JP4919326B2 - レーザ焼結システムに使用するための取外し可能な構築チャンバのための温度管理システム - Google Patents
レーザ焼結システムに使用するための取外し可能な構築チャンバのための温度管理システム Download PDFInfo
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- JP4919326B2 JP4919326B2 JP2006096910A JP2006096910A JP4919326B2 JP 4919326 B2 JP4919326 B2 JP 4919326B2 JP 2006096910 A JP2006096910 A JP 2006096910A JP 2006096910 A JP2006096910 A JP 2006096910A JP 4919326 B2 JP4919326 B2 JP 4919326B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
- B29B13/021—Heat treatment of powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/10—Pre-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Powder Metallurgy (AREA)
Description
15 プロセス・チャンバ
20 支持ハウジング
25 構築チャンバ
26 温度管理ステーション
30 構築台車
40 レーザ・ユニット
Claims (10)
- レーザ焼結装置に用いられる構築チャンバの温度を制御する方法であって、
a. 第1の構築チャンバを温度管理ステーションに接続して、該構築チャンバを、前記レーザ焼結装置の動作温度またはそれに近い温度に予熱する工程、
b. 前記構築チャンバを前記温度管理ステーションから外し、前記レーザ焼結装置中に挿入する工程、
c. 前記レーザ焼結装置を動作させて、溶融粉末と未溶融粉末からなる部品入りケーキ内に少なくとも1つの部品を形成することによって、構築を完了する工程、
d. 前記レーザ焼結装置から前記構築チャンバを取り出す工程、
e. 前記取り出された構築チャンバを前記温度管理ステーションに接続する工程、
f. 前記構築チャンバの冷却を制御して、該構築チャンバと前記部品入りケーキの温度を、該部品入りケーキを壊してその内の前記少なくとも1つの部品を取り出すことのできる温度まで低下させる工程、
を有してなり、
前記部品入りケーキの周囲の選択された位置で該部品入りケーキの温度をモニタすることによって、該部品入りケーキの冷却を制御する工程、および
前記構築チャンバに選択的に熱を供給して、前記部品入りケーキとその中の前記少なくとも1つの部品の温度を制御可能に低下させることによって、前記部品入りケーキの冷却を制御して、前記少なくとも1つの部品の熱歪みを防ぐ工程、
をさらに含むことを特徴とする方法。 - 前記レーザ焼結装置から前記第1の構築チャンバを取り出す工程の前に、交換用構築チャンバを予熱する工程をさらに含むことを特徴とする請求項1記載の方法。
- 前記構築チャンバを前記レーザ焼結装置内のプロセス・チャンバ中に挿入する工程をさらに含むことを特徴とする請求項1記載の方法。
- 前記構築チャンバ内の前記部品入りケーキを含む構築シリンダの周りに配置されたバンド・ヒータ内のサーミスタにより該部品入りケーキの温度をモニタする工程をさらに含むことを特徴とする請求項1記載の方法。
- 前記モニタした温度に応答して前記部品入りケーキの冷却を制御する工程をさらに含むことを特徴とする請求項4記載の方法。
- レーザ焼結装置の取外可能な構築チャンバのための温度管理装置において、
a. レーザ焼結装置に取外可能に連結できる構築チャンバであって、部品の構築中に溶融粉末材料と未溶融粉末材料から形成された部品入りケーキを保持するように適合された、周囲を有する構築シリンダを備えた構築チャンバ、
b. 前記構築シリンダに選択的に熱を供給するのに効果的な、該構築シリンダに連結された少なくとも1つのヒータ、
c. 前記構築シリンダの周囲の温度を検出するのに効果的な、前記少なくとも1つのヒータ内の少なくとも1つのサーミスタ、
d. 電源、および
e. 前記電源に接続された温度管理ステーションであって、構築を開始する前に、前記取外可能な構築チャンバを所望の温度に予熱するように前記少なくとも1つのヒータに選択的にエネルギーを供給するのに効果的に、かつ構築の完了した際に、前記少なくとも1つのサーミスタから受け取った検出値に応答して前記構築チャンバと前記構築シリンダに選択的に熱を供給して、レーザ焼結中に前記溶融粉末材料から形成された部品の熱歪みを防ぐのに効果的な様式で前記構築シリンダ内の該部品入りケーキの冷却を制御するのに効果的に、前記構築チャンバに接続可能な温度管理ステーション、
を備えた温度管理装置。 - 温度と現在の検出値を受信し、それらを前記温度管理ステーションにリレーする、前記取外可能な構築チャンバに接続されたコントロール・ボックスをさらに含むことを特徴とする請求項6記載の装置。
- 前記構築シリンダの周囲に配列された複数のバンド・ヒータをさらに含むことを特徴とする請求項6記載の装置。
- 前記構築チャンバが、レーザ焼結装置に取外可能に連結できる可動性構築台車に取り付けられていることを特徴とする請求項6記載の装置。
- 前記取外可能な構築チャンバがレーザ焼結装置内のプロセス・チャンバに連結できることを特徴とする請求項6記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/096,144 US7790096B2 (en) | 2005-03-31 | 2005-03-31 | Thermal management system for a removable build chamber for use with a laser sintering system |
US11/096,144 | 2005-03-31 |
Publications (2)
Publication Number | Publication Date |
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JP2006312310A JP2006312310A (ja) | 2006-11-16 |
JP4919326B2 true JP4919326B2 (ja) | 2012-04-18 |
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Family Applications (1)
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JP2006096910A Active JP4919326B2 (ja) | 2005-03-31 | 2006-03-31 | レーザ焼結システムに使用するための取外し可能な構築チャンバのための温度管理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US7790096B2 (ja) |
EP (1) | EP1707341B1 (ja) |
JP (1) | JP4919326B2 (ja) |
DE (2) | DE102006014281A1 (ja) |
Cited By (1)
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KR102352989B1 (ko) * | 2020-08-13 | 2022-01-24 | 한국생산기술연구원 | 광흡수율 측정용 분말층 모사장치 및 이를 이용한 광흡수율 측정시스템 |
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US7790096B2 (en) | 2010-09-07 |
DE102006014281A1 (de) | 2006-10-05 |
JP2006312310A (ja) | 2006-11-16 |
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