JP4984398B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a semiconductor device and a manufacturing method thereof, and in particular, a low on-resistance power used for an IC that controls a large current with a high withstand voltage, such as a switching power supply IC, an automotive power system driving IC, or a flat panel display driving IC. The present invention relates to a MOSFET (field effect transistor having an insulated gate structure made of metal-oxide film-semiconductor).

  Recently, with the rapid spread of portable devices and advancement of communication technology, the importance of power ICs incorporating power MOSFETs is increasing. Power ICs that integrate horizontal power MOSFETs in control circuits are expected to achieve downsizing, low power consumption, high reliability, and low cost compared to the conventional combination of power MOSFETs and control drive circuits. Is done. Therefore, in order to integrate a control drive circuit made of a CMOS circuit and a lateral power MOSFET on the same semiconductor substrate, development of a high-performance lateral power MOSFET based on a CMOS process has been actively conducted.

  Incidentally, a MOSFET having a trench structure is known as a technique for reducing the device pitch and increasing the degree of integration. Also in the lateral power MOSFET described above, in order to achieve further higher integration and lower on-resistance, trench technology is actively used. FIG. 16 is a cross-sectional view showing a configuration of a lateral power MOSFET (hereinafter referred to as TLPM) to which a conventional trench structure is applied.

  As shown in FIG. 16, an n-type well region 52 is formed in a surface region of a p-type semiconductor substrate 51, and a p-type offset region 54 is formed in the surface region. From the substrate surface, a trench 55 is formed so as to penetrate the p-type offset region 54 and reach an n-type region (an n-type extended drain region 53 described later). The bottom of the trench 55 is surrounded by an n-type extended drain region 53 that becomes a drift region.

A gate oxide film 63 is provided along the side wall of the trench 55. A gate polysilicon electrode 61 is provided inside the gate oxide film 63. An inner region of the gate polysilicon electrode 61 in the trench 55 is filled with a first interlayer insulating film 65. In the central portion of the first interlayer insulating film 65, the second interlayer insulating film 66 and the first interlayer insulating film 65 on the substrate surface are penetrated to reach an n-type region (an n ⁺ plug region 68 described later). A tungsten plug 69 is provided.

The tungsten plug 69 is surrounded by the barrier metal 71. Tungsten plug 69 and barrier metal 71 electrically connect n ⁺ plug region 68 provided in n-type extended drain region 53 and drain electrode 59 provided on the substrate surface. In the p-type offset region 54, an n-type source region 57 and a p-type source region 58 are provided outside the trench 55. The n-type source region 57 and the p-type source region 58 are electrically connected to the source electrode 60 through a tungsten plug 70 penetrating the second interlayer insulating film 66 and a barrier metal 72 surrounding the tungsten plug 70.

A manufacturing process of the TLPM shown in FIG. 16 will be described with reference to FIGS. First, the n-type well region 52 and the p-type offset region 54 are formed in the surface region of the p-type semiconductor substrate 51, the trench 55 is formed using the oxide film 91 as a mask, and the buffer oxide film 56 is formed. Then, phosphorus (P ₃₁ ) is ion-implanted (FIG. 17). After removing the mask oxide film 91, thermal diffusion is performed to form the extended drain region 53. A gate oxide film 63 and a gate polysilicon electrode 61 are formed along the sidewall of the trench 55. Then, a resist mask 92 is formed on the substrate surface, and arsenic (As ₇₅ ) is ion-implanted into the p-type offset region 54 outside the trench 55 (FIG. 18).

After removing the resist mask 92, a resist mask 93 is newly formed on the surface of the substrate, and boron (B ₁₁ ) is ion-implanted into a region outside the trench 55 in the p-type offset region 54 (FIG. 19). After removing the resist mask 93, thermal diffusion is performed to form an n-type source region 57 and a p-type source region 58. Further, an insulating film is deposited, the trench 55 is filled with the first interlayer insulating film 65, and a second interlayer insulating film 66 is deposited on the substrate surface. Thereafter, the surface of the second interlayer insulating film 66 is planarized by, for example, CMP (chemical mechanical polishing) or the like (FIG. 20).

Next, a resist mask 94 is newly formed on the substrate surface, and a contact hole for filling the drain tungsten plug 69 is opened in the first interlayer insulating film 65 (FIG. 21). After removing the resist mask 94, phosphorus (P ₃₁ ) ions are implanted into the bottom surface of the trench 55 using the first interlayer insulating film 65 and the second interlayer insulating film 66 as a mask (FIG. 22). Then, thermal diffusion is performed to form the n ⁺ plug region 68. Further, a resist mask 95 is newly formed on the substrate surface, and a contact hole for filling the source tungsten plug 70 is opened in the first interlayer insulating film 65 (FIG. 23).

Next, when the barrier metals 71 and 72, the tungsten plugs 69 and 70, and the wiring that becomes the drain electrode 59 and the source electrode 60 are formed, the TLPM shown in FIG. 16 is completed. In order to ensure a breakdown voltage of about 22-30 V or more in this TLPM, for example, the width of the trench 55 is about 2.4 μm, the width of the tungsten plug 69 including the barrier metal 71 is about 0.8 μm, and n ⁺ the distance between the plug region 68 and the gate polysilicon electrode 61 must want to be at least 0.4 .mu.m.

In the conventional TLPM, it is necessary to separately perform the step of forming the n-type source region 57 outside the trench 55 and the step of forming the n ⁺ plug region 68 on the bottom surface of the trench 55 as described above. The reason is as follows. That is, in the process illustrated in FIG. 18, due to the step due to the trench 55, the thickness of the resist mask 92 is increased inside the trench 55 and decreased outside the trench 55.

In this state, if the n-type source region 57 and the n ⁺ plug region 68 are simultaneously formed, the resist mask 92 is thicker inside the trench 55, so that the inner portion of the resist mask 92 is opened. The amount of exposure must be increased. Therefore, as shown in FIG. 24, the opening width a on the bottom surface of the trench 55 is perpendicular to the depth direction of the trench 55 (direction perpendicular to the drawing) as compared to the dimension b on the mask (left and right direction in the drawing). Will spread 0.5 μm on one side.

Then, as shown in FIG. 25, the finally obtained device structure has a structure in which the n ⁺ drain region 56 protrudes to the vicinity of the gate polysilicon electrode 61, and the breakdown voltage is lowered. In this case, in order to secure a breakdown voltage of about 30 V or more, the width of the trench 55 needs to be 3.4 μm, which is 1.0 μm wider than the design value (in this case, 2.4 μm), and the degree of integration decreases. End up.

In order to avoid such inconvenience, the n-type source region 57 and the n ⁺ plug region 68 are formed separately. In other words, the n-type source region 57 and the n ⁺ plug region 68 must be formed in separate steps in order to ensure a breakdown voltage without reducing the degree of integration. By the way, it has a source region and a drain region on the surface, a gate electrode in the trench between them, a gate oxide film between the gate electrode and the source region, and a thick oxide between the gate electrode and the drain region. High voltage power transistors having a film have been proposed (see, for example, Patent Document 1 and Patent Document 2).

Japanese Patent No. 3348911 (FIGS. 2 and 4) US Pat. No. 5,434,435 (FIG. 2)

However, in the manufacturing process of FIGS. 17 to 23, the thick first interlayer insulating film 65 inside the trench 55 is etched to form the drain contact 80, so that the thin second interlayer insulating film 66 on the substrate surface is etched. Thus, damage is more likely to occur than when the source contact 81 is formed. Further, when the n ⁺ plug region 68 is formed on the bottom surface of the trench 55, it is necessary to perform ion implantation at a higher acceleration voltage and dose than when the n-type source region 57 is formed.

Since the n ⁺ plug region 68 is formed after the n-type source region 57 is formed, the annealing time is shortened and the profile of the diffusion region formed before the n ⁺ plug region 68 is not adversely affected. It is necessary to do so. For example, when forming the n-type source region 57, arsenic ions are implanted at an acceleration voltage of 40 keV and a dose of 3.0 × 10 ¹⁵ / cm ² , and then at a temperature of 800 ° C. for 25 minutes. Annealing is performed.

On the other hand, when forming the n ⁺ plug region 68, phosphorus is ion-implanted four times with an acceleration voltage of 70 keV and a dose of 3.75 × 10 ¹⁴ / cm ² , and then at 850 ° C. Annealing is performed at a temperature of 10 seconds. For this reason, crystal defects due to damage are likely to occur on the bottom surface of the trench 55. If there is a crystal defect, there is a problem in that after the barrier metal 71 and the tungsten plug 69 are formed, the tungsten plug 69 enters the crystal defect to cause a plug defect, resulting in a decrease in long-term reliability.

  Here, the mechanism by which the reliability decreases due to crystal defects will be described. FIG. 26 and FIG. 27 are diagrams showing the electric field distribution before and after the reliability test of the conventional TLPM, respectively. However, it is assumed that the withstand voltage is about 22 V or more and the off-characteristic applies a voltage of 20 V between the drain and the source (the source and gate are grounded to GND). In the reliability test, the voltage is applied between the drain and the source in an off state (the source and the gate are grounded to GND).

As shown in FIG. 26, the initial OFF characteristic has a low leakage because the end of the depletion layer does not reach the plug defect 82 even when a voltage of 20 V is applied. However, when a reliability test is performed, as shown in FIG. 27, n 1 in the vicinity of the interface between the first interlayer insulating film 65 and the n-type extended drain region 53 and closer to the n ⁺ plug region 68. ⁺ Electrons from the plug region 68 are trapped and the depletion layer is likely to spread. Therefore, the end of the depletion layer reaches the plug defect 82 and punch through occurs. As a result, the leakage increases and the off-characteristics deteriorate as compared to before the reliability test is performed.

In addition, since the contact hole for the drain contact and the contact hole for the source contact are formed using different masks (see FIGS. 21 and 23), the mask alignment when opening the contact hole for the drain contact is performed. The device pitch should be taken into consideration. In other words, it is necessary to consider the adjustment of the gap between the n ⁺ plug region 68 and the gate polysilicon electrode 61 due to the mask displacement. For this reason, the device pitch increases from the design value.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device that constitutes a highly reliable TLPM and a method for manufacturing the same in order to solve the above-described problems caused by the prior art. Another object of the present invention is to provide a semiconductor device constituting a TLPM with a small device pitch and a method for manufacturing the same.

  In order to solve the above-described problems and achieve the object, a semiconductor device according to the invention of claim 1 is formed in a first conductive type semiconductor region formed in a semiconductor substrate and in the first conductive type semiconductor region. A trench, a gate insulating film provided along the first sidewall of the trench, a gate electrode provided inside the trench along the gate insulating film, and in contact with the first sidewall of the trench A first conductivity type source region provided in a surface region of the first conductivity type semiconductor region, and provided between the first conductivity type source region and the bottom surface of the trench along a first side wall of the trench; A second conductivity type channel region; a field plate insulating film provided along the second side wall of the trench; and a field provided inside the trench along the field plate insulating film. A source electrically connected to the first conductivity type source region and a first conductivity type drain region provided in a surface region of the first conductivity type semiconductor region outside the second sidewall of the trench; An electrode and a drain electrode electrically connected to the first conductivity type drain region are provided.

  A semiconductor device according to a second aspect of the present invention is the semiconductor device according to the first aspect, wherein the first conductivity having a higher concentration than the first conductivity type semiconductor region is provided between the first conductivity type drain region and the bottom surface of the trench. It further comprises a type high concentration drain region.

  According to a third aspect of the present invention, in the semiconductor device according to the first or second aspect, the semiconductor substrate is made of a first conductivity type semiconductor.

  According to a fourth aspect of the present invention, in the semiconductor device according to the first or second aspect, the semiconductor substrate is made of a second conductivity type semiconductor.

In order to solve the above-described problems and achieve the object, a semiconductor device manufacturing method according to a fifth aspect of the present invention includes a first conductivity type semiconductor region forming step of forming a first conductivity type semiconductor region on a semiconductor substrate. A second conductivity type channel region forming step for forming a second conductivity type channel region in the first conductivity type semiconductor region formed by the first conductivity type semiconductor region forming step; and the first conductivity type semiconductor region forming step. And before the second conductivity type channel region formation step, or after the first conductivity type semiconductor region formation step and the second conductivity type channel region formation step, formed by the second conductivity type channel region formation step. Tre forming shallow trench than the first conductivity type semiconductor region formed by the second conductivity type channel deeper than the region, and the first conductivity type semiconductor region forming step And Ji forming step, a gate insulating film formation step of forming a gate insulating film along a first sidewall of the trench formed by the trench forming step, the second sidewall of the trench formed by the trench forming step A field plate insulating film forming step of forming a field plate insulating film along the gate electrode forming step of forming a gate electrode inside the trench along the gate insulating film formed by the gate insulating film forming step; A field plate forming step of forming a field plate inside the trench along the field plate insulating film formed by the field plate insulating film forming step, and after the gate electrode forming step and the field plate forming step , Contacting the first side wall with the first conductivity type half A first conductivity type source region forming step of forming a first conductivity type source region in the surface region of the body region, after the step of forming a gate electrode and said field plate forming step, the first conductive type semiconductor region, the trench A first conductivity type drain region forming step for forming a first conductivity type drain region in a surface region outside the second side wall, and filling the inside of the trench and forming the first conductivity type source region. an interlayer insulating film forming step of forming an interlayer insulating film covering the surface of the first conductivity type drain region formed by the first conductive type source region and the first conductivity type drain region formation step was, the interlayer insulating film forming step a contact hole and the contact hole for the drain contact for the source contact in the interlayer insulating film formed by the contour And Kutohoru opening step, the contact hole opening step drain electrically connected to the opening to the source electrode and the first conductivity type drain region electrically connected to the first conductive type source region via the contact hole was by electrodes And a source electrode / drain electrode forming step for forming the electrode .

According to a sixth aspect of the present invention, there is provided a method for manufacturing a semiconductor device according to the fifth aspect, wherein the gate insulating film formed by the gate insulating film forming step and the field plate formed by the field plate insulating film forming step. An insulating film is formed at the same time.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a semiconductor device according to the fifth or sixth aspect, wherein the gate electrode formed by the gate electrode forming step and the field plate formed by the field plate forming step are simultaneously formed. It is characterized by forming.

According to a eighth aspect of the present invention, there is provided a semiconductor device manufacturing method comprising: a first conductive type semiconductor region forming step of forming a first conductive type semiconductor region on a semiconductor substrate ; and a first conductive type semiconductor region forming step . A second conductivity type channel region forming step of forming a second conductivity type channel region in the one conductivity type semiconductor region, and before the first conductivity type semiconductor region forming step and the second conductivity type channel region forming step, or After the first conductive type semiconductor region forming step and the second conductive type channel region forming step, deeper than the second conductive type channel region formed by the second conductive type channel region forming step , and the first conductive type a trench forming step of forming a shallow trench than the first conductivity type semiconductor region formed by type semiconductor region forming step, formed by the trench forming step A gate insulating film formation step of forming a gate insulating film was along the first sidewall and a second sidewall of the trench, on the inside of the trench along the gate insulating film formed by the gate insulating film formation step a gate electrode forming step of forming a gate electrode, the gate electrode formed by a gate electrode forming step, a removal step of removing a portion along the second sidewall of the trench, the gate electrode formation step and the field plate After the forming step, a first conductive type source region forming step of forming a first conductive type source region in a surface region of the first conductive type semiconductor region in contact with the first sidewall of the trench, and the gate electrode forming step and after the field plate forming step, first to said first conductivity type semiconductor region, the outer surface area of the second sidewall of said trench A first conductivity type drain region formation step of forming a conductivity type drain region, with filling the interior of the trench, the first conductivity type source region and the first conductivity type which is formed by the first conductivity type source region forming step An interlayer insulating film forming step for forming an interlayer insulating film covering the surface of the first conductivity type drain region formed by the drain region forming step; and a contact hole for a source contact and a contact hole for a drain contact are formed in the interlayer insulating film. an opening for contact hole opening step, the source electrodes forming a drain electrode electrically connected to the source electrode and the first conductivity type drain region electrically connected to the first conductive type source region via the contact hole And a drain electrode forming step.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a semiconductor device according to any one of the fifth to eighth aspects, wherein the first conductive type source region is formed by the first conductive type source region forming step. The first conductivity type drain region formed in the first conductivity type drain region formation step is formed using the same mask.

A method of manufacturing a semiconductor device according to a tenth aspect of the present invention is the method according to any one of the fifth to ninth aspects, wherein the first conductive type semiconductor region formed by the first conductive type semiconductor region forming step , After forming the second conductivity type channel region formed by the second conductivity type channel region formation step and the trench formation step, before forming the gate insulation film by the gate insulation film formation step , the first conductivity type A first conductivity type high concentration drain region is formed in a region outside the second sidewall of the trench in the conductivity type semiconductor region so as to be deeper than the first conductivity type drain region.

  According to an eleventh aspect of the present invention, there is provided a method for manufacturing a semiconductor device according to any one of the fifth to tenth aspects, wherein a first conductivity type semiconductor substrate is used as the semiconductor substrate.

  According to a twelfth aspect of the present invention, there is provided a method for manufacturing a semiconductor device according to any one of the fifth to tenth aspects, wherein a second conductivity type semiconductor substrate is used as the semiconductor substrate.

  According to the present invention, it is not necessary to etch a thick insulating film inside the trench to form a contact on the bottom surface of the trench. Moreover, it is not necessary to form a plug region by ion implantation at the bottom of the trench with a high acceleration voltage and dose. Therefore, it is possible to prevent crystal defects from occurring on the bottom surface of the trench. Further, by providing a field plate and setting the field plate and the drain electrode to the same potential, the end of the depletion layer stays near the end of the field plate and does not reach the drain region. Therefore, since punch-through does not occur, high reliability can be obtained.

  On the other hand, when the field plate is not provided, the depletion layer extends to the drain region, so that the breakdown voltage is greatly improved. Further, the on-resistance is lowered by providing the high concentration drain region. Furthermore, it is possible to reduce the device pitch in anticipation of mask alignment, compared to the case where the drain contact hole and the source contact hole are opened using separate masks.

  According to the semiconductor device and the manufacturing method thereof according to the present invention, it is possible to obtain a semiconductor device that constitutes a highly reliable TLPM. In addition, there is an effect that a semiconductor device constituting a TLPM with a small device pitch can be obtained.

  Exemplary embodiments of a semiconductor device and a method for manufacturing the same according to the present invention will be explained below in detail with reference to the accompanying drawings. In this specification, it means that electrons or holes are majority carriers in the layers and regions with n or p, respectively. Note that, in the following description of the embodiments and the accompanying drawings, the same reference numerals are given to the same components, and duplicate descriptions are omitted.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of the TLPM according to the first embodiment of the present invention. As shown in FIG. 1, an n-type well region 2 is provided as a first conductivity type semiconductor region in a surface region of a p-type semiconductor substrate 1. In the n-type well region 2, although not particularly limited, for example, two trenches 5 are formed from the substrate surface. In the n-type well region 2, an n-type extended drain region 3 serving as a drift region is formed so as to surround the bottom of each trench 5.

  A high concentration n-type drain region 6 is provided in the substrate surface layer sandwiched between the two trenches 5 in the n-type well region 2. A p-type offset region 4 serving as a channel region is n-type on the substrate surface layer opposite to the n-type drain region 6 across the trench 5 in the n-type well region 2, that is, outside the two trenches 5. It is provided in contact with the extended drain region 3.

  A high concentration n-type source region 7 is provided in contact with the trench 5 in the substrate surface layer of the p-type offset region 4. A high-concentration p-type source region 8 is provided outside the n-type source region 7. Note that the n-type source region 7 and the p-type source region 8 may be arranged alternately in the depth direction of the trench 5 (direction perpendicular to the drawing).

  In each trench 5, a gate oxide film 13 serving as a gate insulating film and a gate polysilicon electrode 11 serving as a gate electrode are provided on the side in contact with the p-type offset region 4, that is, on the outer side wall. In each trench 5, a field plate oxide film 14 and a field plate 12 serving as a field plate insulating film are provided on the side sandwiching the n-type drain region 6, that is, on the inner side wall. In each trench 5, the space between the gate polysilicon electrode 11 and the field plate 12 is filled with a first interlayer insulating film 15.

  Except for a part of each of the n-type source region 7, the p-type source region 8 and the n-type drain region 6, the substrate surface is covered with a second interlayer insulating film 16. The tungsten plug 19 is covered with a barrier metal 21 and penetrates through the second interlayer insulating film 16 to electrically connect the drain electrode 9 and the n-type drain region 6. Therefore, the semiconductor device of the first embodiment is configured to draw the drain current from the substrate surface between the two trenches 5. The tungsten plug 20 is covered with a barrier metal 22 and penetrates the second interlayer insulating film 16 to electrically connect the source electrode 10 to the n-type source region 7 and the p-type source region 8.

Next, a manufacturing process of the TLPM shown in FIG. 1 will be described with reference to FIGS. First, the n-type well region 2 and the p-type offset region 4 are formed in the surface region of the p-type semiconductor substrate 1. Subsequently, two trenches 5 are formed using the oxide film 23 as a mask. Then, after forming the buffer oxide film 30, for example, phosphorus (P ₃₁ ) is ion-implanted vertically or obliquely into the bottom surface of each trench 5 (FIG. 2). Note that the n-type well region 2 and the p-type offset region 4 may be formed after the trench 5 is formed. Here, the conductivity type of the well region 2 is not the p-type but the n-type because the well region 2 is connected to the n-type extended drain region 3 to draw a drain current from the substrate surface between the two trenches 5. To be able to do that.

Next, the mask oxide film 23 is removed, and thermal diffusion is performed to form the extended drain region 3. A gate oxide film 13 and a field plate oxide film 14 are formed on the inner wall of the trench 5, and a gate polysilicon electrode 11 and a field plate 12 are further formed. At that time, the gate oxide film 13 and the field plate oxide film 14 may be formed simultaneously or separately. Moreover, the gate polysilicon electrode 11 and the field plate 12 may be formed simultaneously or separately. Then, a resist mask 24 for forming the n-type drain region 6 and the n-type source region 7 is formed on the substrate surface, and arsenic (As, for example) is simultaneously formed between the two trenches 5 and the region outside each trench 5. ₇₅ ) is ion-implanted (FIG. 3).

After removing the resist mask 24, a resist mask 25 for forming the p-type source region 8 is formed on the substrate surface, and, for example, boron (B ₁₁ ) is ion-implanted (FIG. 4). Arsenic ion implantation (FIG. 3) may be performed after boron ion implantation (FIG. 4). After removing the resist mask 25, thermal diffusion is performed to form the n-type drain region 6, the n-type source region 7, and the p-type source region 8. Further, an insulating film is deposited, and a portion of the trench 5 between the gate polysilicon electrode 11 and the field plate 12 is filled with the first interlayer insulating film 15 and a second interlayer insulating film 16 is deposited on the substrate surface. .

  Thereafter, the surface of the second interlayer insulating film 16 is planarized by, for example, CMP (chemical mechanical polishing). Then, a resist mask 26 having a desired pattern is formed on the second interlayer insulating film 16, and contact holes for filling the drain tungsten plug 19 and the source tungsten plug 20 are opened (FIG. 5). When the resist mask 26 is removed and the barrier metals 21 and 22, the tungsten plugs 19 and 20, and the wiring that becomes the drain electrode 9 and the source electrode 10 are formed, the TLPM shown in FIG. 1 is completed.

  By the way, in the first embodiment, since the drain current is drawn in the high-resistance well region 2, the on-resistance is slightly higher than when the drain contact is provided on the bottom surface of the trench. Therefore, the inventors compared the on-resistance between the TLPM of the first embodiment and the TLPM of the conventional configuration shown in FIG. The results are shown in Table 1.

However, in calculating the on-resistance value, the doses of the n-type well region 2, the p-type offset region 4, the n-type drain region 6, the n-type source region 7 and the n-type extended drain region 3 of the first embodiment are used. The amount, diffusion depth, and surface concentration were as shown in Table 2. Table 2 shows dose amounts, diffusion depths, and surface concentrations of the n-type well region 52, the p-type offset region 54, the n ⁺ plug region 68, the n-type source region 57, and the n-type extended drain region 53 of the conventional configuration. It was as shown in.

Here, the n-type well region 2, the p-type offset region 4, the n-type drain region 6 and the n-type source region 7 of the first embodiment, the conventional n-type well region 52, the p-type offset region 54, and the n ⁺ The surface concentration of the plug region 68 and the n-type source region 57 is the concentration on the substrate surface beside the trench. Further, the surface concentrations of the n-type extended drain region 3 of the first embodiment and the n-type extended drain region 53 of the conventional configuration are those at the bottom of the trench. In addition, the effective resistivity of the n-type well region 2 of the first embodiment and the n-type well region 52 of the conventional configuration is set to a trench depth of 1.2 μm in consideration of the concentration decreasing in the depth direction. Is 0.1 Ω-cm, and the trench depth is 2.0 μm is 0.2 Ω-cm.

  Further, the width of the trench 5 of the first embodiment, the width between the trenches to be the n-type drain region 6 (the trench remaining width in Table 3), the outside of the trench 5 to be the n-type source region 7 and the p-type source region 8 The width (the trench remaining width in Table 3) and the depth of the trench 5 were as shown in Table 3. In addition, the width of the trench 55 having the conventional structure, the width outside the trench 55 that becomes the n-type source region 57 and the p-type source region 58 (the trench remaining width in Table 3), the width of the tungsten plug 69 at the bottom of the trench, and the trench 55 The depth of was as shown in Table 3. Both the first embodiment and the conventional configuration have a device pitch of 2.3 μm.

  As shown in Table 1, when the trench depth is 1.2 μm, the on-resistance RonA of the first embodiment is approximately the same as the on-resistance RonA of the conventional configuration. This is because the contribution of the high resistance n-type well region 2 is as small as 10% because the distance between the n-type extended drain region 3 and the n-type drain region 6 in the first embodiment is short. On the other hand, when the trench depth is 2.0 μm, in the first embodiment, the contribution of the high-resistance n-type well region 2 is as large as 44%, so the on-resistance RonA is increased, and the on-resistance of the conventional configuration is increased. Compared with RonA, it cannot be said that low on-resistance is sufficient. Therefore, in order to achieve a low on-resistance equivalent to that of the conventional configuration in the first embodiment, the trench depth is preferably about 1.2 μm or less.

  According to the first embodiment, the step of etching the thick oxide film inside the trench to form a contact on the bottom surface of the trench, and the step of forming the plug region by ion implantation at the bottom surface of the trench with a high acceleration voltage and dose. Since it becomes unnecessary, crystal defects do not occur. Further, by setting the field plate 12 and the drain electrode 9 to the same potential, the end of the depletion layer stays in the extended drain region 3 near the end of the field plate 12 and does not reach the drain region 6. Therefore, since punch-through does not occur, high reliability can be obtained. In addition, the device pitch for mask alignment can be made smaller than when the drain contact hole and the source contact hole are opened using separate masks.

Embodiment 2. FIG.
FIG. 6 is a cross-sectional view showing the configuration of the TLPM according to the second embodiment of the present invention. As shown in FIG. 6, the second embodiment is a modification of the first embodiment. The second embodiment is different from the first embodiment in that the field plate oxide film 14 and the field plate 12 are not provided in each trench 5. Other configurations of the second embodiment are the same as those of the first embodiment.

Next, a manufacturing process of the TLPM shown in FIG. 6 will be described with reference to FIGS. First, in the same manner as in the first embodiment, an n-type well region 2, a p-type offset region 4 and two trenches 5 are formed in a p-type semiconductor substrate 1, and, for example, phosphorus (P ₃₁ ) ion implantation is performed. (FIG. 2). Next, in the same manner as in the first embodiment, the extended drain region 3 is formed by thermal diffusion, and the gate oxide film 13, the field plate oxide film 14, the gate polysilicon electrode 11 and the field plate 12 are formed.

Thereafter, a resist mask 27 having a pattern covering the gate polysilicon electrode 11 and opening on the field plate 12 is formed on the substrate surface (FIG. 7). The field plate 12 is extinguished by removing the polysilicon while leaving the gate polysilicon electrode 11. Next, a resist mask 28 for forming the n-type drain region 6 and the n-type source region 7 is formed on the substrate surface, and arsenic (As, for example) is simultaneously formed between the two trenches 5 and the region outside each trench 5. ₇₅ ) is ion-implanted (FIG. 8). The subsequent steps are the same as in the first embodiment (FIGS. 4 and 5).

  According to the second embodiment, since there is no field plate 12, the depletion layer extends to the drain leading portion, that is, the n-type drain region 6 between the two trenches 5, so that the on-resistance is almost the same as in the first embodiment. Thus, a significant increase in breakdown voltage can be achieved. For example, when the breakdown voltage when the dimensions and concentrations of the diffusion layers and trenches are the values shown in Table 2 and Table 3, the breakdown voltage when the trench depth is 1.2 μm is 35V. The breakdown voltage when the trench depth is 2.0 μm is 40V. The on-resistance is the same as that in the first embodiment. As described above, in the second embodiment, when compared with the same impurity profile, the breakdown voltage is significantly improved as compared with the first embodiment with the same on-resistance as in the first embodiment.

Embodiment 3 FIG.
FIG. 9: is sectional drawing which shows the structure of TLPM concerning Embodiment 3 of this invention. As shown in FIG. 9, the third embodiment is a modification of the first embodiment. The third embodiment is different from the first embodiment in that n-type drain region 6 and n-type extended drain region 3 are n-type first conductivity type high-concentration drain regions having a higher concentration than n-type well region 2. The mold offset region 17 is provided. Other configurations of the third embodiment are the same as those of the first embodiment.

Next, a manufacturing process of the TLPM shown in FIG. 9 will be described with reference to FIG. First, the n-type well region 2, the p-type offset region 4 and the n-type offset region 17 are formed in the surface region of the p-type semiconductor substrate 1. Subsequently, two trenches 5 are formed using the oxide film 29 as a mask. Then, after forming the buffer oxide film 30, for example, phosphorus (P ₃₁ ) is ion-implanted vertically or obliquely into the bottom surface of each trench 5 (FIG. 10). Note that the n-type well region 2, the p-type offset region 4, and the n-type offset region 17 may be formed after the trench 5 is formed. The subsequent steps are the same as in the first embodiment (FIGS. 3 to 5).

  According to the third embodiment, when the field plate 12 and the drain electrode 9 are at the same potential, the end of the depletion layer stays in the extended drain region 3 near the end of the field plate 12 and does not reach the n-type offset region 17. Therefore, the n-type offset region 17 does not contribute to the withstand voltage, so that the withstand voltage comparable to that of the first embodiment can be obtained. Further, since the n-type offset region 17 is provided, the on-resistance becomes lower than that in the first embodiment.

  As an example, Table 4 shows the TLPM of the third embodiment and the TLPM of the first embodiment (no n-type offset region 17) and the TLPM of the conventional configuration shown in FIG. 16 (no n-type offset region 17). The results of comparison between on-resistance and breakdown voltage by the present inventors are shown. The numerical values shown in Table 2 and Table 3 were used for the dimensions and concentrations of each diffusion layer and trench.

  As shown in Table 4, the on-resistance RonA of the third embodiment is the same as that of the third embodiment regardless of whether the trench depth is 1.2 μm or 2.0 μm and the average concentration of the n-type offset region 17 is changed. 1 on-resistance RonA. The breakdown voltage is the same in the third embodiment, the first embodiment, and the conventional configuration. That is, according to the third embodiment, the on-resistance can be lowered without causing a decrease in breakdown voltage. In the third embodiment, the on-resistance is slightly higher than that of the conventional configuration, but the increase rate is about 9% or less, so there is no problem in practical use.

Embodiment 4 FIG.
FIG. 11: is sectional drawing which shows the structure of TLPM concerning Embodiment 4 of this invention. As shown in FIG. 11, the fourth embodiment is a modification of the second embodiment. The fourth embodiment differs from the second embodiment in that an n-type offset region 17 having a higher concentration than the n-type well region 2 is provided between the n-type drain region 6 and the n-type extended drain region 3. That is. Other configurations of the fourth embodiment are the same as those of the second embodiment. Further, in manufacturing the TLPM shown in FIG. 11, after the steps shown in FIG. 10 are performed, the steps shown in FIG. 7, FIG. 8, FIG. 4, and FIG.

Embodiment 5 FIG.
12 and 13 are cross-sectional views showing the configuration of the TLPM according to the fifth embodiment of the present invention. As shown in FIGS. 12 and 13, the fifth embodiment is provided with three or more trenches 5 in the first embodiment, and four in the illustrated example. In the fifth embodiment, the n-type source region 7 and the p-type source region 8 are alternately arranged in the depth direction of the trench 5 (direction perpendicular to the drawing). A cross-sectional configuration across the n-type source region 7 is shown in FIG. 12, and a cross-sectional configuration across the p-type source region 8 is shown in FIG.

  In FIG. 12, n-type drain region 6 and n-type source region 7 and in FIG. 13 n-type drain region 6 and p-type source region 8 are alternately arranged with trench 5 interposed therebetween. In the fifth embodiment, the outermost regions of the n-type drain region 6, the n-type source region 7 and the p-type source region 8 are the n-type source region 7 and the p-type source region 8. Other configurations of the fifth embodiment are the same as those of the first embodiment. Note that the second to fourth embodiments may have three or more trenches 5 as in the fifth embodiment.

Embodiment 6 FIG.
14 and 15 are cross-sectional views showing the configuration of the TLPM according to the sixth embodiment of the present invention. As shown in FIGS. 14 and 15, the sixth embodiment is a modification of the fifth embodiment. The sixth embodiment differs from the fifth embodiment in that the outermost region of the n-type drain region 6, the n-type source region 7 and the p-type source region 8 is the n-type drain region 6. is there. FIG. 14 shows a cross-sectional configuration crossing the n-type source region 7, and FIG. 15 shows a cross-sectional configuration crossing the p-type source region 8. Other configurations of the sixth embodiment are the same as those of the fifth embodiment. The second to fourth embodiments may have three or more trenches 5 as in the sixth embodiment.

  As described above, the present invention is not limited to the above-described embodiment, and various modifications can be made. For example, an n-type semiconductor substrate may be used instead of the p-type semiconductor substrate 1. Further, the n-type extended drain region 3 may not be provided at the bottom of the trench 5. In each embodiment, the first conductivity type is n-type and the second conductivity type is p-type. However, in the present invention, the first conductivity type may be p-type and the second conductivity type may be n-type. Furthermore, the dimensions and concentrations described in the embodiments are examples, and the present invention is not limited to these values.

  As described above, the semiconductor device and the manufacturing method thereof according to the present invention are useful for a low on-resistance power MOSFET suitable for an integrated circuit that controls a large current with a high breakdown voltage, and in particular, an IC for a switching power supply, an automobile power system Suitable for power MOSFETs integrated in driving ICs, flat panel display driving ICs, and the like.

It is sectional drawing which shows the structure of TLPM concerning Embodiment 1 of this invention. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure of TLPM concerning Embodiment 2 of this invention. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure of TLPM concerning Embodiment 3 of this invention. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure of TLPM concerning Embodiment 4 of this invention. It is sectional drawing which shows the structure of TLPM concerning Embodiment 5 of this invention. It is sectional drawing which shows the structure of TLPM concerning Embodiment 5 of this invention. It is sectional drawing which shows the structure of TLPM concerning Embodiment 6 of this invention. It is sectional drawing which shows the structure of TLPM concerning Embodiment 6 of this invention. It is sectional drawing which shows the structure of the conventional TLPM. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture of TLPM shown in FIG. It is sectional drawing which shows the structure in the middle of manufacture at the time of manufacturing the conventional TLPM in the process order which is not preferable. It is sectional drawing which shows the structure at the time of manufacturing the conventional TLPM in the process order which is not preferable. It is a schematic diagram which shows the electric field distribution in the step before the reliability test of the conventional TLPM. It is a schematic diagram which shows the electric field distribution in the stage after the reliability test of the conventional TLPM.

Explanation of symbols

2 First conductivity type semiconductor region (n-type well region)
4 Second conductivity type channel region (p-type offset region)
5 Trench 6 First conductivity type drain region (n-type drain region)
7 First conductivity type source region (n-type source region)
9 Drain electrode 10 Source electrode 11 Gate electrode (gate polysilicon electrode)
12 Field plate 13 Gate insulating film (gate oxide film)
14 Field plate insulation film (field plate oxide film)
17 First conductivity type high concentration drain region (n-type offset region)

Claims (12)

A first conductivity type semiconductor region formed in a semiconductor substrate;
A trench formed in the first conductivity type semiconductor region;
A gate insulating film provided along the first sidewall of the trench;
A gate electrode provided inside the trench along the gate insulating film;
A first conductivity type source region provided in a surface region of the first conductivity type semiconductor region in contact with the first sidewall of the trench;
A second conductivity type channel region provided between the first conductivity type source region and the bottom surface of the trench along the first sidewall of the trench;
A field plate insulating film provided along the second sidewall of the trench;
A field plate provided inside the trench along the field plate insulating film;
A first conductivity type drain region provided in a surface region of the first conductivity type semiconductor region outside the second sidewall of the trench;
A source electrode electrically connected to the first conductivity type source region;
A drain electrode electrically connected to the first conductivity type drain region;
A semiconductor device comprising:   2. The semiconductor according to claim 1, further comprising a first conductivity type high concentration drain region having a higher concentration than the first conductivity type semiconductor region between the first conductivity type drain region and a bottom surface of the trench. apparatus.   The semiconductor device according to claim 1, wherein the semiconductor substrate is made of a first conductivity type semiconductor.   The semiconductor device according to claim 1, wherein the semiconductor substrate is made of a second conductivity type semiconductor. A first conductivity type semiconductor region forming step of forming a first conductivity type semiconductor region on a semiconductor substrate ;
A second conductivity type channel region forming step of forming a second conductivity type channel region in the first conductivity type semiconductor region formed by the first conductivity type semiconductor region formation step;
Before the first conductive type semiconductor region forming step and the second conductive type channel region forming step, or after the first conductive type semiconductor region forming step and the second conductive type channel region forming step, the second conductive type Forming a trench deeper than the second conductivity type channel region formed by the type channel region formation step and shallower than the first conductivity type semiconductor region formed by the first conductivity type semiconductor region formation step; ,
Forming a gate insulating film along a first sidewall of the trench formed by the trench forming process; and
A field plate insulating film forming step of forming a field plate insulating film along the second sidewall of the trench formed by the trench forming step;
Forming a gate electrode inside the trench along the gate insulating film formed by the gate insulating film forming step; and
A field plate forming step of forming a field plate inside the trench along the field plate insulating film formed by the field plate insulating film forming step;
A first conductivity type source region that forms a first conductivity type source region in a surface region of the first conductivity type semiconductor region in contact with the first sidewall of the trench after the gate electrode formation step and the field plate formation step Forming process;
After the gate electrode forming step and the field plate forming step, a first conductivity type drain region that forms a first conductivity type drain region in a surface region of the first conductivity type semiconductor region outside the second sidewall of the trench. A region forming step;
The surface of the first conductivity type source region formed by the first conductivity type source region formation step and the first conductivity type drain region formation step is filled with the interior of the trench. An interlayer insulating film forming step of forming an interlayer insulating film to be covered;
A contact hole opening step of opening a contact hole for a source contact and a contact hole for a drain contact in the interlayer insulating film formed by the interlayer insulating film forming step ;
A source electrode for forming a source electrode electrically connected to the first conductivity type source region and a drain electrode electrically connected to the first conductivity type drain region through the contact hole opened by the contact hole opening step. A drain electrode forming step;
A method for manufacturing a semiconductor device, comprising: 6. The method of manufacturing a semiconductor device according to claim 5, wherein a gate insulating film formed by the gate insulating film forming step and a field plate insulating film formed by the field plate insulating film forming step are simultaneously formed. 7. The method of manufacturing a semiconductor device according to claim 5, wherein the gate electrode formed by the gate electrode formation step and the field plate formed by the field plate formation step are formed simultaneously. A first conductivity type semiconductor region forming step of forming a first conductivity type semiconductor region on a semiconductor substrate ;
A second conductivity type channel region forming step of forming a second conductivity type channel region in the first conductivity type semiconductor region formed by the first conductivity type semiconductor region formation step;
Before the first conductive type semiconductor region forming step and the second conductive type channel region forming step, or after the first conductive type semiconductor region forming step and the second conductive type channel region forming step, the second conductive type Forming a trench deeper than the second conductivity type channel region formed by the type channel region formation step and shallower than the first conductivity type semiconductor region formed by the first conductivity type semiconductor region formation step; ,
A gate insulating film forming step of forming a gate insulating film along the first side wall and the second side wall of the trench formed by the trench forming step;
Forming a gate electrode inside the trench along the gate insulating film formed by the gate insulating film forming step; and
A removing step of removing a portion of the gate electrode formed by the gate electrode forming step along the second side wall of the trench;
A first conductivity type source region that forms a first conductivity type source region in a surface region of the first conductivity type semiconductor region in contact with the first sidewall of the trench after the gate electrode formation step and the field plate formation step Forming process;
After the gate electrode forming step and the field plate forming step, a first conductivity type drain region that forms a first conductivity type drain region in a surface region of the first conductivity type semiconductor region outside the second sidewall of the trench. A region forming step;
The surface of the first conductivity type source region formed by the first conductivity type source region formation step and the first conductivity type drain region formation step is filled with the interior of the trench. An interlayer insulating film forming step of forming an interlayer insulating film to be covered;
A contact hole opening step of opening a contact hole for a source contact and a contact hole for a drain contact in the interlayer insulating film;
A source electrode / drain electrode forming step of forming a source electrode electrically connected to the first conductivity type source region through the contact hole and a drain electrode electrically connected to the first conductivity type drain region;
A method for manufacturing a semiconductor device, comprising: Forming a first conductive type source region formed by the first conductive type source region forming step and a first conductive type drain region formed by the first conductive type drain region forming step using the same mask; The method for manufacturing a semiconductor device according to claim 5, wherein the method is a semiconductor device manufacturing method. After forming a first conductive type semiconductor region formed by the first conductive type semiconductor region forming step, a second conductive type channel region formed by the second conductive type channel region forming step, and a trench by the trench forming step. Before forming the gate insulating film by the gate insulating film forming step , the first conductive type semiconductor region is deeper than the first conductive type drain region in the region outside the second sidewall of the trench. 10. The method of manufacturing a semiconductor device according to claim 5, wherein a first conductivity type high concentration drain region is formed in the semiconductor device.   The method for manufacturing a semiconductor device according to claim 5, wherein a first conductivity type semiconductor substrate is used as the semiconductor substrate.   The method for manufacturing a semiconductor device according to claim 5, wherein a second conductivity type semiconductor substrate is used as the semiconductor substrate.

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