JP4973122B2 - 回路基板用部材および回路基板の製造方法 - Google Patents
回路基板用部材および回路基板の製造方法 Download PDFInfo
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- JP4973122B2 JP4973122B2 JP2006292296A JP2006292296A JP4973122B2 JP 4973122 B2 JP4973122 B2 JP 4973122B2 JP 2006292296 A JP2006292296 A JP 2006292296A JP 2006292296 A JP2006292296 A JP 2006292296A JP 4973122 B2 JP4973122 B2 JP 4973122B2
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- flexible film
- film
- circuit pattern
- peeling
- reinforcing plate
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006292296A JP4973122B2 (ja) | 2005-10-27 | 2006-10-27 | 回路基板用部材および回路基板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005312473 | 2005-10-27 | ||
| JP2005312473 | 2005-10-27 | ||
| JP2006292296A JP4973122B2 (ja) | 2005-10-27 | 2006-10-27 | 回路基板用部材および回路基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007150279A JP2007150279A (ja) | 2007-06-14 |
| JP2007150279A5 JP2007150279A5 (https=) | 2009-12-10 |
| JP4973122B2 true JP4973122B2 (ja) | 2012-07-11 |
Family
ID=38211241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006292296A Expired - Fee Related JP4973122B2 (ja) | 2005-10-27 | 2006-10-27 | 回路基板用部材および回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4973122B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6181984B2 (ja) * | 2013-06-07 | 2017-08-16 | 東洋紡株式会社 | 高分子フィルム積層基板 |
| CN103716995B (zh) * | 2013-12-06 | 2017-01-04 | 深圳市东旭发自动化有限公司 | 一种补强板贴合机 |
| KR102466741B1 (ko) * | 2014-05-13 | 2022-11-15 | 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 | 전자 디바이스를 제공하는 방법 |
| CN112652242B (zh) * | 2020-12-09 | 2022-08-23 | 深圳一鑫新材料有限公司 | 柔性曲面显示屏贴合工艺 |
| CN119307192B (zh) * | 2024-12-13 | 2025-04-15 | 博益鑫成高分子材料股份有限公司 | 一种柔性oled面板制程用边缘剥离力增强保护膜 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147713A (ja) * | 1982-02-26 | 1983-09-02 | Sharp Corp | 液晶表示装置の製造方法 |
| JPH0799379A (ja) * | 1993-08-05 | 1995-04-11 | Fujikura Ltd | フレキシブル印刷配線板の製造方法 |
| JP2002043253A (ja) * | 2000-07-26 | 2002-02-08 | Nec Corp | 半導体素子のダイシング方法 |
| JP3945341B2 (ja) * | 2002-08-06 | 2007-07-18 | 東レ株式会社 | 回路基板用部材 |
| JP4178869B2 (ja) * | 2002-08-06 | 2008-11-12 | 東レ株式会社 | 回路基板用部材および回路基板の製造方法 |
| JP2004319869A (ja) * | 2003-04-18 | 2004-11-11 | Toray Ind Inc | 回路基板の製造方法 |
| JP2007251080A (ja) * | 2006-03-20 | 2007-09-27 | Fujifilm Corp | プラスチック基板の固定方法、回路基板およびその製造方法 |
-
2006
- 2006-10-27 JP JP2006292296A patent/JP4973122B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007150279A (ja) | 2007-06-14 |
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