JP6498302B2 - メモリを備える取り外し可能な3d造形モジュール - Google Patents
メモリを備える取り外し可能な3d造形モジュール Download PDFInfo
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
Claims (15)
- ホスト装置に接続することができ及び該ホスト装置から取り外すことができる取り外し可能な造形モジュールであって、
造形材料を格納するための造形材料貯蔵室と、
造形される物体を支持するための造形プラットフォームと、
前記造形プラットフォームを動かすための駆動ユニットと、
ホスト装置の設定を最適化するために使用するための、少なくとも1つの造形パラメータを受け取って格納するためのデータフィールドを含むメモリと、
ホスト装置の相互接続回路に接続して、前記少なくとも1つの造形パラメータを前記ホスト装置とやりとりするためのインターフェース回路
を備える造形モジュール。 - 前記ホスト装置が、積層造形装置、後処理装置、及び/又は、前処理装置を含む、請求項1の造形モジュール。
- 前記造形材料貯蔵室から前記造形プラットフォームに造形材料を内部的に送るための造形材料移送ユニットを備える、請求項1又は2の造形モジュール。
- 前記メモリ及び前記インターフェース回路は、
少なくとも2つの異なるホスト装置に接続し、
前記ホスト装置によって受け取られた造形パラメータを格納し、及び、
1つのホスト装置から受け取った造形パラメータを他のホスト装置に送る
ことができることからなる、請求項1ないし請求項3のいずれか一項に記載の造形モジュール。 - 前記メモリは、造形前ジョブ造形パラメータ、及び/又は、造形後ジョブ造形パラメータを受け取り、格納し、及び送ることができる、請求項1ないし請求項4のいずれか一項に記載の造形モジュール。
- 前記メモリは、前記造形材料貯蔵室内の異なる造形材料の混合物に対応する異なる造形パラメータを同時に格納することができる、請求項1ないし請求項5のいずれか一項に記載の造形モジュール。
- 前記造形パラメータは、溶融温度、結晶化温度、及び放射線吸収係数、及び/又は、それらの範囲を含む、請求項1ないし請求項6のいずれか一項に記載の造形モジュール。
- 請求項1ないし請求項7のいずれか一項に記載の造形モジュールであって、次の(i)〜(iii)、
(i)前記造形プラットフォーム上の造形材料の温度を検出するための少なくとも1つの温度センサーを備える、
(ii)前記造形プラットフォームの上の造形材料の上面の高さを検出するための少なくとも1つの造形材料レベルセンサーを備える、
(iii)前記造形プラットフォーム上の造形材料を予熱するための予熱器を備える、
の少なくとも1つを備える、造形モジュール。 - 前記メモリは、
内部構成要素の可変な状態を格納するための第1のメモリモジュールと、
ホスト装置によって変更可能な可変造形パラメータを格納するための第2のメモリモジュールと、
ホスト装置によって変更できない内部構成要素の固定された較正パラメータを含むファームウェアを格納するための第3のメモリモジュール
を備えることからなる、請求項1ないし請求項8のいずれか一項に記載の造形モジュール。 - 前記内部構成要素は、前記駆動ユニット、移送ユニット、前記温度センサー、前記造形材料レベルセンサー、及び前記予熱器のうちの少なくとも1つである、請求項9の造形モジュール。
- コントローラとサーボ機構のうちの少なくとも一方を備える請求項10の造形モジュールであって、前記内部構成要素のうちの少なくとも1つを制御することからなる、造形モジュール。
- 前記メモリは、前記造形モジュールの累積された造形ジョブのサイクルの計数値を格納する、請求項1ないし請求項11のいずれか一項に記載の造形モジュール。
- 前記造形プラットフォームが適切な位置に配置されて保持され、及び、回路の相互接続が維持されるように、前記造形モジュールを前記ホスト装置に固定するためのファスナー部材を備える、請求項1ないし請求項12のいずれか一項に記載の造形モジュール。
- ホスト装置に取り外し可能に接続するための取り外し可能な造形モジュールであって、該造形モジュールは、内部構成要素と少なくとも1つのメモリとインターフェース回路とを備え、
前記内部構成要素は、
造形される物体を支持するための造形プラットフォームと、
前記造形プラットフォームを動かすための駆動ユニット
を備え、
前記メモリは、
ホスト装置の設定を最適化するために使用するための、造形パラメータを受け取り及び格納し、
少なくとも1つの内部構成要素の状態を受け取り及び格納し、及び
固定された較正パラメータを格納し、
前記インターフェース回路は、前記造形パラメータ、内部構成要素の状態、及び較正パラメータを異なるホスト装置に送ることからなる、造形モジュール。 - 前記ホスト装置が、積層造形装置、後処理装置、及び/又は、前処理装置を含む、請求項14の造形モジュール。
Applications Claiming Priority (1)
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PCT/EP2015/051014 WO2016116139A1 (en) | 2015-01-20 | 2015-01-20 | Removable 3d build module comprising a memory |
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JP2018501134A JP2018501134A (ja) | 2018-01-18 |
JP6498302B2 true JP6498302B2 (ja) | 2019-04-10 |
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US (1) | US11072027B2 (ja) |
EP (1) | EP3247551B1 (ja) |
JP (1) | JP6498302B2 (ja) |
KR (1) | KR102048720B1 (ja) |
CN (1) | CN107206704B (ja) |
BR (1) | BR112017014895A2 (ja) |
WO (1) | WO2016116139A1 (ja) |
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JP2015202594A (ja) * | 2014-04-11 | 2015-11-16 | セイコーエプソン株式会社 | 造形装置、造形方法 |
US11204597B2 (en) * | 2016-05-20 | 2021-12-21 | Moog Inc. | Outer space digital logistics system |
CN109690589B (zh) | 2016-05-20 | 2023-06-27 | 莫戈公司 | 安全可追踪的制造零件 |
CN107506650A (zh) * | 2016-06-14 | 2017-12-22 | 索尼公司 | 信息处理设备和信息处理方法 |
EP3436241B1 (en) | 2016-07-29 | 2023-11-29 | Hewlett-Packard Development Company, L.P. | A three-dimensional printing system |
JP6843968B2 (ja) | 2016-08-22 | 2021-03-17 | ストラタシス,インコーポレイテッド | 多軸ロボットビルドシステムを用いて3d部品を印刷する方法及び部品のオーブン外3d印刷の方法 |
DE102016121781A1 (de) * | 2016-11-14 | 2018-05-17 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur additiven Herstellung dreidimensionaler Objekte |
DE102016121769A1 (de) | 2016-11-14 | 2018-05-17 | Cl Schutzrechtsverwaltungs Gmbh | Anlage zur additiven Herstellung dreidimensionaler Objekte |
WO2018111239A1 (en) * | 2016-12-13 | 2018-06-21 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing |
CN110191793B (zh) * | 2017-01-19 | 2022-04-26 | 惠普发展公司,有限责任合伙企业 | 构建单元控制 |
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