JP4933424B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus for laser processing a plurality of workpieces on a processing table.

  In recent years, various laser processing apparatuses have been developed in order to rapidly laser-process workpieces with high processing accuracy. As such a laser processing apparatus, for example, there is a laser processing apparatus that includes a plurality of processing heads and simultaneously processes a plurality of workpieces (workpieces). When a plurality of workpieces are simultaneously processed by a plurality of processing heads, each workpiece is processed with high accuracy by detecting the amount of displacement of each workpiece relative to the processing table and correcting the detected amount of displacement with an fθ lens. .

  In the processing apparatus described in Patent Document 1, the position of each workpiece is detected by detection means attached to each processing head, and the positional deviation for each processing head is substantially the same based on the detected data. The processing table is moved to the position, thereby processing a plurality of workpieces simultaneously with high processing accuracy.

  Further, the laser processing apparatus described in Patent Document 2 includes a laser beam splitting unit that splits a laser beam from one laser oscillator into a plurality of parts, and each laser beam is provided between the workpieces from the laser beam splitting unit. On the other hand, a laser beam blocking mechanism for blocking the laser beam is provided. Then, irradiation / non-irradiation of the laser beam to each workpiece placed on each processing axis is controlled independently.

JP 2002-361463 A JP 2003-112275 A

  However, in the former prior art, when a plurality of workpieces are to be machined, if the deviation amount of one workpiece among the deviation amounts of the plurality of workpieces does not fall within a predetermined deviation amount, an abnormality is detected. It was necessary to detect and stop machining of all workpieces. For this reason, there is a problem that if the amount of deviation of the workpiece is not within the predetermined deviation amount, the workpiece cannot be processed quickly. In the former prior art, the table is moved so that the shift amounts of the plurality of workpieces are equal, and then it is determined whether to process or stop the plurality of workpieces. For this reason, when the machining of the workpiece is stopped, there is a problem that the table moving operation is wasted.

  In the latter prior art, when the deviation amount of the plurality of workpieces is not within the predetermined deviation amount, the predetermined laser beam must be interrupted, and the processing must be performed only with the laser beam that is not interrupted. There wasn't. For this reason, there is a problem that the workpiece on the side where the laser beam is blocked cannot be processed, and the processing cannot be performed quickly.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus that performs laser processing of a workpiece quickly with high processing accuracy.

In order to solve the above-described problems and achieve the object, the present invention simultaneously irradiates a plurality of laser beams from a plurality of laser irradiation axes via an fθ lens corresponding to each laser irradiation axis on one processing table. In a laser processing apparatus that simultaneously performs laser processing on two workpieces placed on a workpiece, a displacement value for detecting a displacement of each workpiece relative to the machining table for each workpiece and calculating a displacement value for each workpiece relative to the machining table Based on the position deviation value calculated by the calculation unit and the deviation value calculation unit, a workpiece machining method corresponding to the position deviation value is selected from a plurality of types of machining methods related to the machining procedure for each workpiece set in advance. A machining method selection unit that performs correction of a movement amount of the machining table that corrects a positional deviation of each workpiece according to the machining method selected by the machining method selection unit. When processing two workpieces on the processing table using the correction value set by the correction value setting unit according to the processing method by the correction value setting unit to be determined and the processing method selected by the processing method selection unit comprising of a machining control unit that performs machining control, the said processing method selection unit, when any of the workpieces on the machining table is Ru region outside der can laser machining through the fθ lens, the working comparing the predetermined value set in advance with the difference between the positional deviation value between the workpiece on the table, the difference between the positional deviation value is equal to or smaller than the predetermined value, the all the work on the work table If a simultaneous processing method for simultaneously processing all workpieces on the processing table by simultaneously irradiating a laser beam is selected from the plurality of types of processing methods, and if the difference between the displacement values is larger than the predetermined value, Simultaneous processing When a processing method other than the method is selected from the plurality of types of processing methods and all the workpieces on the processing table are in an area that can be laser processed via the fθ lens, the simultaneous processing method is When the machining method selection unit selects the simultaneous machining method, the correction value setting unit selects from among a plurality of types of machining methods, and all workpieces on the machining table correspond to each workpiece. The correction value is set so as to fall within an area where laser processing can be performed simultaneously.

The laser machining apparatus according to the present invention selects a workpiece machining method according to a positional deviation value from a plurality of types of machining methods related to a machining procedure for each workpiece set in advance based on the calculated positional deviation value. If any workpiece on the processing table is outside the region that can be laser processed via the fθ lens and the difference in positional deviation value between the workpieces on the processing table is smaller than a predetermined value, A correction value is set so that all the workpieces within the range that can be simultaneously laser processed through the fθ lens corresponding to each workpiece, and all the workpieces on the processing table are simultaneously irradiated with the laser beam to simultaneously apply all the workpieces on the processing table. Since the simultaneous processing method for performing the processing is selected, there is an effect that the workpiece can be laser processed quickly with high processing accuracy.

  Embodiments of a laser processing apparatus according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment FIG. 1 is a diagram showing a configuration of a laser processing system according to an embodiment of the present invention. The laser processing system 101 includes a laser processing mechanism 1 that performs laser processing on a workpiece (workpiece), a workpiece loading device 9 that loads the workpiece into the laser processing mechanism 1, and a workpiece unloading that loads the workpiece from the laser processing mechanism 1. A device 11 and a workpiece positioning device 12 for positioning the workpiece are provided.

  The laser processing mechanism 1 simultaneously irradiates a plurality of laser beams from a plurality of laser irradiation axes via fθ lenses (processing heads) corresponding to the respective laser irradiation axes, and a plurality of workpieces placed on one processing table. Have the function of laser processing simultaneously. The laser processing mechanism 1 includes a laser oscillator 13, mirrors 2A, 2B, 2X, beam shutters 3A, 3B, galvano mirrors 4A, 4B, 5A, 5B, processing heads 6A, 6B, work position detection cameras 7A, 7B, a work 8A, A processing table 10 on which 8B is placed is provided.

  The laser oscillator 13 emits (generates) a laser beam at a predetermined timing and makes it incident on the mirror 2X. The mirrors 2A, 2B and 2X reflect the laser beam emitted from the laser oscillator 13 and guide it to a predetermined optical path. The mirror 2X reflects the laser beam from the laser oscillator 13 and enters the mirrors 2A and 2B. The mirrors 2A and 2B reflect the laser beam from the mirror 2X and enter the beam shutters 3A and 3B, respectively. The beam shutters 3A and 3B block and pass the laser beams from the mirrors 2A and 2B, respectively, as necessary.

  The galvanometer mirrors 4A, 4B, 5A, and 5B scan the laser beam at an arbitrary angle and guide the laser beam to a predetermined optical path. The galvanometer mirrors 4A and 5A cause the laser beam from the mirror 2A that has passed through the beam shutter 3A to enter the machining head 6A. The galvanometer mirrors 4B and 5B cause the laser beam from the mirror 2B that has passed through the beam shutter 3B to enter the machining head 6B.

  Each of the processing heads 6A and 6B includes an fθ lens, and corrects and emits a laser beam incident through the galvanometer mirrors 5A and 5B so as to enter the workpieces 8A and 8B perpendicularly.

  The processing table 10 places the workpieces 8A and 8B and moves in the XY directions. The workpieces 8A and 8B are laser processed by laser beams emitted from the processing heads 6A and 6B, respectively. The workpieces 8A and 8B here are placed on the same machining table 10, and laser machining of the same machining pattern is performed on the workpieces 8A and 8B.

  The work position detection cameras 7A and 7B are image capturing means for capturing the positions of the work 8A and 8B with respect to the processing table 10. The positions of the workpieces 8A and 8B captured by the workpiece position detection cameras 7A and 7B are used when determining the amount of displacement (position displacement value) of the workpieces 8A and 8B with respect to the processing table 10.

  The workpiece positioning device 12 is a device that positions (corrects the position of) the plate ends of the workpieces 8A and 8B at a predetermined position before the workpieces 8A and 8B are carried into the laser processing mechanism 1. The workpiece carry-in device 9 lifts the workpieces 8 </ b> A and 8 </ b> B on the workpiece positioning device 12 positioned by the workpiece positioning device 12, and loads them on the machining table 10 of the laser machining mechanism 1. The workpiece carry-out device 11 lifts the workpieces 8A and 8B on the machining table 10 and carries them out of the laser machining mechanism 1.

  Next, the configuration of the laser processing apparatus according to the embodiment will be described. FIG. 2 is a block diagram showing the configuration of the laser processing apparatus according to the embodiment of the present invention. The laser processing apparatus 100 is an apparatus that performs laser processing of a workpiece by correcting the position of the processing table and adjusting the galvanometer mirror, and includes a processing program storage unit 22, a position detection unit 23, a deviation amount display unit 24, and a table control unit 25. , A mirror control unit 26, a beam irradiation control unit 27, and a control unit (processing control unit) 21. In addition, illustration of the laser processing mechanism 1 is abbreviate | omitted here.

  The machining program storage unit 22 stores a machining program used when the laser machining apparatus 100 (laser machining mechanism 1) performs laser machining of the workpieces 8A and 8B. The machining program storage unit 22 is connected to the control unit 21, and the machining program is read by the control unit 21 when performing laser machining on the workpieces 8 </ b> A and 8 </ b> B.

  The position detection unit 23 detects the positions of the workpieces 8A and 8B with respect to the processing table 10 based on the images of the workpieces 8A and 8B captured by the workpiece position detection cameras 7A and 7B. The position detection unit 23 inputs the detected positions (position information) of the workpieces 8A and 8B with respect to the machining table 10 to the control unit 21.

  The control unit 21 creates control instruction information for the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27 using the machining program stored in the machining program storage unit 22. In the present embodiment, based on the position information of the workpieces 8A and 8B sent from the position detection unit 23 by the control unit 21, the machining method for the workpieces 8A and 8B (simultaneous machining method for machining two pieces simultaneously, one piece at a time) Determine the individual processing method to be processed). The control unit 21 includes a simultaneous processing unit 31, an individual processing unit 32, a deviation amount calculation unit (deviation value calculation unit, correction value setting unit) 33, and a deviation amount determination unit (processing method selection unit, processing method setting unit) 34. It has.

  When the workpieces 8A and 8B are set on the machining table 10 and the machining of the workpieces 8A and 8B is started, the deviation amount calculation unit 33 is a positional deviation amount (reference) on the machining table 10 of the workpieces 8A and 8B. The deviation amount with respect to the set position) is calculated. The deviation amount calculation unit 33 calculates the position deviation amount of the workpieces 8A and 8B using the position information of the workpieces 8A and 8B sent from the position detection unit 23, and uses the calculation result (position deviation amount) as the deviation amount determination unit 34. Send to.

  Based on the positional deviation amount of the workpieces 8A and 8B received from the deviation amount calculation unit 33, the deviation amount determination unit 34 performs position correction by the processing table 10 and adjustment of the galvanometer mirrors 4A, 4B, 5A, and 5B. It is determined (correction determination) whether or not the position of 8B can be corrected.

  The deviation amount determination unit 34 determines the machining procedure for the workpieces 8A and 8B based on the determination result of the correction determination. When the amount of deviation of the workpieces 8A and 8B with respect to the machining table 10 is equal to or less than a predetermined value defined by the machining program, the deviation amount determination unit 34 selects the simultaneous machining processing unit 31 and simultaneously selects the workpieces 8A and 8B. Instruct processing. The deviation amount determination unit 34 selects the individual machining processing unit 32 and instructs individual machining processing of the workpieces 8A and 8B when the deviation amount of each workpiece with respect to the machining table 10 is larger than a predetermined value defined by the machining program. To do. For example, when it is determined that two workpieces 8A and 8B are to be processed simultaneously, the deviation amount determination unit 34 instructs the simultaneous processing processing unit 31 to simultaneously process the workpieces 8A and 8B, for example, the workpieces 8A and 8B one by one. When it is determined that machining is to be performed, the individual machining processing unit 32 is instructed to perform machining processing for each of the workpieces 8A and 8B.

  Based on the instruction from the deviation amount determination unit 34, the simultaneous machining processing unit 31 includes control instruction information for simultaneously machining the workpieces 8A and 8B, position correction amounts for the workpieces 8A and 8B (a machining table for simultaneous machining). 10 and position data of the mirrors 2A and 2B) (correction value of the movement amount of the processing table 10). The simultaneous processing unit 31 includes a simultaneous position correction processing unit 41 and a simultaneous processing processing instruction unit 42. The simultaneous position correction processing unit 41 calculates (generates) correction data (position correction amount) of the position of the processing table 10 and the positions of the mirrors 2A and 2B for simultaneously processing the workpieces 8A and 8B. The simultaneous machining processing instruction unit 42 generates control instruction information for simultaneously machining the workpieces 8A and 8B. The position correction amount calculated by the simultaneous position correction processing unit 41 and the control instruction information generated by the simultaneous processing processing instruction unit 42 are input to the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27.

  The simultaneous processing instruction unit 42 outputs information instructing the beam irradiation control unit 27 to perform simultaneous processing, thereby causing the beam irradiation control unit 27 to open the beam shutters 3A and 3B, so that both stages (workpieces 8A and 8B) can be opened. Perform simultaneous machining.

  Based on the instruction from the deviation amount determination unit 34, the individual processing unit 32 controls the control instruction information for individually processing the workpieces 8A and 8B one by one, and the position correction amounts of the workpieces 8A and 8B (individual processing is performed. The position data of the machining table 10 and the mirrors 2A and 2B) is generated for each workpiece 8A and 8B. The individual processing unit 32 includes an individual position correction processing unit 43 and an individual processing processing instruction unit 44. The individual position correction processing unit 43 calculates (generates) correction data (position correction amount) of the position of the processing table 10 and the positions of the mirrors 2A and 2B for individually processing the workpieces 8A and 8B one by one. The individual machining process instruction unit 44 generates control instruction information for individually machining the workpieces 8A and 8B one by one. The position correction amount calculated by the individual position correction processing unit 43 and the control instruction information generated by the individual processing processing instruction unit 44 are sent to the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27 in the order of workpieces to be individually processed. Entered.

  The individual processing unit 32 outputs information instructing the individual processing to the beam irradiation control unit 27, thereby causing the beam irradiation control unit 27 to open one of the beam shutters 3A and 3B, and individually processing the workpieces 8A and 8B. Perform processing.

  The table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27 control the laser processing mechanism 1 based on the control instruction information from the control unit 21 and the position correction amount. The table control unit 25 controls the movement (position) of the machining table 10. The mirror control unit 26 controls the mirrors 2A, 2B, 2X, the galvanometer mirrors 4A, 4B, 5A, 5B, etc., and adjusts the optical path of the laser beam that is inclined to the workpieces 8A, 8B. The beam irradiation control unit 27 controls the laser oscillator 13 and the beam shutters 3A and 3B, and adjusts the laser beams (declination timing and output) emitted to the workpieces 8A and 8B.

  The deviation amount display unit 24 has information display means such as a liquid crystal monitor, and the deviation amount of the workpieces 8A and 8B calculated by the deviation amount calculation unit 33 with respect to the machining table 10, the machining state of the workpieces 8A and 8B, and the like. Is displayed.

  Next, an operation procedure of the laser processing apparatus according to the embodiment will be described. FIG. 3 is a flowchart showing an operation procedure of the laser processing system according to the embodiment of the present invention. When laser processing of the workpieces 8A and 8B is started in the laser processing system 101, the workpieces 8A and 8B are first positioned on the workpiece positioning device 12. The workpiece carry-in device 9 lifts and loads (sets) the workpieces 8A and 8B positioned by the workpiece positioning device 12 onto the processing table 10.

  The deviation amount calculation unit 33 of the control unit 21 calculates the amount of positional deviation of the workpieces 8A and 8B on the machining table 10 (step S10), and transmits the calculation result to the deviation amount determination unit 34. The deviation amount determination unit 34 determines whether the workpieces 8A and 8B are within the machining range by adjusting the galvanometer mirrors 4A, 4B, 5A, and 5B based on the positional deviation amounts of the workpieces 8A and 8B received from the deviation amount calculation unit 33. It is determined whether or not the workpieces 8A and 8B are within a range that can be processed by the fθ lens of the processing heads 6A and 6B, respectively (step S20).

  Here, a process for determining whether or not the workpieces 8A and 8B are within the machining range by adjusting the galvanometer mirrors 4A, 4B, 5A, and 5B will be described. FIG. 4 and FIG. 5 are diagrams for explaining a process for determining whether or not the workpiece is within the machining range by adjusting the galvanometer mirror.

  Here, determination of whether or not the workpiece 8A is within the machining range by adjusting the galvanometer mirrors 4A and 5A will be described. 4 and 5, the range that can be processed by the fθ lens is indicated by a processing range 52A, and the processing pattern of the workpiece 8A is indicated by a processing pattern 51A. FIG. 4 shows a case where the workpiece 8A is within the machining range by adjusting the galvanometer mirrors 4A, 5A, and FIG. 5 shows a case where the workpiece 8A is not within the machining range by adjusting the galvanometer mirrors 4A, 5A. Yes.

  In FIG. 4, since all the machining patterns 51A are within the machining range 52A, the workpiece 8A is within the machining range by adjusting the galvanometer mirrors 4A and 5A. On the other hand, in FIG. 5, since all the processing patterns 51A are not within the processing range 52A, the workpiece 8A does not fall within the processing range only by adjusting the galvanometer mirrors 4A and 5A.

  When the workpieces 8A and 8B are within a range that can be processed by the fθ lens (step S20, Yes), the deviation amount determination unit 34 causes the simultaneous processing processing unit 31 to simultaneously process the workpieces 8A and 8B (two simultaneous processings). Process).

  The simultaneous machining processing instruction unit 42 of the simultaneous machining processing unit 31 generates control instruction information for simultaneously processing the workpieces 8A and 8B, and transmits the control instruction information to the mirror control unit 26. The mirror control unit 26 adjusts (corrects) the galvanometer mirrors 4A, 4B, 5A, and 5B so that the processing patterns 51A and 51B of the workpieces 8A and 8B are irradiated with the beam (step S30).

  Thereafter, the control unit 21 of the laser processing apparatus 100 uses the processing program stored in the processing program storage unit 22 to simultaneously process the workpieces 8A and 8B while controlling the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27. Processing is performed (step S40).

  On the other hand, when the workpieces 8A and 8B are out of the range that can be processed by the fθ lens (No in step S20), the deviation amount determination unit 34 is based on the positional deviation amounts of the workpieces 8A and 8B received from the deviation amount calculation unit 33. Whether the workpieces 8A and 8B are both within the machining range by moving the machining table 10 (position correction of the workpieces 8A and 8B) (table position correction) (position correction of the workpieces 8A and 8B can be performed with the machining table 10). Whether or not). That is, the deviation amount determination unit 34 determines whether or not the difference between the positional deviation values between the workpieces 8A and 8B is smaller than a predetermined value (step S50).

  In the present embodiment, if both of the workpieces 8A and 8B are within the processing range by adjusting the galvanometer mirrors 4A, 4B, 5A, and 5B, it is determined that the workpieces 8A and 8B are within the range that can be processed by the fθ lens. . FIG. 6 is a diagram illustrating an example in which two workpieces are not within the machining range only by adjusting the galvanometer mirror.

  In FIG. 6, the machining range adjustable by the galvanometer mirrors 4A and 5A is indicated by a machining range 52A, and the machining range adjustable by the galvanometer mirrors 4B and 5B is indicated by a machining range 52B. Further, the machining pattern of the workpiece 8A is indicated by a machining pattern 51A, and the machining pattern of the workpiece 8B is indicated by a machining pattern 51B.

  Here, since all the machining patterns 51A are within the machining range 52A, the workpiece 8A is within the machining range by adjusting the galvanometer mirrors 4A and 5A. On the other hand, since all the machining patterns 51B are not within the machining range 52B, the workpiece 8B does not fall within the machining range only by adjusting the galvanometer mirrors 4B and 5B. Therefore, the adjustment of the galvanometer mirrors 4A, 4B, 5A, and 5B prevents both the workpieces 8A and 8B from being within the machining range, and it is determined that the workpieces 8A and 8B are not within the range that can be machined by the fθ lens. .

  Here, the concept of the determination process of whether or not the workpieces 8A and 8B are both within the machining range by the position correction by the machining table 10 will be described. 7 and 8 are views for explaining the concept of workpiece position correction using a machining table.

  In FIG. 7, of the two processing patterns 51A and 51B, one end of the processing pattern (here, the processing pattern 51B) is the processing area (here, the upper right corner of the processing pattern) corresponding to the processing pattern. The case where position correction by the processing table 10 is performed so as to overlap with the extreme end (the upper right corner of the processing area) of the processing range 52B) is shown. When the position of the machining table 10 is corrected in this way, the machining pattern 51A moves with the movement of the machining pattern 51B.

  In the present embodiment, for example, when position correction is performed by the processing table 10 so that the end of the processing pattern 51B overlaps the end of the processing range 52B (all processing patterns 51B are contained in the processing range 52B. If all the processing patterns 51A are within the processing range 52A, it is determined that the workpieces 8A and 8B are both within the processing range by position correction by the processing table 10.

  In the case of position correction of the workpieces 8A and 8B shown in FIG. 7, when the extreme end of the machining pattern 51B is overlapped with the extreme end of the machining range 52B, all the machining patterns 51A are within the machining range 52A. Then, it is determined that both the workpieces 8A and 8B are within the machining range by the position correction by the machining table 10.

  Here, position correction by the processing table 10 is performed so that the upper right corner portion of the processing pattern of the processing pattern 51B overlaps the outermost end portion (upper right corner portion of the processing area) of the processing range 52B. Although the case has been described, the position correction by the processing table 10 may be performed so that the processing pattern 51B and the processing range 52B overlap each other. For example, position correction for overlapping the processing pattern 51B and the processing range 52B is determined in accordance with the shift direction of the processing pattern 51A with respect to the processing range 52A.

  When the machining pattern 51A for the machining range 52A is shifted in the upper right direction in the drawing, the lower left corner of the machining pattern is the outermost edge of the machining area 52B (the lower left corner of the machining area). The position correction by the processing table 10 is performed so as to overlap with the corner portion.

  When the processing pattern 51A for the processing range 52A is shifted in the upper left direction in the figure, the lower right corner of the processing pattern 51B is the end of the processing range 52B (processing). The position correction by the processing table 10 is performed so as to overlap with the lower right corner portion of the area.

  Further, when the processing pattern 51A for the processing range 52A is shifted in the lower right direction in the drawing, the upper left corner of the processing pattern is the endmost part (processing) of the processing range 52B among the end portions of the processing pattern 51B. The position correction by the processing table 10 is performed so as to overlap with the upper left corner of the area.

  In addition, here, a case has been described in which the position correction by the processing table 10 is performed so that the end of the processing pattern 51B overlaps the end of the processing range 52B among the two processing patterns 51A and 51B. Of the processing patterns 51A and 51B, the position correction by the processing table 10 may be performed so that the endmost portion of the processing pattern 51A overlaps the endmost portion of the processing range 52A.

  Further, FIG. 8 shows a case where position correction by the processing table 10 is performed using the midpoint (average value of the shift positions) of the shift positions of the two processing patterns 51A and 51B. In other words, the position correction by the processing table 10 is performed so that the midpoint of the processing ranges 52A and 52B and the midpoint of the processing patterns 51A and 51B overlap. That is, the shift amounts (coordinates) of the processing patterns 51A and 51B from the target beam irradiation positions (the center positions of the processing ranges 52A and 52B) are calculated, and the average value of the shift amounts is calculated. Then, position correction is performed by moving the position of the processing table 10 so that the deviation amounts of the processing patterns 51A and 51B are equal to the calculated average value.

  For example, when the center position of the processing range 52A is the origin coordinate (0, 0), the center of the processing pattern 51A before position correction by the processing table 10 is the coordinates (a1, a2), and the center position of the processing range 52B Is the origin coordinates (0, 0), and the center of the processing pattern 51B before position correction by the processing table 10 is the coordinates (b1, b2), the displacement of the processing patterns 51A, 51B with respect to the processing ranges 52A, 52B As for the average value of the quantity (coordinates), the x coordinate is (a1 + b1) / 2 and the y coordinate is (a2 + b2) / 2. Therefore, in this case, the machining table 10 is moved to correct the positions of the machining patterns 51A and 51B so that the centers of the machining patterns 51A and 51B are ((a1 + b1) / 2 and (a2 + b2) / 2). When the position of the machining table 10 is corrected in this way, both of the machining patterns 51A and 51B move on the areas of the machining ranges 52A and 52B, respectively.

  In the present embodiment, for example, when the machining table 10 is moved based on the midpoint of the shift positions of the two machining patterns 51A and 51B, and the positions of the machining patterns 51A and 51B are corrected, all of them are within the machining range 52A. If all the machining patterns 51B fall within the machining range 52B, it is determined that both the workpieces 8A and 8B are within the machining range by the position correction by the machining table 10.

  In the case of position correction of the workpieces 8A and 8B shown in FIG. 8, since all the machining patterns 51A are contained in the machining range 52A and all the machining patterns 51B are contained in the machining range 52B, the position correction by the machining table 10 is performed. It is determined that the workpieces 8A and 8B are both within the machining range.

  That is, in the present embodiment, if position correction by the processing table 10 can be performed so that all the processing patterns 51A are within the processing range 52A and all the processing patterns 51B are within the processing range 52B, It is determined that the workpieces 8A and 8B are both within the machining range by the correction.

  When the workpieces 8A and 8B are within the machining range by the position correction by the machining table 10 (when the difference in the positional deviation amount between the workpieces 8A and 8B is smaller than a predetermined value) (step S60, Yes), the deviation amount determination unit 34 Instructs the simultaneous processing unit 31 to simultaneously process the workpieces 8A and 8B.

  The simultaneous machining processing instruction unit 42 of the simultaneous machining processing unit 31 generates control instruction information for simultaneously machining the workpieces 8A and 8B, and transmits the control instruction information to the table control unit 25 and the mirror control unit 26. The table control unit 25 adjusts (corrects) the position of the processing table 10 so that the positions of the workpieces 8A and 8B are within a range that can be processed by adjusting the galvanometer mirrors 4A, 4B, 5A, and 5B. Further, the mirror control unit 26 adjusts the galvanometer mirrors 4A, 4B, 5A, and 5B so that the processing patterns 51A and 51B of the workpieces 8A and 8B are irradiated with the beam (step S30).

  Here, a method for calculating the position correction values of the workpieces 8A and 8B using the machining table 10 will be described. First, a method for determining whether or not the workpieces 8A and 8B can be laser processed by correcting (adjusting) the galvano mirrors 4A, 4B, 5A, and 5B will be described.

  The workpieces 8A and 8B laser-processed by the laser processing apparatus 100 have a pattern on the workpieces 8A and 8B that is expanded / contracted from the design value, offset offset, rotational offset, squareness offset, Deviation of the pattern shape such as trapezoidal deviation occurs.

  Even when such a deviation occurs, in order to accurately perform laser processing in consideration of the deviation amount, the workpieces 8A and 8B placed on the machining table 10 are positioned by the workpiece position detection cameras 7A and 7B. It is necessary to detect the mark and correct the positional deviation of the workpieces 8A and 8B.

When the number of workpieces is only one, if the laser processing position (X ′, Y ′) after deviation correction (after logarithmic correction to the pattern shape) with respect to the target position (X, Y) is calculated by a conventional method, for example, rotational deviation The expansion / contraction deviation and the offset deviation can be expressed by Expression (1) and Expression (2). Here, P11 to P13 and P21 to P23 are arbitrary correction coefficients.
X ′ = P11X + P12Y + P13 (1)
Y ′ = P21X + P22Y + P23 (2)

For example, when there are two workpieces 8A and 8B, correction formulas (correction coordinates) for the workpieces 8A and 8B are obtained with respect to a common target position (X, Y) in the workpieces 8A and 8B. When the corrected coordinates of the workpiece 8A are (X′p, Y′p) and the coordinates of the workpiece 8B are (X′q, Y′q), the correction formulas of the workpieces 8A and 8B are equations (3) to ( 6). Here, P11 to P13, P21 to P23, Q11 to Q13, and Q21 to Q23 are arbitrary correction coefficients.
X′p = P11X + P12Y + P13 (3)
Y′p = P21X + P22Y + P23 (4)
X′q = Q11X + Q12Y + Q13 (5)
Y′q = Q21X + Q22Y + Q23 (6)

  The X and Y components of the target position can be represented by the sum of the galvanometer mirror position coordinates (Xm, Ym) and the table position (Xt, Yt). The galvanometer mirrors 4A and 5A and the galvanometer mirrors 4B and 5B are independent for the workpiece 8A and the workpiece 8B, but the machining table 10 is common to the workpiece 8A and the workpiece 8B. For this reason, it is necessary to correct the table position (Xt, Yt) using the galvanometer mirror position corresponding to each workpiece 8A, 8B. When Expressions (3) to (6) are corrected with respect to the table position (Xt, Yt), Expressions (7) to (10) are obtained.

Here, X′pm is the galvanometer mirror coordinates (X component of the workpiece 8A) corrected using the table position (X component) of the machining table 10, and Y′pm is the table position of the machining table 10 (X component). The galvanometer mirror coordinates (Y component of the workpiece 8A) corrected using the Y component). X′qm is the galvanometer mirror coordinates (X component of the workpiece 8A) corrected using the table position (X component) of the machining table 10, and Y′qm is the table position (Y of the machining table 10). Galvanometer mirror coordinates (Y component of the workpiece 8A) corrected using the component).
X′pm = P11X + P12Y + P13−Xt (7)
Y′pm = P21X + P22Y + P23−Yt (8)
X′qm = Q11X + Q12Y + Q13−Xt (9)
Y′qm = Q21X + Q22Y + Q23−Yt (10)

The width of the processing range that can be processed by the fθ lens (the area with one side fL square) is fixed. Therefore, the processing range of the fθ lens (one side fL) and the corrected galvanometer mirror coordinates (X′pm, Y′pm, X′qm, Y′qm shown in the equations (7) to (10))) The difference between can be calculated using Equation (11) to Equation (14). Here, Wpx, Wpy, Wqx, and Wqy indicate the difference between the processing range of the fθ lens and the corrected galvanometer mirror coordinates, and when these values are all positive, the workpieces 8A and 8B are simultaneously used. It becomes possible to process.
Wpx = fL / 2− | P11X + P12Y + P13−Xt | (11)
Wpy = fL / 2− | P21X + P22Y + P23−Yt | (12)
Wqx = fL / 2− | Q11X + Q12Y + Q13−Xt | (13)
Wqy = fL / 2− | Q21X + Q22Y + Q23−Yt | (14)

  However, when the deviation amount of the laser irradiation position with respect to the target position is large, the workpieces 8A and 8B may not be simultaneously processed only by correction by the galvanometer mirror (irradiation position correction). Therefore, in the present embodiment, the positions of the workpieces 8A and 8B are corrected by the processing table 10 in order to make maximum use of the range that can be processed by the fθ lens.

Next, a method for calculating the position correction values of the workpieces 8A and 8B using the machining table 10 will be described. The target position (X, Y) can be expressed by the sum of the galvanometer mirror position coordinates (Xm, Ym) and the table position (Xt, Yt). When the corrected laser processing position (X ′, Y ′) with respect to the target position (X, Y) is expressed by the sum of the galvano mirror position coordinates (Xm, Ym) and the table position (Xt, Yt), the equation (15) ) And Equation (16).
X ′ = Px (Xm, Ym) + Px (Xt, Yt) (15)
Y ′ = Py (Xm, Ym) + Py (Xt, Yt) (16)

Here, Px (Xm, Ym) and Py (Xm, Ym) are correction coordinates at the mirror position (coordinates when corrected by the galvanometer mirrors 4A, 4B, 5A, 5B), and Px (Xt , Yt) and Py (Xt, Yt) are correction coordinates at the table position (coordinates when corrected by the processing table 10). Px (Xm, Ym), Px (Xt, Yt), Py (Xm, Ym), and Py (Xt, Yt) have a relationship of the following formulas (17) to (20), respectively.
Px (Xm, Ym) = (P11 + P12) Xm + (P11 + P12) Ym (17)
Px (Xt, Yt) = (P11 + P12) Xt + (P11 + P12) Yt + P13 (18)
Py (Xm, Ym) = (P21 + P22) Xm + (P21 + P22) Ym (19)
Py (Xt, Yt) = (P21 + P22) Xt + (P21 + P22) Yt + P23 (20)

When two workpieces 8A and 8B are set on the machining table 10, correction expressions for the workpieces 8A and 8B can be obtained with respect to the common target position (X, Y) in the workpieces 8A and 8B. . The laser processing positions after correction of the workpieces 8A and 8B can be expressed by equations (21) to (24).
X′p = Px (Xm, Ym) + Px (Xt, Yt) (21)
Y′p = Py (Xm, Ym) + Py (Xt, Yt) (22)
X′q = Qx (Xm, Ym) + Qx (Xt, Yt) (23)
Y′q = Qy (Xm, Ym) + Qy (Xt, Yt) (24)

  Here, X′p and Y′p are the laser processing positions after correction of the workpiece 8A (X component and Y component), and X′q and Y′q are the laser processing positions after correction of the workpiece 8B ( X component and Y component).

  Further, Px (Xm, Ym) and Py (Xm, Ym) here are correction coordinates at the mirror position (coordinates when corrected by the galvanometer mirrors 4A, 4B, 5A, and 5B), and Px (Xt , Yt) and Py (Xt, Yt) are correction coordinates at the table position (coordinates when corrected by the processing table 10). Px (Xm, Ym), Px (Xt, Yt), Py (Xm, Ym), and Py (Xt, Yt) are respectively the above-mentioned formula (17) to formula (20) and the following formula (25) to formula (28).

Qx (Xm, Ym) = (Q11 + Q12) Xm + (Q11 + Q12) Ym (25)
Qx (Xt, Yt) = (Q11 + Q12) Xt + (Q11 + Q12) Yt + Q13 (26)
Qy (Xm, Ym) = (Q21 + Q22) Xm + (Q21 + Q22) Ym (27)
Qy (Xt, Yt) = (Q21 + Q22) Xt + (Q21 + Q22) Yt + Q23 (28)

  In the laser processing apparatus 100, the galvanometer mirrors 4A, 4B, 5A, 5B are arranged on axes independent of the workpieces 8A, 8B, and can be positioned for each workpiece 8A, 8B. The machining table 10 is disposed on a common shaft for the workpieces 8A and 8B, and the table position of the machining table 10 needs to be common to the workpieces 8A and 8B.

For example, when the table position is based on the workpiece 8A, on the workpiece 8B side, it is necessary to consider the table corrections of the equations (21) to (24) for the galvanometer mirror position coordinates on the workpiece 8A side. Therefore, when the position correction is performed so that the shift amount of the workpiece 8A becomes 0 by the movement of the machining table 10, Wpx, Wpy, Wqx, and Wqy can be calculated by Expressions (29) to (32). Here, Wqx and Wqy are deviation amounts of the workpiece 8B with respect to the workpiece 8A.
Wpx = 0 (29)
Wpy = 0 (30)
Wqx = Qx (Xt, Yt) −Px (Xt, Yt) (31)
Wqy = Qy (Xt, Yt) −Py (Xt, Yt) (32)

  That is, when position correction (movement) by the processing table 10 is based on the deviation amount of the workpiece 8A, the deviation amount of the machining pattern of the fθ lens and the workpiece 8B is the sum of the deviation amount of the workpiece 8B alone and the deviation amount of the workpiece 8A alone. become.

If the amount of deviation (Wqx, Wqy) on the workpiece 8B side is larger than a predetermined value, the workpieces 8A, 8B cannot be processed simultaneously. Therefore, the difference between the processing range fL by Wqx, Wqy and the fθ lens so as to be within the processing range of the fθ lens. Is recalculated to move the machining table 10. For example, when Wqx and Wqy exceed the processing range of the fθ lens in the positive direction, Wpx, Wpy, Wqx, and Wqy are calculated by Expressions (33) to (36).
Wpx = fL / 2− (Qx (Xt, Yt) −Px (Xt, Yt)) (33)
Wpy = fL / 2− (Qy (Xt, Yt) −Py (Xt, Yt)) (34)
Wqx = fL / 2 (35)
Wqy = fL / 2 (36)

In this case, the position of the processing table 10 is (Px (Xt, Yt) −Wpx, Py (Xt, Yt) −Wpy). Further, a complete intermediate point ((Px (Xt, Yt) + Qx (Xt, Yt)) of the shift amount (shifted coordinate position) of the workpieces 8A and 8B corrected by the movement of the machining table 10 between the workpiece 8A and the workpiece 8B. The deviation amounts of the workpieces 8A and 8B may be recalculated on the basis of / 2, (Py (Xt, Yt) + Qy (Xt, Yt)) / 2). In this case, Wpx, Wpy, Wqx, and Wqy are calculated by Expression (37) to Expression (40).
Wpx = (Px (Xt, Yt) −Qx (Xt, Yt)) / 2 (37)
Wpy = (Py (Xt, Yt) −Qy (Xt, Yt)) / 2 (38)
Wqx = (Qx (Xt, Yt) −Px (Xt, Yt)) / 2 (39)
Wqy = (Qy (Xt, Yt) −Py (Xt, Yt)) / 2 (40)

  In this case, the calculated Wpx, Wpy, Wqx, and Wqy are subjected to laser processing by correcting the laser irradiation position with a galvanometer mirror. Here, Wpx and Wpy are displacement amounts of the workpiece 8A with respect to the midpoint of the workpieces 8A and 8B, and Wqx and Wqy are displacement amounts of the workpiece 8B with respect to the midpoint of the workpieces 8A and 8B. As described above, the values of Wpx, Wpy, Wqx, and Wqy calculated by Expression (33) to Expression (36) or Expression (37) to Expression (40) are the shift amounts between the workpieces 8A and 8B.

  After adjusting the position of the processing table 10 and the galvanometer mirrors 4A, 4B, 5A, 5B, the control unit 21 of the laser processing apparatus 100 uses the processing program stored in the processing program storage unit 22, and uses the table control unit 25 and the mirror control unit 26. The workpieces 8A and 8B are simultaneously processed while controlling the beam irradiation controller 27 (step S40).

  When the workpieces 8A and 8B are not simultaneously within the machining range in the position correction by the machining table 10 (when the difference in the displacement amount between the workpieces 8A and 8B is larger than a predetermined value) (step S60, No), the displacement amount determination unit 34 determines whether the workpieces 8A and 8B are to be machined one by one as a machining procedure for the workpieces 8A and 8B.

  Whether or not the workpieces 8A and 8B are to be machined one by one when the workpieces 8A and 8B are not simultaneously within the machining range by the position correction by the machining table 10 is set in advance in the laser machining apparatus 100. When simultaneous processing of the workpieces 8A and 8B is not performed, when the laser processing apparatus 100 is set to process the workpieces 8A and 8B one by one (Yes in step S70), the deviation amount determination unit 34 As the processing procedure of 8A and 8B, it is determined that the workpieces 8A and 8B are processed one by one. The deviation amount determination unit 34 instructs the individual processing unit 32 to perform individual processing (work processing for each sheet) of the workpieces 8A and 8B.

  The individual machining processing instruction unit 44 of the individual machining processing unit 32 generates control instruction information for individually processing the workpieces 8A and 8B one by one, and the individual position correction processing unit 43 corrects the position of the workpieces 8A and 8B. A quantity (each position correction quantity for individual processing) is generated. The position correction amount calculated by the individual position correction processing unit 43 and the control instruction information generated by the individual processing processing instruction unit 44 are input to the table control unit 25 and the mirror control unit 26.

  The table control unit 25 and the mirror control unit 26 adjust the processing table 10, galvanometer mirrors 4A, 4B, 5A, 5B and the like based on the position correction amount. The control unit 21 of the laser processing apparatus 100 uses the processing program stored in the processing program storage unit 22 to control the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27, and performs individual processing on the workpieces 8A and 8B. This is performed (step S80).

  When it is set in the laser processing apparatus 100 that the workpieces 8A and 8B are not processed one by one when the workpieces 8A and 8B are not simultaneously processed (step S70, No), the deviation amount determination unit 34 As a processing procedure for 8A and 8B, it is determined whether or not to reset the workpieces 8A and 8B on the processing table 10 (step S90).

  Whether or not to reset the workpieces 8A and 8B to the machining table 10 when the workpieces 8A and 8B cannot be processed simultaneously and the workpieces 8A and 8B are not processed one by one is set in the laser processing apparatus 100 in advance. Keep it.

  When the workpieces 8A and 8B cannot be machined simultaneously and the workpieces 8A and 8B are not machined one by one, the laser machining apparatus 100 is set to reset the workpieces 8A and 8B to the machining table 10 ( In step S90, Yes), the deviation amount determination unit 34 determines that the workpieces 8A and 8B are reset to the processing table 10 (re-loading). The deviation amount determination unit 34 instructs the workpiece carry-out device 11, the workpiece positioning device 12, and the workpiece carry-in device 9 to reset the workpieces 8A and 8B on the machining table 10, and causes the workpieces 8A and 8B to be reset. . Thereby, the reset process of the workpieces 8A and 8B to the machining table 10 is performed (step S100).

  After resetting the workpieces 8A and 8B to the machining table 10, the laser machining system 101 returns to the process of step S10 and calculates the amount of positional deviation of the workpieces 8A and 8B on the machining table 10. Hereinafter, the laser processing system 101 repeats the process after step S20.

  On the other hand, when the workpieces 8A and 8B cannot be machined simultaneously and the workpieces 8A and 8B are not machined one by one, the laser machining apparatus 100 is set not to reset the workpieces 8A and 8B to the machining table 10. If there is (No at Step S90), the deviation amount determination unit 34 determines whether or not to stop the laser processing apparatus 100 (Step S110).

  In the laser processing apparatus 100, whether or not to stop the laser processing apparatus 100 when the workpieces 8A and 8B are not reset to the processing table 10 is set in advance. If the workpieces 8A and 8B are not reset on the machining table 10 and the laser machining apparatus 100 is set to stop the laser machining apparatus 100 (Yes in step S110), the deviation amount determination unit 34 performs a stop process of the laser processing apparatus 100 (step S120). At this time, the laser processing apparatus 100 may output an alarm for notifying abnormal stop.

  On the other hand, when the laser processing apparatus 100 is set not to stop the laser processing apparatus 100 even when the workpieces 8A and 8B are not reset on the processing table 10 (step S110, No). The deviation amount determination unit 34 determines to perform the next workpiece setting process on the machining table 10. The deviation amount determination unit 34 instructs the workpiece carry-out device 11, the workpiece positioning device 12, and the workpiece carry-in device 9 to set the next workpiece on the processing table 10 and causes the next workpiece to be set. Thereby, the workpieces 8A and 8B are carried out of the machining table 10, and the next workpiece setting process is performed (step S130).

  After the next workpiece is set on the machining table 10 of the workpieces 8A and 8B, the laser machining system 101 returns to the processing of step S10 and calculates the amount of positional deviation of the workpieces 8A and 8B on the machining table 10. . Hereinafter, the laser processing system 101 repeats the process after step S20.

  Next, the operation procedure of the laser processing apparatus 100 described with reference to FIG. 3 will be described in detail. First, the deviation amount calculation process (calculation process of the positional deviation amounts of the workpieces 8A and 8B on the machining table 10) by the control unit 21 will be described.

  FIG. 9 is a flowchart showing a detailed procedure of the deviation amount calculation processing. The workpiece position detection cameras 7A and 7B capture images of the workpieces 8A and 8B on the processing table 10 (step S210), and send the captured images to the position detection unit 23. The position detector 23 detects the positions (work positions) of the workpieces 8A and 8B with respect to the processing table 10 based on the images of the works 8A and 8B captured by the workpiece position detection cameras 7A and 7B (step S220). The position detector 23 inputs the detected position information of the workpieces 8A and 8B with respect to the machining table 10 to the controller 21.

  The deviation amount calculation unit 33 of the control unit 21 uses the position information of the workpieces 8A and 8B sent from the position detection unit 23 to calculate the amount of deviation of the workpieces 8A and 8B on the machining table 10 (step S230). The calculation result is transmitted to the deviation amount determination unit 34.

  Next, a processing procedure (step S80) when the laser processing apparatus 100 processes the workpieces 8A and 8B one by one will be described. FIG. 10 is a flowchart showing a processing procedure when processing workpieces one by one.

  When the deviation amount determination unit 34 of the laser processing apparatus 100 determines that the workpieces 8A and 8B are to be processed one by one as the processing procedure for the workpieces 8A and 8B, the individual processing unit 32 performs the individual processing of the workpieces 8A and 8B ( Instructing the processing one by one).

  The individual machining processing instruction unit 44 of the individual machining processing unit 32 first generates control instruction information for individually processing the workpiece 8A, and the individual position correction processing unit 43 detects the position correction amount (when performing individual processing) of the workpiece 8A. Table position correction amount) and the correction amounts of the galvanometer mirrors 4A and 5A.

  The table control unit 25 here generates a table position correction amount when the machining pattern 51A of the workpiece 8A is not in a range that can be machined by adjusting the galvanometer mirrors 4A and 5A. The table position correction amount calculated by the individual position correction processing unit 43, the correction amounts of the galvano mirrors 4A and 5A, and the control instruction information generated by the individual processing processing instruction unit 44 are input to the table control unit 25 and the mirror control unit 26. .

  When the processing pattern 51A of the workpiece 8A is not in a range that can be processed by adjustment of the galvano mirrors 4A and 5A, the table control unit so that the processing pattern 51A is in a range that can be processed by adjustment of the galvano mirrors 4A and 5A. 25, the table position is corrected (position adjustment of the machining table 10) (step S310). Further, the mirror control unit 26 adjusts the galvanometer mirror 4A so that the processing pattern 51A of the workpiece 8A is irradiated with the beam.

  The control unit 21 of the laser processing apparatus 100 controls the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27 using the processing program of the processing program storage unit 22, and performs individual processing of the workpiece 8A ( Step S320).

  Next, the individual machining processing instruction unit 44 of the individual machining processing unit 32 first generates control instruction information for individually processing the workpiece 8B, and the individual position correction processing unit 43 detects the position correction amount (individually) of the workpiece 8B. Table position correction amount at the time of processing) and correction amounts of the galvanometer mirrors 4B and 5B are generated.

  The table control unit 25 here generates a table position correction amount when the machining pattern 51B of the workpiece 8B is not in a range that can be machined by adjusting the galvanometer mirrors 4B and 5B. The table position correction amount calculated by the individual position correction processing unit 43, the correction amounts of the galvano mirrors 4B and 5B, and the control instruction information generated by the individual processing processing instruction unit 44 are input to the table control unit 25 and the mirror control unit 26. .

  When the machining pattern 51B of the workpiece 8B is not in a range that can be machined by adjusting the galvanometer mirrors 4B and 5B, the table control unit so that the machining pattern 51B is in a zone that can be machined by adjusting the galvanometer mirrors 4B and 5B. 25, the table position is corrected (position adjustment of the machining table 10) (step S330). Further, the mirror control unit 26 adjusts the galvanometer mirror 4B so that the processing pattern 51B of the workpiece 8B is irradiated with the beam.

  The control unit 21 of the laser processing apparatus 100 uses the processing program stored in the processing program storage unit 22 to control the table control unit 25, the mirror control unit 26, and the beam irradiation control unit 27, and performs individual processing of the workpiece 8B ( Step S340).

  Here, the individual processing of the workpiece 8A is performed first, and the individual processing of the workpiece 8B is performed later. However, the individual processing of the workpiece 8B may be performed first, and the individual processing of the workpiece 8A may be performed later. .

  Next, a processing procedure (step S100) when the laser processing apparatus 100 resets the workpieces 8A and 8B to the processing table 10 will be described. FIG. 11 and FIG. 12 are flowcharts showing a processing procedure when the workpiece is reset to the machining table.

  Here, a processing procedure for resetting both the workpieces 8A and 8B to the machining table 10 and a processing procedure for resetting either the workpiece 8A or 8B to the machining table 10 will be described. Here, a processing procedure for resetting the workpiece 8A as one of the workpieces 8A and 8B to the machining table 10 will be described. FIG. 11 shows a processing procedure for resetting both the workpieces 8A and 8B to the machining table 10, and FIG. 12 shows a processing procedure for resetting the workpiece 8A to the machining table 10.

  First, a processing procedure (FIG. 11) for resetting both the workpieces 8A and 8B (two workpieces) to the machining table 10 will be described. When both of the workpieces 8A and 8B are reset on the processing table 10, the deviation amount determination unit 34 of the laser processing apparatus 100 instructs the workpiece carry-in device 9 to reset the workpieces 8A and 8B on the processing table 10. Thereby, the workpiece carry-in device 9 lifts the workpieces 8A and 8B on the machining table 10 and returns them to the workpiece positioning device 12 (step S410).

  In the workpiece positioning device 12, the position is corrected and the positioning is performed again so that the amount of deviation of the workpieces 8A and 8B from the machining table 10 is eliminated. At this time, the workpiece positioning device 12 positions the workpieces 8A and 8B using the positional deviation amount of the workpieces 8A and 8B calculated by the deviation amount calculation unit 33 on the machining table 10. That is, the workpiece positioning device 12 performs a predetermined correction so that the machining patterns 51A and 51B of the workpieces 8A and 8B are within the machining ranges 52A and 52B when the workpieces 8A and 8B are set (loaded into) the machining table 10 again. Positioning is performed by correcting the positioning positions of the workpieces 8A and 8B with the value (first positioning correction value) (step S420). The workpiece carry-in device 9 lifts and loads (resets) the workpieces 8A and 8B positioned by the workpiece positioning device 12 onto the processing table 10 (step S430).

  Next, a processing procedure (FIG. 12) for resetting the workpiece 8A (one workpiece) on the machining table 10 will be described. When the workpiece 8A is reset on the processing table 10, the deviation amount determination unit 34 of the laser processing apparatus 100 instructs the workpiece carry-in device 9 to reset the workpiece 8A on the processing table 10. Thereby, the workpiece carrying-in apparatus 9 lifts the workpiece | work 8A on the process table 10 (step S510).

  The deviation amount determination unit 34 calculates the position correction amount of the machining table 10 so that the deviation amounts of the lifted workpiece 8A and the workpiece 8B on the machining table 10 are both within the machining range of the fθ lens. The deviation amount determination unit 34 transmits the calculation result of the position correction amount to the table control unit 25.

  The table control unit 25 moves the position of the processing table 10 based on the position correction amount from the deviation amount determination unit 34. The table control unit 25 here moves the position of the machining table 10 so that the amount of deviation between the lifted workpiece 8A and the workpiece 8B on the machining table 10 falls within the machining range of the fθ lens (step S520). Thereafter, the workpiece carry-in device 9 carries (resets) the workpiece 8A that has been lifted onto the processing table 10 (step S530).

  Here, the processing procedure for resetting the workpiece 8A as either one of the workpieces 8A and 8B has been described. However, only the workpiece 8B may be reset.

  Next, a processing procedure (step S130) when the laser processing apparatus 100 sets the next workpiece on the processing table 10 will be described. FIG. 13 and FIG. 14 are flowcharts showing a processing procedure when the next workpiece is set on the machining table.

  Here, a processing procedure when two next workpieces are simultaneously set on the machining table 10 and a processing procedure when one next workpiece is set on the machining table 10 will be described. FIG. 13 shows a processing procedure when two next workpieces are simultaneously set on the machining table 10, and FIG. 14 shows a processing procedure when setting the next workpieces one by one on the machining table 10.

  First, a processing procedure (FIG. 13) for simultaneously setting two workpieces as the next workpiece on the machining table 10 will be described. When two workpieces are simultaneously set as the next workpiece on the machining table 10, the deviation amount determination unit 34 of the laser machining device 100 is next transferred to the machining table 10 in the workpiece positioning device 12, workpiece unloading device 11, and workpiece loading device 9. Instruct to set two workpieces at the same time. Thereby, the workpiece carry-out device 11 lifts the workpieces 8A and 8B on the machining table 10 and carries the workpieces 8A and 8B out of the laser machining mechanism 1 (step S610).

  Next, the workpiece positioning device 12 positions the next workpiece (two sheets). At this time, the workpiece positioning device 12 performs positioning of the next workpiece with the position correction value that eliminates the positional deviation when the previous workpiece (work 8A, 8B) is set on the machining table 10, and performs positioning. The workpiece positioning device 12 here positions the workpieces 8A and 8B using the positional deviation amounts of the workpieces 8A and 8B calculated by the deviation amount calculation unit 33 on the machining table 10. That is, when the workpiece positioning device 12 sets (loads) the workpieces 8A and 8B to the machining table 10 again, the workpiece positioning device 12 positions correction values (first correction values) so that the machining patterns 51A and 51B of the workpieces 8A and 8B are within the machining ranges 52A and 52B. 2), the next workpiece is positioned (step S620). The workpiece carry-in device 9 lifts and loads the next workpiece (two sheets) positioned by the workpiece positioning device 12 onto the processing table 10 (step S630).

  Next, a processing procedure (FIG. 14) for setting the next workpieces one by one on the machining table 10 will be described. When the next workpiece is set on the machining table 10 one by one, the deviation amount determination unit 34 of the laser machining apparatus 100 places the next workpiece on the machining table 10 in the workpiece positioning device 12, the workpiece carry-out device 11, and the workpiece carry-in device 9. Instruct to set one by one. Thereby, the workpiece carry-out device 11 lifts the workpieces 8A and 8B on the machining table 10 and carries the workpieces 8A and 8B out of the laser machining mechanism 1 (step S710).

  Next, the workpiece positioning device 12 positions the next workpiece (first and second sheets). At this time, the workpiece positioning device 12 positions the next workpiece by position correction similar to that of the previous workpiece (work 8A, 8B). The workpiece carry-in device 9 lifts and loads the next workpiece (first sheet) positioned by the workpiece positioning device 12 onto the processing table 10 (step S720).

  The deviation amount determination unit 34 corrects the position of the machining table 10 so that the deviation amount between the previous workpieces is within the machining range by the fθ lens when the previous workpiece (work 8A, 8B) is set on the machining table 10. Calculate the amount. The deviation amount determination unit 34 transmits the calculation result of the position correction amount to the table control unit 25.

  The table control unit 25 moves the position of the processing table 10 based on the position correction amount from the deviation amount determination unit 34. The table control unit 25 moves the position of the machining table 10 so that the first workpiece and the subsequent second workpiece are within the machining range of the fθ lens (step S730). Thereafter, the workpiece carry-in device 9 lifts and loads the next workpiece (second sheet) positioned by the workpiece positioning device 12 onto the processing table 10 (step S740).

  In this embodiment, the case where the laser processing apparatus 100 processes two workpieces has been described. However, the laser processing apparatus 100 may process three or more workpieces. Also in this case, if the difference in the displacement position between the workpieces is not more than a predetermined value, the machining table 10 is moved to simultaneously process three or more workpieces. In addition, based on preset conditions, one-by-one machining, re-machining processing, machining processing for the next workpiece, and the like are performed.

  Further, in the present embodiment, the case where the workpiece is laser processed by various processing methods according to the workpiece shift position has been described. However, other processing apparatuses can handle the workpiece by various processing methods according to the workpiece shift position. It may be processed.

  As described above, according to the embodiment, based on the calculated displacement value, a workpiece machining method corresponding to the displacement value is selected from a plurality of preset machining methods, and the selected machining method is selected. Since the workpiece is subjected to laser machining, the workpiece can be laser machined quickly with high machining accuracy.

  Further, any of the workpieces 8A and 8B on the processing table 10 is outside the region that can be laser processed via the fθ lens (out of the processing range), and the positional deviation amount between the workpieces 8A and 8B on the processing table 10 When the difference in (positional deviation value) is smaller than a predetermined value (when the workpieces 8A and 8B are both within the machining range due to the table position correction), the fθ lenses corresponding to the workpieces 8A and 8B on the machining table 10 respectively. The position correction amount of the processing table 10 is set so as to fall within the region where laser processing can be performed simultaneously, and all the workpieces 8A and 8B on the processing table 10 are simultaneously irradiated with the laser beam to all the workpieces on the processing table 10. Since the simultaneous machining of 8A and 8B is performed, when the difference in positional deviation is smaller than a predetermined value, a plurality of workpieces can be laser machined quickly with high machining accuracy. It becomes possible. As a result, when trying to machine multiple workpieces, even if the deviation amount of multiple workpieces is not within the specified deviation amount, multiple workpieces can be machined simultaneously and quickly. Processing can be performed.

  Further, when the workpieces 8A and 8B are not simultaneously within the machining range by the position correction by the machining table 10 (when the difference in the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value), the laser machining apparatus 100 is corrected. Since various processing methods to be selected (one processing at a time, processing for resetting, processing for the next workpiece, etc.) are set in advance, the workpieces 8A and 8B are simultaneously processed by the processing table 10 in position correction. Even if it is not inside, the workpiece can be laser processed quickly with high processing accuracy.

  When the deviation amount determination unit 34 determines that the difference between the positional deviation amounts of the workpieces 8A and 8B is larger than a predetermined value, the individual machining processing unit 32 individually corrects the table position of each workpiece 8A and 8B to perform laser machining. Therefore, even if the workpieces 8A and 8B have a large positional deviation, laser processing can be performed quickly without generating an unprocessed workpiece.

  When the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value, the workpiece carry-in device 9 returns the workpieces 8A and 8B to the workpiece positioning device 12, and the workpieces 8A and 8B to be carried in again are simultaneously lasered through the fθ lens. Since the positions of the workpieces 8A and 8B are corrected and positioned by the workpiece positioning device 12 so as to fall within the processable region, it is possible to reduce workpieces that are poorly positioned and to perform laser processing quickly.

  When the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value, the workpieces 8A and 8B can be simultaneously laser processed via the fθ lens while the workpiece 8A is lifted and the workpiece 8A is lifted. Since the machining table 10 is moved so as to fall within the region, and the workpiece 8A is remounted on the machining table 10 after the machining table 10 is moved, it is possible to reduce the number of workpieces that are poorly positioned and to perform laser processing quickly. .

  If the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value, the workpiece carry-out device 11 carries out the workpieces 8A and 8B, and the next workpiece to be loaded enters an area where laser machining can be performed simultaneously via the fθ lens. Since the next workpiece positioning is performed by the workpiece positioning device 12, it is possible to reduce the number of workpieces that are poorly positioned and to perform laser processing quickly.

  When the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value, the workpiece unloading device 11 unloads the workpieces 8A and 8B, and loads the first workpiece to be loaded into the processing table 10 and then loads it. Since the work table 10 is moved so that the processed work (first and second sheets) enters the region where laser machining can be performed simultaneously via the fθ lens, and the second work is carried into the work table 10 after the movement, It is possible to reduce the number of workpieces that are poorly positioned and to perform laser processing quickly.

  Therefore, even when the amount of positional deviation between the workpieces 8A and 8B is larger than a predetermined value, the laser processing apparatus 100 can perform two laser processing, and is more efficient than a case where only one processing is possible. It is possible to perform processing well.

  As described above, the laser processing apparatus according to the present invention is suitable for laser processing of a plurality of workpieces on a processing table.

FIG. 1 is a diagram illustrating a configuration of a laser processing system according to an embodiment. FIG. 2 is a block diagram showing the configuration of the laser processing apparatus according to the embodiment. FIG. 3 is a flowchart showing an operation procedure of the laser processing system according to the embodiment. FIG. 4 is a diagram illustrating a case where the workpiece is within the machining range by adjusting the galvanometer mirror. FIG. 5 is a diagram illustrating a case where the workpiece does not fall within the machining range by adjusting the galvano mirror. FIG. 6 is a diagram illustrating an example in which two workpieces are not within the machining range only by adjusting the galvanometer mirror. FIG. 7 is a diagram (1) for explaining the concept of the position correction of the workpiece by the machining table. FIG. 8 is a diagram (2) for explaining the concept of the workpiece position correction by the machining table. FIG. 9 is a flowchart showing a detailed procedure of the deviation amount calculation processing. FIG. 10 is a flowchart showing a processing procedure when processing workpieces one by one. FIG. 11 is a flowchart showing a processing procedure when two workpieces are simultaneously reset to the machining table. FIG. 12 is a flowchart showing a processing procedure for resetting workpieces one by one on the machining table. FIG. 13 is a flowchart showing a processing procedure when two next workpieces are simultaneously set on the machining table. FIG. 14 is a flowchart showing a processing procedure when the next workpiece is set on the machining table one by one.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser processing mechanism 2A, 2B, 2X Mirror 3A, 3B Beam shutter 4A, 4B, 5A, 5B Galvano mirror 6A, 6B Processing head 7A, 7B Work position detection camera 8A, 8B Work 9 Work loading apparatus 10 Processing table 11 Work carry-out Device 12 Positioning device 13 Laser oscillator 21 Control unit 22 Processing program storage unit 23 Position detection unit 24 Deviation amount display unit 25 Table control unit 26 Mirror control unit 27 Beam irradiation control unit 31 Simultaneous processing unit 32 Individual processing unit 33 Deviation amount Calculation unit 34 Deviation amount determination unit 41 Simultaneous position correction processing unit 42 Simultaneous processing processing instruction unit 43 Individual position correction processing unit 44 Individual processing processing instruction unit 51A, 51B Processing pattern 52A, 52B Processing range 100 Laser processing device 101 Laser processing system

Claims (7)

In a laser processing apparatus that simultaneously irradiates a plurality of laser beams from a plurality of laser irradiation axes via an fθ lens corresponding to each laser irradiation axis, and simultaneously processes two workpieces placed on one processing table,
A deviation value calculating unit that detects a positional deviation of each workpiece with respect to the machining table for each workpiece and calculates a positional deviation value for each workpiece with respect to the machining table;
A machining method selection for selecting a workpiece machining method according to the position deviation value from a plurality of types of machining methods related to machining procedures for each workpiece set in advance, based on the deviation value calculated by the deviation value calculation unit. And
A correction value setting unit that sets a correction value of the movement amount of the machining table for correcting the positional deviation of each workpiece according to the machining method selected by the machining method selection unit;
A machining control unit that performs machining control when machining two workpieces on the machining table using the correction value set by the correction value setting unit according to the machining method in the machining method selected by the machining method selection unit. When,
With
The processing method selection unit
Given either the work on the work table when the Ru region outside der can laser machining through the fθ lens is set in advance with the difference between the positional deviation value between the workpiece on the machining table compared with the value,
If the difference between the displacement values is equal to or less than the predetermined value , the plurality of types of simultaneous machining methods for simultaneously irradiating all workpieces on the machining table with the laser beam and simultaneously machining all workpieces on the machining table Select from the processing methods
If the difference between the displacement values is larger than the predetermined value, a processing method other than the simultaneous processing method is selected from the plurality of types of processing methods,
When all the workpieces on the processing table are in a region where laser processing can be performed via the fθ lens, the simultaneous processing method is selected from the plurality of types of processing methods,
When the machining method selection unit selects the simultaneous machining method, the correction value setting unit enters an area in which all workpieces on the machining table can be simultaneously laser machined through the fθ lens corresponding to each workpiece. The laser processing apparatus is characterized in that the correction value is set. A machining method setting unit that preliminarily sets a plurality of types of machining methods related to the machining procedure of each workpiece that is selected by the machining method selection unit when a difference in positional deviation value between the workpieces is greater than a predetermined value; Prepared,
The said processing method selection part selects the processing method set to the said processing method setting part, when the difference of the position shift value between each said workpiece | work is larger than predetermined value, The said processing method selection part selects the processing method set to the said processing method setting part. Laser processing equipment. The machining method selection unit performs individual machining for each workpiece by moving the machining table for each laser machining of each workpiece when a difference in positional deviation value between the workpieces is larger than a predetermined value. Select the processing method,
The correction value setting unit is provided for each workpiece so that each workpiece enters a region where laser machining can be performed via the fθ lens corresponding to each workpiece by moving the machining table for each laser machining of each workpiece. The laser processing apparatus according to claim 1, wherein the correction value is set. The machining method selection unit is configured to position a workpiece when all the workpieces on the machining table are arranged outside and the workpiece is loaded when a difference in positional deviation value between the workpieces is larger than a predetermined value. After returning to the positioning device for performing the positioning, the positioning device performs the positioning of all the workpieces, and then selects a processing method for re-loading all the positioned workpieces to the processing table,
The correction value setting unit corrects the positioning positions of the workpieces so that all the workpieces re-loaded onto the machining table fall within a region where laser machining can be performed simultaneously via the fθ lenses corresponding to the workpieces. The laser processing apparatus according to claim 1, wherein the positioning correction value is set in the positioning apparatus. The machining method selection unit lifts a predetermined workpiece placed on the machining table from the machining table when the difference in positional deviation value between the workpieces is larger than a predetermined value, and Select the processing method to move the processing table while the workpiece is lifted, and to re-place the predetermined workpiece on the processing table after the processing table is moved,
The correction value setting unit sets the correction value so that all the workpieces placed on the machining table by moving the machining table fall within a region where laser machining can be performed simultaneously via the fθ lens corresponding to each workpiece. The laser processing apparatus according to claim 1 or 2, wherein The machining method selection unit causes all the workpieces on the machining table to be carried out by a carry-out device that is arranged outside and carries out the workpieces when a difference in positional deviation value between the workpieces is larger than a predetermined value. And selecting a machining method for positioning each workpiece to be loaded next by a positioning device disposed outside and positioning when loading the workpiece, and loading each positioned workpiece into the machining table. ,
The correction value setting unit corrects the positioning position of each workpiece so that all of the next workpieces carried on the machining table are within a region where laser machining can be performed simultaneously via the fθ lens corresponding to each workpiece. The laser processing apparatus according to claim 1, wherein a second positioning correction value is set in the positioning device. The machining method selection unit causes all the workpieces on the machining table to be carried out by a carry-out device that is arranged outside and carries out the workpieces when a difference in positional deviation value between the workpieces is larger than a predetermined value. At the same time, a positioning device that is disposed outside and performs positioning when loading the workpiece carries out positioning of each workpiece to be loaded next, and a predetermined workpiece among the positioned workpieces is loaded into the processing table. Select the processing method for moving the processing table and bringing the remaining workpiece out of the workpieces positioned after the processing table is moved into the processing table,
The correction value setting unit sets the correction value so that all workpieces carried on the machining table fall within a region where laser machining can be performed simultaneously via an fθ lens corresponding to each workpiece. The laser processing apparatus according to 1 or 2.

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