JP4970567B2 - フレキシブル基板上の金属層厚さ測定方法 - Google Patents

フレキシブル基板上の金属層厚さ測定方法 Download PDF

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Publication number
JP4970567B2
JP4970567B2 JP2010091275A JP2010091275A JP4970567B2 JP 4970567 B2 JP4970567 B2 JP 4970567B2 JP 2010091275 A JP2010091275 A JP 2010091275A JP 2010091275 A JP2010091275 A JP 2010091275A JP 4970567 B2 JP4970567 B2 JP 4970567B2
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Japan
Prior art keywords
metal layer
thickness
flexible substrate
measuring
thin film
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Expired - Fee Related
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JP2010091275A
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English (en)
Japanese (ja)
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JP2011137793A (ja
Inventor
ハン・ジュニョン
キム・ユン−ベ
チ・グァン−グ
ピョン・ジ−ヨン
Original Assignee
コリア・インスティテュート・オブ・サイエンス・アンド・テクノロジー
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/04—Measuring microscopes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Laminated Bodies (AREA)
JP2010091275A 2009-12-31 2010-04-12 フレキシブル基板上の金属層厚さ測定方法 Expired - Fee Related JP4970567B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090136234A KR101181274B1 (ko) 2009-12-31 2009-12-31 플렉서블 기판상의 금속층 두께 측정방법
KR10-2009-0136234 2009-12-31

Publications (2)

Publication Number Publication Date
JP2011137793A JP2011137793A (ja) 2011-07-14
JP4970567B2 true JP4970567B2 (ja) 2012-07-11

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Family Applications (1)

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JP2010091275A Expired - Fee Related JP4970567B2 (ja) 2009-12-31 2010-04-12 フレキシブル基板上の金属層厚さ測定方法

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JP (1) JP4970567B2 (ko)
KR (1) KR101181274B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102177214B1 (ko) * 2014-03-17 2020-11-11 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조방법
CN108133097B (zh) * 2017-12-21 2021-01-19 大连理工大学 一种抑制褶皱的空间薄膜结构夹具形状优化设计方法
CN114858065B (zh) * 2022-04-26 2024-02-20 兰州空间技术物理研究所 一种检测柔性硅氧烷薄膜厚度的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2647585B2 (ja) * 1991-11-28 1997-08-27 三菱電機株式会社 自動薄膜計測装置
JP3365840B2 (ja) * 1993-12-15 2003-01-14 株式会社ヒューテック 蒸着膜の検査方法および装置
JP3060889B2 (ja) * 1995-05-19 2000-07-10 トヨタ自動車株式会社 薄膜の膜厚測定方法
JPH09320012A (ja) * 1996-05-31 1997-12-12 Sony Corp 磁気ヘッドの製造方法

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Publication number Publication date
KR20110079236A (ko) 2011-07-07
KR101181274B1 (ko) 2012-09-11
JP2011137793A (ja) 2011-07-14

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