JP4913203B2 - Temperature measuring sensor and temperature measuring device using temperature measuring sensor - Google Patents

Description

The present invention relates to a temperature measurement sensor for measuring the temperature of a fluid to be measured such as a chemical used for cleaning a silicon wafer, for example, during the manufacture of a semiconductor such as a silicon wafer, and a temperature measurement apparatus using the temperature measurement sensor. .

  Conventionally, for example, in a semiconductor manufacturing process, a cleaning process is performed to remove impurities, oxides, and the like attached to the surface of a silicon wafer. By sufficiently removing impurities, oxides and the like in this cleaning process, the electronic circuit can be accurately patterned in the patterning process.

  For this reason, in the cleaning process, for example, hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid, hydrofluoric nitric acid, sulfuric acid, ammonia, etc. are used as chemicals to remove impurities and oxides attached to the surface of the silicon wafer.

  Note that the chemical solution used in the cleaning process needs to be controlled by the temperature of the chemical solution because the removal ability to remove oxides and the like varies greatly depending on the temperature of the chemical solution. Has been done.

Such a temperature measurement sensor is provided with a temperature measuring element made of a thermocouple, a platinum resistance thermometer, etc., and the temperature measuring element is covered with a protective tube made of stainless steel such as SUS316L or a metal such as titanium. It has a broken structure.

  In addition, the protective tube made of metal increases the thickness of the protective tube to prevent the temperature measuring element from being corroded by the chemical solution. At the same time, the temperature measuring sensor itself was large, and the handleability was not good.

  For this reason, as disclosed in Patent Document 1, the protective tube is made of a synthetic resin such as PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer) resin having excellent chemical resistance, thereby protecting the protective tube. In order to improve the corrosion resistance, the temperature measuring sensor itself is designed not to become large.

  In addition, the higher the sensitivity of the temperature measurement sensor, the more likely it is affected by noise. In such a case, the noise generated by the semiconductor manufacturing apparatus is reduced by using a separate noise attenuator, so that the temperature measurement sensor is affected. The suppression is performed as much as possible (for example, Patent Document 2).

JP 2001-83018 A JP 2009-58270 A Japanese Patent Laid-Open No. 10-149893

However, even in a protective tube using a synthetic resin such as PFA resin as disclosed in Patent Document 1, the chemical solution permeates through the protective tube with the passage of time, and a temperature measuring element inside the protective tube. Some internal parts were damaged.

  In addition, the temperature measurement sensor is used, for example, to keep the vertical movement of the chemical temperature generated by cleaning the silicon wafer constant. When the protective tube is made of synthetic resin, the temperature response of the temperature measurement sensor is dull. As a result, there is a case where a silicon wafer with a certain quality cannot be obtained.

  Furthermore, since the resin protective tube is weaker than the metal protective tube, its thickness must be increased to prevent deformation due to fluid pressure from the chemical solution. Responsiveness would be even slower.

  In addition, among chemical solutions used when cleaning silicon wafers, low-concentration or pure water has a high resistivity, and the flow of the chemical solution may generate static electricity in the protective tube that adversely affects the quality of the silicon wafer. However, since the protective tube made of resin cannot be connected to the ground wire, a static eliminator (Patent Document 3) for discharging this static electricity is newly required, which increases the cost of the semiconductor manufacturing apparatus. Met.

  Further, if a noise attenuator as disclosed in Patent Document 2 is separately provided, there is a problem that the number of parts increases and the manufacturing cost increases. Therefore, a further temperature measurement sensor that solves the above-described problems is desired. This is the current situation.

In view of such a current situation, the present invention provides a temperature measuring sensor and a temperature which have good temperature responsiveness without causing corrosion due to a fluid to be measured such as a chemical solution, and can effectively eliminate static electricity and noise with a simple structure. An object of the present invention is to provide a temperature measurement device using a measurement sensor.

The present invention was invented in order to achieve the problems and objects in the prior art as described above,
The temperature measurement sensor of the present invention is
A temperature sensor constituting the temperature sensor unit;
A lead wire electrically connected to the proximal end portion of the temperature sensing element;
A protective tube covering at least the temperature sensing element portion;
A temperature measuring sensor comprising:
The temperature measuring sensor is
The protective tube is made of a material mainly composed of carbon,
Furthermore, a metal conductive case disposed so as to cover the protective tube and the lead wire,
The metal conductive case is
The upper end portion is electrically connected to a static elimination functional member for removing static electricity, and the lower end portion is electrically connected to the protective tube.

  If the static elimination function member can perform static elimination through the metal conductive case in this way, it is not necessary to secure a connection space by connecting the protective tube and the static elimination function member as in the prior art, and the temperature measurement sensor Can be reduced in the radial direction.

  Further, since the static electricity can be surely eliminated by the static elimination function member, the control device including the temperature measurement sensor can be functioned accurately, and a silicon wafer can be obtained with a high yield.

Moreover, since the protective tube is made of a material containing carbon as a main component, corrosion due to a fluid to be measured such as a chemical solution does not occur, and a desired measurement accuracy can be maintained for a long time.

  Furthermore, if carbon is the main component, it is not necessary to increase the thickness of the protective tube more than necessary, so that the temperature response of the temperature measuring element of the temperature measuring sensor can be improved.

  For this reason, for example, it is possible to immediately cope with the vertical movement of the chemical temperature that occurs during the cleaning of the silicon wafer.

Moreover, the temperature measurement sensor of the present invention is
The lead wire is a shield wire surrounded by a conductive material around the lead wire,
The conductive material portion of the shield wire is the static elimination functional member.

  Thus, if it is a shield wire, since the noise removal effect is good with the static elimination effect, a highly accurate temperature measurement sensor can be obtained.

Moreover, the temperature measurement sensor of the present invention is
The static elimination functional member is a ground wire.

  Thus, if it is a ground wire, static elimination can be performed especially effectively.

Moreover, the temperature measurement sensor of the present invention is
The metal conductive case is
A slit is provided in an upper end part and / or a lower end part, It is characterized by the above-mentioned.

  If the slits are provided in this way, the adhesion area with the conductive adhesive described later can be increased, and the mechanical strength can be increased.

  Further, by caulking the slit provided in the upper end portion of the metal conductive case, it is possible to prevent the internal parts from popping out and to ensure the electrical connection with the static elimination function member.

  In addition, since the slit can be slightly stretched in the radial direction, when used in semiconductor devices that are frequently used at high temperatures and in a wide range, the difference in expansion and contraction of materials in bonding between different materials Can be absorbed by the slit.

Moreover, the temperature measurement sensor of the present invention is
A convex portion for positioning with the protective tube is provided inside the lower end portion of the metal conductive case.

  In this way, if the convex portion is provided around the lower end portion of the metal conductive case, the upper end portion of the protective tube abuts on the convex portion of the metal conductive case when electrically connecting to the protective tube. Can always maintain a constant quality.

Moreover, the temperature measurement sensor of the present invention is
A thickness of the lower end portion electrically connected to the protective tube of the metal conductive case is set to be thinner than other portions.

In this way, if the thickness of the lower end of the metal conductive case is thin, the metal conductive case is slightly springy, so that the metal conductive case has a difference in contraction due to the difference in thermal expansion coefficient between the protective tube and the metal conductive case. Even if the protective tube is tightened, the stress can be dispersed and the protective tube can be prevented from being damaged.

Moreover, the temperature measurement sensor of the present invention is
The connection part of the upper end part of the said metal conductive case and the said static elimination function member is adhere | attached with the conductive adhesive.

  Thus, if it is a conductive adhesive, a metal conductive case and a static elimination function member can be connected reliably, and the adhesiveness between each member is favorable. Therefore, the reliability in temperature measurement can be further improved.

Moreover, the temperature measurement sensor of the present invention is
A connecting portion between the lower end portion of the metal conductive case and the protective tube is bonded with a conductive adhesive.

  Thus, if it is an electroconductive adhesive agent, a metal conductive case and a protective tube can be connected reliably, and the adhesiveness between each member is favorable. Therefore, the reliability in temperature measurement can be further improved.

Moreover, the temperature measurement sensor of the present invention is
A resin filler is filled between the protective tube and the side temperature body.

  If the resin filler is filled in the protective tube in this way, the temperature of the fluid to be measured is transmitted from the protective tube to the temperature measuring body through the resin filler, so that the temperature of the fluid to be measured is surely measured. Can get to know.

  Furthermore, since the resin filler is solidified, it is possible to prevent the positional deviation between the lead wire and the temperature measuring element in the protective tube.

Moreover, the temperature measurement sensor of the present invention is
Of the internal space of the metal conductive case, a resin filler is filled in an internal space other than the upper end connected to the static elimination function member and the lower end connected to the protective tube.

  If the metal conductive case is filled with the resin filler in this way, it becomes difficult to pick up heat other than the protective tube, so that only the temperature of the fluid to be measured can be picked up, and an accurate temperature measurement sensor can be obtained. .

Moreover, the temperature measurement sensor of the present invention is
The carbon-based material is
It is one of amorphous carbon, silicon carbide, graphite, and diamond-like carbon.

  In this way, when the material of the protective tube is any of amorphous carbon, silicon carbide, graphite, and diamond-like carbon, particularly the hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid, hydrofluoric acid, sulfuric acid, and ammonia whose measured fluid is a strong acid Even in such a case, the protective tube can be reliably protected from corrosion, and the temperature of the fluid to be measured can be reliably controlled.

Moreover, the temperature measurement sensor of the present invention is
The material having carbon as a main component has a thermal conductivity in the range of 5 to 350 W / m ° C.

  If the material is mainly composed of carbon whose thermal conductivity is set in such a range, the temperature of the fluid to be measured can be reliably obtained with the temperature measuring element in the protective tube, and the thermal conductivity is good. Therefore, even a slight temperature change can be surely obtained.

Moreover, the temperature measurement sensor of the present invention is
A resin shrinkable tube is provided so as to cover the metal conductive case.

  If the resin shrinkable tube is provided in this way, the connection portion between the metal conductive case and the charge eliminating function member and the entire metal conductive case can be accommodated in the resin shrinkable tube, so there is no fear of disconnection of the charge eliminating functional member. .

  Furthermore, if the metal conductive case is covered with the resin shrinkable tube, the metal conductive case is not corroded by the fluid to be measured, and the temperature of the fluid to be measured can be reliably controlled.

In addition, the resin shrinkable tube also has an effect of heat insulation from the outside air, making it difficult to pick up heat other than the protective tube. Therefore, only the temperature of the fluid to be measured can be picked up, and a highly accurate temperature measurement sensor can be obtained.
Moreover, if the resin shrinkable tube is provided, the appearance of the temperature measuring sensor is good.

In addition, the temperature measuring device of the present invention is
A temperature measurement device using the temperature measurement sensor according to any one of the above,
A fluid piping part in which a flow path of the fluid to be measured is formed,
The temperature measurement sensor is arranged so that a protective tube portion of the temperature measurement sensor is exposed in the flow path of the fluid piping unit.

  If the temperature measuring device is configured using the temperature measuring sensor as described above, static electricity can be removed from the protective tube through the metal conductive case, and noise can be eliminated by using a lead wire as a shield wire. In addition, the temperature measurement sensor can be made to function more accurately.

  In addition, since the protective tube of the temperature measurement sensor is made of a material whose main component is carbon, there is no fear of being corroded by a fluid to be measured such as a chemical solution.

  Furthermore, since the temperature measurement sensor is not deformed by water pressure, temperature management can be performed with high accuracy, and the size of the temperature measurement sensor can be made smaller than before.

  Furthermore, since the temperature responsiveness is good, the temperature measurement sensor can be made to function accurately, and the temperature of the fluid to be measured such as a chemical solution can be reliably managed.

In addition, the manufacturing method of the temperature measurement sensor of the present invention,
Electrically connecting a lead wire to the proximal end portion of the temperature measuring element constituting the temperature sensor unit;
A protective tube made of a carbon-based material capable of covering at least the temperature sensing element portion and a metal conductive case set to cover the connecting portion between the side temperature body and the lead wire are prepared. And a process of
Fitting and electrically connecting the upper end of the protective tube and the lower end of the metal conductive case;
Filling the inside of the protective tube with a resin filler, and inserting the temperature measuring body connected with the lead wire in this state into the protective tube;
Curing the resin filler;
Electrically connecting an upper end portion of the metal conductive case and a static elimination functional member for removing static electricity;
It is characterized by having at least.

  If it is a temperature measurement sensor obtained by such a manufacturing method, it is possible to perform static elimination with a static elimination functional member through a metal conductive case, so that a protective tube and a static elimination functional member are connected as in the past. Therefore, it is not necessary to secure a space for connection by the above, and the temperature measuring sensor can be downsized in the radial direction.

  Moreover, since static electricity is not charged by the static elimination function member, the control device including the temperature measurement sensor can be functioned accurately, and a silicon wafer can be obtained with a high yield.

  Moreover, since the protective tube is made of a material whose main component is carbon, corrosion due to a fluid to be measured such as a chemical solution does not occur, and a desired measurement accuracy can be maintained for a long time.

  Furthermore, if carbon is the main component, it is not necessary to increase the thickness of the protective tube more than necessary, so that the temperature response of the temperature measuring element of the temperature measuring sensor can be improved.

  For this reason, for example, it is possible to immediately cope with the vertical movement of the chemical temperature that occurs during the cleaning of the silicon wafer.

In addition, the manufacturing method of the temperature measurement sensor of the present invention,
A slit is provided at least at the lower end of the metal conductive case,
In the step of fitting and electrically connecting the upper end of the protective tube and the lower end of the metal conductive case,
A connecting portion between the metal conductive case and the protective tube is bonded with a conductive adhesive.

  By connecting the metal conductive case and the protective tube with the conductive adhesive in this way, the bonding area can be expanded by the slit of the metal conductive case, and the metal conductive case and the protective tube are securely connected to each other. The mechanical strength between them can be increased.

In addition, the manufacturing method of the temperature measurement sensor of the present invention,
At least a slit is provided at the upper end of the metal conductive case,
In the step of electrically connecting the upper end portion of the metal conductive case and the static elimination functional member for static electricity removal,
A connecting portion between the upper end portion of the metal conductive case and the static eliminating function member for removing static electricity is adhered with a conductive adhesive, and the upper end portion of the metal conductive case is further crimped.

  Thus, if the connection between the metal conductive case and the static elimination function member is performed with a conductive adhesive, the adhesion area can be expanded by the slit of the metal conductive case, and the metal conductive case and the static elimination function member are securely connected, The mechanical strength between both members can be increased.

  In addition, the metal conductive case can be crimped by the slit, and the connection between the metal conductive case and the charge removal function member can be made stronger.

In addition, the manufacturing method of the temperature measurement sensor of the present invention,
After the step of electrically connecting the upper end portion of the metal conductive case and the static eliminating function member for static electricity removal,
Furthermore, it has the process of providing a resin shrinkable tube so that the said metal conductive case may be covered.

  If the resin shrinkable tube is provided in this way, the static eliminating function member can be accommodated in the resin shrinkable tube, so there is no fear of disconnection of the static eliminating function member.

Furthermore, if the metal conductive case is covered with the resin shrinkable tube, the metal conductive case is not corroded by the fluid to be measured, and the temperature of the fluid to be measured can be reliably controlled.
Moreover, if the resin shrinkable tube is provided, the appearance of the temperature measurement sensor is good.

According to the present invention, since the temperature measurement sensor has the unique configuration as described above, it has good temperature responsiveness without being corroded by a fluid to be measured such as a chemical solution, and is effective with a simple structure. A temperature measurement sensor capable of removing static electricity and noise and a temperature measurement device using the temperature measurement sensor can be provided.

FIG. 1 is a front view of a temperature measurement sensor of the present invention. FIG. 2 is an enlarged view of part A of the temperature measurement sensor shown in FIG. FIG. 3 is a front view showing an example of the static elimination functional member in the temperature measurement sensor of the present invention. FIG. 4 is a metal conductive case in the temperature measurement sensor of the present invention. FIG. 4 (a) is a front view, FIG. 4 (b) is a side view, and FIG. 4 (c) is B- in FIG. It is sectional drawing by a B line. FIG. 5A to FIG. 5C are process diagrams for explaining the manufacturing method of the temperature measurement sensor of the present invention. FIG. 6A to FIG. 6C are process diagrams for explaining the manufacturing method of the temperature measurement sensor of the present invention. FIG. 7A and FIG. 7B are process diagrams for explaining the manufacturing method of the temperature measurement sensor of the present invention. FIG. 8A to FIG. 8C are process diagrams for explaining another manufacturing method of the temperature measurement sensor of the present invention. FIG. 9 is a front view of a temperature measuring device using the temperature measuring sensor of the present invention.

  Hereinafter, embodiments of the present invention will be described in more detail based on the drawings.

  1 is a front view of a temperature measurement sensor of the present invention, FIG. 2 is an enlarged view of a portion A of the temperature measurement sensor shown in FIG. 1, and FIG. 3 is an embodiment of a static elimination function member in the temperature measurement sensor of the present invention. 4 is a metal conductive case in the temperature measurement sensor of the present invention, FIG. 4 (a) is a front view, FIG. 4 (b) is a side view, and FIG. 4 (c) is FIG. It is sectional drawing by the BB line of (b).

  The temperature measuring sensor and the temperature measuring apparatus of the present invention are for measuring the temperature of a fluid to be measured such as a chemical solution used for cleaning a silicon wafer when a semiconductor such as a silicon wafer is manufactured.

  Hereinafter, a temperature measurement sensor, a method for manufacturing the temperature measurement sensor, and a temperature measurement apparatus using the temperature measurement sensor according to the present invention will be described in order.

<Temperature sensor 10>
First, a temperature measuring sensor 10 of the present invention includes a temperature measuring body 12 constituting a temperature sensor unit for measuring the temperature of a fluid to be measured as shown in FIGS. 1 and 2, and a base end of the temperature measuring body 12. The lead wire 14 is electrically connected to the portion, and the protective tube 16 covers at least the temperature measuring body 12 portion and directly contacts the fluid to be measured.

  When the lead wire 14 and the temperature measuring body 12 are connected, the lead wire 14 is covered with an insulating tube 38.

  A metal conductive case 18 is disposed so as to cover the lead wire 14 to which the temperature measuring element 12 is connected and the protective tube 16. The metal conductive case 18 has an upper end portion that is connected to the static elimination function member 20 for removing static electricity. The lower end portion is electrically connected to the protective tube 16.

  Here, the material of the metal conductive case 18 is not particularly limited as long as it has conductivity. However, if it is made of, for example, stainless steel, titanium, hastelloy, etc., the conductive tube 18 has good conductivity. Static electricity generated in the can be effectively eliminated.

  In addition, the static elimination function member 20 electrically connected to the upper end portion of the metal conductive case 18 is a shield wire in which the periphery of the lead wire 14 is surrounded by a conductive material as shown in FIG. The conductive material portion of the shield wire is the static elimination function member 20.

  In this case, by electrically connecting the ground wire 22 to the end portion of the conductive material above the shield wire, static electricity generated in the protective tube 16 described later can be discharged toward the upper end portion of the ground wire 22 to eliminate static electricity. I am doing so. The connecting portion between the shield wire and the ground wire 22 is preferably covered with a resin shrinkable tube 42 to prevent a short circuit and corrosion.

  On the other hand, as shown in FIG. 3B, in the case of a so-called normal lead wire 14, a ground wire 22 provided separately from the lead wire 14 becomes the static elimination functional member 20. In this case as well, static electricity generated in the protective tube 16 is allowed to flow in the direction of the upper end of the ground wire 22 so as to be neutralized.

  Here, in order to obtain the static elimination effect of static electricity, both types of FIG. 3A and FIG. 3B can be used. In addition, in order to obtain the noise elimination effect, in particular, FIG. It is preferable to use a shielded wire of this type, and it is preferable to select according to the effect required under the usage environment.

  Further, as shown in FIGS. 4A to 4C, a plurality of (four in FIG. 4) slits 24 and 26 are formed at the upper end and the lower end of the metal conductive case 18. .

  First, the slit 24 provided at the upper end portion of the metal conductive case 18 is set so as to be positioned at the connecting portion of both members when electrically connected to the static elimination function member 20, and is provided at the lower end portion. The slit 26 is set so as to be positioned at a connecting portion between the two members when electrically connected to the protective tube 16.

  Since the slits 24 and 26 can slightly extend in the radial direction, the expansion of the material at the joint between different materials is required when used in a semiconductor device that is frequently used at a high temperature and in a wide range. The difference in shrinkage can be absorbed by the slits 24 and 26.

Further, the slit 24 at the upper end of the metal conductive case 18 can be caulked. After electrically connecting with the static elimination function member 20, the slit 24 is caulked so that the internal parts can be projected. The electrical connection with the static elimination function member 20 can be ensured.

  Note that the connection portion of the metal conductive case 18 to the static elimination function member 20 and the connection portion of the protective tube 16 can be electrically connected even if directly connected to the metal conductive case 18, but the conductive adhesive 32. , 34 can be connected more reliably, and connection reliability can be further improved.

  As the conductive adhesives 32 and 34 used here, known ones can be used, but among them, it is preferable to use a highly conductive and heat-resistant epoxy adhesive.

  On the other hand, a convex portion 28 is provided on the inner side of the lower end portion of the metal conductive case 18, so that when the metal conductive case 18 and the protective tube 16 are connected, the upper end portion of the protective tube 16 is electrically conductive. Positioning can be performed by abutting against the convex portion 28 of the case, and it is possible to maintain a constant quality during manufacturing.

  Further, a thin portion 30 is provided below the convex portion 28 of the metal conductive case 18, and when this is electrically connected to the protective tube 16 due to the synergistic effect of this and the slit 26 described above, this thin portion 30 has a slight spring property so that the stress can be dispersed.

  For this reason, the protective tube 16 is not damaged even if the metal conductive case 18 tightens the protective tube 16 due to the difference in contraction caused by the difference in thermal expansion coefficient between the protective tube 16 and the metal conductive case 18. Connection reliability can be improved.

  Further, the protective tube 16 of the temperature measurement sensor 10 is made of a material mainly composed of carbon, and such a material mainly composed of carbon has a thermal conductivity in the range of 5 to 350 W / m ° C. In addition, the material is not particularly limited as long as it is a material excellent in chemical resistance, thermal responsiveness, and electrical conductivity. For example, amorphous carbon, silicon carbide, graphite, diamond-like carbon, etc. are preferably used.

  In particular, if the protective tube 16 is made of amorphous carbon, it can be protected even if the protective tube 16 is immersed in a chemical solution such as hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid, fluorinated nitric acid, sulfuric acid, and ammonia used when cleaning a silicon wafer. The tube 16 does not corrode, and the conventional metal protective tube 16 needs to be thicker in order to resist the corrosion caused by the chemical solution. No. 16 does not require this, so that the temperature of the chemical solution can be reliably controlled with excellent thermal response.

  The thickness of the protective tube 16 is appropriately selected depending on the size of the protective tube 16. For example, if the protective tube 16 has a diameter of about 4 mm, the thickness is about 0.6 to 1.5 mm. Preferably there is.

  For example, the protective tube 16 has a bottomed cylindrical protective tube 16 as shown in FIG. 1 by punching a central portion of rod-shaped amorphous carbon (manufactured by Nisshinbo Industries, Ltd.). .

  Although not shown, the outer surface of the metal protective tube 16 such as stainless steel that contacts the fluid to be measured may be coated with amorphous carbon, thereby obtaining the same effect.

  Further, the inside of the protective tube 16 is filled with a resin filler 36, whereby the lower end portion of the lead wire 14 and the temperature measuring body 12 are prevented from being displaced in the protective tube 16.

  Similarly, the resin filler 36 is also filled in the internal space of the metal conductive case 18 other than the upper end connected to the static elimination function member 20 and the lower end connected to the protective tube 16.

  The resin filler 36 is not particularly limited as long as it is excellent in thermal responsiveness and has a thermal conductivity in the range of 2.4 to 10 W / m ° C. For example, a silicone resin or an epoxy resin Can be used.

  Specific examples of the silicone resin include Shin-Etsu Silicone KE1867 and KE3467 manufactured by Shin-Etsu Chemical Co., Ltd. As specific examples of the epoxy resin, Alemco Bond 2210 epoxy manufactured by Odek Corporation and Durarco 132IP epoxy manufactured by Taiyo Wire Mesh Co., Ltd. are suitable.

  Since such a resin filler 36 has good heat conduction, even if a slight temperature change occurs in the fluid to be measured, the temperature changer 12 can accurately obtain the temperature change.

  In addition, since the resin filler 36 in the protective tube 16 is filled in a state where the temperature measuring body 12 is housed in the protective tube 16, the difference between the inner diameter of the protective tube 16 and the outer diameter of the temperature measuring body 12 is zero. It is preferably about 1 mm to 1.0 mm. When this value is smaller than 0.1 mm, it is difficult to assemble, and it is easy to be affected by the difference in thermal expansion between the internal parts and the protective tube 16, and conversely when it is larger than 1.0 mm. Will be less responsive.

  The temperature measurement sensor 10 to which the metal conductive case 18 is connected in this way is finally covered with the resin shrinkable tube 40 so as to completely cover the metal conductive case 18, thereby constituting the temperature measurement sensor 10 of the present invention. Yes.

  Since the temperature measurement sensor 10 of the present invention is neutralized by the static elimination function member 20 through the metal conductive case 18, there is no need for a space for connection between the protective tube 16 and the static elimination function member 20, and the temperature measurement sensor 10 is The size can be reduced in the radial direction.

  Further, as described above, the material for forming the protective tube 16 is a material mainly composed of carbon (particularly amorphous carbon), so that the protective tube is generated by a fluid to be measured such as a chemical used for cleaning a silicon wafer, for example. 16 can be surely prevented, and by disposing the static elimination functional member 20, discharge can be performed and static electricity can be reliably removed.

  Furthermore, if the lead wire 14 is a shielded wire, noise can be removed in addition to static electricity neutralization.

<Method for Manufacturing Temperature Measuring Sensor 10>
Next, a method for manufacturing the temperature measurement sensor 10 of the present invention will be described.
FIGS. 5A to 7B are process diagrams for explaining a manufacturing method in the embodiment of the temperature measurement sensor 10 of the present invention.

  In the manufacturing method of the temperature measurement sensor 10 of the present invention, first, as shown in FIG. 5A, the lead wire 14 is electrically connected to the proximal end portion of the temperature measuring body 12 constituting the temperature sensor portion. Then, an insulating tube 38 is disposed so as to cover the connecting portion of both members.

  Next, as shown in FIG. 5 (b), the metal conductive case 18 and the protective tube 16 for completely covering the temperature measuring body 12 are opposed to each other, and the upper end of the protective tube 16 is electrically connected to each other. A conductive adhesive 34 is applied to the part.

  Then, as shown in FIG. 5C, in this state, the protective tube 16 is inserted into the lower end portion of the metal conductive case 18, and this time, the conductive property is again covered so as to cover the slit 26 at the lower end portion of the metal conductive case 18. Adhesive 34 is applied.

  In addition, the convex part 28 is formed in the inner periphery of the lower end part of the metal conductive case 18, and it can position now between both members by making the upper end part of the protective tube 16 contact | abut here. ing.

  Next, the conductive adhesive 34 is cured by leaving the metal conductive case 18 and the protective tube 16 in an environment of 160 ° C. for 30 minutes, and the metal conductive case 18 and the protective tube 16 are electrically connected.

  Further, a heat-resistant epoxy resin is applied to the connecting portion of both members, and this is left for 2 hours in an environment of 180 ° C. to cure the heat-resistant epoxy resin, and then the resin filler 36 is protected from the upper end of the metal conductive case 18. 16 and the metal conductive case 18.

  Next, as shown in FIG. 6A, in this state, the temperature measuring body 12 to which the lead wire 14 is connected is inserted from the upper end of the metal conductive case 18, and the temperature measuring body 12 is inserted into the protective tube 16. The resin filler 36 is cured by leaving it to stand for 30 minutes in an environment of 160 ° C. to obtain a state as shown in FIG.

  The resin filler 36 filled here may be the same or different in the protective tube 16 and the metal conductive case 18, and in this case, only in the protective tube 16 first. With the resin filler 36 filled, the temperature measuring element 12 to which the lead wire 14 is connected is inserted to cure the resin filler 36, and another metal filler is filled into the metal conductive case 18 and cured. Just do it.

  Next, a conductive adhesive 32 is applied between the metal conductive case 18 and the static elimination functional member 20 from the slit 24 at the upper end of the metal conductive case 18, and the upper end of the metal conductive case 18 is caulked in this state. As shown in FIG. 6C, the crimping portion 44 is formed.

  Further, as shown in FIG. 7 (a), the conductive adhesive 32 is applied again so as to cover the caulking portion 44, and this is left in an environment of 160 ° C. for 30 minutes, whereby a conductive adhesive is obtained. 32 is cured.

  Finally, the resin contraction tube 40 is put on the outside of the metal conductive case 18 to obtain the temperature measurement sensor 10 as shown in FIG.

  In addition, in the process of FIG.7 (b), although the one resin shrinkable tube 40 is covered so that the metal conductive case 18 may be covered, it is not limited to this, For example, it showed to Fig.8 (a) First, the connection portion between the protective tube 16 and the metal conductive case 18 is covered with the resin shrinkage tube 46, and the connection portion between the static elimination function member 20 and the metal conductive case 18 is further resin-shrinked as shown in FIG. 8B. The tube 48 may be covered, and finally the entire metal conductive case 18 may be covered with the resin shrinkable tube 40.

  Thus, if the temperature measurement sensor 10 is manufactured by the above-described manufacturing method, the number of members is small, and in addition to the connection between the members at the connection portion, the connection with the conductive adhesive is also performed, so the connection reliability It is possible to provide the temperature measurement sensor 10 having an extremely high value.

<Temperature measuring device 50>
Next, the temperature measuring device 50 using the temperature measuring sensor 10 shown in FIGS. 1 to 4 will be described.

  As shown in FIG. 9, the temperature measuring device 50 of the present invention includes a fluid piping part 52 in which a flow path of a fluid to be measured (chemical solution) is formed. The temperature measurement sensor 10 is arranged so that the protective tube 16 portion of the temperature measurement sensor 10 is exposed.

  In the present embodiment, a temperature measurement sensor attachment portion 54 for arranging the temperature measurement sensor 10 is provided in the middle of the fluid piping portion 52, and a fixing device 56 is attached to the temperature measurement sensor attachment portion 54. Thus, the temperature measuring sensor 10 is fixed.

  Note that the protective tube 16 portion of the temperature measurement sensor 10 is disposed so as to protrude into the fluid piping portion 52, so that when the fluid to be measured flows through the fluid piping portion 52, the protective tube 16 portion is disposed. The fluid to be measured is touched, and the temperature data of the fluid to be measured captured by the temperature measuring body 12 is separately managed by a computer or the like.

  In addition, since the temperature measuring device 50 of the present invention can discharge static electricity generated on the surface of the protective tube 16 from the static eliminating function member 20 connected thereto through the metal conductive case 18, the vicinity of the protective tube 16 is provided. However, the diameter of the temperature measurement sensor 10 does not become too large as in the prior art, the diameter is relatively small, the discharge function can be provided, and noise can be removed if a shielded wire is used. The measurement accuracy by can be further increased than before.

  Thus, the temperature measuring device 50 using the temperature measuring sensor 10 of the present invention has many effects as described above.

  The preferred embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment. For example, the above-described temperature measurement sensor 10 is described as including the temperature measuring body 12, but this measurement is not limited thereto. Even without the warm body 12, it is possible to obtain the static electricity removal effect and noise removal effect of the protective tube 16, and various modifications can be made without departing from the object of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Temperature measuring sensor 12 ... Temperature measuring body 14 ... Lead wire 16 ... Protection tube 18 ... Metal conductive case 20 ... Static elimination functional member 22 ... Ground wire 24 ... Slit 26 ... Slit 28 ... Convex 30 ... Thin part 32 ... Conductive adhesive 34 ... Conductive adhesive 36 ... Resin filler 38 ... Insulating tube 40 ... Resin shrink tube 42 ... resin shrink tube 44 ... caulking part 46 ... resin shrink tube 48 ... resin shrink tube 50 ... temperature measuring device 52 ... fluid piping 54 ... temperature Measuring sensor mounting part 56... Fixing tool

Claims (7)

A temperature sensor constituting the temperature sensor unit;
A shield wire that is electrically connected to the proximal end portion of the temperature sensing element and is surrounded by a static elimination functional member around the lead wire ;
A protective tube covering at least the temperature sensing element portion;
A temperature measuring sensor comprising:
The temperature measuring sensor is
The protective tube is made of any of amorphous carbon, silicon carbide, graphite, diamond-like carbon ,
Furthermore, provided with a metal conductive case having a slit at the upper end and / or the lower end , arranged so as to cover the protective tube and the shield wire ,
The metal conductive case is
Wherein with the upper end portion is electrically connected to the charge removing function member of the shielded wire, the lower portion is connected to the protective tube and electrically,
Furthermore, the thickness of the lower end portion that is electrically connected to the protective tube of the metal conductive case is set to be thinner than other portions,
A temperature measurement sensor configured to measure a temperature of a chemical solution used for cleaning a silicon wafer at the time of manufacturing a semiconductor . The temperature measurement sensor according to claim 1 , wherein a connection portion between the upper end portion of the metal conductive case and the static elimination function member is bonded with a conductive adhesive. The temperature measurement sensor according to claim 1 or 2 , wherein a connection portion between a lower end portion of the metal conductive case and the protective tube is bonded with a conductive adhesive. The temperature measuring sensor according to any one of claims 1 to 3 , wherein a resin filler is filled between the protective tube and the side temperature body. The internal space of the metal conductive case is filled with a resin filler in an internal space other than an upper end connected to the static elimination function member and a lower end connected to a protective tube. The temperature measurement sensor according to any one of 1 to 4 . Temperature measurement sensor according to any of claims 1 5, characterized in that the resin shrinkable tube so as to cover the metal conductive casing is provided. A temperature measuring device using the temperature measuring sensor according to any one of claims 1 to 6 ,
A fluid piping part in which a flow path of the fluid to be measured is formed,
A temperature measuring device, wherein a temperature measuring sensor is arranged so that a protective tube portion of the temperature measuring sensor is exposed in a flow path of the fluid piping portion.

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