JP4907292B2 - 半導体装置及び前記半導体装置を用いた通信システム - Google Patents

半導体装置及び前記半導体装置を用いた通信システム Download PDF

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Publication number
JP4907292B2
JP4907292B2 JP2006279598A JP2006279598A JP4907292B2 JP 4907292 B2 JP4907292 B2 JP 4907292B2 JP 2006279598 A JP2006279598 A JP 2006279598A JP 2006279598 A JP2006279598 A JP 2006279598A JP 4907292 B2 JP4907292 B2 JP 4907292B2
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integrated circuit
semiconductor integrated
coiled antenna
semiconductor device
antenna
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JP2006279598A
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JP2007134694A (ja
JP2007134694A5 (enExample
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豊 塩野入
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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JP2006279598A 2005-10-14 2006-10-13 半導体装置及び前記半導体装置を用いた通信システム Expired - Fee Related JP4907292B2 (ja)

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JP2006279598A JP4907292B2 (ja) 2005-10-14 2006-10-13 半導体装置及び前記半導体装置を用いた通信システム

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JP2005300971 2005-10-14
JP2005300971 2005-10-14
JP2006279598A JP4907292B2 (ja) 2005-10-14 2006-10-13 半導体装置及び前記半導体装置を用いた通信システム

Related Child Applications (1)

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JP2011271810A Division JP2012089872A (ja) 2005-10-14 2011-12-13 半導体装置

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JP2007134694A JP2007134694A (ja) 2007-05-31
JP2007134694A5 JP2007134694A5 (enExample) 2008-11-13
JP4907292B2 true JP4907292B2 (ja) 2012-03-28

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5403903B2 (ja) 2007-12-04 2014-01-29 ルネサスエレクトロニクス株式会社 半導体装置、その製造方法、および当該半導体装置を用いた信号送受信方法
JP5442950B2 (ja) 2008-01-29 2014-03-19 ルネサスエレクトロニクス株式会社 半導体装置、その製造方法、当該半導体装置を用いた信号送受信方法、およびテスタ装置
JPWO2009113373A1 (ja) * 2008-03-13 2011-07-21 日本電気株式会社 半導体装置
WO2010032602A1 (en) 2008-09-18 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101611643B1 (ko) 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102087138B1 (ko) * 2012-05-14 2020-03-10 엘지전자 주식회사 무선 전력 전송장치
KR20150139731A (ko) * 2014-06-03 2015-12-14 주식회사 히타치엘지 데이터 스토리지 코리아 무선 전력 전송 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416356A (en) * 1993-09-03 1995-05-16 Motorola, Inc. Integrated circuit having passive circuit elements
JP3719618B2 (ja) * 1996-06-17 2005-11-24 松下電器産業株式会社 半導体装置及びその製造方法
JP4896369B2 (ja) * 2002-12-25 2012-03-14 株式会社半導体エネルギー研究所 半導体装置
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
JP2004273538A (ja) * 2003-03-05 2004-09-30 Seiko Epson Corp 半導体装置及びその製造方法
JP4536496B2 (ja) * 2003-12-19 2010-09-01 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の駆動方法

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