CN101253018B - Laser machining apparatus - Google Patents

Laser machining apparatus Download PDF

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Publication number
CN101253018B
CN101253018B CN200680002183.4A CN200680002183A CN101253018B CN 101253018 B CN101253018 B CN 101253018B CN 200680002183 A CN200680002183 A CN 200680002183A CN 101253018 B CN101253018 B CN 101253018B
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China
Prior art keywords
workpiece
aforementioned
machine table
processing
processing method
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CN200680002183.4A
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CN101253018A (en
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金田充弘
管原雅之
杉村好司
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to CN200680002183.4A priority Critical patent/CN101253018B/en
Priority claimed from PCT/JP2006/319361 external-priority patent/WO2008038385A1/en
Publication of CN101253018A publication Critical patent/CN101253018A/en
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Abstract

Provided is a laser working apparatus (100) for emitting a plurality of laser beams simultaneously through a plurality of fthelta lenses thereby to work simultaneously a plurality of works placed on one working table. The laser working apparatus (100) comprises a dislocation calculating unit (33) for calculating the positional dislocation of each work and correcting the positional dislocation of the work thereby to set the correction value of the movement of the working table in accordance with a working method, a dislocation deciding unit (34) for selecting the working method according to the positional dislocation from a plurality of preset kinds of working methods, and a control unit (21) for working and controlling the works on the working table by using a correcting value according to the working method. In case any work is outside of the working range of the fthelta lens and in case the difference of the positional dislocation between the individual works is smaller than a predetermined value, the dislocation calculating unit (33) sets the correction value so that all works may fall within the working range of the fthelta lens, and the dislocation deciding unit (34) selects a simultaneous working method for irradiating all works with the laser beams thereby to perform the simultaneous working of all works.

Description

Laser processing device
Technical field
The present invention relates to a plurality of workpiece on the machine table are carried out the laser processing device of Laser Processing.
Background technology
In recent years, for high accuracy and apace workpiece is carried out Laser Processing, developed multiple laser processing device.As this laser processing device, have a plurality of processing heads for example are set, process the laser processing device of a plurality of workpiece (machined object) simultaneously.Processed simultaneously by a plurality of processing heads under the situation of a plurality of workpiece, the position by detecting each workpiece is proofreaied and correct detected position deviation amount by f θ lens with respect to the departure of machine table, processes each workpiece accurately.
The processing unit (plant) of record in the patent documentation 1, its utilization is installed in the position that detecting unit on each processing head detects each machined object, according to detected data, machine table is moved on the roughly the same position of the position deviation of each processing head, process a plurality of machined objects thus accurately simultaneously.
In addition, in the patent documentation 2 record laser processing device, it has the laser beam cutting unit that the laser from 1 laser oscillator is divided into multi beam, from the laser beam cutting unit to each machined object, respectively each laser beam is provided with the laser beam guard mechanism, to block laser beam.And independence is controlled the irradiation of the laser beam of each machined object of mounting on each processing axle, is not shone.
Patent documentation 1: the spy opens the 2002-361463 communique
Patent documentation 2: the spy opens the 2003-112275 communique
Summary of the invention
But, in above-mentioned the former prior art, under the situation that will process a plurality of workpiece,, also must detect unusual and end all workpiece processing even there is the departure of 1 workpiece not fall within the departure of regulation in the departure of a plurality of workpiece.Therefore, even exist 1 workpiece departure not fall under the situation within the departure of regulation the problem that also can't carry out workpiece processing fast.In addition, in above-mentioned the former prior art, make workbench so that after the mode that the departure of a plurality of workpiece equates moves, judge that carrying out a plurality of workpiece processing still is to end.Therefore, exist under the situation of ending workpiece processing, workbench invalidly carries out the problem of shift action.
In addition, in the above-mentioned latter's prior art, do not fall in the departure of a plurality of workpiece under the situation within the departure of regulation, must block the laser beam of regulation, only process by the laser beam that is not blocked.Therefore, existence can't be processed the be blocked workpiece of a side of laser beam, the problem that can not process fast.
The present invention In view of the foregoing proposes, and purpose is to obtain a kind of laser processing device, and it can carry out workpiece laser processing fast and in high precision.
In order to solve above-mentioned problem, realize purpose, laser processing device of the present invention, it is from a plurality of laser irradiation axis, via the f θ lens corresponding with each laser irradiation axis, shine a plurality of laser beams simultaneously, simultaneously a plurality of workpiece of mounting on 1 machine table are carried out Laser Processing, it is characterized in that, have: the deviate calculating part, it detects the position deviation of aforementioned each workpiece with respect to aforementioned machine table for each workpiece, calculates the position deviation value of each workpiece with respect to aforementioned machine table; The processing method selection portion, the position deviation value that it calculates according to aforementioned deviate calculating part is selected the processing method of the workpiece corresponding with the aforementioned location deviate from predefined multiple processing method; The corrected value configuration part, the processing method that it is selected according to aforementioned processing method selection portion is set the corrected value of the amount of movement of the aforementioned machine table that the position deviation of aforementioned each workpiece is proofreaied and correct; And machining control portion, it is utilizing the processing method of being selected by aforementioned processing method selection portion, the corrected value that use is set by aforementioned corrected value configuration part, when processing a plurality of workpiece on the aforementioned machine table, carry out machining control, aforementioned processing method selection portion, be in and carry out outside the zone of Laser Processing via aforementioned f θ lens at certain workpiece on the aforementioned machine table, and under the situation of difference less than setting of the position deviation value between each workpiece on the aforementioned machine table, from aforementioned multiple processing method, select processing method simultaneously, this while processing method is that all workpiece on aforementioned machine table shine aforementioned laser beam simultaneously, all workpiece on the aforementioned machine table are processed simultaneously, aforementioned corrected value configuration part, selected under the situation of aforementioned while processing method in aforementioned processing method selection portion, set the aforementioned corrected value, so that all workpiece on the aforementioned machine table enter and can carry out in the zone of Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
The effect of invention
The laser processing device that the present invention relates to, according to the position deviation value that calculates, from predefined multiple processing method, select the Work piece processing method corresponding with the position deviation value, be in and carry out outside the zone of Laser Processing via f θ lens at certain workpiece on the machine table, and under the situation of position deviation value between each workpiece on the machine table less than setting, because select following while processing method, promptly, set corrected value, so that all workpiece on the machine table enter can be via the f θ lens corresponding with each workpiece, carry out in the zone of Laser Processing simultaneously, while all workpiece illuminating laser beams on machine table, processing when carrying out all workpiece on the machine table, so playing can high accuracy, carry out the effect of workpiece laser processing fast.
Description of drawings
Fig. 1 is the figure of the structure of the laser-processing system that relates to of expression embodiment.
Fig. 2 is the block diagram of the structure of the laser processing device that relates to of expression embodiment.
Fig. 3 is the flow chart of the sequence of movement of the laser-processing system that relates to of expression embodiment.
Fig. 4 is that expression makes workpiece be in the figure of the situation in the range of work by automatically controlled speculum adjustment.
Fig. 5 is that expression makes workpiece not be in the figure of the situation in the range of work by automatically controlled speculum adjustment.
Fig. 6 only represents that in automatically controlled speculum was adjusted, 2 workpiece were not in the figure of an example of the situation in the range of work.
Fig. 7 is the figure (1) that is used to illustrate the notion of the location of workpiece correction of being undertaken by machine table.
Fig. 8 is the figure (2) that is used to illustrate the notion of the location of workpiece correction of being undertaken by machine table.
Fig. 9 is the flow chart of the detailed sequence of expression departure computing.
Figure 10 is the flow chart of the processing sequence of expression when handling single workpiece.
Figure 11 is the flow chart of the processing sequence of expression when machine table reapposes processing to 2 workpiece simultaneously.
Figure 12 is the flow chart of the processing sequence of expression when machine table reapposes processing to single workpiece.
Figure 13 is the flow chart of the processing sequence of expression when machine table is placed processing simultaneously to 2 workpiece of next group.
The flow chart of the processing sequence that Figure 14 is expression when machine table is carried out single placement and handled the next group workpiece.
The specific embodiment
Below, describe the embodiment of the laser processing device that the present invention relates to reference to the accompanying drawings in detail.And the present invention is not defined as present embodiment.
Embodiment
Fig. 1 is the figure of the structure of the laser-processing system that relates to of expression embodiments of the present invention.Laser-processing system 101 have to workpiece (machined object) carry out Laser Processing Laser Processing mechanism 1, carry out workpiece that workpiece moves into to Laser Processing 1 and move into device 9, carry out workpiece conveyance device 11 that workpiece takes out of and the Working piece positioning device 12 that carries out the workpiece location from Laser Processing mechanism 1.
Laser Processing mechanism 1 has following function: from a plurality of laser irradiation axis, the f θ lens (processing head) via corresponding with each laser irradiation axis shine a plurality of laser beams simultaneously, simultaneously a plurality of workpiece of Laser Processing mounting on 1 machine table.Laser Processing mechanism 1 has laser oscillator 13, speculum 2A, 2B, 2X, photochopper 3A, 3B, automatically controlled speculum 4A, 4B, 5A, 5B, processing head 6A, 6B, location of workpiece detection camera 7A, 7B, is loaded with the machine table 10 of workpiece 8A, 8B.
Laser oscillator 13 is incident to speculum 2X with predetermined timing outgoing (generation) laser beam.Speculum 2A, 2B, 2X reflect by laser oscillator 13 emitting laser bundles, the light path of guiding regulation.Speculum 2X reflection is from the laser beam of laser oscillator 13, to speculum 2A, 2B incident.Speculum 2A, 2B reflection is from the laser beam of speculum 2X, respectively to photochopper 3A, 3B incident.Photochopper 3A, 3B will block from the laser beam of speculum 2A, 2B respectively or it is passed through as requested.
Automatically controlled speculum 4A, 4B, 5A, 5B make laser beam with angle scanning arbitrarily, with the light path of laser beam direction regulation.Automatically controlled speculum 4A, 5A make passed through photochopper 3A from the laser beam of speculum 2A to processing head 6A incident.Automatically controlled speculum 4B, 5B make passed through photochopper 3B from the laser beam of speculum 2B to processing head 6B incident.
Processing head 6A, 6B have f θ lens respectively, proofread and correct via the laser beam of automatically controlled speculum 5A, 5B incident and make its outgoing, so that it is respectively perpendicular to workpiece 8A, 8B incident.
Machine table 10 mounting workpiece 8A, 8B, and move to the XY direction.Workpiece 8A, 8B carry out Laser Processing by the laser beam that sends from processing head 6A, 6B respectively.Workpiece 8A wherein, 8B mounting are carried out the Laser Processing of same processing graphic pattern on workpiece 8A, 8B on same machine table 10.
The location of workpiece detects camera 7A, 7B and takes workpiece 8A, the 8B image taking unit with respect to the position of machine table 10.The location of workpiece detects the workpiece 8A that camera 7A, 7B take, the position of 8B, uses when judging workpiece 8A, 8B with respect to the position deviation amount (position deviation value) of machine table 10.
Working piece positioning device 12 is to carry out workpiece 8A, 8B before the moving into of Laser Processing mechanism 1, and plate end of workpiece 8A, 8B etc. is positioned at the device of assigned position (correction position).Workpiece is moved into device 9 and is mentioned workpiece 8A, 8B on the Working piece positioning device 12 after being positioned by Working piece positioning device 12, and it is moved into the machine table 10 of Laser Processing mechanism 1.Workpiece conveyance device 11 is mentioned workpiece 8A, the 8B on the machine table 10, takes out of to the outside of Laser Processing mechanism 1.
Below, the structure of the laser processing device that embodiment is related to describes.Fig. 2 is the block diagram of the structure of the laser processing device that relates to of expression embodiments of the present invention.Laser processing device 100 is adjustment of the position correction of carrying out machine table, automatically controlled speculum and the device that carries out workpiece laser processing has procedure storage part 22, position detection part 23, departure display part 24, workbench control part 25, speculum control part 26, laser beam irradiation control part 27, control part (machining control portion) 21.In addition, omit the diagram of Laser Processing mechanism 1 here.
The procedure that procedure storage part 22 storage laser processing devices 100 (Laser Processing mechanism 1) use when carrying out the Laser Processing of workpiece 8A, 8B.Procedure storage part 22 is connected with control part 21, when carrying out the Laser Processing of workpiece 8A, 8B, reads procedure by control part 21.
Position detection part 23 detects the workpiece 8A of camera 7A, 7B shooting, the image of 8B according to the location of workpiece, detects workpiece 8A, the 8B position with respect to machine table 10.Position detection part 23 is with detected workpiece 8A, 8B position (positional information) the input control part 21 with respect to machine table 10.
Control part 21 uses the procedure of storage in the procedure storage part 22, generates the control indication information to workbench control part 25, speculum control part 26, laser beam irradiation control part 27.In the present embodiment, control part 21 is according to the workpiece 8A that is sent by position detection part 23, the positional information of 8B, determines the processing method (when processing 2 simultaneously the independent processing method of processing method, individually processing etc.) of workpiece 8A, 8B.Control part 21 has to be processed handling part 31 simultaneously, processes handling part 32, departure calculating part (deviate calculating part, corrected value configuration part) 33, departure judging part (processing method selection portion, processing method configuration part) 34 separately.
Workpiece 8A, 8B be placed on the machine table 10 and beginning workpiece 8A, 8B add man-hour, departure calculating part 33 calculates position deviation amount on machine table 10 of workpiece 8A, 8B (with respect to the departure as the placement location of benchmark).Departure calculating part 33 uses the workpiece 8A that is sent by position detection part 23, the positional information of 8B, calculates the position deviation amount of workpiece 8A, 8B, and result of calculation (position deviation amount) is sent to departure judging part 34.
Departure judging part 34 is according to the position deviation amount of the workpiece 8A, the 8B that receive from departure calculating part 33, the adjustment of position correction that can judgement be undertaken by machine table 10 or automatically controlled speculum 4A, 4B, 5A, 5B, the position of calibration of workpieces 8A, 8B (proofread and correct and judge).
Departure judging part 34 is determined the processing sequence of workpiece 8A, 8B according to the judged result of proofread and correct judging etc.Be less than or equal under the situation of the setting of being stipulated by procedure with respect to the departure of machine table 10 at each workpiece 8A, 8B, departure judging part 34 selects to process simultaneously handling part 31, and processing is handled in the time of instruction workpiece 8A, 8B.Under departure the situation greater than the setting by procedure stipulated of each workpiece with respect to machine table 10, departure judging part 34 is selected processing handling part 32 separately, the independent processing processing of instruction workpiece 8A, 8B.Be judged as simultaneously processing for example under the situation of 2 workpiece 8A, 8B at departure judging part 34, processing was handled when instruction was processed handling part 31 simultaneously and carried out workpiece 8A, 8B, for example be judged as individually under the situation of processing work 8A, 8B, the instruction processing handling part 32 single processing of carrying out workpiece 8A, 8B is separately handled.
Process handling part 31 simultaneously according to the indication from departure judging part 34, generation is used for processed workpiece 8A, the control instruction information of 8B, the position correction amount (adding the machine table 10 in man-hour, the position data of speculum 2A, 2B simultaneously) (corrected value of the amount of movement of machine table 10) of workpiece 8A, 8B simultaneously.Processing handling part 31 simultaneously has the handling part of position correction simultaneously 41 and processes processing instruction portion 42 simultaneously.Simultaneously position correction handling part 41 calculates the correction data (position correction amount) that (generations) is used for the position of the position of machine table 10 of while processed workpiece 8A, 8B and speculum 2A, 2B.Process processing instruction portion 42 simultaneously and generate the control instruction information that is used for while processed workpiece 8A, 8B.Simultaneously the position correction amount that calculates of position correction handling part 41, process the control instruction information that processing instruction portion 42 generates simultaneously, be transfused to workbench control part 25, speculum control part 26, laser beam irradiation control part 27.
Process the information of processing instruction portion 42 simultaneously, make laser beam irradiation control part 27 open photochopper 3A, 3B, processing when implementing for two stages (workpiece 8A, 8B) by processing simultaneously to laser beam irradiation control part 27 output orders.
Separately processing handling part 32 is according to the instruction from departure judging part 34, and each workpiece 8A, 8B are generated the control instruction information that is used for single workpiece 8A, the 8B that processes processing and the position correction amount (machine table 10 when carrying out single processing the or the position data of speculum 2A, 2B) of workpiece 8A, 8B.Processing handling part 32 has independent position correction handling part 43 and processes processing instruction portion 44 separately separately.Separately position correction handling part 43 calculates (generation) and is used for individually workpiece 8A, 8B are processed the position of machine table 10 of processing and the position correction data (position correction amount) of speculum 2A, 2B.Processing processing instruction portion 44 generates the control instruction information that is used for individually workpiece 8A, 8B being processed processing separately.Separately the position correction amount that calculates of position correction handling part 43, process the control instruction information that processing instruction portion 44 generates separately, with order input service platform control part 25, speculum control part 26, the laser beam irradiation control part 27 of the workpiece handled separately.
Separately processing handling part 32 is by to the laser beam irradiation control part 27 output orders information of processing separately, makes laser beam irradiation control part 27 open some among photochopper 3A, the 3B, carries out the independent processing of workpiece 8A, 8B.
Workbench control part 25, speculum control part 26, laser beam irradiation control part 27, according to control instruction information and position correction amount from control part 21, control Laser Processing mechanism 1.Workbench control part 25 carries out mobile (position) the relevant control with machine table 10.Speculum control part 26 control speculum 2A, 2B, 2X, automatically controlled speculum 4A, 4B, 5A, 5B etc. adjust the light path to workpiece 8A, 8B emitting laser bundle.Laser beam irradiation control part 27 control laser oscillators 13, photochopper 3A, 3B adjust the laser beam (outgoing timing, output) of directive workpiece 8A, 8B.
Departure display part 24 has information display units such as LCD monitor, and workpiece 8A, 8B that demonstration departure calculating part 33 calculates are with respect to the departure of machine table 10, the machining state of workpiece 8A, 8B etc.
Below, the sequence of movement of the laser processing device that embodiment is related to describes.Fig. 3 is the flow chart of the sequence of movement of the laser-processing system that relates to of expression embodiments of the present invention.In laser-processing system 101, if the Laser Processing of beginning workpiece 8A, 8B, then at first workpiece 8A, 8B are positioned on the Working piece positioning device 12.Workpiece is moved into device 9 and is mentioned by workpiece 8A, 8B behind Working piece positioning device 12 location, it is moved on (placing) machine table 10.
The departure calculating part 33 of control part 21 calculates workpiece 8A, the position deviation amount (step S10) of 8B on machine table 10, sends result of calculation to departure judging part 34.Departure judging part 34 is according to the position deviation amount of the workpiece 8A, the 8B that receive from departure calculating part 33, judge the adjustment by automatically controlled speculum 4A, 4B, 5A, 5B, whether workpiece 8A, 8B are in the range of work interior (whether workpiece 8A, 8B are in respectively in the scope that can be processed by the f θ lens of processing head 6A, 6B) (step S20).
Here, for the adjustment by automatically controlled speculum 4A, 4B, 5A, 5B, the judgment processing whether workpiece 8A, 8B are in the range of work describes.Fig. 4 and Fig. 5 are the adjustment that is used to illustrate by automatically controlled speculum, and whether workpiece is in the figure of the judgment processing in the range of work.
Here, to the adjustment by automatically controlled speculum 4A, 5A, the judgement whether workpiece 8A is in the range of work describes.In Fig. 4 and Fig. 5, represent the scope that can process by f θ lens with range of work 52A, represent the processing graphic pattern of workpiece 8A with processing graphic pattern 51A.In Fig. 4, expression is by the adjustment of automatically controlled speculum 4A, 5A, and workpiece 8A is in the situation in the range of work, and in Fig. 5, expression is by the adjustment of automatically controlled speculum 4A, 5A, and workpiece 8A is not in the situation in the range of work.
In Fig. 4, because all processing graphic pattern 51A fall in the range of work 52A, so the adjustment by automatically controlled speculum, workpiece 8A is in the range of work.On the other hand, in Fig. 5, because not every processing graphic pattern 51A falls in the range of work 52A, so only by the adjustment of automatically controlled speculum 4A, 5A, workpiece 8A is not in the range of work.
Under the situation in workpiece 8A, 8B are in the scope that can be processed by f θ lens (step S20, be), departure judging part 34 to process simultaneously handling part 31 indications when carrying out workpiece 8A, 8B processing handle (2 time processing handle).
Processing processing instruction portion 42 when processing handling part 31 simultaneously generates and is used for the control instruction information of processed workpiece 8A, 8B simultaneously, sends to speculum control part 26.Speculum control part 26 is adjusted (proofread and correct and handle) automatically controlled speculum 4A, 4B, 5A, 5B, so that laser irradiates processing graphic pattern 51A, the 51B (step S30) of workpiece 8A, 8B.
Then, the control part 21 of laser processing device 100, use the procedure of procedure storage part 22, control workbench control part 25, speculum control part 26, laser beam irradiation control part 27 on one side, process processing (step S40) when carrying out workpiece 8A, 8B on one side.
On the other hand, be at workpiece 8A, 8B under the situation outside the scope that can process by f θ lens (step S20, not), departure judging part 34 is according to the position deviation amount of the workpiece 8A, the 8B that receive from departure calculating part 33, judge mobile (position correction of workpiece 8A, 8B) (the operating position correction) by machine table 10, can whether workpiece 8A, 8B all be in the range of work (carry out the position correction of workpiece 8A, 8B by machine table 10).That is to say that departure judging part 34 judges that whether the difference of the position deviation value between workpiece 8A, 8B is less than setting (step S50).
In the present embodiment, if the adjustment by automatically controlled speculum 4A, 4B, 5A, 5B, workpiece 8A, 8B are in the range of work, then are judged as workpiece 8A, 8B and are in the scope that can be processed by f θ lens.Fig. 6 is the adjustment of only representing by automatically controlled speculum, and 2 workpiece are not in the figure of an example of the situation in the range of work.
In Fig. 6, represent the range of work that can adjust by automatically controlled speculum 4A, 5A with range of work 52A, represent the range of work that can adjust by automatically controlled speculum 4B, 5B with range of work 52B.In addition, represent the processing graphic pattern of workpiece 8A, represent the processing graphic pattern of workpiece 8B with processing graphic pattern 51B with processing graphic pattern 51A.
Here, because all processing graphic pattern 51A fall in the range of work 52A, so the adjustment by automatically controlled speculum 4A, 5A, workpiece 8A is in the range of work.On the other hand, because not every processing graphic pattern 51B falls in the range of work 51B, so only by the adjustment of automatically controlled speculum 4B, 5B, workpiece 8B is not in the range of work.Therefore, by the adjustment of automatically controlled speculum 4A, 4B, 5A, 5B, can not make workpiece 8A, 8B the two all be in the range of work, judge that workpiece 8A, 8B are not in the scope that can be processed by f θ lens.
Here, for the position correction that utilizes machine table 10, the notion whether workpiece 8A, 8B all are in the judgment processing in the range of work describes.Fig. 7 and Fig. 8 are the figure of notion that is used to illustrate the position correction of the workpiece that utilizes machine table.
In Fig. 7, expression utilizes machine table 10 to carry out position correction, so that among 2 processing graphic pattern 51A, the 51B, the end (upper right corner part of processing graphic pattern) of a processing graphic pattern (being processing graphic pattern 51B here), the situation that the end (upper right corner part of machining area) of the machining area corresponding with processing graphic pattern (being range of work 52B here) overlaps.If in this manner machine table is carried out position correction, then along with the moving of processing graphic pattern 51B, processing graphic pattern 51A also moves.
In the present embodiment, carry out position correction utilizing machine table 10, so that for example under the situation that the end of the end of processing graphic pattern 51B and range of work 52B overlaps (all processing graphic pattern 51B fall under the situation in the range of work 52B), if all processing graphic pattern 51A fall in the interior 52A of the range of work, then be judged as by utilizing the position correction of machine table 10, workpiece 8A, 8B are in the range of work.
Under the situation of the position correction of workpiece 8A, 8B shown in Figure 7, under the end that makes processing graphic pattern 51B and situation that the end of range of work 52B overlaps, because all processing graphic pattern 51A fall in the range of work 52A, so be judged as by utilizing the position correction of machine table 10, workpiece 8A, 8B are in the range of work.
In addition, here, for utilizing machine table 10 to carry out position correction so that the upper right corner part of processing graphic pattern is illustrated with the situation that the end (upper right corner part of machining area) of range of work 52B overlaps in the end of processing graphic pattern 51B, but also can be to utilize machine table 10 to carry out position correction, so that processing graphic pattern 51B and range of work 52B overlap in other position.For example, corresponding to the bias direction of processing graphic pattern 51A, determine the position correction that processing graphic pattern 51B and range of work 52B are overlapped with respect to range of work 52A.
Processing graphic pattern 51A with respect to range of work 52A deflection figure under the top-right situation, utilize machine table 10 to carry out position correction, so that the lower left corner part of processing graphic pattern overlaps with the end (lower left corner part of machining area) of range of work 52B in the end of processing graphic pattern 51B.
In addition, processing graphic pattern 51A with respect to range of work 52A deflection figure under the upper left situation, utilize machine table 10 to carry out position correction, so that the lower right corner part of processing graphic pattern overlaps with the end (lower right corner part of machining area) of range of work 52B in the end of processing graphic pattern 51B.
In addition, processing graphic pattern 51A with respect to range of work 52A deflection figure under the bottom-right situation, utilize machine table 10 to carry out position correction, so that the upper left corner part of processing graphic pattern overlaps with the end (upper left corner part of machining area) of range of work 52B in the end of processing graphic pattern 51B.
In addition, here, carry out position correction for utilizing machine table 10, so that among 2 processing graphic pattern 51A, the 51B, the end of processing graphic pattern 51B is illustrated with the situation that the end of range of work 52B overlaps, but also can utilize machine table 10 to carry out position correction, so that among 2 processing graphic pattern 51A, the 51B, the end of processing graphic pattern 51A overlaps with the end of range of work 52A.
In addition, in Fig. 8, the mid point (mean value of differential location) of the differential location of 2 processing graphic pattern 51A, 51B, the situation of utilizing machine table 10 to carry out position correction are used in expression.In other words, utilize machine table 10 to carry out position correction, so that the mid point of range of work 52A, 52B overlaps with the mid point of processing graphic pattern 51A, 51B.That is to say that the departure (coordinate) of the target location (center of range of work 52A, 52B) of calculating processing pattern 51A, 51B off-beams irradiation is calculated the mean value of this departure.And position correction is carried out in the position of mobile machine table 10, so that the departure of each processing graphic pattern 51A, 51B equates with the mean value that calculates.
For example, in the center with range of work 52A is origin (0,0) under the situation, the center that utilizes machine table 10 to carry out the preceding processing graphic pattern 51A of position correction is coordinate (a1, a2), in the center with range of work 52B is origin (0,0) under the situation, the center that utilizes machine table 10 to carry out the preceding processing graphic pattern 51B of position correction is coordinate (b1, b2), in these cases, processing graphic pattern 51A, 51B are with respect to the mean value of the departure (coordinate) of range of work 52A, 52B, and the x coordinate is that (a1+b1)/2, y coordinate are (a2+b2)/2.Therefore, under this situation, mobile machine table 10 is carried out the position correction of processing graphic pattern 51A, 51B, so that the center of each processing graphic pattern 51A, 51B is ((a1+b1)/2, (a2+b2)/2).If carry out the position correction of machine table 10 in this manner, then the two is mobile in the zone of range of work 52A, 52B respectively for processing graphic pattern 51A, 51B.
In the present embodiment, move machine table 10 at for example mid point according to the differential location of 2 processing graphic pattern 51A, 51B, carry out under the situation of position correction of processing graphic pattern 51A, 51B, if all processing graphic pattern 51A fall in the range of work 51A, all processing graphic pattern 51B fall in the range of work 52B, judge that then workpiece 8A, 8B are in the range of work by utilizing the position correction of machine table 10.
Under the situation of the position correction of workpiece 8A, 8B shown in Figure 8, because all processing graphic pattern 51A fall in the range of work 52A, all processing graphic pattern 51B fall in the range of work 52B, all judge that workpiece 8A, 8B are in the range of work by utilizing the position correction of machine table 10.
That is to say, in the present embodiment, carry out position correction if can utilize machine table 10, so that all processing graphic pattern 51A fall in the interior 52A of the range of work, and all processing graphic pattern 51B fall in the range of work 52B, judge that then workpiece 8A, 8B are in the range of work by utilizing the position correction of machine table 10.
By utilizing the position correction of machine table 10, workpiece 8A, 8B are in (under the situation of difference less than setting of the position deviation amount between workpiece 8A, 8B) under the situation in the range of work (step S60, be), departure judging part 34 to process simultaneously handling part 31 indications when carrying out workpiece 8A, 8B processing handle.
Processing processing instruction portion 34 when processing handling part 31 simultaneously generates and is used for the control instruction information of processed workpiece 8A, 8B simultaneously, and sends workbench control part 25, speculum control part 26 to.Workbench control part 25 is adjusted the position of (proofread and correct and handle) machine table 10, so that the position of workpiece 8A, 8B becomes the scope that can process by the adjustment of automatically controlled speculum 4A, 4B, 5A, 5B.In addition, speculum control part 26 is adjusted automatically controlled speculum 4A, 4B, 5A, 5B, with processing graphic pattern 51A, the 51B illumination beam (step S30) to workpiece 8A, 8B.
Here, the computational methods for the position correction value of the workpiece 8A, the 8B that utilize machine table 10 to carry out describe.At first, can for by the correction (adjustment) of automatically controlled speculum 4A, 4B, 5A, 5B, the determination methods of workpiece 8A, 8B being carried out Laser Processing describes.
Carry out workpiece 8A, the 8B of Laser Processing by laser processing device 100, because of the operation of workpiece formation or the variation of surrounding environment, the pattern on workpiece 8A, the 8B can produce the deviation of the pattern form of flexible deviation, deviation, rotating deviation, right angle deviation, trapezoidal deviation etc. with respect to design load.
Under the situation that produces above-mentioned deviation, carry out Laser Processing accurately because considering departure, so need to detect the workpiece 8A of mounting on machine table 10, the witness marker of 8B, the position deviation of calibration of workpieces 8A, 8B with workpiece position probing camera 7A, 7B.
Under the situation of having only a workpiece, if calculate the Laser Processing position (X ', Y ') of (logarithm to pattern form is proofreaied and correct the back) after the offset correction with respect to target location (X, Y) with existing method, then for example rotating deviation, flexible deviation, deviation can use formula (1) and formula (2) to represent.In addition, P11～P13 wherein, P21～P23 are correction coefficient arbitrarily.
X’＝P11X+P12Y+P13…(1)
Y’＝P21X+P22Y+P23…(2)
In addition, under the situation that 2 workpiece 8A, 8B are for example arranged, (X Y), obtains the corrector (calibration coordinate) of each workpiece 8A, 8B with respect to the shared target location of each workpiece 8A, 8B.If making the coordinate after the correction of workpiece 8A be (X ' q, Y ' q) for the coordinate of (X ' p, Y ' p), workpiece 8B, then the corrector of workpiece 8A, 8B can use formula (3)～formula (6) to represent.In addition, P11～P13 wherein, P21～P23, Q11～Q13, Q21～Q23 are correction coefficient arbitrarily.
X’p＝P11X+P12Y+P13…(3)
Y’p＝P21X+P22Y+P23…(4)
X’q＝Q11X+Q12Y+Q13…(5)
Y’q＝Q21X+Q22Y+Q23…(6)
The X of target location, Y component can with automatically controlled reflector position coordinate (Xm, Ym) and operating position (Xt, Yt) and expression.Automatically controlled speculum 4A, 5A and automatically controlled speculum 4B, 5B are independently for workpiece 8A and workpiece 8B, but machine table 10 is shared for workpiece 8A and workpiece 8B.Therefore, must use the automatically controlled reflector position corresponding with each workpiece 8A, 8B, (Xt Yt) proofreaies and correct to operating position.If (Xt, Yt) corrector (3)～formula (6) then obtains formula (7)～formula (10) with respect to operating position.
In addition, the X ' pm here is to use the automatically controlled speculum coordinate (the X component of workpiece 8A) after the operating position (X component) of machine table 10 is proofreaied and correct, and Y ' pm is to use the automatically controlled speculum coordinate (the Y component of workpiece 8A) after the operating position (Y component) of machine table 10 is proofreaied and correct.In addition, X ' qm is to use the automatically controlled speculum coordinate (the X component of workpiece 8A) after the operating position (X component) of machine table 10 is proofreaied and correct, and Y ' qm is to use the automatically controlled speculum coordinate (the Y component of workpiece 8A) after the operating position (Y component) of machine table 10 is proofreaied and correct.
X’pm＝P11X+P12Y+P13-Xt…(7)
Y’pm＝P21X+P22Y+P23-Yt…(8)
X’qm＝Q11X+Q12Y+Q13-Xt…(9)
Y’qm＝Q21X+Q22Y+Q23-Yt…(10)
Can utilize the width (1 limit is the zone, four directions of fL) of the range of work that f θ lens process to fix.Therefore, the range of work of f θ lens (1 limit fL) and proofread and correct after automatically controlled speculum coordinate (by X ' pm, Y ' pm, X ' qm, the Y ' qm of formula (7)～formula (10) expression) poor, can use formula (11)～formula (14) calculating.In addition, the range of work that the Wpx here, Wpy, Wqx, Wqy represent f θ lens with proofread and correct after automatically controlled speculum coordinate poor, under these values all be positive situation, can while processing work 8A, 8B.
Wpx＝fL/2-|P11X+P12Y+P13-Xt|…(11)
Wpy＝fL/2-|P21X+P22Y+P23-Yt|…(12)
Wqx＝fL/2-|Q11X+Q12Y+Q13-Xt|…(13)
Wqy＝fL/2-|Q21X+Q22Y+Q23-Yt|…(14)
But, laser irradiating position with respect to the big situation of the departure of target location under, only correction (correction of irradiation position) sometimes, simultaneously processing work 8A, 8B by utilizing automatically controlled speculum.Therefore, in the present embodiment,, utilize the position of machine table 10 calibration of workpieces 8A, 8B for flexible use as much as possible can utilize the scope of f θ lens processing.
Below, describe for the computational methods of the position correction value of the workpiece 8A, the 8B that are undertaken by machine table 10.The target location (X, Y) can by automatically controlled speculum coordinate (Xm, Ym) and operating position (Xt, Yt) and the expression.If by automatically controlled speculum coordinate (Xm, Ym) and operating position (Xt, Yt) (X, Y) the Laser Processing position after proofreading and correct (X ', Y ') then obtains formula (15), formula (16) to the target location with expression
X’＝Px(Xm，Ym)+Px(Xt，Yt)…(15)
Y’＝Py(Xm，Ym)+Py(Xt，Yt)…(16)
In addition, Px (Xm wherein, Ym), Py (Xm, Ym) be the calibration coordinate (utilizing the coordinate under the situation after automatically controlled speculum 4A, 4B, 5A, 5B proofread and correct) at reflector position place, Px (Xt, Yt), (Xt Yt) is the calibration coordinate (utilizing the coordinate under the situation after machine table 10 is proofreaied and correct) at operating position place to Py.Px (Xm, Ym), Px (Xt, Yt), Py (Xm, Ym), (Xt Yt) has the relation of following formula (17)～formula (20) respectively to Py.
Px(Xm，Ym)＝(P11+P12)Xm+(P11+P12)Ym…(17)
Px(Xt，Yt)＝(P11+P12)Xt+(P11+P12)Yt+P13…(18)
Py(Xm，Ym)＝(P21+P22)Xm+(P21+P22)Ym…(19)
Py(Xt，Yt)＝(P21+P22)Xt+(P21+P22)Yt+P23…(20)
Under 2 workpiece workpiece 8A, 8B were placed in situation on the machine table 10, (X Y), obtained each workpiece 8A, 8B corrector separately with respect to the shared target location of each workpiece 8A, 8B.Formula (21)～formula (24) expression can be used in Laser Processing position after the correction of workpiece 8A, 8B.
X’p＝Px(Xm，Ym)+Px(Xt，Yt)…(21)
Y’p＝Py(Xm，Ym)+Py(Xt，Yt)…(22)
X’q＝Qx(Xm，Ym)+Qx(Xt，Yt)…(23)
Y’q＝Qy(Xm，Ym)+Qy(Xt，Yt)…(24)
In addition, X ' p wherein, Y ' p are the Laser Processing positions (X component and Y component) after workpiece 8A proofreaies and correct, and X ' q, Y ' q are the Laser Processing positions (X component and Y component) after workpiece 8B proofreaies and correct.
In addition, Px (Xm wherein, Ym), Py (Xm, Ym) be the calibration coordinate (utilizing the coordinate under the situation after automatically controlled speculum 4A, 4B, 5A, 5B proofread and correct) at reflector position place, Px (Xt, Yt), (Xt Yt) is the calibration coordinate (utilizing the coordinate under the situation after machine table 10 is proofreaied and correct) at operating position place to Py.Px (Xm, Ym), Px (Xt, Yt), Py (Xm, Ym), (Xt Yt) has the relation of aforementioned formula (17)～formula (20) and following formula (25)～formula (28) respectively to Py.
Qx(Xm，Ym)＝(Q11+Q12)Xm+(Q11+Q12)Ym…(25)
Qx(Xt，Yt)＝(Q11+Q12)Xt+(Q11+Q12)Yt+Q13…(26)
Qy(Xm，Ym)＝(Q21+Q22)Xm+(Q21+Q22)Ym…(27)
Qy(Xt，Yt)＝(Q21+Q22)Xt+(Q21+Q22)Yt+Q23…(28)
In laser processing device 100, automatically controlled speculum 4A, 4B, 5A, 5B be configured at each workpiece 8A, 8B independently the axle on, can position each workpiece 8A, 8B.Machine table 10 is configured on the shared axle of workpiece 8A, 8B, and the operating position of machine table 10 must be shared to workpiece 8A, 8B.
Be under the situation of benchmark for example in the position that makes operating position with workpiece 8A, in workpiece 8B side, need be to the automatically controlled reflector position coordinate of workpiece 8A side, the workbench of consideration formula (21)～formula (24) is proofreaied and correct.Therefore, if proofread and correct by the line position that moves forward into of machine table 10, so that the departure of workpiece 8A is 0, then Wpx, Wpy, Wqx, Wqy can be calculated by formula (29)～formula (32).In addition, the Wqx here, Wqy are the departure of workpiece 8B with respect to workpiece 8A.
Wpx＝0…(29)
Wpy＝0…(30)
Wqx＝Qx(Xt，Yt)-Px(Xt，Yt)…(31)
Wqy＝Qy(Xt，Yt)-Py(Xt，Yt)…(32)
That is to say, be benchmark if make the position correction (moving) undertaken by machine table 10 with the departure of workpiece 8A, then the departure of the processing graphic pattern of f θ lens and workpiece 8B be the independent departure of independent departure of workpiece 8B and workpiece 8A and.
Under the situation of departure (Wqx, Wqy) greater than setting of workpiece 8B side, because simultaneously processing work 8A, 8B, so the range of work fL's that recomputates Wqx, Wqy and undertaken by f θ lens is poor, and mobile machine table 10, so that it falls in the range of work of f θ lens.For example, under the situation of forward above the range of work of f θ lens, Wpx, Wpy, Wqx, Wqy through type (33)～formula (36) are calculated at Wqx, Wqy.
Wpx＝fL/2-(Qx(Xt，Yt)-Px(Xt，Yt))…(33)
Wpy＝fL/2-(Qy(Xt，Yt)-Py(Xt，Yt))…(34)
Wqx＝fL/2…(35)
Wqy＝fL/2…(36)
Under this situation, the position of machine table 10 be (Px (and Xt, Yt)-Wpx, Py (Xt, Yt)-Wpy).In addition, can also be with the middle point ((Px (Xt of the departure by workpiece 8A, 8B behind the shift calibrating of machine table 10 (coordinate position of deviation) of workpiece 8A and workpiece 8B, Yt)+Qx (Xt, Yt))/2, ((Py (Xt, Yt)+and Qy (Xt, Yt))/2) be benchmark, recomputate the departure of workpiece 8A, 8B.Under this situation, Wpx, Wpy, Wqx, Wqy can utilize formula (37)～formula (40) to calculate.
Wpx＝(Px(Xt，Yt)-Qx(Xt，Yt))/2…(37)
Wpy＝(Py(Xt，Yt)-Qy(Xt，Yt))/2…(38)
Wpx＝(Qx(Xt，Yt)-Px(Xt，Yt))/2…(39)
Wpx＝(Qy(Xt，Yt)-Py(Xt，Yt))/2…(40)
Under this situation,, utilize automatically controlled speculum to carry out the correction of laser irradiating position, carry out Laser Processing Wpx, Wpy, Wqx, the Wqy that calculates.Wpx wherein, Wpy are the departure of workpiece 8A with respect to the mid point of workpiece 8A, 8B, and Wqx, Wqy are the departure of workpiece 8B with respect to the mid point of workpiece 8A, 8B.Thus, by formula (33)～formula (36) or formula (37)～Wpx, Wpy that formula (40) calculates, the value of Wqx, Wqy, become the departure between workpiece 8A, 8B.
Adjusted after the position of machine table 10 and automatically controlled speculum 4A, 4B, 5A, the 5B, the control part 21 of laser processing device 100 uses the procedure of procedure storage part 22, control on one side workbench control part 25, speculum control part 26, laser beam irradiation control part 27, processing processing (step S40) when carrying out workpiece 8A, 8B on one side.
In the position correction of being undertaken by machine table 10 and workpiece 8A, 8B are not in (under the situation of difference greater than setting of the position deviation amount between workpiece 8A, 8B) under the situation in the range of work (step S60, not) simultaneously, departure judging part 34 judges whether the processing sequence with workpiece 8A, 8B, individually processing work 8A, 8B.
For laser processing device 100, be set in advance in workpiece 8A, 8B and be not in simultaneously under the situation in the range of work, whether individually processing work 8A, 8B by the position correction of machine table 10.To laser processing device 100, be set in when processing is handled when not carrying out workpiece 8A, 8B, under the situation of single processing work 8A, 8B (step S70, be), the processing sequence that departure judging part 34 is judged with workpiece 8A, 8B, single processing work 8A, 8B.The independent processing processing (single processing processing) of workpiece 8A, 8B is carried out in departure judging part 34 instructions processing handling part 32 separately.
The independent independent processing processing instruction portion 44 of processing handling part 32, generation is used for the control instruction information of single processed workpiece 8A, 8B, and position correction handling part 43 generates the position correction amount (each position correction amount when handling separately) of workpiece 8A, 8B separately.Separately the position correction amount that calculates of position correction handling part 43, process the control instruction information that processing instruction portion 44 generates separately, input to workbench control part 25, speculum control part 26.
Workbench control part 25, speculum control part 26 are adjusted machine table 10, automatically controlled speculum 4A, 4B, 5A, 5B etc. according to position correction amount.The control part 21 of laser processing device 100, the procedure of use procedure storage part 22, control workbench control part 25, speculum control part 26, laser beam irradiation control part 27 carry out the independent processing of workpiece 8A, 8B and handle (step S80).
Laser processing device 100 is set in do not carry out workpiece 8A, 8B in processing when handling, under the situation of not single processing work 8A, 8B (step S70, not), departure judging part 34 judges whether the processing sequence with workpiece 8A, 8B, carries out workpiece 8A, 8B reappose (the step S90) to machine table 10.
For laser processing device 100, preestablish it under the situation of simultaneously processing work 8A, the also not single processing work 8A of 8B, 8B, whether carry out workpiece 8A, 8B reapposing to machine table 10.
To laser processing device 100, when being set in simultaneously processing work 8A, the also not single processing work 8A of 8B, 8B, carry out workpiece 8A, 8B under the situation about reapposing of machine table 10 (step S90, be), departure judging part 34 is judged and is carried out workpiece 8A, 8B reappose (the moving into once more) to machine table 10.Departure judging part 34 instruction workpiece conveyance devices 11, Working piece positioning device 12, workpiece are moved into device 9, carry out workpiece 8A, the 8B processing that reapposes to machine table 10, so that it carries out the processing that reapposes of workpiece 8A, 8B.Thus, can carry out workpiece 8A, 8B and reappose processing (step S100) to machine table 10.
Workpiece 8A, 8B to machine table 10 reappose processing after, laser-processing system 101 is returned the processing of step S10, calculates workpiece 8A, the departure of 8B on machine table 10.Then, the later processing of laser-processing system 101 repeating step S20.
On the other hand, laser processing device 100 is being set in processing work 8A, 8B simultaneously, when also not single processing work 8A, 8B, do not carry out workpiece 8A, 8B under the situation that reapposes processing of machine table 10 (step S90, not), what departure judging part 34 judged whether to carry out laser processing device 100 stops to handle (step S110).
For laser processing device 100, be set in advance in and do not carry out workpiece 8A, 8B under the situation about reapposing of machine table 10, whether carry out the processing that stops of laser processing device 100.To laser processing device 100, be set in and do not carry out workpiece 8A, 8B when the reapposing of machine table 10, process under the situation that stops to handle of processing unit (plant) 100 (step S110, be), what departure judging part 34 made that it carries out laser processing device 100 stops to handle (step S120).At this moment, laser processing device 100 can also be exported and be used to notify the alarm that abends.
On the other hand, to laser processing device 100, even set when not carrying out workpiece 8A, 8B to the reapposing of machine table 10, also do not carry out under the situation that stops to handle of laser processing device 100 (step S110, not), departure judging part 34 judges that carrying out the next group workpiece places to machine table 10 and handle.Departure judging part 34 instruction workpiece conveyance devices 11, Working piece positioning device 12, workpiece are moved into device 9, carry out the next group workpiece and handle to the placement of machine table 10, and its placement of carrying out the next group workpiece is handled.Thus, workpiece 8A, 8B are taken out of machine table 10, carry out the placement of next group workpiece and handle (step S130).
After the next group workpiece of machine table 10 was placed processing, laser-processing system 101 was returned the processing of step S 10 at workpiece 8A, 8B, calculated workpiece 8A, the position deviation amount of 8B on machine table 10.Then, the later processing of laser-processing system 101 repeating step S20.
Below, be described in detail in the sequence of movement of laser processing device 100 illustrated in fig. 3.At first, the departure computing of being undertaken by control part 21 (computing of the position deviation amount of workpiece 8A, 8B on the machine table 10) is described.
Fig. 9 is the flow chart of the detailed sequence of expression departure computing.The location of workpiece detects the image (step S210) that camera 7A, 7B take workpiece 8A, 8B on the machine table 10, sends the image that photographs to position detection part 23.The workpiece 8A that position detection part 23 photographs according to location of workpiece detection camera 7A, 7B, the image of 8B detect workpiece 8A, the 8B position (location of workpiece) (step S220) with respect to machine table 10.Position detection part 23 is with detected workpiece 8A, the 8B positional information input control part 21 with respect to machine table 10.
The departure calculating part 33 of control part 21, the workpiece 8A that use is sent here from position detection part 23, the positional information of 8B are calculated workpiece 8A, the position deviation amount (step S230) of 8B on machine table 10, send result of calculation to departure judging part 34.
Below, the processing sequence (step S80) when carrying out single the processing for laser processing device 100 couples of workpiece 8A, 8B describes.The flow chart of the processing sequence when Figure 10 is the single processing workpiece of expression.
The departure judging part 34 of laser processing device 100, in the processing sequence that is judged as with workpiece 8A, 8B, individually under the situation of processing work 8A, 8B, the independent processing processing (single processing processing) of workpiece 8A, 8B is carried out in instruction processing handling part 32 separately.
The independent independent processing processing instruction portion 44 of processing handling part 32, at first generate and be used for the control instruction information of processed workpiece 8A individually, the position correction amount (the operating position correcting value when handling separately) of independent position correction handling part 43 generation workpiece 8A and the correcting value of automatically controlled speculum 4A, 5A.
The workbench control part 25 here is not in and can becomes by the adjustment of automatically controlled speculum 4A, 5A under the situation of the scope that can process at the processing graphic pattern 51A of workpiece 8A, generates the operating position correcting value.Separately the correcting value of the operating position correcting value that calculates of position correction handling part 43 and automatically controlled speculum 4A, 5A, process the control instruction information that processing instruction portion 44 generates separately, input to workbench control part 25, speculum control part 26.
Under the situation in the processing graphic pattern 51A of workpiece 8A is not in the scope that can process by the adjustment of automatically controlled speculum 4A, 5A, utilize workbench control part 25 to carry out operating position and proofread and correct (position of machine table 10 is adjusted), so that processing graphic pattern 51A is in the scope (step S310) that can process by the adjustment of automatically controlled speculum 4A, 5A.In addition, speculum control part 26 is adjusted automatically controlled speculum 4A, so that light beam irradiates goes out the processing graphic pattern 51A of workpiece 8A.
The control part 21 of laser processing device 100, the procedure of use procedure storage part 22, control workbench control part 25, speculum control part 26, laser beam irradiation control part 27 carry out the independent processing of workpiece 8A and handle (step S320).
Then, the independent independent processing processing instruction portion 44 of processing handling part 32, at first generate and be used for the ground control instruction information of processed workpiece 8B separately, the position correction amount (the operating position correcting value when handling separately) of independent position correction handling part 43 generation workpiece 8B and the correcting value of automatically controlled speculum 4B, 5B.
The workbench control part 25 here under the situation in the processing graphic pattern 51B of workpiece 8B is not in the scope that can process by the adjustment of automatically controlled speculum 4B, 5B, generates the operating position correcting value.Separately the correcting value of the operating position correcting value that calculates of position correction handling part 43 and automatically controlled speculum 4B, 5B, process the control instruction information that processing instruction portion 44 generates separately, input to workbench control part 25, speculum control part 26.
Under the situation in the processing graphic pattern 51B of workpiece 8B is not in the scope that can process by the adjustment of automatically controlled speculum 4B, 5B, utilize workbench control part 25 to carry out operating position and proofread and correct (position of machine table 10 is adjusted), so that processing graphic pattern 51B is in the scope (step S330) that can process by the adjustment of automatically controlled speculum 4B, 5B.In addition, speculum control part 26 is adjusted automatically controlled speculum 4B, so that light beam irradiates goes out the processing graphic pattern 51B of workpiece 8B.
The control part 21 of laser processing device 100, the procedure of use procedure storage part 22, control workbench control part 25, speculum control part 26, laser beam irradiation control part 27 carry out the independent processing of workpiece 8B and handle (step S340).
In addition, carry out the independent processing of workpiece 8A here earlier, carry out the independent processing of workpiece 8B then, but also can carry out the independent processing of workpiece 8B earlier, carry out the independent processing of workpiece 8A then.
Below, carry out workpiece 8A, the 8B processing sequence (step S 100) when reapposing of machine table 10 handled for laser processing device 100 and describe.Figure 11 and Figure 12 are the flow charts that the processing sequence of workpiece when reapposing of machine table handled carried out in expression.
Here, describe for these two processing sequence when machine table 10 reapposes of workpiece 8A, 8B, any one processing sequence when machine table 10 reapposes among workpiece 8A, the 8B.And, here, describe for the processing sequence during any one workpiece 8A in reapposing as workpiece 8A, 8B to machine table 10.Figure 11 be to machine table 10 reappose workpiece 8A, 8B the two the time processing sequence, Figure 12 is the processing sequence when machine table 10 reapposes workpiece 8A.
At first, describe for the two processing sequence (Figure 11) when the reapposing of machine table 10 of workpiece 8A, 8B (2 workpiece).Workpiece 8A, 8B the two under the situation that machine table 10 reapposes, the departure judging part 34 of laser processing device 100, the instruction workpiece is moved into device 9 and is carried out workpiece 8A, the 8B processing that reapposes to machine table 10.Thus, workpiece is moved into device 9 and is mentioned workpiece 8A, 8B on the machine table 10, turns back to Working piece positioning device 12 (step S410).
Carry out position correction and reorientate by Working piece positioning device 12, so that workpiece 8A, 8B do not have the departure with respect to machine table 10.At this moment, workpiece 8A, the 8B position deviation amount on machine table 10 that Working piece positioning device 12 uses departure calculating part 33 to calculate, location workpiece 8A, 8B.That is to say, Working piece positioning device 12 positions with the position location of corrected value (the 1st positioning correcting value) calibration of workpieces 8A, the 8B of regulation, so that once more workpiece 8A, 8B are being placed (moving into) on machine table 10 time, processing graphic pattern 51A, the 51B of workpiece 8A, 8B falls in range of work 52A, the 52B (step S420).Workpiece is moved into device 9 and is mentioned by workpiece 8A, 8B behind Working piece positioning device 12 location, moves on (reapposing) machine table 10 (step S430).
Below, describe for the processing sequence (Figure 12) of workpiece 8A (1 workpiece) when the reapposing of machine table 10.Under the situation that machine table 10 reapposes, 34 pairs of workpiece of the departure judging part of laser processing device 100 are moved into device 9 instructions and are carried out the reappose processing of workpiece 8A to machine table 10 at workpiece 8A.Thus, workpiece is moved into device 9 and is mentioned workpiece 8A (step S510) on the machine table 10.
The position correction amount of departure judging part 34 calculating processing platforms 10 so that the departure of the workpiece 8B on workpiece 8A that mentions and the machine table 10, all is in and can uses in the scope that f θ lens process.Departure judging part 34 sends the result of calculation of position correction amount to workbench control part 25.
Workbench control part 25 is according to the position correction amount from departure judging part 34, the position of mobile machine table 10.The workbench control part 25 here moves the position of machine table 10, so that the departure of the workpiece 8B on workpiece 8A that mentions and the machine table 10, all in the scope of using f θ lens to process (step S520).Then, workpiece is moved into the workpiece 8A that device 9 will mention and is moved on (reapposing) machine table 10 (step S530).
And, here, be illustrated for the processing sequence during any one workpiece 8A in reapposing as workpiece 8A, 8B to machine table 10, but also can only reappose workpiece 8B.
Below, carry out the processing sequence (step S130) of next group workpiece when the placement of machine table 10 is handled for laser processing device 100 and describe.Figure 13 and Figure 14 are the flow charts of the processing sequence of expression next group workpiece when the placement of machine table is handled.
Here, processing sequence and the processing sequence when machine table 10 is individually placed the next group workpiece when placing 2 next group workpiece simultaneously to machine table 10 describes.Figure 13 is the processing sequence when machine table 10 is placed 2 next group workpiece simultaneously, and Figure 14 is the processing sequence when machine table 10 is individually placed the next group workpiece.
Processing sequence (Figure 13) during at first, for 2 workpiece placing simultaneously to machine table 10 as the next group workpiece describes.Under the situation of placing simultaneously to machine table 10 as 2 workpiece of next group workpiece, the departure judging part 34 instruction Working piece positioning devices 12 of laser processing device 100, workpiece conveyance device 11, workpiece are moved into device 9, place 2 workpiece as the next group workpiece simultaneously to machine table 10.Thus, workpiece conveyance device 11 is mentioned workpiece 8A, the 8B on the machine table 10, and workpiece 8A, 8B are taken out of (step S610) outside the Laser Processing mechanism 1.
Then, Working piece positioning device 12 carries out next group workpiece (2 s') location.At this moment, Working piece positioning device 12 utilization is placed on preceding a collection of workpiece (workpiece 8A, 8B) under the situation on the machine table 10, and the position correction value of no position deviation is carried out the position correction of next group workpiece and positioned.Workpiece 8A, the 8B position deviation amount on machine table 10 that the Working piece positioning device 12 here uses departure calculating parts 33 to calculate is carried out the location of workpiece 8A, 8B.That is to say, Working piece positioning device 12 is under situation about once more workpiece 8A, 8B being placed on (moving into) machine table 10, so that processing graphic pattern 51A, the 51B of workpiece 8A, 8B fall into the position correction value (the 2nd position location corrected value) in range of work 52A, the 52B, carry out the location (step S620) of next group workpiece.Workpiece is moved into device 9 and is mentioned by the next group workpiece (2) behind Working piece positioning device 12 location, moves into (step S630) on the machine table 10.
Below, describe for the processing sequence (Figure 14) when machine table 10 is individually placed the next group workpiece.Individually placing to machine table 10 under the situation of next group workpiece, the departure judging part 34 instruction Working piece positioning devices 12 of laser processing device 100, workpiece conveyance device 11, workpiece are moved into device 9, make it individually place the next group workpiece to machine table 10.Thus, workpiece conveyance device 11 is mentioned workpiece 8A, the 8B on the machine table 10, and workpiece 8A, 8B are taken out of (step S710) outside the Laser Processing mechanism 1.
Then, Working piece positioning device 12 carries out next group workpiece (the 1st 's and the 2nd) location.At this moment, Working piece positioning device 12 by with the same position correction of preceding a collection of workpiece (workpiece 8A, 8B), carry out the location of next group workpiece.Workpiece is moved into device 9 and is mentioned by the next group workpiece (the 1st) behind Working piece positioning device 12 location, moves into (step S720) on the machine table 10.
The position correction amount of departure judging part 34 calculating processing platforms 10, so that preceding a collection of workpiece (workpiece 8A, 8B) is being placed under the situation on the machine table 10, the departure between preceding a collection of workpiece is in the scope that can be processed by f θ lens.Departure judging part 34 sends the result of calculation of position correction amount to workbench control part 25.
Workbench control part 25 moves the position of machine table 10 according to the position correction amount from departure judging part 34.The workbench control part 25 here moves the position of machine table 10, so that the 1st workpiece and the 2nd workpiece afterwards are in the scope that can be processed by f θ lens (step S730).Then, workpiece is moved into device 9 and is mentioned by the next group workpiece (the 2nd) behind Working piece positioning device 12 location, moves into (step S740) on the machine table 10.
In addition, in the present embodiment, the situation of processing 2 workpiece for laser processing device 100 is illustrated, but laser processing device 100 also can be processed more than or equal to 3 workpiece.Under this situation,, machine table 10 is moved, processing when carrying out more than or equal to 3 workpiece if the difference of the differential location between workpiece is less than or equal to setting.In addition, according to predetermined conditions, carry out single processing, reprocessing processing, next group workpiece processing processing etc.
In addition, in the present embodiment, for the differential location according to workpiece, the situation that workpiece is carried out Laser Processing that ins all sorts of ways is illustrated, but also can be the differential location of other processing unit (plant) according to workpiece, and processing work ins all sorts of ways.
According to above-mentioned embodiment, based on the position deviation value that calculates, from predefined multiple processing method, select the Work piece processing method corresponding, use the processing method of selecting to carry out the Laser Processing of workpiece with the position deviation value, so Laser Processing workpiece fast and in high precision.
In addition, workpiece 8A on machine table 10, any one of 8B all is in and can carries out outside the zone of Laser Processing (outside the Laser Processing scope) via f θ lens, and each workpiece 8A on the machine table 10, (proofread and correct under the situation of difference less than setting of the position deviation amount between 8B (position deviation value) by operating position, workpiece 8A, 8B is under the interior situation of the range of work), because set the position correction amount of machine table 10, so that the workpiece 8A on the machine table 10,8B is in can be via each self-corresponding f θ lens, carry out in the zone of Laser Processing simultaneously, and laser beam shone all workpiece 8A on the machine table 10 simultaneously, on the 8B, carry out the workpiece 8A on the machine table 10, processing in the time of 8B, so under the situation of the difference of offset residual quantity on the throne less than setting, can high accuracy and apace a plurality of workpiece are carried out Laser Processing.Thus, under the situation that will process a plurality of workpiece,, also can process a plurality of workpiece simultaneously, process fast even the departure of a plurality of workpiece does not fall within the departure of regulation.
In addition, for laser processing device 100, be not in the various processing methods (individually the processing processing of processing, next group workpiece etc. is handled, reapposed in processing) that (difference of the position deviation amount between workpiece 8A, 8B is greater than the situation of setting) selected under the situation in the range of work simultaneously because be set in advance in workpiece 8A, 8B by the position correction of machine table 10, even so in the position correction of being undertaken by machine table 10, and workpiece 8A, 8B still are not under the situation in the range of work simultaneously, can high accuracy and processing work apace yet.
In addition, judge at departure judging part 34 under the situation of difference greater than setting of position deviation amount of workpiece 8A, 8B, because utilize separately processing handling part 32 correcting working table position and each workpiece 8A, 8B are carried out Laser Processing respectively, even so have at workpiece 8A, 8B under the situation of very big position deviation, not processed workpiece can be do not occurred yet, Laser Processing can be carried out apace.
In addition, under the situation of position deviation amount between workpiece 8A, 8B greater than setting, workpiece is moved into device 9 makes workpiece 8A, 8B return Working piece positioning device 12, position by the position of Working piece positioning device 12 calibration of workpieces 8A, 8B, so that entering, the workpiece 8A, the 8B that move into once more can carry out in the zone of Laser Processing simultaneously via f θ lens, therefore, the bad workpiece in location can be reduced, Laser Processing can be carried out fast simultaneously.
In addition, under the situation of position deviation amount between workpiece 8A, 8B greater than setting, because when 1 workpiece 8A is mentioned, in during making that workpiece 8A is raised, machine table 10 is moved and after machine table 10 moves again with workpiece 8A mounting again on machine table 10, can carry out in the zone of Laser Processing simultaneously via f θ lens so that workpiece 8A, 8B enter,, can carry out Laser Processing apace simultaneously so can reduce the bad workpiece in location.
In addition, under the situation of position deviation amount between workpiece 8A, 8B greater than setting, because workpiece conveyance device 11 is taken out of workpiece 8A, 8B, carry out the location of next group workpiece by Working piece positioning device 12, so that the workpiece that move into next time enters and can carry out in the zone of Laser Processing simultaneously via f θ lens, so can reduce the bad workpiece in location, can carry out Laser Processing apace simultaneously.
In addition, under the situation of position deviation amount between workpiece 8A, 8B greater than setting, because workpiece conveyance device 11 is taken out of workpiece 8A, 8B, after the 1st workpiece that moved into next time moved on the machine table 10, machine table 10 is moved and after moving, the 2nd workpiece moved on the machine table 10, so that the workpiece of moving into (the 1st and the 2nd) enters and can carry out in the zone of Laser Processing simultaneously via f θ lens, so can reduce the bad workpiece in location, can carry out Laser Processing apace simultaneously.
Therefore, even under the situation of position deviation amount greater than setting between workpiece 8A, 8B, laser processing device 100 also can carry out 2 Laser Processings, compares with the situation that can only process 1, can process processing efficiently.
Industrial applicibility
As mentioned above, the laser processing device that the present invention relates to is applicable to the Laser Processing of a plurality of workpiece on the machine table.

Claims (7)

1. laser processing device, it is from a plurality of laser irradiation axis, and the f θ lens via corresponding with each laser irradiation axis shine a plurality of laser beams simultaneously, simultaneously a plurality of workpiece of mounting on 1 machine table are carried out Laser Processing, it is characterized in that having:
The deviate calculating part, it detects the position deviation of aforementioned each workpiece with respect to aforementioned machine table for each workpiece, calculates the position deviation value of each workpiece with respect to aforementioned machine table;
The processing method selection portion, the position deviation value that it calculates according to aforementioned deviate calculating part is selected the processing method of the workpiece corresponding with the aforementioned location deviate from predefined multiple processing method;
The corrected value configuration part, the processing method that it is selected according to aforementioned processing method selection portion is set the corrected value of the amount of movement of the aforementioned machine table that the position deviation of aforementioned each workpiece is proofreaied and correct; And
Machining control portion, it uses the corrected value of being set by aforementioned corrected value configuration part utilizing the processing method of being selected by aforementioned processing method selection portion, when processing a plurality of workpiece on the aforementioned machine table, carries out machining control,
Aforementioned processing method selection portion, be in outside the zone that to carry out Laser Processing via aforementioned f θ lens at certain workpiece on the aforementioned machine table and under the situation of difference less than setting of the position deviation value between each workpiece on the aforementioned machine table, from aforementioned multiple processing method, select processing method simultaneously, this while processing method is that all workpiece on aforementioned machine table shine aforementioned laser beam simultaneously, all workpiece on the aforementioned machine table are processed simultaneously
Aforementioned corrected value configuration part, selected under the situation of aforementioned while processing method in aforementioned processing method selection portion, set the aforementioned corrected value, so that all workpiece on the aforementioned machine table enter and can carry out in the zone of Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
2. laser processing device as claimed in claim 1 is characterized in that,
Also have the processing method configuration part, it is set in advance under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, the processing method that aforementioned processing method selection portion is selected,
Aforementioned processing method selection portion under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, is selected the processing method of being set by aforementioned processing method configuration part.
3. laser processing device as claimed in claim 1 or 2 is characterized in that,
Aforementioned processing method selection portion under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, is selected independent processing method, this independent processing method is when each Laser Processing of aforementioned each workpiece, aforementioned machine table is moved, each said workpiece is processed separately
Aforementioned corrected value configuration part, each aforementioned each workpiece is set the aforementioned corrected value, so that the moving of the aforementioned machine table during the each Laser Processing by aforementioned each workpiece, aforementioned each workpiece enters and can carry out in the zone of Laser Processing via the f θ lens corresponding with aforementioned each workpiece.
4. laser processing device as claimed in claim 1 or 2 is characterized in that,
Aforementioned processing method selection portion, under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, select following processing method: make all workpiece on the aforementioned machine table, return and be configured in the outside and when moving into said workpiece, carry out the workpiece positioning means for positioning, make after this positioner carries out the location of aforementioned all workpiece, aforementioned all workpiece behind the location are moved into aforementioned machine table once more
Aforementioned corrected value configuration part, aforementioned positioner is set the 1st positioning correcting value of the position location of proofreading and correct aforementioned each workpiece, so that move into all workpiece on the aforementioned machine table once more, enter and to carry out in the zone of Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
5. laser processing device as claimed in claim 1 or 2 is characterized in that,
Aforementioned processing method selection portion, under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, select following processing method: the regulation workpiece of mounting on aforementioned machine table mentioned from aforementioned machine table, simultaneously during the workpiece of aforementioned regulation is raised, aforementioned machine table is moved, after aforementioned machine table moves, with aforementioned regulation workpiece once more mounting on aforementioned machine table.
The aforementioned corrected value is set in aforementioned corrected value configuration part, so that mobile by aforementioned machine table, mounting all workpiece on aforementioned machine table enter and can carry out in the zone of Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
6. laser processing device as claimed in claim 1 or 2 is characterized in that,
Aforementioned processing method selection portion, under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, select following processing method: the conveyance device that is configured in the outside and is used to take out of said workpiece is taken out of all workpiece on the aforementioned machine table, simultaneously by the positioner that is configured in the outside and when moving into said workpiece, positions, carry out the location of each workpiece that next group moves into, each workpiece behind the location is moved into aforementioned machine table
Aforementioned corrected value configuration part, aforementioned positioner is set the 2nd positioning correcting value of the position location of proofreading and correct aforementioned each workpiece, so that move into all workpiece of the next group on the aforementioned machine table, enter and to carry out in the zone of Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
7. laser processing device as claimed in claim 1 or 2 is characterized in that,
Aforementioned processing method selection portion, under the situation of difference greater than setting of the position deviation value between aforementioned each workpiece, select following processing method: all workpiece on the aforementioned machine table are taken out of by the conveyance device that is configured in the outside and is used to take out of said workpiece, make the positioner that is configured in the outside and when said workpiece is moved into, positions simultaneously, carry out the location of each workpiece that next group moves into, the workpiece of the regulation in the workpiece behind the location is moved into aforementioned machine table, aforementioned machine table is moved, after aforementioned machine table moves, all the other workpiece in the workpiece behind the location are moved into aforementioned machine table
The aforementioned corrected value is set in aforementioned corrected value configuration part, so that move into all workpiece on the aforementioned machine table, enters the zone that can carry out Laser Processing simultaneously via the f θ lens corresponding with each workpiece.
CN200680002183.4A 2006-09-28 2006-09-28 Laser machining apparatus Expired - Fee Related CN101253018B (en)

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