JP4948930B2 - 圧電発振器 - Google Patents
圧電発振器 Download PDFInfo
- Publication number
- JP4948930B2 JP4948930B2 JP2006207184A JP2006207184A JP4948930B2 JP 4948930 B2 JP4948930 B2 JP 4948930B2 JP 2006207184 A JP2006207184 A JP 2006207184A JP 2006207184 A JP2006207184 A JP 2006207184A JP 4948930 B2 JP4948930 B2 JP 4948930B2
- Authority
- JP
- Japan
- Prior art keywords
- oscillation
- support substrate
- piezoelectric oscillator
- sealing member
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Description
部材の弾性率よりも高いことを特徴とするものである。
2・・・発振用IC
3・・・圧電振動子(水晶振動子)
4・・・封止部材
5・・・配線導体
6・・・外部端子
7・・・封止空間
Claims (4)
- 支持基板と発振用ICとを、両者の間に封止空間が形成されるようにして接合し、前記封止空間内に前記発振用ICと電気的に接続される圧電振動子を収容してなる圧電発振器において、
前記支持基板と前記発振用ICとを樹脂からなる環状の封止部材で接合することにより前記封止空間を気密封止するとともに、
前記支持基板に設けた配線導体と前記発振用ICとを電気的に接続するための導通部材が、前記封止空間内に設けられており、
前記導通部材は、前記発振用ICから前記支持基板にかけての側面全体が、樹脂からなる補助部材により被覆されており、
前記補助部材の弾性率が前記封止部材の弾性率よりも高い
ことを特徴とする圧電発振器。 - 前記封止部材の外側面には金属膜が被着されていることを特徴とする請求項1に記載の圧電発振器。
- 前記金属膜が支持基板に設けた接地導体と電気的に接続されていることを特徴とする請求項2に記載の圧電発振器。
- 前記圧電振動子が水晶振動子であることを特徴とする請求項1に記載の圧電発振器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006207184A JP4948930B2 (ja) | 2006-07-28 | 2006-07-28 | 圧電発振器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006207184A JP4948930B2 (ja) | 2006-07-28 | 2006-07-28 | 圧電発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008035277A JP2008035277A (ja) | 2008-02-14 |
JP4948930B2 true JP4948930B2 (ja) | 2012-06-06 |
Family
ID=39124225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006207184A Expired - Fee Related JP4948930B2 (ja) | 2006-07-28 | 2006-07-28 | 圧電発振器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4948930B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5513047B2 (ja) * | 2009-09-17 | 2014-06-04 | 京セラクリスタルデバイス株式会社 | 電子デバイス及び電子デバイスの製造方法 |
JP2021158628A (ja) | 2020-03-30 | 2021-10-07 | セイコーエプソン株式会社 | 振動デバイス、および電子機器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0423326A (ja) * | 1990-05-14 | 1992-01-27 | Fujitsu Ltd | 半導体装置の製造方法 |
JP3303791B2 (ja) * | 1998-09-02 | 2002-07-22 | 株式会社村田製作所 | 電子部品の製造方法 |
JP4289779B2 (ja) * | 2000-11-07 | 2009-07-01 | パナソニック株式会社 | 半導体実装方法および半導体実装装置 |
JP4039012B2 (ja) * | 2001-07-05 | 2008-01-30 | エプソントヨコム株式会社 | 圧電発振器 |
JP2004274000A (ja) * | 2003-03-12 | 2004-09-30 | Matsushita Electric Ind Co Ltd | 半田付け方法 |
JP4545004B2 (ja) * | 2004-09-29 | 2010-09-15 | 京セラ株式会社 | 圧電発振器 |
-
2006
- 2006-07-28 JP JP2006207184A patent/JP4948930B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008035277A (ja) | 2008-02-14 |
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