JP4942693B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting element housing package and a light emitting device for housing a light emitting element.

  Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their life in the future. It has begun to be used in various fields such as indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. A cross-sectional view of a light emitting element storage package (hereinafter also simply referred to as a package) for mounting a conventional light emitting element is shown in FIG.

  As shown in FIG. 2, a conventional package 11 generally has a base 12 made of a material such as various resins or ceramics. The substrate 12 has a nickel (Ni) plating layer or a gold (Au) plating layer formed on the surface of a metallized layer obtained by firing a conductive paste containing tungsten (W), molybdenum (Mo) -manganese (Mn), or the like by plating. The wiring conductor which gave is formed. Then, electric power is supplied from the outside to the light emitting element 14 in the package 11 through the wiring conductor, and the light emitting element 14 becomes operable.

The substrate 12 is bonded to the outer peripheral portion of one main surface on the inner side of the package 11 so as to surround the mounting portion 12a, and various resins and ceramics, or aluminum (Al) or silver having high reflectivity for light in the visible light region. A frame 13 made of a metal such as (Ag) is provided. The frame 13 is attached to the base 12 by a conventionally known ceramic lamination method, or a brazing material such as Ag-copper (Cu) or a resin adhesive having a melting point of 700 to 900 ° C., and melted at 500 ° C. or less. Fixed with low melting glass.

  The light emitting element 14 is die-bonded on the mounting portion 12a of the base 12 with Ag paste or the like, and the wiring conductor disposed around the mounting portion 12a and the electrode of the light emitting element 14 are bonded via a bonding wire such as Au or Al. Electrically connected. Thereafter, the inside of the frame 13 is filled with a transparent resin (not shown) such as epoxy resin or silicone resin so as to cover the light emitting element 14, and is thermally cured, thereby protecting the light emitting element 14 and the light emitting element 14 The light emitting device can be formed by being firmly attached to the package 11. Or, after applying a phosphor or a transparent resin mixed with a phosphor on the side surface or top surface of the light-emitting element 14, the inside of the frame 13 is filled with a transparent resin and thermally cured to fluoresce the light from the light-emitting element 14. A light emitting device capable of extracting light having a desired wavelength spectrum after wavelength conversion by a body can be obtained. Note that a translucent lid (not shown) can be bonded to the upper surface of the frame 13 with solder, a resin bonding material, or the like, if necessary.

  This light-emitting device can emit visible light by causing the light-emitting element 14 to emit light by a drive current supplied from an external electric circuit. Applications include various indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. In recent years, this light-emitting device has been used for illumination, and a device having higher characteristics in terms of high luminance and heat dissipation is required. In addition, when used for illumination, the lifetime is an important issue, and thus a long-life light emitting device is required.

Therefore, recently, in order to improve the light emission luminance of the light emitting device, it has been studied to configure the frame 13 and the base 12 with a material having higher reflectance. For example, high brightness can be obtained by using a metal having a high reflectivity with respect to the light of the light emitting element 14 made of Ag or Al as the material of the frame 13 or by depositing these metals on the inner surface of the frame 13. It has been proposed to use a light emitting device.
Japanese Patent Laid-Open No. 2002-344029

  However, in the conventional package 11, since the package 11 is easily distorted by the heat emitted from the light emitting element 14, the pattern of the light beam (light beam) emitted from the light emitting element 14 and reflected by the frame 13 is constant. In other words, the radiation angle of light becomes unstable, and the light intensity distribution represented by a single light flux or an aggregate thereof deviates from a desired value and pattern.

  In particular, when the light-emitting device is used for local illumination or the like, the light emission angle and the instability of the light intensity distribution are important problems.

  Further, when the input power of the light emitting element 14 is increased in order to increase the luminance, the amount of heat generated from the light emitting element 14 becomes very large and the package 11 is likely to be heated to a high temperature. 14 has a problem that the temperature and the life of the light-emitting element 14 itself are reduced by repeating the thermal history of the temperature rise and temperature drop.

  Accordingly, the present invention has been completed in view of such conventional problems, and an object of the present invention is to satisfactorily reflect the light emitted from the light emitting element to radiate the light uniformly and efficiently, and to change the light intensity by changing the temperature. Another object of the present invention is to provide a light-emitting element housing package and a light-emitting device capable of producing a light-emitting device capable of obtaining stable optical characteristics in which the light emission angle and light intensity distribution do not change.

According to one aspect of the present invention, a light emitting device has a substrate made of ceramics and a light emitting element. The light emitting device further includes first and second frames. The light emitting element is mounted on the base. The first frame surrounds the light emitting element and is provided on the upper surface of the base. The first frame is made of a metal material. The second frame has a step between the lower surface and the outer peripheral surface and outside the lower surface, and the step is joined to the first frame.

  The light emitting element storage package of the present invention includes a base having a mounting portion for mounting the light emitting element in the center of the upper surface, and a first frame attached to surround the mounting portion on the outer peripheral portion of the upper surface of the base And the inner peripheral surface provided on the first frame is inclined so as to spread outward as it goes upward, and the inner peripheral surface is a reflecting surface that reflects light emitted from the light emitting element. The second frame has a step formed over the entire circumference between the lower surface and the outer peripheral surface, and the step is an inner peripheral surface of the first frame. Further, since it is provided on the first frame joined to the upper surface, the light emitted from the light emitting element can be reflected to the outside by 80% or more by the inclined inner peripheral surface as the light reflecting surface, and light emission Even if the input power of the element is relatively low, sufficient luminance can be obtained. As a result, the amount of heat generated from the light emitting element can be suppressed to effectively prevent the life of the light emitting element from being lowered and the lifetime from being shortened, and high light emission efficiency can be maintained over a long period of time.

  In addition, since the second frame body is bonded to the base body via the first frame body, even if the light emitting element storage package is distorted by the heat of the light emitting element, the stress generated by the distortion is applied to the first frame body. And the influence on the second frame can be greatly reduced. Furthermore, since the heat of the light emitting element is transferred from the base body to the second frame body via the first frame body, the thermal resistance from the light emitting element to the second frame body is increased, and the second frame body is Strain due to heat can be effectively suppressed. Therefore, there is no unevenness in the intensity distribution of light emitted from the light-emitting element storage package and the illuminance distribution on the irradiation surface, and stable light is output, and the light-emitting device operates with high reliability and stability over a long period of time. be able to.

  Furthermore, since the second frame is joined to the first frame by a step formed between the lower surface and the outer peripheral surface, the distance between the inner peripheral surface of the second frame and the step is increased. By enlarging, it is possible to make it difficult for heat to be transferred from the joint portion with the first frame to the inner peripheral surface. As a result, the inner peripheral surface that reflects the light of the light emitting element can be effectively suppressed from being deformed by heat, and the light reflection characteristics of the inner peripheral surface can be maintained well.

  In the light emitting element storage package according to the present invention, the second frame body has a gap between the lower surface of the first frame body and the portion positioned on the inner side of the base body. Heat can be made difficult to transmit. Moreover, even if heat is transmitted to the second frame, the exposed area of the second frame is large, so that heat dissipation is excellent, and the second frame is effectively prevented from being deformed by heat. it can.

  In the light emitting element storage package of the present invention, when the thermal expansion coefficient of the first frame is α1, and the thermal expansion coefficient of the second frame is α2, α1 <α2. The difference in thermal expansion coefficient between the body and the substrate can be relaxed by the first frame, and the stress due to the difference in thermal expansion can be effectively suppressed from occurring in the substrate and the first and second frames.

  Since the light emitting device of the present invention includes the light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion, and a translucent member that covers the light emitting element, the light emitting device is excellent in luminous efficiency, Stable optical characteristics can be obtained and high performance can be achieved.

The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. In FIG. 1, 2 is a base, 3 is a second frame, and 6 is a first frame, and these mainly constitute a package 1 for housing the light emitting element 4.

  The package 1 of the present invention has a base body 2 made of ceramics having a mounting portion 2a on which the light emitting element 4 is mounted at the center of the upper main surface, and an outer peripheral portion of the upper main surface of the base body 2 surrounding the mounting portion 2a. The attached first frame 6 and the inner frame attached to the upper surface of the first frame 6 so as to surround the mounting portion 2a are inclined so as to spread outward as it goes upward. And a second frame 3 whose inner peripheral surface is a reflective surface that reflects the light emitted from the light emitting element 4.

  The substrate 2 of the present invention functions as a support member for supporting and mounting the light emitting element 4 and a heat radiating member for radiating the heat of the light emitting element 4. A mounting portion 2 a for mounting the light emitting element 4 is provided at the center of the upper surface of the base 2. The light emitting element 4 is attached to the mounting portion 2a via a resin adhesive, a tin (Sn) -lead (Pb) solder, a low melting point brazing material such as Sn-Au. And the heat | fever of the light emitting element 4 maintains the operability of the light emitting element 4 favorably by being transmitted to the base | substrate 2 via a resin adhesive and a low melting-point brazing material, and being efficiently dissipated outside. Further, the light emitted from the light emitting element 4 is reflected by the inner peripheral surface of the second frame 6 and radiated to the outside.

  The substrate 2 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, glass ceramics, and the like. A wiring conductor (not shown) leading out is formed.

  The wiring conductor formed on the substrate 2 is formed of a metallized layer such as W, Mo, Mn, or Cu. For example, a metal paste obtained by adding an organic solvent and a solvent to a powder such as W is mixed with a predetermined paste. The substrate 2 is formed by printing and applying to a pattern and baking. A metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm is provided on the surface of the wiring conductor to prevent oxidation and to firmly connect a bonding wire (not shown). It is good to deposit by plating.

  The first frame 6 is made of a metal such as copper or a copper-based metal, a resin, or ceramics. Preferably, it is made of metal. Thereby, the stress generated when the package 1 is distorted by heat or the like can be effectively relaxed, and the airtightness of the package can be maintained well. When the first frame 6 is made of metal, it is formed into the above-mentioned predetermined shape by subjecting the ingot of the material to conventionally known metal processing such as cutting, rolling and punching.

The second frame 3 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, or ceramics. When the second frame 3 is made of metal, the inner peripheral surface is mirror-finished by a method such as polishing, so that the inner peripheral surface can reflect the visible light emitted from the light emitting element 4 well. can do. Moreover, when it consists of resin or ceramics, a metal layer is formed in an inner peripheral surface by plating, vapor deposition, etc., and let an inner peripheral surface be a reflective surface which can reflect the visible light emitted from the light emitting element 4 favorably. be able to. From the viewpoint that a reflecting surface with high reflection efficiency of visible light from the light emitting element 4 can be more easily manufactured and that corrosion due to oxidation or the like can be prevented, the second frame 3 is made of Al. Or SUS.

  When the second frame 3 is made of a metal, the second frame 3 is formed in the predetermined shape by performing conventionally known metal processing such as cutting, rolling, and punching on the ingot of the material.

  The second frame 3 is joined to the first frame 6 by a step formed between the lower surface and the outer peripheral surface. Thereby, the distance between the inner peripheral surface of the second frame 3 and the step can be increased, and heat can be hardly transmitted from the joint portion with the first frame 6 to the inner peripheral surface. As a result, the inner peripheral surface that reflects the light of the light emitting element 4 can be effectively suppressed from being deformed by heat, and the light reflection characteristics of the inner peripheral surface can be favorably maintained.

Preferably, the second frame 3 is preferably bonded to the first frame 6 only at the upper surface of the step. Thereby, the 2nd frame 3 becomes easy to change moderately, and restraint by the 1st frame can be released moderately. As a result, even if the first frame body 6 and the base body 2 are distorted, it is possible to effectively suppress the second frame body 3 from being distorted due to the distortion.

  Further, the inner peripheral surface of the second frame 3 is preferably inclined at an angle of 35 to 70 degrees with respect to the upper surface of the base 2. Thereby, the light of the light emitting element 4 mounted on the mounting portion 2a is favorably reflected on the inner peripheral surface of the inclined second frame 3, and the light is radiated to the outside within a radiation angle within 45 degrees. The luminous efficiency, luminance, and luminous intensity of the light emitting device using the package 1 of the present invention can be made extremely high. The light emission angle is an angle of light spread on a plane orthogonal to the base 2 passing through the center of the light emitting element 4, and the opening shape in the cross section of the second frame 3 is circular. If so, the radiation angle is constant over the entire circumference of the inner peripheral surface of the second frame 3. Moreover, when the opening shape in the cross section of the 2nd frame 3 has deviation, such as an ellipse shape, a radiation angle is the maximum value.

  When the angle between the inner peripheral surface of the second frame 3 and the upper surface of the substrate 2 is less than 35 degrees, the radiation angle spreads to 45 degrees or more, the amount of dispersed light increases, and the brightness and brightness of light decrease. It becomes easy to do. On the other hand, when the angle exceeds 70 degrees, the light of the light emitting element 4 is not emitted well outside the package 1 and is easily diffusely reflected in the package 1. Therefore, the angle formed by the inner peripheral surface of the second frame 3 and the upper surface of the base 2 is preferably 35 to 70 degrees.

  In addition, when the shape of the inner peripheral surface of the second frame 3 is an inverted conical shape, the angle formed by the inner peripheral surface of the second frame 3 and the upper surface of the base 2 is 35 to 70 degrees over the entire circumference. It is good to do. Further, when the shape of the inner peripheral surface of the second frame 3 is a quadrangular pyramid, it is preferable that at least a pair of opposed inner surfaces be inclined at 35 to 70 degrees with respect to the upper surface of the base 2. Preferably, the entire inner surface is inclined at 35 to 70 degrees with respect to the upper surface of the substrate 2. Thereby, the luminous efficiency can be made extremely high.

The arithmetic average roughness Ra of the inner peripheral surface of the second frame 3 is preferably 0.004 to 4 μm or less. That is, when the arithmetic average roughness Ra of the inner peripheral surface exceeds 4 μm, it becomes difficult to regularly reflect the light of the light emitting element 4 accommodated in the package 1 and to emit it above the package 1, and the light intensity is increased. Attenuation or bias tends to occur. Moreover, when the arithmetic average roughness Ra of the inner peripheral surface of the second frame 3 is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. In addition, in order to make Ra of an internal peripheral surface into said range, it can form by a conventionally well-known electrolytic polishing process, a chemical polishing process, or a cutting process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

  Further, the second frame 3 is bonded to the upper surface of the first frame 6 by a resin adhesive such as silicone or epoxy, or a metal brazing material such as Ag-Cu brazing or Pb-Sn, It joins by solders, such as Au-Sn, Au-silicon (Si), Sn-Ag-Cu. Such a bonding material such as an adhesive and solder may be appropriately selected in consideration of the material, thermal expansion coefficient, and the like of the base body 2, the first frame body 6, and the second frame body 3, and is particularly limited. Is not to be done. Further, when high reliability of bonding between the base body 2 and the first frame body 6 and between the first frame body 6 and the second frame body 3 is required, the bonding is preferably performed with a metal brazing material or solder. Is good.

  Further, when importance is attached to the characteristics of the light emitting device, the first and second frame bodies 6 and 3 are preferably joined by a caulking method in order to prevent the first and second frame bodies 6 and 3 from being displaced by the joining material. In the caulking method, the positioning of the second frame 3 is uniquely performed, and it is possible to suppress the positional deviation and inclination of the second frame 3 in the manufacturing process of the package 1, and the first frame 6 and the second frame 3 can be suppressed. The center axis with the frame 3 can be matched and joined with high accuracy. As a result, the optical axis of the light emitting element 4 and the central axis of the second frame 3 that reflects light can be matched with high accuracy in the manufacturing process of the package 1. Accordingly, it is possible to manufacture a light emitting device that can obtain a desired light intensity distribution, illuminance distribution, and emission color.

  The relational expression of the thermal expansion coefficients of the first frame body 6 and the second frame body 3 is such that the thermal expansion coefficient of the first frame body 6 is α1, and the thermal expansion coefficient of the second frame body 3 is α2. In this case, it is preferable that α1 <α2. As a result, the difference in thermal expansion coefficient between the second frame 3 and the base 2 is relaxed by the first frame 6, and the stress due to the thermal expansion difference is applied to the base 2 and the first and second frames 6, 3. Can be effectively suppressed. Therefore, it is possible to relieve stress caused by thermal expansion and heat absorption when the package 1 is manufactured and the light emitting device is operated, and to suppress the inclination and deformation of the second frame 3. For example, a first frame 6 made of Cu (thermal expansion coefficient 17 × 10 −6 / ° C.) or the like, a second frame 3 made of Al (thermal expansion coefficient 23 × 10 −6 / ° C.) or the like, and alumina ceramics. In the case of using the base 2 made of (thermal expansion coefficient 7 to 9 × 10 −6 / ° C.) or the like, although the base 2 and the second frame 3 are greatly different in thermal expansion coefficient, the first By adopting the configuration of the present invention using the frame 6, distortion due to thermal expansion can be effectively relieved.

  In addition, it is preferable that a portion of the lower surface of the second frame 3 located inside the first frame 6 has a gap with the upper surface of the base 2. Thereby, it is possible to make it difficult for heat to be transmitted from the base 2. Even if heat is transmitted to the second frame 3, the exposed area of the second frame 3 is large, so that the heat dissipation is excellent, and the second frame 3 is effectively prevented from being deformed by heat. can do. As a result, stable light can be output without causing unevenness in the intensity distribution of the light emitted from the package 1 and the illuminance distribution on the irradiated surface.

  Thus, in the package 1 of the present invention, the light emitting element 4 is mounted on the mounting portion 2a of the base 2, and the light emitting element 4 is connected to an external electric circuit outside the package 1 through bonding wires and wiring conductors such as Au and Al. It can be electrically connected. Then, a translucent member 5 such as a transparent resin is filled inside the second frame 3 and thermally cured to form a coating layer that covers the light emitting element 4, and an upper surface of the second frame 3 as necessary. The light-emitting device of the present invention is obtained by bonding a translucent lid (not shown) with solder, a resin adhesive, or the like. Alternatively, a phosphor or a transparent resin mixed with a phosphor is applied to the side surface and the upper surface of the light emitting element 4, and then the light transmissive member 5 covering the light emitting element 4 is filled and thermally cured. By joining a translucent lid to the upper surface with solder, resin adhesive, or the like, a light-emitting device capable of taking out light having a desired wavelength spectrum by converting the wavelength of light from the light-emitting element 4 with a phosphor.

  Examples of the light-emitting device of the present invention will be described below with reference to FIG.

First, an alumina ceramic substrate having a thermal expansion coefficient of 6 × 10 −6 / ° C. and a Young's modulus of 2.9 × 10 11 Pa made of a square plate having a thickness of 10 × 10 mm and a thickness of 0.5 mm was prepared as the substrate 2.

  The first frame 6 is a Cu frame having an outer diameter of 10 mm, an inner diameter of 8 mm, a thickness of 1 mm, a thermal expansion coefficient of 20 × 10 −6 / ° C., and a Young's modulus of 1.3 × 10 11 Pa. Got ready.

Further, as the second frame 3, the outer diameter is 10 mm, the inner diameter of the upper surface is 8 mm, the inner diameter of the lower surface is 2 mm, the thickness is 3 mm, and the height of the step formed on the outer periphery of the lower surface Is 0.5mm,
An Al frame having a thermal expansion coefficient of 23 × 10 −6 / ° C. and a Young's modulus of 0.7 × 10 11 Pa was prepared.

  Further, an electrical connection pattern for electrically connecting the light emitting element 4 and an external electric circuit via an internal wiring formed inside the base 2 was formed on the upper surface of the base 2. The electrical connection pattern is formed into a 0.5 mm × 0.5 mm square pad by a metallized layer made of Mo—Mn powder, and a 3 μm thick Ni plating layer and a 2 μm thick Au plating layer are formed on the surface. Sequentially deposited.

Further, the internal wiring inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed with a metallized conductor made of Mo-Mn powder in the same manner as the electrical connection pattern.

  Furthermore, a joining portion for joining the base body 2 and the first frame body 6 with Au—Sn brazing is formed on the outer peripheral portion of the upper surface of the base body 2 so as not to interfere with the electrical connection pattern. . This joint was obtained by depositing a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 2 μm on the surface of a metallized layer made of Mo—Mn powder.

  Next, the first frame body 6 is bonded to the bonding portion on the upper surface of the base 2 with Au—Sn brazing, and the second frame body 3 is Sn—Ag— on the upper surface and inner peripheral surface of the first frame body 6. The light emitting element 4 having a thickness of 0.08 mm that emits near-ultraviolet light is joined to the mounting portion 2a with Ag paste, and the light emitting element 4 and the electrical connection pattern are attached to a gold wire (not shown). Then, wire bonding and electrical connection were made.

  Further, a silicone resin (translucent member 5) containing three kinds of phosphors that emit red light, green light, and blue light when excited by near ultraviolet light is coated around the light emitting element 4 with a dispenser and heated. The sample was cured to produce a light emitting device as a sample.

  In addition, the light emitting device as a comparative example does not use the first and second frames 6 and 3 in the above embodiment, and the outer diameter is 10 mm and the inner diameter on the upper surface is as shown in FIG. The sample was prepared in the same manner as the above sample except that a frame having a diameter of 8 mm, an inner circumference of 2 mm, a thickness of 3.5 mm, a thermal expansion coefficient of 23 × 10 −6 / ° C., and a Young's modulus of 0.7 × 10 11 Pa was used.

  Then, these light emitting devices were mounted on an aluminum substrate, and the light emission angle was measured when the light emitting element 4 was operated by applying a forward current of 50 mA. First, a light emission angle was obtained by obtaining a region having a light emission intensity that is half or more of the maximum value of the light emission intensity, and the variation of the light emission angle with respect to time was measured.

  As a result of the evaluation, in the light emitting device as a comparative example, the fluctuation of the light emission angle after 1 hour was ± 5 degrees. On the other hand, in the light emitting device of the present invention, the fluctuation of the light emission angle is ± 1 ° even after 1 hour, and the deformation of the second frame 3 and the fluctuation of the light emission angle due to the heat of the light emitting element 4 are detected. We were able to suppress effectively. In addition, the wavelength at which the light output from the light emitting element peaks, the so-called center wavelength variation is +3 μm, and the stress inside the light emitting element 4 caused by the difference in thermal expansion coefficient between the base 2 and the first frame 6 is effectively utilized. I was able to suppress it. As a result, by using the light emitting element storage package of the present invention, the fluctuation of the light output of the phosphor depending on the center wavelength of the light emitting element 4 is suppressed, so that the color emission is small and the light emission angle is stable. It was found that a light emitting device can be manufactured.

  It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

  For example, a plurality of light emitting elements 4 may be provided on the base 2 in order to improve the light emission intensity. It is also possible to contain three or more phosphors that are excited by the light of the light emitting element 4 to emit light, and thereby, it is possible to widen the complementary color gamut and obtain good color rendering.

It is sectional drawing which shows an example of embodiment about the light emitting element accommodation package of this invention. It is sectional drawing of the conventional package for light emitting element accommodation.

Explanation of symbols

1: Light-emitting element storage package 2: Base 2a: Mounting portion 3: Second frame 4: Light-emitting element 5: Translucent member 6: First frame

Claims (3)

A substrate made of ceramics ;
A light emitting device mounted on the substrate;
A first frame that surrounds the light emitting element and is made of a metal material provided on the upper surface of the base;
A second frame having a step between the lower surface and the outer peripheral surface and outside the lower surface, wherein the step is joined to the first frame;
A light emitting device comprising:   The light emitting device according to claim 1, wherein the second frame is fixed to the first frame with a bonding material. A substrate;
A light emitting device mounted on the substrate;
A first frame that surrounds the light emitting element and is made of a metal material provided on the upper surface of the base;
A second frame having a step between the lower surface and the outer peripheral surface and outside the lower surface, the step being fixed to the first frame by a bonding material;
A light emitting device comprising:

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