JP4961299B2 - 露光装置およびデバイス製造方法 - Google Patents

露光装置およびデバイス製造方法 Download PDF

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Publication number
JP4961299B2
JP4961299B2 JP2007206531A JP2007206531A JP4961299B2 JP 4961299 B2 JP4961299 B2 JP 4961299B2 JP 2007206531 A JP2007206531 A JP 2007206531A JP 2007206531 A JP2007206531 A JP 2007206531A JP 4961299 B2 JP4961299 B2 JP 4961299B2
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JP
Japan
Prior art keywords
wafer
liquid
substrate
auxiliary plate
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007206531A
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English (en)
Japanese (ja)
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JP2009043879A (ja
JP2009043879A5 (https=
Inventor
朋史 西川原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007206531A priority Critical patent/JP4961299B2/ja
Priority to TW097129417A priority patent/TW200923590A/zh
Priority to KR1020080076311A priority patent/KR20090015824A/ko
Priority to US12/188,168 priority patent/US7630056B2/en
Publication of JP2009043879A publication Critical patent/JP2009043879A/ja
Publication of JP2009043879A5 publication Critical patent/JP2009043879A5/ja
Application granted granted Critical
Publication of JP4961299B2 publication Critical patent/JP4961299B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007206531A 2007-08-08 2007-08-08 露光装置およびデバイス製造方法 Expired - Fee Related JP4961299B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007206531A JP4961299B2 (ja) 2007-08-08 2007-08-08 露光装置およびデバイス製造方法
TW097129417A TW200923590A (en) 2007-08-08 2008-08-01 Exposure apparatus and device manufacturing method
KR1020080076311A KR20090015824A (ko) 2007-08-08 2008-08-05 노광장치 및 디바이스 제조 방법
US12/188,168 US7630056B2 (en) 2007-08-08 2008-08-07 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007206531A JP4961299B2 (ja) 2007-08-08 2007-08-08 露光装置およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2009043879A JP2009043879A (ja) 2009-02-26
JP2009043879A5 JP2009043879A5 (https=) 2010-09-16
JP4961299B2 true JP4961299B2 (ja) 2012-06-27

Family

ID=40346177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007206531A Expired - Fee Related JP4961299B2 (ja) 2007-08-08 2007-08-08 露光装置およびデバイス製造方法

Country Status (4)

Country Link
US (1) US7630056B2 (https=)
JP (1) JP4961299B2 (https=)
KR (1) KR20090015824A (https=)
TW (1) TW200923590A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10018923B2 (en) 2016-02-17 2018-07-10 Canon Kabushiki Kaisha Lithography apparatus, and method of manufacturing article

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5001343B2 (ja) 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー．ブイ． 流体抽出システム、液浸リソグラフィ装置、及び液浸リソグラフィ装置で使用される液浸液の圧力変動を低減する方法
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
NL2006127A (en) * 2010-02-17 2011-08-18 Asml Netherlands Bv A substrate table, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus.
JP6006406B2 (ja) * 2012-05-29 2016-10-12 エーエスエムエル ネザーランズ ビー．ブイ． オブジェクトホルダ及びリソグラフィ装置
EP2856262B1 (en) 2012-05-29 2019-09-25 ASML Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
WO2016173779A1 (en) 2015-04-29 2016-11-03 Asml Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
NL2018653A (en) * 2016-05-12 2017-11-15 Asml Netherlands Bv Extraction body for lithographic apparatus
NL2020011A (en) * 2017-01-26 2018-08-01 Asml Netherlands Bv A lithography apparatus and a method of manufacturing a device
WO2021170320A1 (en) * 2020-02-24 2021-09-02 Asml Netherlands B.V. Substrate support and substrate table

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3104396B1 (en) * 2003-06-13 2018-03-21 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
KR101281397B1 (ko) * 2003-12-15 2013-07-02 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
JP4600286B2 (ja) * 2003-12-16 2010-12-15 株式会社ニコン ステージ装置、露光装置、及び露光方法
JP4826146B2 (ja) * 2004-06-09 2011-11-30 株式会社ニコン 露光装置、デバイス製造方法
US7701550B2 (en) * 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8102512B2 (en) * 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
JP4848956B2 (ja) * 2004-11-01 2011-12-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
WO2006064851A1 (ja) * 2004-12-15 2006-06-22 Nikon Corporation 基板保持装置、露光装置、及びデバイス製造方法
JP2006173527A (ja) * 2004-12-20 2006-06-29 Sony Corp 露光装置
TWI424260B (zh) * 2005-03-18 2014-01-21 尼康股份有限公司 A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
JP4752320B2 (ja) * 2005-04-28 2011-08-17 株式会社ニコン 基板保持装置及び露光装置、基板保持方法、露光方法、並びにデバイス製造方法
JP2007019392A (ja) * 2005-07-11 2007-01-25 Canon Inc 露光装置
JP3997244B2 (ja) 2005-10-04 2007-10-24 キヤノン株式会社 露光装置及びデバイス製造方法
US7420194B2 (en) * 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7839483B2 (en) * 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8027019B2 (en) * 2006-03-28 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9013672B2 (en) * 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8514365B2 (en) * 2007-06-01 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10018923B2 (en) 2016-02-17 2018-07-10 Canon Kabushiki Kaisha Lithography apparatus, and method of manufacturing article

Also Published As

Publication number Publication date
US20090040481A1 (en) 2009-02-12
US7630056B2 (en) 2009-12-08
JP2009043879A (ja) 2009-02-26
TW200923590A (en) 2009-06-01
KR20090015824A (ko) 2009-02-12

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