JP4925584B2

JP4925584B2 - Optical components

Info

Publication number: JP4925584B2
Application number: JP2005000489A
Authority: JP
Inventors: 泰彦古野; 治大工原; 康幸三木
Original assignee: Fujitsu Component Ltd
Current assignee: Fujitsu Component Ltd
Priority date: 2005-01-05
Filing date: 2005-01-05
Publication date: 2012-04-25
Anticipated expiration: 2025-01-05
Also published as: JP2006189553A

Description

本発明は、主に光通信用の光学部品に関する。 The present invention mainly relates to an optical component for optical communication.

光導波路として作用する従来の光学部品の製造においては、コア、レンズ及びミラーを別々に作製し、それらを高精度な位置合わせにより実装していた。例えば特許文献１には、実装基板が光導波路を兼ねる構造により軽量化及び小型化が図られた光モジュールが開示されている。この光モジュールにおいては、光導波路の一部を切削加工することによりミラーが形成される。また特許文献２には、レンズ、反射面及び光導波路を射出成形により一体成形して得られるイメージセンサ用部品が開示されている。この部品は、反射面をレンズと光導波路との間に配置することにより薄型化及び小型化が図られている。さらに特許文献３には、スキャナ装置に使用される光読取りデバイス及びその製造方法が開示されている。ここでは、レンズ及び導波路を含む基板が射出成形により一体的に成形される。 In the production of a conventional optical component that acts as an optical waveguide, a core, a lens, and a mirror are separately manufactured and mounted by high-precision alignment. For example, Patent Document 1 discloses an optical module that is reduced in weight and size by a structure in which a mounting substrate also serves as an optical waveguide. In this optical module, a mirror is formed by cutting a part of the optical waveguide. Patent Document 2 discloses an image sensor component obtained by integrally molding a lens, a reflecting surface, and an optical waveguide by injection molding. This component is reduced in thickness and size by disposing the reflecting surface between the lens and the optical waveguide. Further, Patent Document 3 discloses an optical reading device used in a scanner apparatus and a manufacturing method thereof. Here, the substrate including the lens and the waveguide is integrally formed by injection molding.

再公表特許ＷＯ００／０８５０５号公報Re-published patent WO00 / 08505 特開２０００−６９２２２号公報JP 2000-69222 A 特開２０００−７８３４９号公報JP 2000-78349 A

特許文献１に記載の光モジュールにおいては、光導波路を形成するコア及びクラッドが実装基板中に薄膜形成技術及びフォトリソグラフィによって形成され、さらに反射面はダイヤモンドソーによる切削加工により形成される。従って比較的多い製造工程をいずれも非常に高精度に行う必要があり、手間及びコストが大きくなる虞がある。一方、特許文献２に記載されるような射出成形による部品形成はコスト面で有利であるが、反射面の形成においては所定の部位に反射板の接着又は真空蒸着等の工程が別途必要である。また特許文献３においては、レンズ及び導波路を含む基板を一体的に射出成形することによって高精度化及び低コスト化が図られている。しかし、基板の導波路端面に取付けられる光検出素子以降の構成は特に記載されていないことから、光検出素子からの電気配線は別途設けられる必要があり、従って電気配線等まで含めて全体として低コスト化が図られているとは言えない。 In the optical module described in Patent Document 1, a core and a clad that form an optical waveguide are formed in a mounting substrate by a thin film forming technique and photolithography, and a reflecting surface is formed by cutting with a diamond saw. Therefore, it is necessary to carry out a relatively large number of manufacturing processes with very high accuracy, which may increase labor and cost. On the other hand, the formation of parts by injection molding as described in Patent Document 2 is advantageous in terms of cost, but the formation of the reflective surface requires a separate process such as adhesion of a reflective plate or vacuum deposition at a predetermined site. . In Patent Document 3, high accuracy and low cost are achieved by integrally injection-molding a substrate including a lens and a waveguide. However, since the configuration after the photodetecting element attached to the waveguide end face of the substrate is not particularly described, it is necessary to separately provide the electric wiring from the photodetecting element, and therefore the entire structure including the electric wiring is low. It cannot be said that cost is being achieved.

そこで本発明は、光導波路として作用する、高精度かつ低コストの光学部品を提供することを目的とする。 Therefore, an object of the present invention is to provide a highly accurate and low-cost optical component that acts as an optical waveguide.

上記目的を達成するために、請求項１に記載の発明は、基板、前記基板上に形成されるコア、前記コア上に配置されるクラッド層、及び前記コアと前記基板との間に配置されて前記コア内を進む光を全反射する反射面を有する光学部品であって、前記クラッド層は、前記コアの端部に面する該クラッド層の部位の裏側に実装されて前記コアに光学的に接続される光学素子を有し、前記クラッド層は、前記光学素子に電気的に接続される電気配線が形成された可撓性の樹脂フィルムからなり、前記電気配線が形成された前記樹脂フィルムの部分が、前記基板から張り出すことを特徴とする、光学部品を提供する。 To achieve the above object, the invention according to claim 1, a substrate, a core that is formed on the substrate, a cladding layer disposed on the front SL core, and disposed between the core and the substrate An optical component having a reflection surface that totally reflects light traveling through the core , wherein the cladding layer is mounted on the back side of the portion of the cladding layer facing the end of the core and is optically applied to the core. The clad layer is made of a flexible resin film on which an electrical wiring electrically connected to the optical element is formed, and the resin on which the electrical wiring is formed An optical component is provided, wherein a film portion projects from the substrate.

請求項２に記載の発明は、基板、前記基板上に形成されるコア、前記コア上に配置されるクラッド層、及び前記コアと前記基板との間に配置されて前記コア内を進む光を全反射する反射面を有する光学部品であって、前記クラッド層は、前記コアの端部に面する該クラッド層の部位の裏側に実装されて前記コアに光学的に接続される光学素子を有し、前記クラッド層は、前記光学素子に電気的に接続されるとともに該光学素子から所定長さを有して延びる電気配線が印刷により形成された樹脂フィルムからなることを特徴とする、光学部品を提供する。 According to a second aspect of the invention, a substrate, a core that is formed on the substrate, before Symbol cladding layer disposed on the core, and light traveling in the core are disposed between the core and the substrate An optical component having a reflection surface that totally reflects the optical element, wherein the cladding layer is mounted on the back side of the portion of the cladding layer facing the end of the core and optically connected to the core. The clad layer is made of a resin film that is electrically connected to the optical element and has an electrical wiring extending from the optical element and having a predetermined length formed by printing. Provide parts.

請求項３に記載の発明は、請求項１又は２に記載の光学部品において、前記電気配線は、通信用コネクタに電気的に直接接続可能である、光学部品を提供する。 A third aspect of the present invention provides the optical component according to the first or second aspect , wherein the electrical wiring is electrically connectable directly to a communication connector .

請求項４に記載の発明は、請求項１〜３のいずれか１項に記載の光学部品において、前記基板、前記コアが形成される前記基板の溝、並びに前記コアへの光の導入及び前記コアからの光の導出の少なくとも一方を行うためのレンズが射出成形により一体的に成形される、光学部品を提供する。 According to a fourth aspect of the present invention, in the optical component according to any one of the first to third aspects, the substrate, the groove of the substrate in which the core is formed, the introduction of light into the core, and the Provided is an optical component in which a lens for performing at least one of light extraction from a core is integrally formed by injection molding .

請求項５に記載の発明は、基板、前記基板上に形成されるコア、前記コアへの光の導入及び前記コアからの光の導出の少なくとも一方を行うためのレンズ、及び前記コアと前記基板との間に配置されて前記コア内を進む光を全反射する反射面を有する光通信用の光学部品であって、前記基板、前記コアが形成される前記基板の溝、前記レンズ及び前記反射面は射出成形により一体的に成形されることを特徴とする、光学部品を提供する。 The invention according to claim 5 is a substrate, a core formed on the substrate, a lens for performing at least one of introduction of light into the core and extraction of light from the core, and the core and the substrate And an optical component for optical communication having a reflective surface that totally reflects light traveling through the core, the substrate, the groove of the substrate in which the core is formed, the lens, and the reflection An optical component is provided in which the surface is integrally formed by injection molding .

本発明によれば、クラッド層を形成する樹脂に直接電気配線を形成することにより部品数の低減が図られた光学部品が提供される。さらに、クラッド層を形成する樹脂が可撓性を有することにより、光学部品とコネクタとの接続に自由度をもたせることができる。また光導波路を形成する基板、コアが形成される基板の溝、反射面及びレンズは、一体成形により高精度かつ低コストに形成することができる。 According to the present invention, there is provided an optical component in which the number of components is reduced by directly forming an electrical wiring on the resin forming the cladding layer. Furthermore, since the resin forming the clad layer has flexibility, it is possible to provide flexibility in connection between the optical component and the connector. Further, the substrate on which the optical waveguide is formed, the groove of the substrate on which the core is formed, the reflecting surface, and the lens can be formed with high accuracy and low cost by integral molding.

以下、図面を参照しながら本発明を詳細に説明する。
図１及び図２はそれぞれ、本発明の好適な実施形態に係る、光導波路及びレンズを含む光通信用光学部品すなわち光導波路部材１０の概略斜視図及びその断面図である。光学部品１０は、樹脂製の基板１２と、ガイド孔１４で位置決めされて基板１２に接続される図示しない光コネクタからの光が入射する１つ以上の入射レンズ１６、その光コネクタへの光が出射される１つ以上の出射レンズ１８、入射レンズ１６に入射された光が通過する入射光用コア２０、及び出射レンズ１８に向かう光が通過する出射光用コア２２を有する。入射及び出射レンズ１６及び１８は基板１２と同じ樹脂で形成され、入射光用及び出射光用コア２０及び２２は基板１２を形成する樹脂より屈折率の高い樹脂から形成される。基板１２、入射レンズ１６、出射レンズ１８、並びに入射光用コア２０及び入射光用コア２２が形成される基板１２の溝１３は基板１２の製造時に射出成形により一体的に形成されるので、各々を個別に製造して位置合わせする場合に比べ高精度かつ低コストに光学部品１０を形成することができる。コア２０及び２２は、溝１３にコア材を流し込み、その上に図示しないラミネート材を貼付し、さらにラミネート材の上からＵＶ照射及び熱硬化することによって形成される。従ってコア２０及び２２の形状は任意に選択することができ、例えば、図３に示すように曲がった形状としてもよい。 Hereinafter, the present invention will be described in detail with reference to the drawings.
1 and 2 are a schematic perspective view and a sectional view of an optical component for optical communication, that is, an optical waveguide member 10 including an optical waveguide and a lens, respectively, according to a preferred embodiment of the present invention. The optical component 10 includes a resin substrate 12, one or more incident lenses 16 that receive light from an optical connector (not shown) that is positioned in the guide hole 14 and is connected to the substrate 12, and light to the optical connector 10 One or more outgoing lenses 18 to be emitted, an incident light core 20 through which light incident on the incident lens 16 passes, and an outgoing light core 22 through which light toward the outgoing lens 18 passes are provided. The incident and exit lenses 16 and 18 are made of the same resin as the substrate 12, and the incident light and outgoing light cores 20 and 22 are made of a resin having a higher refractive index than the resin forming the substrate 12. Since the substrate 12, the incident lens 16, the exit lens 18, and the groove 13 of the substrate 12 in which the incident light core 20 and the incident light core 22 are formed are integrally formed by injection molding when the substrate 12 is manufactured. The optical component 10 can be formed with high accuracy and at low cost as compared with the case where the individual parts are manufactured and aligned. The cores 20 and 22 are formed by pouring a core material into the groove 13, attaching a laminate material (not shown) thereon, and further UV-irradiating and thermosetting the laminate material. Therefore, the shapes of the cores 20 and 22 can be arbitrarily selected. For example, the cores 20 and 22 may be bent as shown in FIG.

入射光用及び反射光用コア２０及び２２は、後述する光学素子が配置される部位、すなわちそれぞれ端部２４及び２６まで基板１２上を延びる。入射光用コア２０の端部２４は、図４（ａ）に示すように、コア２０内を進んできた光が全反射されるように形成された斜面すなわち反射面２８を有する。この反射面２８には、基板１２を形成する樹脂とコア２０を形成する樹脂との屈折率、及び光の進行方向に対する反射面２８の傾斜角度θを適切に選定すれば、金属等の反射部材を別途設けなくてもよい。すなわち、コア２０と基板１２との境界面がそのまま反射面２８として機能する。この場合、傾斜角度θはコア２０内を進行する光の全反射角とすることが好ましい。また端部２４は、コア２０内を進んできた光を全反射する構造であれば他の形状を有してもよく、例えば図４（ｂ）に示すような曲面を有してもよい。なお、反射面２８での全反射をより確実にするために、端部２４の境界面に銀等の反射部材を蒸着等により形成してももちろんよい。また、出射光用コア２２の端部２６についても同様の構成が適用可能であるが説明は省略する。 The incident light and reflected light cores 20 and 22 extend on the substrate 12 to portions where optical elements to be described later are disposed, that is, the end portions 24 and 26, respectively. As shown in FIG. 4A, the end portion 24 of the incident light core 20 has a slope, that is, a reflection surface 28 formed so that the light traveling through the core 20 is totally reflected. If the refractive index of the resin forming the substrate 12 and the resin forming the core 20 and the inclination angle θ of the reflecting surface 28 with respect to the light traveling direction are appropriately selected for the reflecting surface 28, a reflecting member such as a metal is used. May not be provided separately. That is, the boundary surface between the core 20 and the substrate 12 functions as the reflecting surface 28 as it is. In this case, the inclination angle θ is preferably a total reflection angle of light traveling in the core 20. Further, the end 24 may have another shape as long as it has a structure that totally reflects the light that has traveled through the core 20, and may have a curved surface as shown in FIG. 4B, for example. Of course, a reflecting member such as silver may be formed on the boundary surface of the end portion 24 by vapor deposition or the like in order to make the total reflection on the reflecting surface 28 more reliable. Further, the same configuration can be applied to the end portion 26 of the outgoing light core 22, but the description thereof is omitted.

本発明は、光導波路を形成するために基板上に設けられるクラッド層として透光性を備えた樹脂製のプレート又はフィルムを使用し、そのプレート又は樹脂上に直接電気配線を形成することを特徴とする。例えば図５（ａ）及び（ｂ）に示すように、基板１２の上面３０にはクラッド層として透光性の樹脂製フィルム３２が貼り合わされる。樹脂フィルム３２は、基板１２を形成する樹脂の屈折率と同じか又は近い屈折率の樹脂から作製され、基板１２に貼り合わされたときにクラッド層として作用する部分３３と、樹脂フィルム３２上に印刷等により形成される電気配線３４とを有する。また図５（ｂ）に示すように、基板１２に貼り合わされたときにコア２０及び２２の端部２４及び２６に面する樹脂フィルム３２の部位の裏側には、２つの光学素子すなわち受光素子３６及び発光素子３８がそれぞれ配置される。換言すれば、受光素子３６及び発光素子３８は、電気配線３４に電気的に接続されるとともに、コア２０及び２２の端部２４及び２６にそれぞれ光学的に接続される。なお基板１２も樹脂フィルム３２と同等の透光性を有することが好ましい。 The present invention uses a resin-made plate or film having translucency as a clad layer provided on a substrate for forming an optical waveguide, and directly forms electrical wiring on the plate or resin. And For example, as shown in FIGS. 5A and 5B, a translucent resin film 32 is bonded to the upper surface 30 of the substrate 12 as a cladding layer. The resin film 32 is made of a resin having a refractive index that is the same as or close to the refractive index of the resin forming the substrate 12, and is printed on the resin film 32 and a portion 33 that acts as a cladding layer when bonded to the substrate 12. And the like. Further, as shown in FIG. 5B, two optical elements, that is, a light receiving element 36 are provided on the back side of the portion of the resin film 32 facing the end portions 24 and 26 of the cores 20 and 22 when bonded to the substrate 12. And the light emitting element 38 is each arrange | positioned. In other words, the light receiving element 36 and the light emitting element 38 are electrically connected to the electrical wiring 34 and optically connected to the end portions 24 and 26 of the cores 20 and 22, respectively. In addition, it is preferable that the board | substrate 12 also has the translucency equivalent to the resin film 32. FIG.

電気配線３４は、図６に示すように、例えば光学部品１０に光を送受信するための光通信用コネクタ４０に接続されたプリント基板４２に電気的に接続することができる。このとき、図１又は図５（ｂ）に示すように基板１２上の適当な箇所に位置合わせ用のピン４４を射出成形時に併せて形成しておき、一方プリント基板４２にもピン４４に係合するガイド孔４６を設けることにより、電気配線３４をプリント基板４２上の所定の箇所（例えば銅等の導通部）に正確に接続することができる。このような位置決め手段を用いた構成によれば、光学素子３６又は３８から通信用コネクタ４０までの電気配線を低強度かつ扱いにくいコードを用いることなく、省スペースで簡単に行うことができる。なお図６とは逆に基板１２にガイド孔を設けてプリント基板４２にピンを設けてもよいし、あるいは図７に示すように、基板１２及びプリント基板４２の双方に略同一形状のガイド孔４８及び５０を設け、それらのガイド孔に係合する位置合わせピン５２を別途設けてもよい。 As shown in FIG. 6, the electrical wiring 34 can be electrically connected to a printed circuit board 42 connected to an optical communication connector 40 for transmitting and receiving light to and from the optical component 10, for example. At this time, as shown in FIG. 1 or FIG. 5B, alignment pins 44 are formed at appropriate positions on the substrate 12 at the time of injection molding, while the printed circuit board 42 is also associated with the pins 44. By providing the matching guide hole 46, the electrical wiring 34 can be accurately connected to a predetermined location on the printed circuit board 42 (for example, a conductive portion such as copper). According to the configuration using such positioning means, the electrical wiring from the optical element 36 or 38 to the communication connector 40 can be easily performed in a small space without using a low-strength and difficult-to-handle cord. In contrast to FIG. 6, the substrate 12 may be provided with guide holes and the printed circuit board 42 may be provided with pins, or as shown in FIG. 7, both of the substrate 12 and the printed circuit board 42 have substantially the same shape. 48 and 50 may be provided, and an alignment pin 52 that engages with these guide holes may be provided separately.

図６及び図７に示す構成は、基板１２を直接通信用コネクタ４０に接続可能にすることによりさらに簡単になる。例えば図８及び図９に示すように、電気配線３４を有する透光性の樹脂フィルム３２が貼り合わされた基板１２の端部５４に通信用コネクタ４０を直接取付け、かつ電気配線３４がコネクタ４０に電気的に接続されるようにすることにより、上述のプリント基板４２は省略することができる。従って、部品数及び組立工数の削減による低コスト化を図ることができる。また基板１２とコネクタ４０との位置決めが容易となり、電気的な接続がより確実に行える。 The configuration shown in FIGS. 6 and 7 is further simplified by enabling the substrate 12 to be directly connected to the communication connector 40. For example, as shown in FIGS. 8 and 9, the communication connector 40 is directly attached to the end portion 54 of the substrate 12 to which the translucent resin film 32 having the electrical wiring 34 is bonded, and the electrical wiring 34 is connected to the connector 40. By making the electrical connection, the above-described printed circuit board 42 can be omitted. Therefore, cost reduction can be achieved by reducing the number of parts and the number of assembly steps. In addition, positioning between the substrate 12 and the connector 40 is facilitated, and electrical connection can be performed more reliably.

さらに、図１０及び図１１に示すように、可撓性を備えた透光性の樹脂フィルム３２を基板１２から張り出すように構成し、樹脂フィルム３２の端部５６に通信用コネクタ４０を接続することも可能である。図１０及び図１１の構成によれば、樹脂フィルム３２が可撓性を有することから、光学部品１０と通信用コネクタ４０との位置関係にある程度の自由度をもたせることができる。 Further, as shown in FIGS. 10 and 11, a translucent resin film 32 having flexibility is configured to protrude from the substrate 12, and the communication connector 40 is connected to the end portion 56 of the resin film 32. It is also possible to do. 10 and 11, since the resin film 32 has flexibility, the positional relationship between the optical component 10 and the communication connector 40 can have a certain degree of freedom.

なお上述の樹脂フィルム３２は透光性であると説明したが、例えば光学素子３６及び３８が取付けられるフィルム３２上の部位に孔を有することにより、光学素子３６及び３８とコア２０及び２２の端部２４及び２６とのそれぞれの光学的接続が可能な構成であれば、樹脂フィルム３２は透光性でなくともよい。 In addition, although the above-mentioned resin film 32 was demonstrated to be translucent, the end of the optical elements 36 and 38 and the cores 20 and 22 are formed by, for example, having holes in the portions on the film 32 to which the optical elements 36 and 38 are attached. The resin film 32 may not be translucent as long as each optical connection with the portions 24 and 26 is possible.

本発明に係る光通信用光学部品の好適な実施形態の概略斜視図である。1 is a schematic perspective view of a preferred embodiment of an optical component for optical communication according to the present invention. 図１の２−２線における断面図である。It is sectional drawing in the 2-2 line of FIG. 図２の変形例を示す断面図である。It is sectional drawing which shows the modification of FIG. （ａ）図２の部分拡大図であり、（ｂ）（ａ）の変形例を示す図である。(A) It is the elements on larger scale of FIG. 2, (b) It is a figure which shows the modification of (a). （ａ）電気配線を備えた樹脂フィルムの図であり、（ｂ）（ａ）の樹脂フィルムを図１の光学部品にクラッド層として配置した概略斜視図である。(A) It is a figure of the resin film provided with the electrical wiring, (b) It is the schematic perspective view which has arrange | positioned the resin film of (a) as a clad layer in the optical component of FIG. プリント基板を介して図５（ｂ）の光学部品にコネクタを電気的に接続した概略断面図である。It is the schematic sectional drawing which electrically connected the connector to the optical component of FIG.5 (b) through the printed circuit board. 図６の変形例を示す概略断面図である。It is a schematic sectional drawing which shows the modification of FIG. プリント基板を使用せずにコネクタに接続可能な光学部品の実施形態を示す概略斜視図である。It is a schematic perspective view which shows embodiment of the optical component which can be connected to a connector without using a printed circuit board. 図８の９−９線における断面図である。It is sectional drawing in the 9-9 line | wire of FIG. プリント基板を使用せずにコネクタに接続可能な光学部品の他の実施形態を示す概略斜視図である。It is a schematic perspective view which shows other embodiment of the optical component which can be connected to a connector without using a printed circuit board. 図１０の１１−１１線における断面図である。It is sectional drawing in the 11-11 line | wire of FIG.

Explanation of symbols

１０光学部品
１２基板
１３溝
１６、１８レンズ
２０、２２コア
３２樹脂フィルム
３３クラッド層
３４電気配線
３６、３８光学素子
４０コネクタ DESCRIPTION OF SYMBOLS 10 Optical component 12 Board | substrate 13 Groove | groove 16,18 Lens 20,22 Core 32 Resin film 33 Cladding layer 34 Electrical wiring 36, 38 Optical element 40 Connector

Claims

Optical having a substrate, a core that is formed on the substrate, a cladding layer disposed on the front SL core, and a reflection surface for totally reflecting the light traveling in the core are disposed between the core and the substrate Parts,
The cladding layer has an optical element mounted on the back side of the portion of the cladding layer facing the end of the core and optically connected to the core;
The clad layer is made of a flexible resin film on which an electrical wiring electrically connected to the optical element is formed,
An optical component, wherein a portion of the resin film on which the electrical wiring is formed projects from the substrate.

Optical having a substrate, a core that is formed on the substrate, a cladding layer disposed on the front SL core, and a reflection surface for totally reflecting the light traveling in the core are disposed between the core and the substrate Parts,
The cladding layer has an optical element mounted on the back side of the portion of the cladding layer facing the end of the core and optically connected to the core;
The optical component, wherein the clad layer is made of a resin film electrically connected to the optical element and formed by printing electrical wiring extending from the optical element with a predetermined length.

The optical component according to claim 1, wherein the electrical wiring is electrically connectable directly to a communication connector.

The substrate, the groove of the substrate in which the core is formed, and a lens for performing at least one of introduction of light into the core and extraction of light from the core are integrally formed by injection molding. Item 4. The optical component according to any one of Items 1 to 3.

A substrate, a core formed on the substrate, a lens for performing at least one of introduction of light into the core and extraction of light from the core, and the core disposed between the core and the substrate An optical component for optical communication having a reflecting surface that totally reflects light traveling inside,
The optical component, wherein the substrate, the groove of the substrate on which the core is formed, the lens, and the reflecting surface are integrally formed by injection molding.