JP4973122B2 - 回路基板用部材および回路基板の製造方法 - Google Patents

回路基板用部材および回路基板の製造方法 Download PDF

Info

Publication number
JP4973122B2
JP4973122B2 JP2006292296A JP2006292296A JP4973122B2 JP 4973122 B2 JP4973122 B2 JP 4973122B2 JP 2006292296 A JP2006292296 A JP 2006292296A JP 2006292296 A JP2006292296 A JP 2006292296A JP 4973122 B2 JP4973122 B2 JP 4973122B2
Authority
JP
Japan
Prior art keywords
flexible film
film
circuit pattern
peeling
reinforcing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006292296A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007150279A (ja
JP2007150279A5 (OSRAM
Inventor
太 奥山
寧昭 谷村
孝義 赤松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2006292296A priority Critical patent/JP4973122B2/ja
Publication of JP2007150279A publication Critical patent/JP2007150279A/ja
Publication of JP2007150279A5 publication Critical patent/JP2007150279A5/ja
Application granted granted Critical
Publication of JP4973122B2 publication Critical patent/JP4973122B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)
JP2006292296A 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法 Expired - Fee Related JP4973122B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006292296A JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005312473 2005-10-27
JP2005312473 2005-10-27
JP2006292296A JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2007150279A JP2007150279A (ja) 2007-06-14
JP2007150279A5 JP2007150279A5 (OSRAM) 2009-12-10
JP4973122B2 true JP4973122B2 (ja) 2012-07-11

Family

ID=38211241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006292296A Expired - Fee Related JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP4973122B2 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6181984B2 (ja) * 2013-06-07 2017-08-16 東洋紡株式会社 高分子フィルム積層基板
CN103716995B (zh) * 2013-12-06 2017-01-04 深圳市东旭发自动化有限公司 一种补强板贴合机
WO2015175353A1 (en) * 2014-05-13 2015-11-19 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
CN112652242B (zh) * 2020-12-09 2022-08-23 深圳一鑫新材料有限公司 柔性曲面显示屏贴合工艺
CN119307192B (zh) * 2024-12-13 2025-04-15 博益鑫成高分子材料股份有限公司 一种柔性oled面板制程用边缘剥离力增强保护膜

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147713A (ja) * 1982-02-26 1983-09-02 Sharp Corp 液晶表示装置の製造方法
JPH0799379A (ja) * 1993-08-05 1995-04-11 Fujikura Ltd フレキシブル印刷配線板の製造方法
JP2002043253A (ja) * 2000-07-26 2002-02-08 Nec Corp 半導体素子のダイシング方法
JP3945341B2 (ja) * 2002-08-06 2007-07-18 東レ株式会社 回路基板用部材
JP4178869B2 (ja) * 2002-08-06 2008-11-12 東レ株式会社 回路基板用部材および回路基板の製造方法
JP2004319869A (ja) * 2003-04-18 2004-11-11 Toray Ind Inc 回路基板の製造方法
JP2007251080A (ja) * 2006-03-20 2007-09-27 Fujifilm Corp プラスチック基板の固定方法、回路基板およびその製造方法

Also Published As

Publication number Publication date
JP2007150279A (ja) 2007-06-14

Similar Documents

Publication Publication Date Title
KR101028479B1 (ko) 회로기판용 부재, 회로기판의 제조방법 및 회로기판의제조장치
KR20040028618A (ko) 회로기판, 회로기판용 부재 및 그 제조방법 및가요성필름의 라미네이트방법
JP4973122B2 (ja) 回路基板用部材および回路基板の製造方法
JP2008300881A (ja) 回路基板用部材およびそれを用いた電子部品実装回路基板の製造方法
JP4178869B2 (ja) 回路基板用部材および回路基板の製造方法
JP4314834B2 (ja) 回路基板の製造方法および回路基板用部材
JP4075652B2 (ja) 半導体装置の製造方法
JP4479512B2 (ja) 回路基板用部材および回路基板用部材の製造方法
JP4626139B2 (ja) 回路基板の製造方法
JP4006970B2 (ja) 両面回路基板の製造方法
JP2003273493A (ja) 回路基板の製造方法及び回路基板用部材
JP2003101193A (ja) 回路基板の製造方法
JP3945341B2 (ja) 回路基板用部材
JP4211413B2 (ja) 回路基板用部材
JP4158659B2 (ja) 電子部品実装回路基板の製造方法
JP4345464B2 (ja) 電子部品が接合された回路基板用部材の製造方法
JP2004346106A (ja) 回路基板部材用粘着剤および回路基板部材
JP2004265913A (ja) 回路基板用部材および回路基板の製造方法
JP2003101192A (ja) 回路基板の製造方法
JP4433771B2 (ja) 回路基板用部材および回路基板の製造方法
JP4862238B2 (ja) 回路基板の製造方法
JP2007194324A (ja) 回路基板用部材およびその製造方法
JP2006080429A (ja) 回路基板用部材およびその製造方法
JP2004319869A (ja) 回路基板の製造方法
JP2009246096A (ja) 回路基板、フィルム回路基板およびフィルム回路基板の製造方法。

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091026

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091026

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120313

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120326

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150420

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees