JP4983065B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4983065B2 JP4983065B2 JP2006090872A JP2006090872A JP4983065B2 JP 4983065 B2 JP4983065 B2 JP 4983065B2 JP 2006090872 A JP2006090872 A JP 2006090872A JP 2006090872 A JP2006090872 A JP 2006090872A JP 4983065 B2 JP4983065 B2 JP 4983065B2
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- semiconductor chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Description
図1は、第1の実施の形態の半導体装置の側部断面図である。なお、以下では、図1中上側を「上」、下側を「下」という。
図2は、図1に示す半導体装置を示す背面図である。
図3は、SiP基板の回路構成を示す平面図である。なお、以下では図3中の左側を「左」、右側を「右」という。
半導体チップ22は、標準パラレルIOインタフェース311と高速IO制御ブロック312、313とシリアライザ314、316とデシリアライザ315、317とキャンセラー回路318と出力バッファ319と入力バッファ320と入出力バッファ321とを有している。
高速IO制御ブロック312、313は、それぞれ8ビットのパラレルデータを10ビットデータに変換してシリアル伝送する8B10B方式の制御部である。
シリアライザ316は、高速IO制御ブロック313から出力される8ビットのパラレル・バスの信号を1本の伝送線路に送り出すためのシリアル信号に変換し、入出力バッファ321に出力する。
キャンセラー回路(ノイズキャンセラー回路)318は、キャンセラー回路318に入力された信号から自己出力信号をキャンセルし、入力信号を抽出する。
入力バッファ320は、外部から入力されるシリアル信号(高速信号)をデシリアライザ315に出力する。
図4は、第2の実施の形態の半導体装置を示す側部断面図である。
以下、第2の実施の形態の半導体装置について、前述した第1の実施の形態の半導体装置との相違点を中心に説明し、同様の事項については、その説明を省略する。
図5は、第3の実施の形態の半導体装置を示す側部断面図である。
以下、第3の実施の形態の半導体装置について、前述した第1の実施の形態の半導体装置および第2の実施の形態の半導体装置との相違点を中心に説明し、同様の事項については、その説明を省略する。
21、22 半導体チップ
100、100a、100b SiP基板
212 マイクロプロセッサ
218、311 標準パラレルIOインタフェース
Claims (5)
- システムインパッケージを構成する半導体装置において、
パッケージ基板に搭載され、アナログ回路で構成された高速信号入出力部を備えた第1の半導体チップと、
マイクロプロセッサを備え、前記第1の半導体チップと分離した状態で前記パッケージ基板に搭載され、前記第1の半導体チップの前記高速信号入出力部を用いて他の半導体チップとの間で高速信号の送受信を行うインタフェース部と、前記インタフェース部とは別個に前記高速信号より低速の信号の送受信を行う汎用信号入出力部を備えた第2の半導体チップと、
を有し、
前記第2の半導体チップは前記パッケージ基板の外部にある基板との間で、前記高速信号を送受信する場合は前記第1の半導体チップの高速信号入出力部を用い、前記高速信号より低速の信号を送受信する場合は前記第2の半導体チップの汎用信号入出力部を用いることを特徴とする半導体装置。 - 前記半導体装置において、前記高速信号を取り扱う回路は前記第1の半導体チップに集積されており、前記第1の半導体チップには前記高速信号を取り扱う回路のみが集積されていることを特徴とする請求項1記載の半導体装置。
- 前記第2の半導体チップの表面形状は、前記第1の半導体チップの表面形状に対応するように形成されていることを特徴とする請求項1または2に記載の半導体装置。
- 前記第2の半導体チップは、前記パッケージ基板にフリップ実装されていることを特徴とする請求項1または2に記載の半導体装置。
- 前記第1の半導体チップに供給する電源と前記第2の半導体チップに供給する電源とは別個に供給されることを特徴とする請求項1または2に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006090872A JP4983065B2 (ja) | 2006-03-29 | 2006-03-29 | 半導体装置 |
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JP2006090872A JP4983065B2 (ja) | 2006-03-29 | 2006-03-29 | 半導体装置 |
Publications (2)
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JP2007266402A JP2007266402A (ja) | 2007-10-11 |
JP4983065B2 true JP4983065B2 (ja) | 2012-07-25 |
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JP2006090872A Active JP4983065B2 (ja) | 2006-03-29 | 2006-03-29 | 半導体装置 |
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US9231548B2 (en) * | 2012-03-23 | 2016-01-05 | Marvell Israel (M.I.S.L) Ltd. | Package with printed filters |
WO2017136289A2 (en) * | 2016-02-02 | 2017-08-10 | Xilinx, Inc. | Active-by-active programmable device |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH03206654A (ja) * | 1990-01-09 | 1991-09-10 | Seiko Epson Corp | 半導体装置 |
JPH0582717A (ja) * | 1991-09-24 | 1993-04-02 | Toshiba Corp | 半導体集積回路装置 |
JP2001015674A (ja) * | 1999-06-29 | 2001-01-19 | Toshiba Lsi System Support Kk | 半導体装置 |
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