through hole 61a of the semi-cylindrical portion 61, and a nut 60b that can be screwed to the screw portion 14a is screwed from above and below. Thus, the nut 60b is fixed so as to sandwich the semi-cylindrical portion 61. Note that the nut that is screwed onto the screw portion 14a from below does not interfere with other members.

The semi-cylindrical portion 61 has a substantially semi-cylindrical shape, and a substantially rectangular flat surface is formed on the peripheral surface. The semi-cylindrical portion 61 and the semi-cylindrical portion 62 are fixed with bolts (not shown) so that a columnar space is formed by the mutually semi-cylindrical spaces. At this time, the circumferential length of the columnar space formed by the semi-cylindrical portion 61 and the semi-cylindrical portion 62 is slightly shorter than the circumferential length of the clamp shaft 53 (shafts 53a, 53b). The clamp shaft 53 is firmly fixed to the semi-cylindrical portion 61 and the semi-cylindrical portion 62 by the semi-cylindrical portion 61 and the semi-cylindrical portion 62 being closely attached and fixed.
As described above, the clamp arm 14 is fixed to the clamp shaft 53 via the semi-cylindrical portion 61 and the semi-cylindrical portion 62.

The clamp arm portion 54 is finely adjusted so that the substrate 12 is optimally clamped at the place where the substrate transfer apparatus 50 is operated.
The clamp point is not different from that of the substrate transfer apparatus 10 described above.

Next, the operation of the substrate transport apparatus 50 of the present invention configured as described above will be described.
First, similarly to the substrate transfer apparatus 10 described above, an inverted glass substrate is placed on the mounting pad 22 of the substrate holding frame 11, and the operation end 19 is rotated by driving means (not shown).

  As a result of the pivoting operation to the operation end 19, the entire clamp shaft 53 provided vertically is smoothly pivoted, and the bevel gear 18 meshed in an optimal state in the gear housing is smoothly pivoted. The clamp shaft 53 attached horizontally is smoothly rotated.

More specifically, the rotation of the shaft 53a is transmitted to the shaft 53b via the coupling 53c. At this time, when the coil spring 55 is twisted by the shaft 53b, the number of turns increases, the distance between the pitches becomes short, and the total length slightly increases. A force for translating the shaft 53b is generated by this increase, but the two coil springs 55 provided in each shaft 53b are provided with a set of right-handed and left-twisted ones. The forces act to counteract each other. Further, even if the shaft 53b moves without completely canceling the translational force, the translational force is not transmitted to the shaft 53a because the coupling 53c absorbs the displacement.
Therefore, the bevel gear 18 transmits the rotation of the operation end 19 to the clamp shaft 53 while maintaining a preset optimal meshing state.

Furthermore, since the coil spring 55 is not in close contact with the coil spring 55 even if the number of turns is increased, the distance between the pitches is shortened. Further, the ball bearing 57 and the angular bearing 58c support the clamp shaft 53 while smoothly rotating.
Therefore, as the bevel gear 18 rotates, the clamp shaft 53 rotates smoothly.

When the substrate 12 is pressed to the correct position in a state where the clamp arm 14 of the clamp arm portion 54 fixed to the clamp shaft 53 is released by the rotation of the clamp shaft 53, the operation end portion 19 is driven from a driving means (not shown). Is released, and the clamp arm 14 optimally holds and fixes the substrate 12 by the spring force of the coil spring 55.
At this time, the tubular member 63 attached to the clamp arm 14 has a large frictional force acting on the contact surface with the clamp arm 14 and does not shift its position from the clamp arm 14.

  By repeating the above-described operation, the six substrates 12 mounted on the substrate transport apparatus 50 are transported to the plasma CVD apparatus and a silicon film is formed, and then transported to the substrate take-out position of the production line. Then, after the substrate 12 is sucked and held by a robot arm (not shown), the operation end 19 is rotated by a driving means (not shown), and the clamp arm 14 is released. In this way, the deposited substrates are sequentially taken out.

  As described above, the substrate transfer apparatus 50 of the present invention can obtain the same effects as those of the substrate transfer apparatus 10 described above, and the bevel gear 18 is optimally meshed and the clamp shaft 53 rotates smoothly. The arm 14 can be released smoothly.

  That is, the gear housing 58 is set so that the bevel gears 18 provided on the shafts 53a are in an optimal meshing state when the shafts 53a are attached to the angular bearings 58c. Thereby, the error at the time of an assembly | attachment can be prevented.

  Further, even if the number of turns of the coil spring 55 is increased and a force for translating the shaft 53b is generated, the two coil springs 55 provided on each shaft 53b are provided as a pair of right-handed and left-handed ones. Thus, the translational forces act to cancel each other. Thereby, the force which is going to translate the shaft 53b can be reduced.

  Further, even if the shaft 53b moves without completely canceling the translation force, the translation force is not transmitted to the shaft 53a because the coupling 53c absorbs the displacement. Thereby, it can prevent that the shaft 53a moves and the meshing state of the bevel gear wheel 18 changes.

  Therefore, the shaft 53b does not move and the optimal meshing state of the bevel gear 18 is not impaired, and therefore the rotation of the operation end portion 19 is efficiently transmitted to the clamp shaft 53 with the meshing resistance of the bevel gear 18 being minimized. can do. Even if the shaft 53a and the shaft 53b are misaligned, the coupling state of the bevel gear 18 is not affected by the coupling 53c.

Furthermore, since the coil spring 55 is not in close contact with the coil spring 55 even if the number of turns is increased, the distance between the pitches is shortened. Further, the ball bearing 57 and the angular bearing 58c support the clamp shaft 53 while smoothly rotating.
Accordingly, the clamp shaft 53 smoothly rotates with the rotation of the bevel gear 18 to facilitate the rotation operation of the operation end portion 19, and the urging force of the coil spring 55 is used to clamp the clamp arm portion 54. Can be turned into power.

  Further, the tubular member 63 attached to the clamp arm 14 has a large frictional force acting on the contact surface with the clamp arm 14, and the position of the tube-like member 63 does not shift from the clamp arm 14. Even if it is displaced, a part of it remains at the tip of the substrate 12. Thereby, the clamp arm 14 and the board | substrate 12 do not contact directly, and the damage to the board | substrate 12 can be prevented.

  Further, as described above, since the clamp arm portion 54 has a so-called halved structure, it can be finely adjusted so that the substrate 12 is optimally clamped at the place where the substrate transfer apparatus 50 is operated. Thereby, for example, the clamping force and its contact angle with respect to the substrate 12 can be optimally set without being affected by the manufacturing accuracy of the clamp shaft 53, the manufacturing accuracy of the clamp arm 14, and the initial mounting accuracy.

  Note that the operation procedure shown in the above-described embodiment, various shapes and combinations of the constituent members, and the like are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in each of the above-described embodiments, the clamp arm 14 and the clamp arm portion 54 are biased using the coil springs 15 and 55, but a constant load spring device 70 shown in FIG. 10 may be used instead.
In FIG. 9, the constant load spring device 70 includes a constant load spring 71 and a drum 72 fixed to the substrate holding frame 11 so as to be parallel to the clamp shaft 13.

The constant load spring 71 is a long thin steel plate formed with a substantially constant curvature, and the outer end in the longitudinal direction is drawn toward the clamp shaft 13 so that the constant load spring 71 warps against the drum 72. It is screwed to the circumferential surface of the clamp shaft 13 so as to be wound up, in other words, wound in the direction opposite to the winding direction around the drum 72.
Then, by rotating the clamp shaft 13 and winding the constant load spring 71 around the clamp shaft 13, a constant torque (rewinding torque) in the direction opposite to the winding direction is always generated.

  With such a configuration, the constant load spring 71 is formed with a substantially constant curvature, so that the constant load spring 71 tries to rewind to the drum 72 regardless of the length of the wound constant load spring 71. A constant torque can be obtained.

By using the constant load spring 71 in this way, the torque required to open and close the clamp arm 14 and the like can be reduced as compared with the case where the coil springs 15 and 55 are used. That is, when the coil springs 15 and 55 are used, an initial torsion angle is given for urging the spring, and when the clamp arm 14 and the clamp arm part 54 are released, the initial torsion angle is further increased to release the initial torsion angle. A twist angle is required.
That is, in the case of the coil springs 15 and 55, the torque required to open and close the clamp arm 14 and the like tends to increase in proportion to the increase of the torsion angle. The clamp arm 14 can be opened and closed by torque. Further, the clamp shaft 53 can be opened and closed without applying a load more than necessary.

  In the above-described embodiment, an example in which two clamp shafts are coupled with bevel gears has been described. However, all four clamp shafts may be coupled with gears, and the operation end 19 may be provided at one location.

1 is a perspective view showing a substrate transfer apparatus 10 according to a first embodiment of the present invention. FIG. 3 is a perspective view showing a substrate holding frame 11 of the substrate transport apparatus 10. It is explanatory drawing which shows the holding mechanism 16 of the board | substrate holding frame 11. FIG. 3 is an enlarged view of a main part of a substrate holding frame 11. FIG. It is explanatory drawing which shows a board | substrate clamp point. It is a figure which shows a part of holding mechanism 56 of the board | substrate conveyance apparatus 50 which concerns on 2nd embodiment of this invention. It is a figure which shows the attachment state of the coil spring 55 in the holding mechanism 56. FIG. It is an assembly block diagram of the clamp arm part 54. FIG. It is a figure which shows the attachment state of the constant load spring 70 which concerns on embodiment of this invention. It is explanatory drawing which shows the conventional board | substrate clamp point.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10,50 ... Board | substrate conveyance apparatus 11 ... Board | substrate holding frame 11a ... Opening part 12 ... Board | substrate 13,53 ... Clamp axis | shaft 14 ... Clamp arm 15 ... Coil spring 16,56 ... Holding mechanism 17 ... Support arm 18 ... Bevel gear wheel 19 ... Operation end Part 20: Nut 21 ... Ring member 22 ... Mounting pad, 71 ... Constant load spring

Claims (5)

A substrate transfer device for holding a substrate on a substrate holding frame and transferring the substrate,
A clamp shaft rotatably supported by the substrate holding frame;
A clamp arm attached to the clamp shaft and holding the periphery of the substrate;
A holding mechanism comprising a spring for urging the clamp shaft in the substrate pressing direction ;
The clamp shaft is
Arranged along four sides of the substrate holding frame,
Several are linked so that they can be linked,
A substrate transfer apparatus, wherein the clamp arm can be released against a biasing force of the spring . The substrate transfer apparatus according to claim 1, wherein the spring is a coil spring . The substrate transfer apparatus according to claim 1 , wherein the spring is a constant load spring . The clamp arm is
The clamp point A located at the four corners of the substrate and the clamp point B located between the clamp points A are disposed so as to be pressed. The board | substrate conveyance apparatus of description. 5. The substrate transfer apparatus according to claim 1 , further comprising a mounting pad disposed on a lower end of the substrate holding frame for mounting the substrate. 6.

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